CN103069582A - 用于具有多种磷光体的选择泵浦led的系统和方法 - Google Patents

用于具有多种磷光体的选择泵浦led的系统和方法 Download PDF

Info

Publication number
CN103069582A
CN103069582A CN2011800402216A CN201180040221A CN103069582A CN 103069582 A CN103069582 A CN 103069582A CN 2011800402216 A CN2011800402216 A CN 2011800402216A CN 201180040221 A CN201180040221 A CN 201180040221A CN 103069582 A CN103069582 A CN 103069582A
Authority
CN
China
Prior art keywords
led
phosphor
electromagnetic radiation
wavelength
active region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011800402216A
Other languages
English (en)
Other versions
CN103069582B (zh
Inventor
奥雷利安·J·F·戴维
特洛伊·特罗蒂尔
弗兰克·M·斯特兰卡
迈可尔·R·克拉梅什
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soraa Inc
Original Assignee
Soraa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soraa Inc filed Critical Soraa Inc
Priority to CN201710543269.8A priority Critical patent/CN107256861B/zh
Publication of CN103069582A publication Critical patent/CN103069582A/zh
Application granted granted Critical
Publication of CN103069582B publication Critical patent/CN103069582B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883Arsenides; Nitrides; Phosphides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/56Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing sulfur
    • C09K11/562Chalcogenides
    • C09K11/565Chalcogenides with zinc cadmium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737Phosphates
    • C09K11/7738Phosphates with alkaline earth metals
    • C09K11/7739Phosphates with alkaline earth metals with halogens
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774Aluminates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)
  • Lasers (AREA)

Abstract

描述了具有多种磷光体的LED泵浦光。使用发射在紫色和/或紫外波长下的辐射的LED来泵浦发射其他颜色的磷光体材料。设置在不同波长范围内操作的LED以减少光的再吸收并提高光输出效率。

Description

用于具有多种磷光体的选择泵浦LED的系统和方法
相关申请
本申请要求于2010年8月19日提交的美国临时专利申请号61/375,097和于2011年6月28日提交的美国临时专利申请号61/502,212的优先权,由此出于所有目的将其两者通过引用结合于此。
背景技术
本发明涉及照明系统,并且具体地涉及具有多种磷光体(multiplephosphor)的发光二极管(LED)泵浦光。
固态照明是已知的。固态照明依赖于半导体材料以例如通过发光二极管产生光。其中,红色LED已知并使用铝铟镓磷化物或AlInGaP半导体材料。最近,Shuji Nakamura首先使用InGaN材料以产生发射蓝色光的LED。蓝色LED导致其他创新如固态白色发光和蓝色激光二极管。
已经提出并证明了基于InGaN材料系统的高强度紫外(UV)、蓝色、和绿色LED。通常在UV-紫色中效率最高,但当发射波长增加为蓝色或绿色时效率降低。不幸的是,实现高强度、高效率的基于InGaN的绿色LED存在问题。此外,基于InGaN的LED昂贵并且难以以有效的方式大范围地生产。虽然获得了成功,但是必须改进固态照明技术以充分发挥它们的潜能。
发明内容
本发明提供了具有多种磷光体的选择波长的泵浦LED光。在不同的实施方式中,使用发射在紫色和/或紫外波长下的辐射的LED来泵浦发射不同频率的光的磷光体材料。泵浦LED的特征在于,在正常操作下具有约405nm至430nm的峰值发射波长。它们至少连同在超过约405nm波长下具有强吸收的蓝色磷光体一起使用。在一些实施方式中,在不同波长范围内操作的LED以组合设置以减少辐射再吸收并提高光输出效率。
本发明提供了一种光学装置,所述光学装置包括安装构件(mountingmember)和覆盖(上覆,overlying)安装构件的一部分的至少一个发光二极管。该LED包括具有表面区域的含镓和氮的基板和覆盖表面区域的含镓和氮的缓冲层。有源区域发射峰值波长在从约405nm至约430nm范围内的电磁辐射。LED包括电触点(接触部)以向结区域(连接区域,junctionregion)提供电流。该装置另外包括在粘合剂材料内的三种磷光体材料的混合物。磷光体材料的混合物被设置在LED附近范围内并与来自LED的电磁辐射相互作用以将电磁辐射转换为在约440至650纳米之间的波长范围。在另一个实施方式中,该装置包括在LED装置附近范围内在比约405nm更长的波长下具有强吸收的蓝色磷光体材料。有源区域被构造成发射其峰值在约405至430纳米范围内的电磁辐射,同时在从约100°C至约150°C的操作温度范围内在至少100A/cm2的电流密度下维持约70%和更高的内量子效率(internal quantum efficiency)。
附图说明
图1示出在不同波长下发射的LED的效率特性;
图2和图3示出了蓝色磷光体的吸收特性和取决于LED的发射波长的相应白色LED性能;
图4示出了峰值发射在约405-430nm范围内的泵浦蓝色、红色、和绿色磷光体的LED。
图5示出了在450nm(左)和420nm(右)下发射的多量子阱LED中散布的载流子;
图6示出了构造成阵列的泵浦LED;
图7示出了构造成具有像素化(pixelated)磷光体组成的阵列的泵浦LED;
图8示出了构造成具有两种LED发射波长的阵列的泵浦LED;和
图9是示出根据本发明实施方式的双磷光体紫色泵浦白色LED的LED发射光谱简化图。
具体实施方式
本发明涉及照明系统并涉及具有多种磷光体的LED泵浦光的设备(provision)。使用发射在紫色和/或紫外波长下的辐射的LED来泵浦发射不同颜色的磷光体材料。优选地,泵浦LED具有在正常操作条件下约405至430nm的峰值发射波长。
如上面所提到的,常规的LED光源通常不充分。例如,产生高显色指数(CRI)的白色LED光的最常用的方法之一由在440-470nm范围内(通常称为泵浦LED)发射的LED装置组成,其激发两种磷光体:黄色/绿色磷光体和红色磷光体。这种方法是方便的,因为一些黄色/绿色磷光体,如Ce:YAG,具有高量子效率。
不幸地,这种方法也有限制。基于YAG的磷光体仅能够在约460nm的窄光谱范围内被有效激发,限制了可以使用的泵浦LED的波长范围。虽然可以在低电流密度下在这样的波长下产生高内量子效率(IQE)的LED装置,但它们的IQE在高电流密度下迅速下降。这是由于以下两个作用:(a)较大压电场(piezoelectric field)的存在,其减少了载流子重叠并因此增加了载流子的寿命,将IQE曲线移动至较低的电流密度(参考(ref));和(b)与约445nm下发射的厚有源区域相关的挑战(由于厚InGaN层的应变相关生长限制和在多量子阱系统中载流子散步困难两者引起的)。
图1示出了在不同波长下发射的LED的效率行为。与长波长LED(445nm和以上)相比,短波长LED(415-430nm)在较高的载流子密度下维持效率。图1获自“Influence of polarization fields on carrier lifetime andrecombination rates in InGaN-based light-emitting diodes”,A.David et al,Appl.Phys.Lett.97,033501(2010),其描述了在较长波长的LED中偏振场的增强。论文“Carrier distribution in(0001)InGaN/GaN multiple quantumwell light-emitting diodes”,A.David et al,Appl.Phys.Lett.92,053502(2008),讨论了450nm-泵浦LED中在量子阱之间散布载流子的困难。
来自泵浦LED的蓝色光对白色光谱有贡献。因此,通过磷光体发射的蓝色光的量需要良好的控制以实现给定的CCT。在磷光体组成/装载中需要解释泵浦LED的波长的变化。当制造白色LED时,解释波长差异可以是一项具有挑战性的任务。
对于440-nm泵浦LED的现有技术结果可以在论文“White lightemitting diodes with super-high luminous efficacy”,Y.Narukawa et al,J.Phys.D43,354002(2010)中找到。在室温和约100A/cm2的电流密度下,报道了65%的外量子效率。假设在室温和100°C的结温度之间的约90%的提取效率(extraction efficiency)和约10%的性能下降,这对应于在100A/cm2和100°C下约65%的IQE。
另一个传统的方法在于使用其发射峰值在395-405nm范围内的泵浦LED来泵浦三个或四个磷光体的系统。这是有利的,因为与445nm泵浦LED相比,400nm泵浦LED通常在更高的电流密度下保持更高的性能,这可能是由于较低的压电场和厚的有源区域引起的。
使用其最终光谱受到最终光谱中发射器(发射极)波长存在与否的影响最小(在颜色或亮度方面)的LED发射器提供了在驱动电流和温度下范围内非常稳定的性能。用于操作的装置范围的颜色稳定的磷光体材料的适当选择(如405nm发射器的光谱权重(spectral weight))仅为450nm的发射器的1.5%。420nm发射器的光谱权重仍仅为450nm发射器的10%。成品的磷光体转换LED的颜色和通量的稳定性相对于传统蓝色泵浦装置显著增加,其中最终光谱的多达20%由在450nm下的基础发射器组成。
靶向最终光谱中一定量的发射器光泄漏的需要的消除也在制造环境中提供了改进的得色量(color yield)。对于约405nm至430nm泵浦装置的制造磷光体沉积过程可以接受更多的工艺变化而不牺牲大容量彩色重复性。而这提供了以更高的生产能力进行制造过程而不会损失重复性。
与双组分颜色系统相比,三种或更多种组成颜色(芯片发射和至少两种磷光体)的使用为磷光体转换LED装置提供了较大的可调的色域。可以获得大范围的可调颜色和显色指数。双颜色组分白色LED就普朗克曲线(Planckian curve)仅具有一个的可能的横截面(一个点以实现平衡的白色光谱)而三个或更多个颜色系统提供了沿着普朗克曲线的无限可调性。
然而,这种方法受到各种限制:
1.在泵浦波长和磷光体波长之间的斯托克斯损失(Stokes loss)较大,因此在磷光体下变频过程中将损失更多的能量。400nm泵浦LED的相对较大的带隙导致较高的操作电压。400nm泵浦LED的有源区域中的降低的载流子限制使载流子更容易逃逸,并因此降低了高温性能。与在445nm下相比,大多数材料在400nm下具有显著更大的吸收(这是通常用于LED中的高反射率的金属如Al和Ag、硅酮、一些如GaN或SiC的基板、和Au丝焊的情况。),其降低了光提取效率。
2.没有集中开发用于380-430nm激发光的磷光体。这使得可用的磷光体材料的性能水平落后于采用使用材料诸如Y3Al5O12:Ce3+(YAG-黄色)和CaAlSiN:Eu2+(红色)的450nm泵浦LED的LED制造商所拥有的现有技术磷光体性能,其具有应用于其改进的时间和压力。
3.由于现有技术磷光体材料性能的这种偏移(offset),并非所有的可用的磷光体均可用于高性能LED装置。主要的实例是蓝色磷光体,其不适合用于所有芯片发射波长。图2中示出了两个蓝色发射磷光体的吸收特性。垂直线表示相对于这两个磷光体吸收曲线的405nm和420nm发射器的位置。虽然这两种材料在405nm下的吸收强度类似,但它们在420nm下明显不同。第一磷光体的吸收强度的这种减少显著地影响具有较长波长发射器的装置性能。在图3中示出这种性能变化。
本发明提供了具有高性能的白色LED光源。尤其是,本发明提供了高-CRI白色LED的新方法。例如,白色LED光源包括其峰值发射在约405nm至430nm范围内的一个或多个泵浦LED和三种或更多种磷光体(如蓝色、绿色和红色)的系统。通过磷光体发射产生基本上白色的光谱。
本发明的一个优点是由于适度的应变和压电场,约405nm至430nm的范围内的泵浦LED可以在高载流子密度下显示非常高的IQE(与400nm泵浦LED类似)。另一方面,有源区域中载流子限制显著提高,使得不会损害高温性能。与400nm LED相比,较低带隙也使得启动较低的正向电压。因此,从泵浦LED的性能出发,约405nm至430nm的范围是最佳的。对于这种LED(在100A/cm2的电流密度和100°C的结温度下)的高IQE性能可以优于70%并且甚至超过90%。这与如现有技术中描述的在440nm下发射的现有技术LED的约65%形成对比。
此外,在400nm和约405nm至430nm之间大多数材料中的光学吸收显著降低,产生了整体较高的光提取效率。此外,如上面所解释的,使用三种或更多种磷光体以产生白光在颜色控制和过程稳定性方面有利。蓝色磷光体在约405nm至430nm的范围内可获得有强吸收并且有高量子效率。在此波长范围内具有强吸收的蓝色发射磷光体的一些实例是BaMgAl10O17:Eu2+、Sr10(PO4)6Cl2:E、LaAl(Si6-zAlz)N10-zOz:Ce3+、a-赛隆:Ce3+(a-硅铝氧氮陶瓷:Ce3+,a-Sialon:Ce3+)、(Y,La)-Si-O-N:Ce3+、Gd1-xSr2+xAlO5-xFx:Ce3+。与400nm泵浦LED相比,斯托克斯损失也减轻。
图4示出了本发明的一个实施方式,其中,其峰值发射在约405nm至430nm的范围内的LED泵浦蓝色、红色和绿色磷光体。如在图4中所示,在基板或基台(submount)上提供泵浦LED源。例如,泵浦LED源发射在405nm至430nn波长下的辐射。泵浦LED源设置在磷光体材料的混合物中,其吸收由LED源发射的辐射。磷光体材料由泵浦LED激发并发射蓝色、绿色和红色的光。在一个优选的实施方式中,通过来自磷光体的辐射的组合,磷光体的混合物特别适合于发射白色光。将磷光体材料的混合物设置在对泵浦LED源和磷光体发射的光两者均基本上透明的密封剂中。
取决于应用,该密封剂可以包括各种类型的材料。在一个优选的实施方式中,专门配置密封剂以提高光提取效率。例如,密封剂材料可以包含聚合物物质。在一个优选的实施方式中,泵浦LED源发射在从约405nm至430nm的波长范围内的辐射并泵浦混合在一起的三种磷光体(例如,蓝色、绿色和红色磷光体),并且磷光体混合物将大部分泵浦LED源的光转换为波长较长的光。当然,磷光体混合物可以包含额外的磷光体,如可以添加琥珀色磷光体以提高CRI。
在各种实施方式中,由于温度的变化由LED发射的波长发生改变。例如,在室温下泵浦LED发射在约398nm波长下的辐射。当温度升高至约120°C时,泵浦LED发射约405nm的辐射。通常,高电流和/或高温是波长偏移的主要原因。例如,对于操作温度每增加23°C,由泵浦LED所发射的辐射的波长增加1nm。本发明的各种实施方式中使用的密封剂和磷光体材料可以补偿波长偏移。
图5示出了在450nm(左)和420nm(右)发射的多量子阱(MQW)LED中散布的载流子。在450nm的发射方案中,能量势垒(energy barrier)较大,其可阻碍量子阱之间空穴的散布。如所示的,电子或多或少地均匀散布,而空穴不是。与此相反,在420nm的发射方案中,能量势垒较低并且因此提高了空穴散布,从而增加了有源区域的有效容积。本发明的实施方式实现更好的载流子散布。更具体地,与450nm泵浦LED相比,可以降低载流子限制,其使得载流子能够更好地散布在MQW系统中。因此,可以采用厚的有源区域(例如,大于10nm厚或大于50nm厚)并跨越该有源区域有效地注入载流子,如图5中示出。
图6示出了本发明的一个实施方式,其中五个泵浦LED被设置在阵列中。在此实施中,LED在约405nm至430nm下发射。LED被配置有特别制造用于色彩转换的磷光体混合物。如上所述,磷光体混合物包含对泵浦LED发射的光具有高吸收的磷光体材料。例如,磷光体混合物包含下列材料中的一种或多种:BaMgAl10O17:Eu2+、Sr10(PO4)6Cl2:E、LaAl(Si6-zAlz)N10-zOz:Ce3+、a-赛隆:Ce3+、(Y,La)-Si-O-N:Ce3+、Gd1-xSr2+xAlO5-xFx:Ce3+。制备磷光体混合物用于将来自泵浦LED的光转换为其它颜色,如红色、绿色和/或蓝色的光。当将不同颜色的光组合时,优选产生基本上白色的光。将磷光体材料的混合物设置在密封剂中,所述密封剂对泵浦-LED和磷光体发射的光两者基本上透明。在一个优选的实施方式中,密封剂被专门构造成提高光提取效率并且由聚合物物质形成。
图7示出本发明的一个实施方式,其中泵浦LED被设置在阵列中,并且磷光体组成以像素化配置空间地变化。此处,单独的空间区域执行至红色、绿色、和蓝色的光的转换。如图7中所示,五个LED被设置在构造成泵浦磷光体材料的阵列中。不同颜色的单色磷光体材料吸收由LED发射的辐射并重新发射与磷光体材料相关的颜色的光。磷光体材料以像素化的方式设置在LED之上。专门创建像素化图案以产生发射的混合,其组合产生颜色基本上为白色的光。
在一个优选的实施方式中,LED发射基本上相同颜色的辐射(例如,波长约405nm至430nm),并且来自LED的辐射泵浦位于不同空间位置中的单色磷光体材料。而彩色的磷光体材料发射彩色的光。例如,如图7中所示,磷光体材料分别发射红色、绿色和蓝色的光。在图7所示的构造中,基于所需要的颜色和所使用的LED的类型,泵浦LED和/或磷光体的类型跨阵列可以变化。
图8示出本发明的一个实施方式,其中以阵列设置泵浦LED,并且采用两种LED发射波长。短波长LED(约405nm至430nm)泵浦红色和绿色磷光体,而较长波长LED(440nm至460nm)发射蓝色的光。如图8所示,5个LED装置形成位于基板或基台上的LED阵列。更具体地,中间的LED装置发射蓝色的光(例如,约440nm至460nm的波长),而其它LED装置发射基本上在紫色(例如,约405nm至430nm)波长范围内的辐射。将紫色LED装置设置在有色的磷光体材料中,其中LED装置泵浦发射有色的光,如红色光的磷光体材料。类似地,绿色磷光体材料,在吸收基本上紫色的辐射后,发射绿色光。蓝色的LED装置不设置在磷光体材料中,并且作为结果,直接发射由蓝色LED装置产生的蓝色光。
取决于应用,可以使用多个泵浦LED连同不构造成泵浦磷光体材料的蓝色或红色LED组合来以阵列几何设置LED。应当理解,图8所示的LED的设置可以帮助减少光吸收。例如,相对于400nm,在约405nm至430nm下模内吸收(inter-die absorption)减少(因为基板吸收较低),其是使用较长波长泵浦LED的另外的优点。
磷光体材料和LED装置的不同设置使得能够获得不同颜色的光。在一个优选的实施方式中,LED装置生长在非极性或半极性基板上。在一些实施方式中,LED装置可以生长在低位错密度基板(<1×107位错/cm2)上以使得在高电流密度和高温下能够可靠操作。
波长转换材料可以是陶瓷或半导体颗粒磷光体、陶瓷或半导体板磷光体、有机或无机的下变频器、上变频器(反斯托克斯)、纳米颗粒和提供波长转换的其它材料。以下列出了一些实例:
(Srn,Ca1-n)10(PO4)6*B2O3:Eu2+(其中0≤n≤1)
(Ba,Sr,Ca)5(PO4)3(Cl,F,Br,OH):Eu2+,Mn2+
(Ba,Sr,Ca)BPO5:Eu2+,Mn2+
Sr2Si3O8*2SrCl2:Eu2+
(Ca,Sr,Ba)3MgSi2O8:Eu2+,Mn2+
BaAl8O13:Eu2+
2SrO*0.84P2O5*0.16B2O3:Eu2+
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+
K2SiF6:Mn4+
(Ba,Sr,Ca)Al2O4:Eu2+
(Y,Gd,Lu,Sc,La)BO3:Ce3+,Tb3+
(Ba,Sr,Ca)2(Mg,Zn)Si2O7:Eu2+
(Mg,Ca,Sr,Ba,Zn)2Si1-xO4-2x:Eu2+(其中0≤x≤0.2)
(Sr,Ca,Ba)(Al,Ga)2S4:Eu2+
(Ca,Sr)8(Mg,Zn)(SiO4)4Cl2:Eu2+,Mn2+
Na2Gd2B2O7:Ce3+,Tb3+
(Sr,Ca,Ba,Mg,Zn)2P2O7:Eu2+,Mn2+
(Gd,Y,Lu,La)2O3:Eu3+,Bi3+
(Gd,Y,Lu,La)2O2S:Eu3+,Bi3+
(Gd,Y,Lu,La)VO4:Eu3+,Bi3+
(Ca,Sr)S:Eu2+,Ce3+
(Y,Gd,Tb,La,Sm,Pr,Lu)3(Sc,Al,Ga)5-nO12-3/2n:Ce3+(其中0≤n≤0.5)
ZnS:Cu+,Cl-
(Y,Lu,Th)3Al5O12:Ce3+
ZnS:Cu+,Al3+
ZnS:Ag+,Al3+
ZnS:Ag+,Cl-
(Ca,Sr)Ga2S4:Eu2+
SrY2S4:Eu2+
CaLa2S4:Ce3+
(Ba,Sr,Ca)MgP2O7:Eu2+,Mn2+
(Y,Lu)2WO6:Eu3+,Mo6+
CaWO4
(Y,Gd,La)2O2S:Eu3+
(Y,Gd,La)2O3:Eu3+
(Ba,Sr,Ca)nSinNn:Eu2+(其中2n+4=3n)
Ca3(SiO4)Cl2:Eu2+
(Y,Lu,Gd)2-nCanSi4N6+nC1-n:Ce3+,(其中0≤n≤0.5)
用Eu2+和/或Ce3+掺杂的(Lu,Ca,Li,Mg,Y)α-赛隆(SiAlON)
(Ca,Sr,Ba)SiO2N2:Eu2+,Ce3+
(Sr,Ca)AlSiN3:Eu2+
CaAlSi(ON)3:Eu2+
Sr10(PO4)6Cl2:Eu2+
(BaSi)O12N2:Eu2+
SrSi2(O,Cl)2N2:Eu2+
(Ba,Sr)Si2(O,Cl)2N2:Eu2+
LiM2O8:Eu3+其中M=(W或Mo)
在上面的清单中,可以理解,当磷光体具有两种或更多种的掺杂剂离子(即在上述磷光体的冒号之后的那些离子)时,这意味着磷光体在材料内具有那些掺杂剂离子的至少一种(但不一定是全部)。即,如本领域技术人员理解的,这种类型的表示法意味着磷光体可以包含那些特定的离子中的任何一种或全部作为制剂中的掺杂剂。
在一些实施方式中,基于量子点的磷光体用于色彩转换的用途。量子点材料是其尺寸和化学性质决定其发光特性的半导体和稀土掺杂氧化物纳米晶体家族。半导体量子点的典型的化学组成包括熟知的(ZnxCd1-x)Se[x=0..1]、(Znx,Cd1-x)Se[x=0..1]、Al(AsxP1-x)[x=0..1]、(Znx,Cd1-x)Te[x=0..1]、Ti(AsxP1-x)[x=0..1]、In(AsxP1-x)[x=0..1]、(AlxGa1-x)Sb[x=0..1]、(Hgx,Cd1-x)Te[x=0..1]闪锌矿半导体晶体结构。稀土掺杂氧化物纳米晶体的公开实例包括Y2O3:Sm3+、(Y,Gd)2O3:Eu3+、Y2O3:Bi、Y2O3:Tb、Gd2SiO5:Ce、Y2SiO5:Ce、Lu2SiO5:Ce、Y3Al5)12:Ce,但不应该排除其它简单的氧化物或正硅酸盐。
在一些实施方式中,本发明提供了双磷光体紫色泵浦白色LED,其能够用于照明。在一个特定的实施方式中,蓝绿色(cyan)磷光体和橙色磷光体与紫色泵浦LED芯片一起使用。例如,提供发射在约400~440nm的波长下的辐射的紫色芯片。在此构造中,两种磷光体的发射基本上确定了白色光的色度和颜色质量。例如,主要通过两种磷光体的混合物确定颜色,并且泵浦光的泄漏通常是最低的而且不是非常眼睛敏感的。这种方法结合了磷光体复杂性和使用双磷光体系统的简化颜色调节的成本降低的优势。此外,紫色泵浦的低眼睛敏感性确保了提供制造中具有高产量的颜色目标,这与蓝色泵浦系统的情况不同,在该情况中关于蓝色光泄漏的严密控制对于维持高容量制造中关于色度散布的严密控制是必需的。
图9是示出双磷光体紫色泵浦白色LED的发射光谱的示意图。在这个实例中,将来自Intematix公司的蓝绿色磷光体G1758TM和橙色磷光体O6040TM组合并由~420nm发射LED泵浦。可以理解,也可以使用其他类型的蓝绿色和橙色磷光体。在这种构造中其它磷光体组合和其它泵浦发射波长的选择是可能的。在图9中,相对于5%的泄漏的绝对水平,紫色泵浦LED泄漏变化+/-20%。对于所有三种情况,在约2700K的CCT下显色指数(CRI)为约83。三种光谱之间的色度的变化非常小,在u'、v'方面来自普朗克的总偏差小于0.004。流明效能为约301-305lm/Wopt。与较短波长泵浦LED相比,使用长波长泵浦芯片(例如,在420nm的情况下)的配置一个益处是,其增加光提取效率和封装效率,降低正向电压和斯托克斯损失。此外,通过避免蓝色磷光体,这种配置去除了效率损失的一个分量,降低了整体磷光体装载,并降低了成本和复杂性。
虽然上面是具体实施方式的全面描述,但是可以使用各种修改、替代构造、和等价物。因此,上面的描述和说明不应被视为限制由所附权利要求书所限定的本发明的范围。

Claims (21)

1.一种光学装置,包括:
安装构件;
提供覆盖所述安装构件的一部分的至少一个发光二极管(LED);所述LED包括具有表面区域的含镓和氮的基板;覆盖所述表面区域的含镓和氮的缓冲层;包含有源区域的结区域,所述有源区域被构造成发射在由约405至约430纳米组成的范围内的电磁辐射;和耦接到所述结区域以提供能够引起所述有源区域发射所述电磁辐射的电流的第一电接触区域和第二电接触区域;以及
在粘合剂材料内的包含第一磷光体材料、第二磷光体材料、和第三磷光体材料的磷光体材料的混合物,所述磷光体材料的混合物被设置在所述LED附近范围内并被构造成与所述电磁辐射相互作用以基本上将在约405至430nm范围内的电磁辐射转换为在约440至650nm之间范围内的波长。
2.根据权利要求1所述的装置,其中,所述含镓和氮的基板的特征在于非极性或半极性取向。
3.根据权利要求1所述的装置,其中,所述含镓和氮的基板是本体GaN基板。
4.根据权利要求1所述的装置,其中,所述LED在至少100A/cm2和更大的电流密度下驱动。
5.根据权利要求1所述的装置,其中,所述LED具有至少50的流明/瓦效率。
6.根据权利要求1所述的装置,其中,以阵列构造提供多个LED。
7.根据权利要求6所述的装置,其中,所述LED的波长跨所述阵列而变化。
8.根据权利要求1所述的装置,其中,所述第一磷光体材料包含蓝色磷光体。
9.根据权利要求1所述的装置,其中,所述第一磷光体材料包含内量子效率能够为至少70%的蓝色磷光体。
10.根据权利要求1所述的装置,其中,所述第一磷光体材料包含吸收系数在从1到40cm-1的范围内的蓝色磷光体。
11.根据权利要求1所述的装置,其中,所述第一磷光体材料包含峰值发射波长在440nm至480nm之间范围内并且光谱FWHM为至少10nm的蓝色磷光体。
12.根据权利要求1所述的装置,其中,所述第一磷光体材料包含内量子效率为至少70%、吸收系数在从1至40cm-1的范围内、峰值发射波长在440nm至480nm之间的范围内并且光谱FWHM大于10nm的蓝色磷光体。
13.根据权利要求1所述的装置,其中,所述第一磷光体材料包含选自下述的蓝色磷光体:BaMgAl10O17:Eu2+、Sr2P2O7:Eu2+、Sr6P5BO20:Eu2+、(SrCa)2B5O9Cl:Eu2+、SR5CL(PO4)3:Eu2+、Ca2P2O7:Eu2+、ZnS:Ag,Cl、Sr10(PO4)6Cl2:E、LaAl(Si6-zAlz)N10-zOz:Ce3+、a-赛隆:Ce3+、(Y,La)-Si-O-N:Ce3+、Gd1-xSr2+xAlO5-xFx:Ce3+[x=0..6]。
14.根据权利要求1所述的装置,其中,所述磷光体混合物被平衡以产生平均显色性为至少75的普朗克曲线(du’v’<.01)之上或附近的辐射。
15.根据权利要求1所述的装置,其中,所述有源区域被构造成以至少100A/cm2的电流密度注入并在至少100°C的结温度下维持约70%和更高的内量子效率。
16.根据权利要求1所述的装置,其中,所述有源区域被构造成在至少100A/cm2的电流密度和至少85°C的温度下发射内量子效率为至少70%的在从约405至430纳米范围内的电磁辐射;因此来自所述有源区域的所述电磁辐射基本上没有小于405且大于440纳米范围的波长。
17.根据权利要求1所述的装置,其中,磷光体的组成在所述装置的水平或垂直方向上变化。
18.一种光学装置,包括:
设置在安装构件的一部分上的至少一个发光二极管(LED);所述LED具有带有表面区域的含镓和氮的基板;覆盖所述表面区域的含镓和氮的缓冲层;包含有源区域的结区域,所述有源区域发射在由约405至430纳米组成的范围内的电磁辐射;和耦接到所述结区域以提供引起所述有源区域发射电磁辐射的电流的第一电接触区域和第二电接触区域;
设置在所述LED附近的颜色转换材料;以及
其中,所述有源区域被构造成发射从约405至430纳米的电磁辐射,同时至少减少压电场影响以引起所述有源区域输出至少100安培/平方厘米并维持至少约70%的内量子效率和从约85°C至约150°C范围的温度;并且因此所述电磁辐射基本上没有小于405且大于440纳米范围的波长。
19.根据权利要求18所述的装置,其中,所述含镓和氮的基板是本体GaN,所述本体GaN选自半极性取向、非极性取向、或极性取向。
20.根据权利要求18所述的装置,其中,所述含镓和氮的基板的特征在于小于1E7cm-2的位错密度。
21.根据权利要求18所述的装置,包括第一颜色转换材料和第二转换材料,所述第一颜色转换材料和第二颜色转换材料与不同波长有关。
CN201180040221.6A 2010-08-19 2011-08-19 用于具有多种磷光体的选择泵浦led的系统和方法 Active CN103069582B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710543269.8A CN107256861B (zh) 2010-08-19 2011-08-19 用于具有多种磷光体的选择泵浦led的系统和方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37509710P 2010-08-19 2010-08-19
US61/375,097 2010-08-19
US201161502212P 2011-06-28 2011-06-28
US61/502,212 2011-06-28
PCT/US2011/048499 WO2012024636A2 (en) 2010-08-19 2011-08-19 System and method for selected pump leds with multiple phosphors

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710543269.8A Division CN107256861B (zh) 2010-08-19 2011-08-19 用于具有多种磷光体的选择泵浦led的系统和方法

Publications (2)

Publication Number Publication Date
CN103069582A true CN103069582A (zh) 2013-04-24
CN103069582B CN103069582B (zh) 2017-07-28

Family

ID=45593349

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710543269.8A Active CN107256861B (zh) 2010-08-19 2011-08-19 用于具有多种磷光体的选择泵浦led的系统和方法
CN201180040221.6A Active CN103069582B (zh) 2010-08-19 2011-08-19 用于具有多种磷光体的选择泵浦led的系统和方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201710543269.8A Active CN107256861B (zh) 2010-08-19 2011-08-19 用于具有多种磷光体的选择泵浦led的系统和方法

Country Status (6)

Country Link
US (4) US9293667B2 (zh)
JP (3) JP2013536583A (zh)
KR (5) KR20190044144A (zh)
CN (2) CN107256861B (zh)
DE (1) DE112011102386T5 (zh)
WO (1) WO2012024636A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107430222A (zh) * 2015-03-20 2017-12-01 沙特基础工业全球技术公司 包括微孔结构且具有改善的反射率的反射物品

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100006873A1 (en) * 2008-06-25 2010-01-14 Soraa, Inc. HIGHLY POLARIZED WHITE LIGHT SOURCE BY COMBINING BLUE LED ON SEMIPOLAR OR NONPOLAR GaN WITH YELLOW LED ON SEMIPOLAR OR NONPOLAR GaN
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
US8207554B2 (en) 2009-09-11 2012-06-26 Soraa, Inc. System and method for LED packaging
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
US20130313516A1 (en) * 2012-05-04 2013-11-28 Soraa, Inc. Led lamps with improved quality of light
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US9293644B2 (en) 2009-09-18 2016-03-22 Soraa, Inc. Power light emitting diode and method with uniform current density operation
US8575642B1 (en) 2009-10-30 2013-11-05 Soraa, Inc. Optical devices having reflection mode wavelength material
US8905588B2 (en) * 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110215348A1 (en) * 2010-02-03 2011-09-08 Soraa, Inc. Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110186874A1 (en) * 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
US8192051B2 (en) 2010-11-01 2012-06-05 Quarkstar Llc Bidirectional LED light sheet
US8896235B1 (en) 2010-11-17 2014-11-25 Soraa, Inc. High temperature LED system using an AC power source
US8541951B1 (en) 2010-11-17 2013-09-24 Soraa, Inc. High temperature LED system using an AC power source
US10036544B1 (en) 2011-02-11 2018-07-31 Soraa, Inc. Illumination source with reduced weight
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
US8410726B2 (en) 2011-02-22 2013-04-02 Quarkstar Llc Solid state lamp using modular light emitting elements
US9290618B2 (en) 2011-08-05 2016-03-22 Sabic Global Technologies B.V. Polycarbonate compositions having enhanced optical properties, methods of making and articles comprising the polycarbonate compositions
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US9488324B2 (en) 2011-09-02 2016-11-08 Soraa, Inc. Accessories for LED lamp systems
US9109760B2 (en) 2011-09-02 2015-08-18 Soraa, Inc. Accessories for LED lamps
US8962117B2 (en) 2011-10-27 2015-02-24 Sabic Global Technologies B.V. Process for producing bisphenol A with reduced sulfur content, polycarbonate made from the bisphenol A, and containers formed from the polycarbonate
EP2795674B1 (en) * 2011-12-22 2021-12-15 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules, in particular flash modules, and method for manufacturing the same
WO2013116697A1 (en) 2012-02-03 2013-08-08 Sabic Innovative Plastics Ip B.V. Light emitting diode device and method for production thereof containing conversion material chemistry
US9287471B2 (en) 2012-02-29 2016-03-15 Sabic Global Technologies B.V. Polycarbonate compositions containing conversion material chemistry and having enhanced optical properties, methods of making and articles comprising the same
EP2819981B1 (en) 2012-02-29 2016-12-21 SABIC Global Technologies B.V. Process for producing low sulfur bisphenol a, processes for producing polycarbonate, articles made from polycarbonate
US9269876B2 (en) 2012-03-06 2016-02-23 Soraa, Inc. Light emitting diodes with low refractive index material layers to reduce light guiding effects
US9346949B2 (en) 2013-02-12 2016-05-24 Sabic Global Technologies B.V. High reflectance polycarbonate
WO2013170016A1 (en) * 2012-05-09 2013-11-14 The Regents Of The University Of California Light-emitting diodes with low temperature dependence
US10436422B1 (en) 2012-05-14 2019-10-08 Soraa, Inc. Multi-function active accessories for LED lamps
US9995439B1 (en) 2012-05-14 2018-06-12 Soraa, Inc. Glare reduced compact lens for high intensity light source
US9360190B1 (en) 2012-05-14 2016-06-07 Soraa, Inc. Compact lens for high intensity light source
US10145026B2 (en) 2012-06-04 2018-12-04 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules
US9686867B2 (en) 2012-09-17 2017-06-20 Massachussetts Institute Of Technology Foldable machines
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
WO2014066784A1 (en) 2012-10-25 2014-05-01 Sabic Innovative Plastics Ip B.V. Light emitting diode devices, method of manufacture, uses thereof
DE102012219873A1 (de) 2012-10-30 2014-05-15 Osram Gmbh Lichtsystem mit Farbort-Stabilisierung
US9215764B1 (en) 2012-11-09 2015-12-15 Soraa, Inc. High-temperature ultra-low ripple multi-stage LED driver and LED control circuits
US9761763B2 (en) 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
US9326350B2 (en) * 2013-02-07 2016-04-26 Everlight Electronics Co., Ltd. Light-emitting device with multi-color temperature and multi-loop configuration
US9267661B1 (en) 2013-03-01 2016-02-23 Soraa, Inc. Apportioning optical projection paths in an LED lamp
US9435525B1 (en) 2013-03-08 2016-09-06 Soraa, Inc. Multi-part heat exchanger for LED lamps
US9219204B1 (en) 2013-03-11 2015-12-22 Rayvio Corporation Semiconductor device and a method of making a semiconductor device
JP6391669B2 (ja) * 2013-04-04 2018-09-19 サーケイディアン・ザークライト・インコーポレーテッド 概日神経内分泌機能を保護するための照明システム
TWI594661B (zh) * 2013-04-19 2017-08-01 隆達電子股份有限公司 發光二極體顯示器及其製造方法
WO2014186548A1 (en) 2013-05-16 2014-11-20 Sabic Innovative Plastics Ip B.V. Branched polycarbonate compositions having conversion material chemistry and articles thereof
KR101739756B1 (ko) 2013-05-29 2017-06-08 사빅 글로벌 테크놀러지스 비.브이. 색 안정성 열가소성 조성물
CN105492519B (zh) 2013-05-29 2018-03-09 沙特基础全球技术有限公司 具有颜色稳定的热塑性光传输制品的照明设备
US9410664B2 (en) 2013-08-29 2016-08-09 Soraa, Inc. Circadian friendly LED light source
US9419189B1 (en) * 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
DE102013113188A1 (de) * 2013-11-28 2015-05-28 Osram Gmbh Lumineszenzkonversionselement und optoelektronisches Halbleiterbauteil mit einem solchen Lumineszenzkonversionselement
JP6306264B2 (ja) 2014-09-11 2018-04-04 フィリップス ライティング ホールディング ビー ヴィ 向上された演白性及び変換効率を備えるpc−ledモジュール
DE102015101413B4 (de) * 2015-01-30 2020-03-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Leuchtmittel mit veränderbarer Emission und Verfahren zum gesteuerten Verändern des Farbeindrucks einer Lichtquelle
CN107407749A (zh) * 2015-03-20 2017-11-28 沙特基础工业全球技术公司 包括微孔结构且具有改善的反射率的反射物品
EP3314986A1 (en) 2015-06-26 2018-05-02 Kenall Manufacturing Company Single-emitter lighting device that outputs a minimum amount of power to produce integrated radiance values sufficient for deactivating pathogens
US10363325B2 (en) 2015-06-26 2019-07-30 Kenall Manufacturing Company Lighting device that deactivates dangerous pathogens while providing visually appealing light
US11273324B2 (en) 2015-07-14 2022-03-15 Illumipure Corp LED structure and luminaire for continuous disinfection
US20170014538A1 (en) * 2015-07-14 2017-01-19 Juha Rantala LED structure and luminaire for continuous disinfection
US10357582B1 (en) * 2015-07-30 2019-07-23 Vital Vio, Inc. Disinfecting lighting device
DE112016003453T5 (de) 2015-07-30 2018-04-12 Vital Vio, Inc. Einzeldiodendesinfektion
US10918747B2 (en) 2015-07-30 2021-02-16 Vital Vio, Inc. Disinfecting lighting device
JP6384468B2 (ja) 2015-12-22 2018-09-05 日亜化学工業株式会社 発光装置
DE102016104875A1 (de) * 2016-03-16 2017-09-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Blitzlichtbeleuchtung für ein tragbares Gerät
JP6477779B2 (ja) * 2016-05-26 2019-03-06 日亜化学工業株式会社 発光装置
US20200313049A1 (en) * 2016-06-21 2020-10-01 Soraa, Inc. Light emitting diode package
US10422501B2 (en) * 2016-12-14 2019-09-24 Ford Global Technologies, Llc Vehicle lighting assembly
KR20180090002A (ko) * 2017-02-02 2018-08-10 서울반도체 주식회사 발광 다이오드 패키지
JP7263247B2 (ja) 2017-03-17 2023-04-24 シーボロー・アイピー・アイ.・ビー.ブイ. コンバーター系
JP7164800B2 (ja) 2017-09-28 2022-11-02 日亜化学工業株式会社 発光装置
DE102017122936A1 (de) * 2017-10-04 2019-04-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
US10835627B2 (en) 2017-12-01 2020-11-17 Vital Vio, Inc. Devices using flexible light emitting layer for creating disinfecting illuminated surface, and related method
US10309614B1 (en) 2017-12-05 2019-06-04 Vital Vivo, Inc. Light directing element
CN108150968A (zh) * 2017-12-26 2018-06-12 中华映管股份有限公司 反射膜
US10413626B1 (en) 2018-03-29 2019-09-17 Vital Vio, Inc. Multiple light emitter for inactivating microorganisms
US10662310B2 (en) * 2018-04-24 2020-05-26 Osram Opto Semiconductors Gmbh Optoelectronic component having a conversation element with a high refractive index
CN109382333B (zh) * 2018-11-05 2021-01-22 厦门乾照光电股份有限公司 一种led外延片的选片方法
US11639897B2 (en) 2019-03-29 2023-05-02 Vyv, Inc. Contamination load sensing device
WO2020224787A1 (en) * 2019-05-09 2020-11-12 Osram Opto Semiconductors Gmbh Radiation-emitting device
US11541135B2 (en) 2019-06-28 2023-01-03 Vyv, Inc. Multiple band visible light disinfection
WO2021030748A1 (en) 2019-08-15 2021-02-18 Vital Vio, Inc. Devices configured to disinfect interiors
US11878084B2 (en) 2019-09-20 2024-01-23 Vyv, Inc. Disinfecting light emitting subcomponent
US11499707B2 (en) 2020-04-13 2022-11-15 Calyxpure, Inc. Light fixture having a fan and ultraviolet sterilization functionality
DE102020112115A1 (de) 2020-05-05 2021-11-11 Elringklinger Ag Elektrochemische Zelle
US20210351226A1 (en) 2020-05-05 2021-11-11 Raysolve Optoelectronics (Suzhou) Company Limited Full color light emitting diode structure and method for manufacturing the same
DE102020112118A1 (de) 2020-05-05 2021-11-11 Elringklinger Ag Temperaturdetektionsvorrichtung und elektrochemisches System
CN115769392A (zh) * 2020-09-11 2023-03-07 Ams-欧司朗国际有限公司 光电子器件和用于鉴别光电子器件的方法
US11759540B2 (en) 2021-05-11 2023-09-19 Calyxpure, Inc. Portable disinfection unit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
US20060068154A1 (en) * 2004-01-15 2006-03-30 Nanosys, Inc. Nanocrystal doped matrixes
US20070181895A1 (en) * 2004-03-18 2007-08-09 Hideo Nagai Nitride based led with a p-type injection region
WO2010017148A1 (en) * 2008-08-04 2010-02-11 Soraa, Inc. White light devices using non-polar or semipolar gallium containing materials and phosphors

Family Cites Families (193)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH086086B2 (ja) * 1985-09-30 1996-01-24 株式会社リコー 白色エレクトロルミネツセンス素子
FR2597851B1 (fr) * 1986-04-29 1990-10-26 Centre Nat Rech Scient Nouveaux borates mixtes a base de terres rares, leur preparation et leur application comme luminophores
DE3740280A1 (de) * 1987-11-27 1989-06-01 Hoechst Ag Verfahren zur herstellung von n,n'-dimethyl-perylen-3,4,9,10-tetracarbonsaeurediimid in hochdeckender pigmentform
US5120051A (en) * 1988-01-11 1992-06-09 Greenberg S Elliot Arm exercise device
US4918497A (en) * 1988-12-14 1990-04-17 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
US5142387A (en) 1990-04-11 1992-08-25 Mitsubishi Denki Kabushiki Kaisha Projection-type display device having light source means including a first and second concave mirrors
US5077161A (en) * 1990-05-31 1991-12-31 Xerox Corporation Imaging members with bichromophoric bisazo perylene photoconductive materials
JP2593960B2 (ja) * 1990-11-29 1997-03-26 シャープ株式会社 化合物半導体発光素子とその製造方法
JP2666228B2 (ja) * 1991-10-30 1997-10-22 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
US5208462A (en) * 1991-12-19 1993-05-04 Allied-Signal Inc. Wide bandwidth solid state optical source
US5211467A (en) * 1992-01-07 1993-05-18 Rockwell International Corporation Fluorescent lighting system
US6137217A (en) * 1992-08-28 2000-10-24 Gte Products Corporation Fluorescent lamp with improved phosphor blend
US5518808A (en) * 1992-12-18 1996-05-21 E. I. Du Pont De Nemours And Company Luminescent materials prepared by coating luminescent compositions onto substrate particles
PL173917B1 (pl) 1993-08-10 1998-05-29 Ct Badan Wysokocisnieniowych P Sposób wytwarzania krystalicznej struktury wielowarstwowej
EP0647730B1 (en) * 1993-10-08 2002-09-11 Mitsubishi Cable Industries, Ltd. GaN single crystal
US6440823B1 (en) 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
US5679152A (en) 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
JP2596709B2 (ja) * 1994-04-06 1997-04-02 都築 省吾 半導体レーザ素子を用いた照明用光源装置
IL117403A (en) 1996-03-07 2000-06-29 Rogozinksi Joseph Systems for the prevention of traffic blinding
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
DE19640594B4 (de) 1996-10-01 2016-08-04 Osram Gmbh Bauelement
JP3772801B2 (ja) 1996-11-05 2006-05-10 日亜化学工業株式会社 発光ダイオード
US6104450A (en) 1996-11-07 2000-08-15 Sharp Kabushiki Kaisha Liquid crystal display device, and methods of manufacturing and driving same
JP3378465B2 (ja) 1997-05-16 2003-02-17 株式会社東芝 発光装置
JP3653950B2 (ja) * 1997-05-21 2005-06-02 松下電器産業株式会社 窒化ガリウム系化合物半導体発光素子および窒化ガリウム系化合物半導体薄膜の製造方法
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5962971A (en) * 1997-08-29 1999-10-05 Chen; Hsing LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights
US6340824B1 (en) 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
US6633120B2 (en) 1998-11-19 2003-10-14 Unisplay S.A. LED lamps
TW417315B (en) 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
ES2299260T5 (es) * 1998-09-28 2011-12-20 Koninklijke Philips Electronics N.V. Sistema de iluminación.
JP2001144331A (ja) 1999-09-02 2001-05-25 Toyoda Gosei Co Ltd 発光装置
US6504301B1 (en) * 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
JP4145437B2 (ja) 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
US6466135B1 (en) * 2000-05-15 2002-10-15 General Electric Company Phosphors for down converting ultraviolet light of LEDs to blue-green light
JP2001356701A (ja) 2000-06-15 2001-12-26 Fuji Photo Film Co Ltd 光学素子、光源ユニットおよび表示装置
JP3968968B2 (ja) 2000-07-10 2007-08-29 住友電気工業株式会社 単結晶GaN基板の製造方法
US7102158B2 (en) * 2000-10-23 2006-09-05 General Electric Company Light-based system for detecting analytes
JP2002217454A (ja) 2001-01-19 2002-08-02 Matsushita Electric Ind Co Ltd Ledアレー及びこれを用いたled表示装置
JP4116260B2 (ja) 2001-02-23 2008-07-09 株式会社東芝 半導体発光装置
US6635904B2 (en) 2001-03-29 2003-10-21 Lumileds Lighting U.S., Llc Indium gallium nitride smoothing structures for III-nitride devices
US6488767B1 (en) 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
US6642652B2 (en) * 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
US7486413B2 (en) 2001-07-23 2009-02-03 Genoa Color Technologies Ltd. System and method for displaying an image
DE10137042A1 (de) 2001-07-31 2003-02-20 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Planare Lichtquelle auf LED-Basis
JP3864870B2 (ja) 2001-09-19 2007-01-10 住友電気工業株式会社 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法
JP3801125B2 (ja) 2001-10-09 2006-07-26 住友電気工業株式会社 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
JP4280038B2 (ja) * 2002-08-05 2009-06-17 日亜化学工業株式会社 発光装置
JP2004047748A (ja) 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
JP2004128444A (ja) * 2002-07-31 2004-04-22 Shin Etsu Handotai Co Ltd 発光素子及びそれを用いた照明装置
US20050218780A1 (en) 2002-09-09 2005-10-06 Hsing Chen Method for manufacturing a triple wavelengths white LED
JP2006500767A (ja) 2002-09-19 2006-01-05 クリー インコーポレイテッド 発光ダイオード及びその製造方法
JP3910517B2 (ja) 2002-10-07 2007-04-25 シャープ株式会社 Ledデバイス
US7009199B2 (en) 2002-10-22 2006-03-07 Cree, Inc. Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current
EP1576671A4 (en) 2002-12-16 2006-10-25 Univ California NON-POLAR PLANAR GALLIUM NITRIDE GROWTH AND PLANAR GEOMETRY BY HYDRIDE VAPOR EPITAXY
JP2004207519A (ja) 2002-12-25 2004-07-22 Toyoda Gosei Co Ltd 発光装置
US7118438B2 (en) 2003-01-27 2006-10-10 3M Innovative Properties Company Methods of making phosphor based light sources having an interference reflector
US7091661B2 (en) 2003-01-27 2006-08-15 3M Innovative Properties Company Phosphor based light sources having a reflective polarizer
US7042020B2 (en) 2003-02-14 2006-05-09 Cree, Inc. Light emitting device incorporating a luminescent material
JP2004273798A (ja) 2003-03-10 2004-09-30 Toyoda Gosei Co Ltd 発光デバイス
WO2004084275A2 (en) 2003-03-18 2004-09-30 Crystal Photonics, Incorporated Method for making group iii nitride devices and devices produced thereby
CN1538534A (zh) 2003-04-15 2004-10-20 郑荣彬 白光发光装置
US20040206970A1 (en) 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
KR101148332B1 (ko) 2003-04-30 2012-05-25 크리, 인코포레이티드 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7157745B2 (en) 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
US7246919B2 (en) 2004-03-03 2007-07-24 S.C. Johnson & Son, Inc. LED light bulb with active ingredient emission
JP2005085942A (ja) 2003-09-08 2005-03-31 Seiko Epson Corp 光モジュール、光伝送装置
DE602004019169D1 (de) 2003-09-22 2009-03-12 Fujifilm Corp Feine organische Pigmentpartikel und Verfahren zu deren Herstellung
US7323256B2 (en) 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
US7318651B2 (en) 2003-12-18 2008-01-15 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Flash module with quantum dot light conversion
US20060038542A1 (en) 2003-12-23 2006-02-23 Tessera, Inc. Solid state lighting device
US20050285128A1 (en) 2004-02-10 2005-12-29 California Institute Of Technology Surface plasmon light emitter structure and method of manufacture
US7675231B2 (en) 2004-02-13 2010-03-09 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting diode display device comprising a high temperature resistant overlay
US7250715B2 (en) 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices
US20050199899A1 (en) 2004-03-11 2005-09-15 Ming-Der Lin Package array and package unit of flip chip LED
US7083302B2 (en) * 2004-03-24 2006-08-01 J. S. Technology Co., Ltd. White light LED assembly
US8035113B2 (en) 2004-04-15 2011-10-11 The Trustees Of Boston University Optical devices featuring textured semiconductor layers
KR100718188B1 (ko) 2004-05-07 2007-05-15 삼성코닝 주식회사 비극성 a면 질화물 반도체 단결정 기판 및 이의 제조방법
US6956246B1 (en) 2004-06-03 2005-10-18 Lumileds Lighting U.S., Llc Resonant cavity III-nitride light emitting devices fabricated by growth substrate removal
US7361938B2 (en) 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US8227820B2 (en) 2005-02-09 2012-07-24 The Regents Of The University Of California Semiconductor light-emitting device
US8194006B2 (en) 2004-08-23 2012-06-05 Semiconductor Energy Laboratory Co., Ltd. Display device, driving method of the same, and electronic device comprising monitoring elements
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
CN100547815C (zh) * 2004-12-24 2009-10-07 株式会社东芝 白色led、背光和液晶显示器
KR100893348B1 (ko) 2004-12-24 2009-04-15 가부시끼가이샤 도시바 백색 led 및 그것을 사용한 백라이트 및 액정 표시 장치
JP2006186022A (ja) 2004-12-27 2006-07-13 Toyoda Gosei Co Ltd 発光装置
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US8318519B2 (en) 2005-01-11 2012-11-27 SemiLEDs Optoelectronics Co., Ltd. Method for handling a semiconductor wafer assembly
US7646033B2 (en) 2005-01-11 2010-01-12 Semileds Corporation Systems and methods for producing white-light light emitting diodes
CN101138278A (zh) 2005-03-09 2008-03-05 皇家飞利浦电子股份有限公司 包括辐射源和荧光材料的照明系统
TWI453813B (zh) 2005-03-10 2014-09-21 Univ California 用於生長平坦半極性的氮化鎵之技術
JP4592457B2 (ja) 2005-03-17 2010-12-01 シャープ株式会社 赤色蛍光体およびこれを用いた発光装置
JP4104013B2 (ja) 2005-03-18 2008-06-18 株式会社フジクラ 発光デバイス及び照明装置
TWI413274B (zh) * 2005-03-18 2013-10-21 Mitsubishi Chem Corp 發光裝置,白色發光裝置,照明裝置及影像顯示裝置
JP5721921B2 (ja) * 2005-03-28 2015-05-20 三菱化学株式会社 白色発光装置及び照明装置
JP5076282B2 (ja) 2005-04-28 2012-11-21 三菱化学株式会社 表示装置
KR100704492B1 (ko) 2005-05-02 2007-04-09 한국화학연구원 형광체를 이용한 백색 발광 다이오드의 제조 방법
US7358543B2 (en) 2005-05-27 2008-04-15 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device
CN100517781C (zh) * 2005-05-30 2009-07-22 夏普株式会社 发光器件及其制造方法
US8148713B2 (en) 2008-04-04 2012-04-03 The Regents Of The University Of California Method for fabrication of semipolar (Al, In, Ga, B)N based light emitting diodes
US20070018182A1 (en) * 2005-07-20 2007-01-25 Goldeneye, Inc. Light emitting diodes with improved light extraction and reflectivity
US20070086916A1 (en) 2005-10-14 2007-04-19 General Electric Company Faceted structure, article, sensor device, and method
US20070138505A1 (en) 2005-12-12 2007-06-21 Kyma Technologies, Inc. Low defect group III nitride films useful for electronic and optoelectronic devices and methods for making the same
JP4726633B2 (ja) 2006-01-11 2011-07-20 シャープ株式会社 発光素子の製造方法
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
CN101009347A (zh) 2006-01-27 2007-08-01 中国科学院物理研究所 硅(102)衬底上生长的非极性a面氮化物薄膜及其制法和用途
RU2315135C2 (ru) 2006-02-06 2008-01-20 Владимир Семенович Абрамов Метод выращивания неполярных эпитаксиальных гетероструктур на основе нитридов элементов iii группы
DE502006004123D1 (de) 2006-02-24 2009-08-13 Sefar Ag Flächenheizelement und Verfahren zur Herstellung eines Flächenheizelementes
JP4790651B2 (ja) 2006-03-23 2011-10-12 昭和電工株式会社 面光源装置およびその面光源装置を用いた表示装置
KR101263934B1 (ko) 2006-05-23 2013-05-10 엘지디스플레이 주식회사 발광다이오드 및 그의 제조방법
US7703945B2 (en) 2006-06-27 2010-04-27 Cree, Inc. Efficient emitting LED package and method for efficiently emitting light
US20090273005A1 (en) 2006-07-24 2009-11-05 Hung-Yi Lin Opto-electronic package structure having silicon-substrate and method of forming the same
US7859002B2 (en) 2006-08-09 2010-12-28 Panasonic Corporation Light-emitting device
CN101554089A (zh) 2006-08-23 2009-10-07 科锐Led照明科技公司 照明装置和照明方法
US7705276B2 (en) 2006-09-14 2010-04-27 Momentive Performance Materials Inc. Heater, apparatus, and associated method
US8362603B2 (en) 2006-09-14 2013-01-29 Luminus Devices, Inc. Flexible circuit light-emitting structures
JP2008091488A (ja) 2006-09-29 2008-04-17 Rohm Co Ltd 窒化物半導体製造方法
US7642122B2 (en) 2006-10-08 2010-01-05 Momentive Performance Materials Inc. Method for forming nitride crystals
EP2100990A1 (en) 2006-10-16 2009-09-16 Mitsubishi Chemical Corporation Process for producing nitride semiconductor, crystal growth rate enhancement agent, nitride single crystal, wafer and device
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
US7521862B2 (en) 2006-11-20 2009-04-21 Philips Lumileds Lighting Co., Llc Light emitting device including luminescent ceramic and light-scattering material
JP2008141118A (ja) 2006-12-05 2008-06-19 Rohm Co Ltd 半導体白色発光装置
WO2008073400A1 (en) 2006-12-11 2008-06-19 The Regents Of The University Of California Transparent light emitting diodes
WO2008073435A1 (en) 2006-12-11 2008-06-19 The Regents Of The University Of California Lead frame for transparent and mirrorless light emitting diode
JP2008159606A (ja) 2006-12-20 2008-07-10 Rohm Co Ltd 窒化物半導体発光素子およびその製造方法
US20080149166A1 (en) 2006-12-21 2008-06-26 Goldeneye, Inc. Compact light conversion device and light source with high thermal conductivity wavelength conversion material
US7902564B2 (en) 2006-12-22 2011-03-08 Koninklijke Philips Electronics N.V. Multi-grain luminescent ceramics for light emitting devices
JP2008192797A (ja) 2007-02-05 2008-08-21 Sony Corp 光源モジュール及びその製造方法、光源装置、並びに液晶表示装置
JP2008198650A (ja) 2007-02-08 2008-08-28 Toshiba Discrete Technology Kk 半導体発光素子及び半導体発光装置
TW200834962A (en) 2007-02-08 2008-08-16 Touch Micro System Tech LED array package structure having Si-substrate and method of making the same
US8110425B2 (en) 2007-03-20 2012-02-07 Luminus Devices, Inc. Laser liftoff structure and related methods
US20080258165A1 (en) * 2007-04-23 2008-10-23 Goldeneye, Inc. Light emitting diode chip
JP2008311532A (ja) * 2007-06-15 2008-12-25 Rohm Co Ltd 白色発光装置及び白色発光装置の形成方法
JP4925119B2 (ja) * 2007-06-21 2012-04-25 シャープ株式会社 酸化物蛍光体および発光装置
JP2010534411A (ja) 2007-07-25 2010-11-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 色変換素子、及び色制御が可能な光出力装置
EP2171346A1 (en) 2007-07-31 2010-04-07 LSI Industries, Inc. Lighting apparatus
JP5044329B2 (ja) 2007-08-31 2012-10-10 株式会社東芝 発光装置
US7791093B2 (en) 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
US8519437B2 (en) 2007-09-14 2013-08-27 Cree, Inc. Polarization doping in nitride based diodes
US7737457B2 (en) * 2007-09-27 2010-06-15 Lumination Llc Phosphor down converting element for an LED package and fabrication method
DE102008045424B4 (de) 2007-10-01 2018-03-22 San-Ei Kagaku Co. Ltd. Einen anorganischen Füllstoff und einen organischen Füllstoff enthaltende härtbare Kunstharzmischung und Verwendung derselben
JPWO2009066430A1 (ja) 2007-11-19 2011-03-31 パナソニック株式会社 半導体発光装置および半導体発光装置の製造方法
JP5083817B2 (ja) * 2007-11-22 2012-11-28 シャープ株式会社 Iii族窒化物半導体発光素子及びその製造方法
JP5302533B2 (ja) 2007-11-30 2013-10-02 パナソニック株式会社 発光装置
WO2009070809A1 (en) 2007-11-30 2009-06-04 The Regents Of The University Of California High light extraction efficiency nitride based light emitting diode by surface roughening
US20090173958A1 (en) 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
JP5361199B2 (ja) * 2008-01-29 2013-12-04 株式会社東芝 蛍光体および発光装置
US7801195B2 (en) 2008-02-14 2010-09-21 Koninklijke Philips Electronics N.V. Electrically-pumped semiconductor zigzag extended cavity surface emitting lasers and superluminescent LEDs
JP5003527B2 (ja) 2008-02-22 2012-08-15 住友電気工業株式会社 Iii族窒化物発光素子、及びiii族窒化物系半導体発光素子を作製する方法
US8567973B2 (en) * 2008-03-07 2013-10-29 Intematix Corporation Multiple-chip excitation systems for white light emitting diodes (LEDs)
JP2009252861A (ja) 2008-04-03 2009-10-29 Rohm Co Ltd 半導体レーザ素子
EP2272104A1 (en) 2008-04-23 2011-01-12 Koninklijke Philips Electronics N.V. A luminous device
WO2009151515A1 (en) * 2008-05-06 2009-12-17 Qd Vision, Inc. Solid state lighting devices including quantum confined semiconductor nanoparticles
CN105481362A (zh) * 2008-06-02 2016-04-13 松下电器产业株式会社 半导体发光设备以及使用所述半导体发光设备的光源设备
US8847249B2 (en) 2008-06-16 2014-09-30 Soraa, Inc. Solid-state optical device having enhanced indium content in active regions
TWI384898B (zh) 2008-06-18 2013-02-01 Delta Electronics Inc 可調光之發光二極體驅動電路
KR101448153B1 (ko) * 2008-06-25 2014-10-08 삼성전자주식회사 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자
US20100006873A1 (en) 2008-06-25 2010-01-14 Soraa, Inc. HIGHLY POLARIZED WHITE LIGHT SOURCE BY COMBINING BLUE LED ON SEMIPOLAR OR NONPOLAR GaN WITH YELLOW LED ON SEMIPOLAR OR NONPOLAR GaN
CN101621101A (zh) 2008-06-30 2010-01-06 展晶科技(深圳)有限公司 发光二极管及其制造方法
US20100117106A1 (en) 2008-11-07 2010-05-13 Ledengin, Inc. Led with light-conversion layer
US8169135B2 (en) 2008-12-17 2012-05-01 Lednovation, Inc. Semiconductor lighting device with wavelength conversion on back-transferred light path
US7923741B1 (en) 2009-01-05 2011-04-12 Lednovation, Inc. Semiconductor lighting device with reflective remote wavelength conversion
US8299473B1 (en) 2009-04-07 2012-10-30 Soraa, Inc. Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors
US20100289044A1 (en) * 2009-05-12 2010-11-18 Koninklijke Philips Electronics N.V. Wavelength conversion for producing white light from high power blue led
US8337030B2 (en) 2009-05-13 2012-12-25 Cree, Inc. Solid state lighting devices having remote luminescent material-containing element, and lighting methods
US8247248B2 (en) 2009-05-15 2012-08-21 Achrolux Inc. Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
EP2448026A4 (en) 2009-06-26 2013-08-14 Asahi Rubber Inc REFLECTIVE MATERIAL OF WHITE COLOR AND PRODUCTION PROCESS
US20110038154A1 (en) * 2009-08-11 2011-02-17 Jyotirmoy Chakravarty System and methods for lighting and heat dissipation
US8207554B2 (en) 2009-09-11 2012-06-26 Soraa, Inc. System and method for LED packaging
US9293667B2 (en) * 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
US8933644B2 (en) * 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US20110186887A1 (en) 2009-09-21 2011-08-04 Soraa, Inc. Reflection Mode Wavelength Conversion Material for Optical Devices Using Non-Polar or Semipolar Gallium Containing Materials
US8269245B1 (en) 2009-10-30 2012-09-18 Soraa, Inc. Optical device with wavelength selective reflector
US8471280B2 (en) 2009-11-06 2013-06-25 Koninklijke Philips Electronics N.V. Silicone based reflective underfill and thermal coupler
US8203161B2 (en) 2009-11-23 2012-06-19 Koninklijke Philips Electronics N.V. Wavelength converted semiconductor light emitting device
US20110186874A1 (en) 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
US8905588B2 (en) * 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110215348A1 (en) 2010-02-03 2011-09-08 Soraa, Inc. Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
US8740413B1 (en) * 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US9024517B2 (en) * 2010-03-03 2015-05-05 Cree, Inc. LED lamp with remote phosphor and diffuser configuration utilizing red emitters
KR101942227B1 (ko) 2010-04-30 2019-01-24 보아 테크놀러지, 인크. 릴 기반 끈 조임 시스템
US8459814B2 (en) 2010-05-12 2013-06-11 National Taiwan University Of Science And Technology White-light emitting devices with stabilized dominant wavelength
US8350453B2 (en) * 2010-05-25 2013-01-08 Nepes Led Corporation Lamp cover including a phosphor mixed structure for light emitting device
US20110317397A1 (en) 2010-06-23 2011-12-29 Soraa, Inc. Quantum dot wavelength conversion for hermetically sealed optical devices
US8210698B2 (en) 2010-07-28 2012-07-03 Bridgelux, Inc. Phosphor layer having enhanced thermal conduction and light sources utilizing the phosphor layer
EP2500623A1 (en) 2011-03-18 2012-09-19 Koninklijke Philips Electronics N.V. Method for providing a reflective coating to a substrate for a light-emitting device
CN103563111B (zh) 2011-06-01 2017-09-12 飞利浦照明控股有限公司 包括导热体的发光模块、灯和灯具
TWI440228B (zh) 2011-09-29 2014-06-01 Viking Tech Corp Light emitting diode package structure and manufacturing method thereof
JP6255923B2 (ja) 2013-11-11 2018-01-10 株式会社Ihi 燃焼装置、ガスタービン及び発電装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
US20060068154A1 (en) * 2004-01-15 2006-03-30 Nanosys, Inc. Nanocrystal doped matrixes
US20070181895A1 (en) * 2004-03-18 2007-08-09 Hideo Nagai Nitride based led with a p-type injection region
WO2010017148A1 (en) * 2008-08-04 2010-02-11 Soraa, Inc. White light devices using non-polar or semipolar gallium containing materials and phosphors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107430222A (zh) * 2015-03-20 2017-12-01 沙特基础工业全球技术公司 包括微孔结构且具有改善的反射率的反射物品

Also Published As

Publication number Publication date
CN103069582B (zh) 2017-07-28
KR20210099214A (ko) 2021-08-11
JP2017208555A (ja) 2017-11-24
US20160276550A1 (en) 2016-09-22
DE112011102386T5 (de) 2013-04-25
US11611023B2 (en) 2023-03-21
US9293667B2 (en) 2016-03-22
KR20230122189A (ko) 2023-08-22
CN107256861A (zh) 2017-10-17
KR20190044144A (ko) 2019-04-29
JP2015213174A (ja) 2015-11-26
WO2012024636A3 (en) 2012-05-10
KR20130064787A (ko) 2013-06-18
US20170222100A1 (en) 2017-08-03
US10700244B2 (en) 2020-06-30
US9660152B2 (en) 2017-05-23
CN107256861B (zh) 2023-05-05
KR101973142B1 (ko) 2019-04-26
WO2012024636A2 (en) 2012-02-23
US20210057615A1 (en) 2021-02-25
JP2013536583A (ja) 2013-09-19
KR20180051666A (ko) 2018-05-16
US20120043552A1 (en) 2012-02-23

Similar Documents

Publication Publication Date Title
US11611023B2 (en) System and method for selected pump LEDs with multiple phosphors
EP2426745B1 (en) Wavelength conversion configuration for a light emitting device
US7064480B2 (en) Illumination device with at least one led as the light source
CN1954044B (zh) 使用磷光体转换发光二极管的有效光源的规则
CN103311413B (zh) 白色发光装置
US7999456B2 (en) White light emitting diode with yellow, green and red light emitting phosphor
JP7337299B2 (ja) 優れた色制御を持つ高発光効率照明用のledと蛍光体の組み合わせ
JP2013187358A (ja) 白色発光装置
US9837585B2 (en) Light emitting device
US7804239B2 (en) White light emitting diode
CN101872741B (zh) 主波长分布收敛的发光元件及其制造方法
US20230420619A1 (en) System and method for selected pump leds with multiple phosphors

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant