CN103068859B - 聚乙烯醇缩醛树脂、其浆料组合物、陶瓷坯片和多层陶瓷电容器 - Google Patents
聚乙烯醇缩醛树脂、其浆料组合物、陶瓷坯片和多层陶瓷电容器 Download PDFInfo
- Publication number
- CN103068859B CN103068859B CN201180040224.XA CN201180040224A CN103068859B CN 103068859 B CN103068859 B CN 103068859B CN 201180040224 A CN201180040224 A CN 201180040224A CN 103068859 B CN103068859 B CN 103068859B
- Authority
- CN
- China
- Prior art keywords
- mole
- polyvinyl acetal
- acetal resin
- content
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 title claims abstract description 138
- 239000011354 acetal resin Substances 0.000 title claims abstract description 129
- 229920006324 polyoxymethylene Polymers 0.000 title claims abstract description 129
- 229920002554 vinyl polymer Polymers 0.000 title claims abstract description 127
- 239000000919 ceramic Substances 0.000 title claims abstract description 90
- 150000001875 compounds Chemical class 0.000 title claims description 62
- 239000003985 ceramic capacitor Substances 0.000 title claims description 16
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 46
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 42
- 239000000126 substance Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims description 61
- 239000011347 resin Substances 0.000 claims description 61
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 48
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 48
- YGHRJJRRZDOVPD-UHFFFAOYSA-N 3-methylbutanal Chemical compound CC(C)CC=O YGHRJJRRZDOVPD-UHFFFAOYSA-N 0.000 claims description 44
- 150000002148 esters Chemical group 0.000 claims description 42
- 150000001299 aldehydes Chemical class 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 30
- 239000003960 organic solvent Substances 0.000 claims description 22
- 230000032798 delamination Effects 0.000 abstract description 16
- 238000005238 degreasing Methods 0.000 abstract description 10
- 125000004185 ester group Chemical group 0.000 abstract 1
- -1 poly ethylene Polymers 0.000 description 57
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical group OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 53
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 36
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 32
- 238000000034 method Methods 0.000 description 26
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 26
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 20
- 239000003292 glue Substances 0.000 description 18
- 238000007127 saponification reaction Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 16
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 15
- 150000003863 ammonium salts Chemical class 0.000 description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000004902 Softening Agent Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 238000010792 warming Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000004711 α-olefin Substances 0.000 description 6
- 239000003377 acid catalyst Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 230000000254 damaging effect Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical group 0.000 description 4
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- NMPVEAUIHMEAQP-UHFFFAOYSA-N 2-Bromoacetaldehyde Chemical compound BrCC=O NMPVEAUIHMEAQP-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 2
- LGYNIFWIKSEESD-UHFFFAOYSA-N 2-ethylhexanal Chemical compound CCCCC(CC)C=O LGYNIFWIKSEESD-UHFFFAOYSA-N 0.000 description 2
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N Glycolaldehyde Chemical compound OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- AMIMRNSIRUDHCM-UHFFFAOYSA-N Isopropylaldehyde Chemical compound CC(C)C=O AMIMRNSIRUDHCM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001241 acetals Chemical class 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 229940107816 ammonium iodide Drugs 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- KSMVZQYAVGTKIV-UHFFFAOYSA-N decanal Chemical compound CCCCCCCCCC=O KSMVZQYAVGTKIV-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- HFJRKMMYBMWEAD-UHFFFAOYSA-N dodecanal Chemical compound CCCCCCCCCCCC=O HFJRKMMYBMWEAD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 235000019439 ethyl acetate Nutrition 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- NUKZAGXMHTUAFE-UHFFFAOYSA-N methyl hexanoate Chemical compound CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- NUJGJRNETVAIRJ-UHFFFAOYSA-N octanal Chemical compound CCCCCCCC=O NUJGJRNETVAIRJ-UHFFFAOYSA-N 0.000 description 2
- LCPDWSOZIOUXRV-UHFFFAOYSA-N phenoxyacetic acid Chemical compound OC(=O)COC1=CC=CC=C1 LCPDWSOZIOUXRV-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229940100595 phenylacetaldehyde Drugs 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000013517 stratification Methods 0.000 description 2
- 238000001149 thermolysis Methods 0.000 description 2
- DAXJNUBSBFUTRP-RTQNCGMRSA-N (8r,9s,10r,13s,14s)-6-(hydroxymethyl)-10,13-dimethyl-7,8,9,11,12,14,15,16-octahydro-6h-cyclopenta[a]phenanthrene-3,17-dione Chemical class O=C1C=C[C@]2(C)[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CC(CO)C2=C1 DAXJNUBSBFUTRP-RTQNCGMRSA-N 0.000 description 1
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical compound O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- WIHIUTUAHOZVLE-UHFFFAOYSA-N 1,3-diethoxypropan-2-ol Chemical compound CCOCC(O)COCC WIHIUTUAHOZVLE-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- QJJDJWUCRAPCOL-UHFFFAOYSA-N 1-ethenoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOC=C QJJDJWUCRAPCOL-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- NIBFJPXGNVPNHK-UHFFFAOYSA-N 2,2-difluoro-1,3-benzodioxole-4-carbaldehyde Chemical group C1=CC(C=O)=C2OC(F)(F)OC2=C1 NIBFJPXGNVPNHK-UHFFFAOYSA-N 0.000 description 1
- BQCXFGVWPFXMKD-UHFFFAOYSA-N 2,2-dimethylpropanoic acid;ethenyl acetate Chemical compound CC(=O)OC=C.CC(C)(C)C(O)=O BQCXFGVWPFXMKD-UHFFFAOYSA-N 0.000 description 1
- GEICDMWIZIQEEI-UHFFFAOYSA-N 2,3-dibromobenzaldehyde Chemical compound BrC1=CC=CC(C=O)=C1Br GEICDMWIZIQEEI-UHFFFAOYSA-N 0.000 description 1
- LLMLNAVBOAMOEE-UHFFFAOYSA-N 2,3-dichlorobenzaldehyde Chemical compound ClC1=CC=CC(C=O)=C1Cl LLMLNAVBOAMOEE-UHFFFAOYSA-N 0.000 description 1
- WDBAXYQUOZDFOJ-UHFFFAOYSA-N 2,3-difluorobenzaldehyde Chemical compound FC1=CC=CC(C=O)=C1F WDBAXYQUOZDFOJ-UHFFFAOYSA-N 0.000 description 1
- IXWOUPGDGMCKGT-UHFFFAOYSA-N 2,3-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1O IXWOUPGDGMCKGT-UHFFFAOYSA-N 0.000 description 1
- UIFVCPMLQXKEEU-UHFFFAOYSA-N 2,3-dimethylbenzaldehyde Chemical compound CC1=CC=CC(C=O)=C1C UIFVCPMLQXKEEU-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- ZSDQQJHSRVEGTJ-UHFFFAOYSA-N 2-(6-amino-1h-indol-3-yl)acetonitrile Chemical compound NC1=CC=C2C(CC#N)=CNC2=C1 ZSDQQJHSRVEGTJ-UHFFFAOYSA-N 0.000 description 1
- GRWPTSXPZYCYOM-UHFFFAOYSA-N 2-(dimethylamino)acetaldehyde Chemical compound CN(C)CC=O GRWPTSXPZYCYOM-UHFFFAOYSA-N 0.000 description 1
- DGPBVJWCIDNDPN-UHFFFAOYSA-N 2-(dimethylamino)benzaldehyde Chemical compound CN(C)C1=CC=CC=C1C=O DGPBVJWCIDNDPN-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- UNNGUFMVYQJGTD-UHFFFAOYSA-N 2-Ethylbutanal Chemical compound CCC(CC)C=O UNNGUFMVYQJGTD-UHFFFAOYSA-N 0.000 description 1
- OXQGTIUCKGYOAA-UHFFFAOYSA-N 2-Ethylbutanoic acid Natural products CCC(CC)C(O)=O OXQGTIUCKGYOAA-UHFFFAOYSA-N 0.000 description 1
- PKZJLOCLABXVMC-UHFFFAOYSA-N 2-Methoxybenzaldehyde Chemical compound COC1=CC=CC=C1C=O PKZJLOCLABXVMC-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- AJMJPGWUPHIMKQ-UHFFFAOYSA-N 2-[2-(2-butanoyloxyethoxy)ethoxy]ethyl butanoate Chemical compound CCCC(=O)OCCOCCOCCOC(=O)CCC AJMJPGWUPHIMKQ-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- LYIIBVSRGJSHAV-UHFFFAOYSA-N 2-aminoacetaldehyde Chemical group NCC=O LYIIBVSRGJSHAV-UHFFFAOYSA-N 0.000 description 1
- FXWFZIRWWNPPOV-UHFFFAOYSA-N 2-aminobenzaldehyde Chemical compound NC1=CC=CC=C1C=O FXWFZIRWWNPPOV-UHFFFAOYSA-N 0.000 description 1
- FGEPRNXUNITOCW-UHFFFAOYSA-N 2-aminobutanal Chemical compound CCC(N)C=O FGEPRNXUNITOCW-UHFFFAOYSA-N 0.000 description 1
- NDOPHXWIAZIXPR-UHFFFAOYSA-N 2-bromobenzaldehyde Chemical compound BrC1=CC=CC=C1C=O NDOPHXWIAZIXPR-UHFFFAOYSA-N 0.000 description 1
- HAIGSNHRJAADFJ-UHFFFAOYSA-N 2-bromobutanal Chemical compound CCC(Br)C=O HAIGSNHRJAADFJ-UHFFFAOYSA-N 0.000 description 1
- QSKPIOLLBIHNAC-UHFFFAOYSA-N 2-chloro-acetaldehyde Chemical compound ClCC=O QSKPIOLLBIHNAC-UHFFFAOYSA-N 0.000 description 1
- PZGXJYSPQYRCBB-UHFFFAOYSA-N 2-chlorobutanal Chemical compound CCC(Cl)C=O PZGXJYSPQYRCBB-UHFFFAOYSA-N 0.000 description 1
- JJMDTERTPNYIGZ-UHFFFAOYSA-N 2-cyclohexylacetaldehyde Chemical compound O=CCC1CCCCC1 JJMDTERTPNYIGZ-UHFFFAOYSA-N 0.000 description 1
- PGYJSURPYAAOMM-UHFFFAOYSA-N 2-ethenoxy-2-methylpropane Chemical compound CC(C)(C)OC=C PGYJSURPYAAOMM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical group CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 1
- ZWDVQMVZZYIAHO-UHFFFAOYSA-N 2-fluorobenzaldehyde Chemical compound FC1=CC=CC=C1C=O ZWDVQMVZZYIAHO-UHFFFAOYSA-N 0.000 description 1
- DYNFCHNNOHNJFG-UHFFFAOYSA-N 2-formylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C=O DYNFCHNNOHNJFG-UHFFFAOYSA-N 0.000 description 1
- FVSAFCHCUDOKSI-UHFFFAOYSA-N 2-methylprop-2-enamide;propane-1-sulfonic acid Chemical compound CC(=C)C(N)=O.CCCS(O)(=O)=O FVSAFCHCUDOKSI-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- CMWKITSNTDAEDT-UHFFFAOYSA-N 2-nitrobenzaldehyde Chemical compound [O-][N+](=O)C1=CC=CC=C1C=O CMWKITSNTDAEDT-UHFFFAOYSA-N 0.000 description 1
- ZMQKVTSIRCJPOE-UHFFFAOYSA-N 2-piperidin-1-ylacetaldehyde Chemical compound O=CCN1CCCCC1 ZMQKVTSIRCJPOE-UHFFFAOYSA-N 0.000 description 1
- QIQRCPPUXQAGLN-UHFFFAOYSA-N 2-pyrrolidin-1-ylacetaldehyde Chemical compound O=CCN1CCCC1 QIQRCPPUXQAGLN-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical group CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- ZMMOYIXZGHJMNI-UHFFFAOYSA-N 3-oxopropanenitrile Chemical compound O=CCC#N ZMMOYIXZGHJMNI-UHFFFAOYSA-N 0.000 description 1
- YGCZTXZTJXYWCO-UHFFFAOYSA-N 3-phenylpropanal Chemical compound O=CCCC1=CC=CC=C1 YGCZTXZTJXYWCO-UHFFFAOYSA-N 0.000 description 1
- GOUHYARYYWKXHS-UHFFFAOYSA-N 4-formylbenzoic acid Chemical compound OC(=O)C1=CC=C(C=O)C=C1 GOUHYARYYWKXHS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical group ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241001120493 Arene Species 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKJADYKTJJGKDX-UHFFFAOYSA-N Butyl pentanoate Chemical compound CCCCOC(=O)CCCC OKJADYKTJJGKDX-UHFFFAOYSA-N 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- FIFKCYFSZWXWMR-KVVVOXFISA-N C(C)(=O)OC=C.C(CCCCCCC\C=C/CCCCCCCC)(=O)O Chemical compound C(C)(=O)OC=C.C(CCCCCCC\C=C/CCCCCCCC)(=O)O FIFKCYFSZWXWMR-KVVVOXFISA-N 0.000 description 1
- SURDLKHTEHRIDE-UHFFFAOYSA-N C(C)=O.[F] Chemical compound C(C)=O.[F] SURDLKHTEHRIDE-UHFFFAOYSA-N 0.000 description 1
- SIJWMTHNMMSTNI-UHFFFAOYSA-N C(CCC)=O.[F] Chemical compound C(CCC)=O.[F] SIJWMTHNMMSTNI-UHFFFAOYSA-N 0.000 description 1
- QMOCRTQXPZBMEM-UHFFFAOYSA-N C=O.BrC=1C(=C(C=CC1)Br)Br Chemical compound C=O.BrC=1C(=C(C=CC1)Br)Br QMOCRTQXPZBMEM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical compound N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- ICMAFTSLXCXHRK-UHFFFAOYSA-N Ethyl pentanoate Chemical compound CCCCC(=O)OCC ICMAFTSLXCXHRK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical group O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- HETCEOQFVDFGSY-UHFFFAOYSA-N Isopropenyl acetate Chemical compound CC(=C)OC(C)=O HETCEOQFVDFGSY-UHFFFAOYSA-N 0.000 description 1
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 1
- 239000005956 Metaldehyde Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- LDKWQZDHSCQJCY-UHFFFAOYSA-N [I-].C(=O)CC[NH3+].C[NH+](C)C.[I-] Chemical compound [I-].C(=O)CC[NH3+].C[NH+](C)C.[I-] LDKWQZDHSCQJCY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000006136 alcoholysis reaction Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- AFVLVVWMAFSXCK-VMPITWQZSA-N alpha-cyano-4-hydroxycinnamic acid Chemical group OC(=O)C(\C#N)=C\C1=CC=C(O)C=C1 AFVLVVWMAFSXCK-VMPITWQZSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- YNKMHABLMGIIFX-UHFFFAOYSA-N benzaldehyde;methane Chemical compound C.O=CC1=CC=CC=C1 YNKMHABLMGIIFX-UHFFFAOYSA-N 0.000 description 1
- 150000003935 benzaldehydes Chemical class 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- GFJVXXWOPWLRNU-UHFFFAOYSA-N ethenyl formate Chemical compound C=COC=O GFJVXXWOPWLRNU-UHFFFAOYSA-N 0.000 description 1
- UJRIYYLGNDXVTA-UHFFFAOYSA-N ethenyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OC=C UJRIYYLGNDXVTA-UHFFFAOYSA-N 0.000 description 1
- LZWYWAIOTBEZFN-UHFFFAOYSA-N ethenyl hexanoate Chemical group CCCCCC(=O)OC=C LZWYWAIOTBEZFN-UHFFFAOYSA-N 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FXHGMKSSBGDXIY-UHFFFAOYSA-N heptanal Chemical compound CCCCCCC=O FXHGMKSSBGDXIY-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- BSABBBMNWQWLLU-UHFFFAOYSA-N lactaldehyde Chemical compound CC(O)C=O BSABBBMNWQWLLU-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- OVWYEQOVUDKZNU-UHFFFAOYSA-N m-tolualdehyde Chemical compound CC1=CC=CC(C=O)=C1 OVWYEQOVUDKZNU-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- OJXOOFXUHZAXLO-UHFFFAOYSA-M magnesium;1-bromo-3-methanidylbenzene;bromide Chemical compound [Mg+2].[Br-].[CH2-]C1=CC=CC(Br)=C1 OJXOOFXUHZAXLO-UHFFFAOYSA-M 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- GKKDCARASOJPNG-UHFFFAOYSA-N metaldehyde Chemical compound CC1OC(C)OC(C)OC(C)O1 GKKDCARASOJPNG-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N methylethylethylene Natural products CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- BGEHHAVMRVXCGR-UHFFFAOYSA-N methylundecylketone Natural products CCCCCCCCCCCCC=O BGEHHAVMRVXCGR-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- QQGJWWNPACORPU-UHFFFAOYSA-N n,n-dimethylpropan-1-amine;prop-2-enamide Chemical compound NC(=O)C=C.CCCN(C)C QQGJWWNPACORPU-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- HNBDRPTVWVGKBR-UHFFFAOYSA-N n-pentanoic acid methyl ester Natural products CCCCC(=O)OC HNBDRPTVWVGKBR-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004002 naphthaldehydes Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- GYHFUZHODSMOHU-UHFFFAOYSA-N nonanal Chemical compound CCCCCCCCC=O GYHFUZHODSMOHU-UHFFFAOYSA-N 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- LIINGNMKNRSOGW-UHFFFAOYSA-N oct-7-enal Chemical compound C=CCCCCCC=O LIINGNMKNRSOGW-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- YKKYHJNXWUHFTR-UHFFFAOYSA-N propane;prop-2-enamide Chemical compound CCC.NC(=O)C=C YKKYHJNXWUHFTR-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/02—Homopolymers or copolymers of unsaturated alcohols
- C09D129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/38—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an acetal or ketal radical
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/6342—Polyvinylacetals, e.g. polyvinylbutyral [PVB]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F116/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F116/02—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
- C08F116/04—Acyclic compounds
- C08F116/06—Polyvinyl alcohol ; Vinyl alcohol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/38—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an acetal or ketal radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
- C04B2235/3234—Titanates, not containing zirconia
- C04B2235/3236—Alkaline earth titanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Conductive Materials (AREA)
Abstract
由本发明可以提供一种聚乙烯醇缩醛树脂,其能够得到具有充分的机械强度的陶瓷坯片,陶瓷坯片储存时的尺寸变化少,脱脂时不容易出现脱层。本发明涉及一种聚乙烯醇缩醛树脂,其聚合度为200以上且6000以下,乙烯酯单元的含量为0.01摩尔%~30摩尔%,缩醛化度为55摩尔%~83摩尔%,分子中具有化学式(1)表示的结构单元。
Description
技术领域
本发明涉及适合用作陶瓷坯片的粘结剂的聚乙烯醇缩醛树脂、以及使用了该聚乙烯醇缩醛树脂的浆料组合物、陶瓷坯片、导电糊剂和多层陶瓷电容器。
背景技术
制造多层陶瓷电容器时,一般采用如下的制造方法。首先,在分散有陶瓷粉末的有机溶剂中添加聚乙烯醇缩丁醛树脂等粘结剂树脂与增塑剂,利用球磨机等均匀混合从而制备浆料组合物。将制备的浆料组合物在聚对苯二甲酸乙二醇酯薄膜等剥离性的支撑体上流延成型,通过加热等蒸馏去除等后,自支撑体剥离从而得到陶瓷坯片。
然后,交替层叠多张在陶瓷坯片的表面通过丝网印刷等涂布构成内部电极的导电糊剂而成的物质,通过加热压接等形成层叠体后,切断成规定形状。接着,进行将层叠体中所包含的粘结剂成分等通过热分解去除的处理、即所谓的脱脂处理后,进行烧成,经在得到的陶瓷烧成物的端面烧结外部电极的工序,从而得到多层陶瓷电容器。因而,上述陶瓷坯片要求浆料组合物的制备操作的良好的操作性和进一步提高对这些加工的诸工序的耐受强度。
近年来,随着电子设备的多功能化和小型化,要求多层陶瓷电容器的大容量化和小型化。与此对应,进行了如下尝试:作为用于陶瓷坯片的陶瓷粉末,使用0.5μm以下的微细粒径的粉末,以上述浆料组合物为5μm以下左右的薄膜状的方式,涂覆于剥离性的支撑体上。
然而,使用微细粒径的陶瓷粉末时,填充密度、比表面积增加,因而使用的粘结剂树脂量增加,伴随着这一点,浆料组合物的粘度也增大,有时涂覆变困难、产生陶瓷粉末自身分散不良。另一方面,制作陶瓷坯片时的诸工序中,由于负载有拉伸、弯曲等应力,为了耐受这些应力,作为粘结剂树脂适合使用聚合度高的树脂。
专利文献1(日本特开2006-089354号公报)中公开了由含有聚合度大于2400且为4500以下、乙烯酯单元的含量为1摩尔%~20摩尔%,缩醛化度为55摩尔%~80摩尔%的聚乙烯醇缩醛树脂、陶瓷粉末和有机溶剂的浆料组合物得到的陶瓷坯片的机械强度优异。
然而,最近要求陶瓷坯片进一步薄层化,利用含有上述陶瓷粉末的浆料组合物制造超薄层的陶瓷坯片时,其厚度为2μm以下时,产生容易引起片浸蚀(sheetattack)现象的问题。
在这里,片浸蚀现象是指在得到的陶瓷坯片上印刷构成内部电极层的导电糊剂时,由于导电糊剂中的有机溶剂,陶瓷坯片所含有的粘结剂树脂溶解,在陶瓷坯片上产生破裂等缺陷的现象,出现该片浸蚀现象时,多层陶瓷电容器的电气性能、可靠性降低,成品率显著降低。
专利文献2(日本特开2008-133371号公报)中公开了一种聚乙烯醇缩醛树脂,其特征在于:其为使皂化度为80摩尔%以上且数均聚合度为1000~4000的聚乙烯醇树脂缩醛化而得到的聚乙烯醇缩醛树脂,其中,缩醛化度为60摩尔%~75摩尔%,且利用乙醛进行缩醛化的部分与利用丁醛进行缩醛化的部分的比(利用丁醛进行缩醛化而消失的羟基的摩尔数/利用乙醛进行缩醛化而消失的羟基的摩尔数)为0.1~2。
然而,多层陶瓷电容器的小型化存在极限,为了使芯片大容量化、或者保持容量而小型化,除了要求陶瓷坯片薄层化,还要求多层化。伴随着这样的多层化和小型化,陶瓷坯片储存时的吸湿性成为课题。即,陶瓷坯片的储存中,由于粘结剂树脂吸湿,有时引起尺寸变化,有时由于将薄膜多层层叠,每层的水分量多时,脱脂时水分一下子蒸发,产生被称为脱层(Delamination)的层间剥离。因此,陶瓷坯片储存时的调湿、脱脂条件的调节非常重要。
例如,利用乙醛的改性聚乙烯醇缩醛的玻璃化转变温度变高,因而能够提高机械强度,但由于乙醛的疏水性低,因而即便是与丁醛的混合缩醛化物,吸湿性也高,无法满足上述课题。另外,即便是仅利用丁醛的缩醛化物,也无法满足充分的低吸湿性。
由此,专利文献1和专利文献2中没有公开兼备陶瓷坯片储存时的尺寸变化少、脱脂时不容易出现脱层的性质的聚乙烯醇缩醛树脂。
现有技术文献
专利文献
专利文献1:日本特开2006-089354号公报
专利文献2:日本特开2008-133371号公报
发明内容
发明要解决的问题
鉴于上述现状,本发明的目的在于提供一种聚乙烯醇缩醛树脂,其中,在将其用作陶瓷坯片的粘结剂树脂时,可以得到具有充分的机械强度、储存时的尺寸变化少、进而脱脂时不容易出现脱层的陶瓷坯片。另外,本发明的目的还在于提供使用该聚乙烯醇缩醛树脂的浆料组合物、陶瓷坯片、导电糊剂和多层陶瓷电容器。
用于解决问题的方案
本发明人进行深入研究的结果发现,聚合度为200以上且6000以下、乙烯酯单元的含量为0.01摩尔%~30摩尔%、缩醛化度为55摩尔%~83摩尔%、分子中具有化学式(1)表示的结构单元的聚乙烯醇缩醛树脂的玻璃化转变温度高、且显示出低吸水性。此外,尤其是将该聚乙烯醇缩醛树脂用作陶瓷坯片所使用的浆料组合物的粘结剂树脂时,厚度变薄的陶瓷坯片也具有充分的机械强度,储存时的尺寸变化少,进而脱脂时不容易出现脱层,从而完成了本发明。
即,本发明涉及一种聚乙烯醇缩醛树脂,其聚合度为200以上且6000以下,乙烯酯单元的含量为0.01摩尔%~30摩尔%,缩醛化度为55摩尔%~83摩尔%,分子中具有化学式(1)表示的结构单元。
优选聚乙烯醇缩醛树脂的聚合度大于1500且为4500以下。
优选聚乙烯醇缩醛树脂为使用含3-甲基丁醛的醛使聚乙烯醇树脂缩醛化而得到的。
优选聚乙烯醇缩醛树脂在分子中具有化学式(2)和/或化学式(3)表示的结构单元。
优选前述聚乙烯醇缩醛树脂中,相对于全部的经缩醛化的结构单元的总摩尔量,含有30摩尔%以上的化学式(1)表示的结构单元。
本发明涉及一种浆料组合物,其含有前述聚乙烯醇缩醛树脂、陶瓷粉末和有机溶剂。
本发明涉及一种陶瓷坯片,其为使用前述浆料组合物而得到的。
本发明涉及一种导电糊剂,其含有前述聚乙烯醇缩醛树脂和导电性粉末。
本发明涉及一种多层陶瓷电容器,其为使用前述陶瓷坯片而得到的。
本发明涉及一种多层陶瓷电容器,其为使用前述导电糊剂而得到的。
发明的效果
根据本发明,可以提供一种聚乙烯醇缩醛树脂,其用作陶瓷坯片的粘结剂树脂时,能够得到具有充分的机械强度、储存时的尺寸变化少、进而脱脂时不容易出现脱层的陶瓷坯片。进而,本发明的聚乙烯醇缩醛树脂也可以用作构成内部电极的导电糊剂的粘结剂树脂。
具体实施方式
以下详述本发明。
本发明的聚乙烯醇缩醛树脂的聚合度为200以上且6000以下。聚乙烯醇缩醛树脂的聚合度低于200时,制作薄膜陶瓷坯片时,机械强度变得不充分,另一方面,聚合度大于6000时,有时无法充分地溶解于有机溶剂,有时溶液粘度变得过高,涂覆性、分散性低下。聚乙烯醇缩醛树脂的聚合度优选为800以上,更优选为1000以上,进一步优选为大于1500,尤其优选为1700以上,最优选为大于2000。另外,聚乙烯醇缩醛树脂的聚合度优选为4500以下,更优选为3500以下。
上述聚乙烯醇缩醛树脂例如可以如下来制造:使用至少包含3-甲基丁醛的醛使聚合度为200以上且6000以下的聚乙烯醇树脂缩醛化。上述聚乙烯醇树脂的聚合度优选为800以上,更优选为1000以上,进一步优选为大于1500、尤其优选为1700以上。另外,上述聚乙烯醇树脂的聚合度优选为4500以下,更优选为3500以下。
需要说明的是,上述聚合度由聚乙烯醇缩醛树脂的制造时所用的聚乙烯醇树脂的粘均聚合度和聚乙烯醇缩醛树脂的粘均聚合度双方求得。即,经缩醛化后聚合度不会变化,因而聚乙烯醇树脂与使该聚乙烯醇树脂缩醛化得到的聚乙烯醇缩醛树脂的聚合度相同。在这里,聚乙烯醇树脂的粘均聚合度是指基于JISK6726:1994年求得的平均聚合度。另外,作为聚乙烯醇树脂混合使用2种以上的聚乙烯醇树脂时,是指混合后的聚乙烯醇树脂整体的表观上的粘均聚合度。另一方面,聚乙烯醇缩醛树脂的聚合度为基于JISK6728:1977年所述的方法测定的粘均聚合度。在这里,聚乙烯醇缩醛树脂为2种以上的聚乙烯醇缩醛树脂的混合物时,也是指混合后的聚乙烯醇缩醛树脂整体的表观上的粘均聚合度。
上述聚乙烯醇缩醛树脂的乙烯酯单元的含量下限为0.01摩尔%,上限为30摩尔%。聚乙烯醇缩醛树脂的乙烯酯单元的含量低于0.01摩尔%时,聚乙烯醇缩醛树脂中的羟基的分子内和分子间的氢键增加从而浆料组合物的粘度变得过高,另外,在导电糊剂所使用的有机溶剂中的溶解性变得过高,出现片浸蚀现象。另一方面,聚乙烯醇缩醛树脂的乙烯酯单元的含量超过30摩尔%时,由于聚乙烯醇缩醛树脂的玻璃化转变温度低下,柔软性变得过强,陶瓷坯片的处理性、机械强度和储存时的尺寸稳定性低下。上述乙烯酯单元的含量的优选的下限为0.5摩尔%,优选的上限为23摩尔%,更优选的上限为20摩尔%。
乙烯酯单元的含量为0.01摩尔%~30摩尔%的聚乙烯醇缩醛树脂例如可以如下来制造:使乙烯酯单元的含量为0.01摩尔%~30摩尔%的聚乙烯醇树脂、代表性的是皂化度为70摩尔%~99.99摩尔%的聚乙烯醇树脂缩醛化。聚乙烯醇树脂的皂化度的优选的下限为77摩尔%,更优选的下限为80摩尔%,优选的上限为99.5摩尔%。在这里,本说明书中的乙烯酯单元的含量是指,相对于乙烯酯单元、乙烯醇单元和经缩醛化的乙烯醇单元的摩尔量的合计值的、乙烯酯单元的摩尔量的含有比例。
上述聚乙烯醇缩醛树脂的缩醛化度的下限为55摩尔%,上限为83摩尔%。聚乙烯醇缩醛树脂的缩醛化度低于55摩尔%时,聚乙烯醇缩醛树脂的亲水性高从而变得难以溶解于有机溶剂,进而,引起陶瓷坯片的储存时因吸水导致的尺寸变化,脱脂时出现脱层。另一方面,聚乙烯醇缩醛树脂的缩醛化度大于83摩尔%时,由于残留羟基变少,不仅有损聚乙烯醇缩醛树脂的强韧性,生产率也低下。因而,上述缩醛化度的优选的下限为60摩尔%,更优选的下限为65摩尔%,优选的上限为80摩尔%。在这里,本说明书中的缩醛化度是基于经缩醛化的乙烯醇单元的摩尔量而非基于经缩醛化的结构单元算出的。即,缩醛化度是指,相对于乙烯酯单元、乙烯醇单元和经缩醛化的乙烯醇单元的摩尔量的合计值的、经缩醛化的乙烯醇单元的摩尔量的含有比例。
作为将本发明的聚乙烯醇缩醛树脂的缩醛化度调节至55摩尔%~83摩尔%的方法,例如可以举出:适当调节相对于聚乙烯醇树脂的醛的添加量、添加醛与酸催化剂后的反应时间等的方法。例如,相对于聚乙烯醇树脂100质量份,优选添加30质量份~150质量份的醛。
需要说明的是,上述聚乙烯醇缩醛树脂的乙烯酯单元的含量、乙烯醇单元的含量和缩醛化度可以如下计算:将聚乙烯醇缩醛树脂溶解于DMSO-d6(二甲基亚砜),测定1H-NMR或13C-NMR谱图并算出。
作为本发明的聚乙烯醇缩醛树脂,可以使用使聚乙烯醇树脂与后述的醛反应(缩醛化)得到的树脂。这样的聚乙烯醇树脂可以通过以往公知的方法而得到,即:使乙烯酯类单体聚合,将得到的聚合物皂化。作为使乙烯酯类单体聚合的方法,可以采用溶液聚合法、本体聚合法、悬浮聚合法、乳液聚合法等以往公知的方法。作为聚合引发剂,可以根据聚合方法适当选择偶氮类引发剂、过氧化物类引发剂、氧化还原类引发剂等。皂化反应可以适用以往公知的使用碱催化剂或酸催化剂的醇解、水解等,其中,以甲醇为溶剂、使用烧碱(NaOH)催化剂的皂化反应较简便,最优选。
作为乙烯酯类单体,例如可以举出:甲酸乙烯酯、醋酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、异丁酸乙烯酯、特戊酸乙烯酯、叔碳酸乙烯酯、己酸乙烯酯、辛酸乙烯酯、月桂酸乙烯酯、棕榈酸乙烯酯、硬脂酸乙烯酯、油酸乙烯酯、苯甲酸乙烯酯等,尤其优选醋酸乙烯酯。
另外,使前述乙烯酯类单体聚合时,在不损害本发明的主旨的范围内,可以与其它单体共聚。因此,本发明中的聚乙烯醇树脂的概念也包含乙烯醇单元与其它单体单元构成的聚合物。作为其它单体的例子,例如可以举出:乙烯、丙烯、正丁烯、异丁烯等α-烯烃,丙烯酸及其盐,丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸异丙酯、丙烯酸正丁酯、丙烯酸异丁酯、丙烯酸叔丁酯、丙烯酸2-乙基己酯、丙烯酸十二烷基酯、丙烯酸十八烷基酯等丙烯酸酯类,甲基丙烯酸及其盐,甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸异丙酯、甲基丙烯酸正丁酯、甲基丙烯酸异丁酯、甲基丙烯酸叔丁酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸十二烷基酯、甲基丙烯酸十八烷基酯等甲基丙烯酸酯类,丙烯酰胺、N-甲基丙烯酰胺、N-乙基丙烯酰胺、N,N-二甲基丙烯酰胺、双丙酮丙烯酰胺、丙烯酰胺丙烷磺酸及其盐、丙烯酰胺丙基二甲胺或者其酸盐或季盐、N-羟甲基丙烯酰胺及其衍生物等丙烯酰胺衍生物,甲基丙烯酰胺、N-甲基甲基丙烯酰胺、N-乙基甲基丙烯酰胺、甲基丙烯酰胺丙烷磺酸及其盐、甲基丙烯酰胺丙基二甲胺或者其酸盐或季盐、N-羟甲基甲基丙烯酰胺或者其衍生物等甲基丙烯酰胺衍生物,甲基乙烯基醚、乙基乙烯基醚、正丙基乙烯基醚、异丙基乙烯基醚、正丁基乙烯基醚、异丁基乙烯基醚、叔丁基乙烯基醚、十二烷基乙烯基醚、硬脂基乙烯基醚等乙烯基醚类,丙烯腈、甲基丙烯腈等腈类,氯乙烯、氟乙烯等卤化乙烯,偏二氯乙烯、偏二氟乙烯等偏二卤代乙烯,醋酸烯丙酯、烯丙基氯等烯丙基化合物,马来酸及其盐、酯或酸酐,乙烯基三甲氧基硅烷等乙烯基甲硅烷基化合物,醋酸异丙烯酯等。这些单体通常以相对于乙烯酯类单体为20摩尔%以下、更优选低于10摩尔%的比例使用。
作为缩醛化所使用的酸催化剂,没有特别的限制,可以任意使用有机酸和无机酸,例如可以举出:醋酸、对甲苯磺酸、硝酸、硫酸、盐酸等。其中,优选使用盐酸、硫酸、硝酸,尤其优选使用盐酸、硝酸。
本发明的聚乙烯醇缩醛树脂可以通过如下的方法得到。首先,将3质量%~15质量%浓度的聚乙烯醇树脂水溶液调节至80℃~100℃的温度范围,将其温度在10分钟~60分钟内慢慢冷却。温度降低至-10℃~40℃时,添加醛和酸催化剂,将温度保持恒定的同时,进行10分钟~300分钟的缩醛化反应。优选包含其后将反应液在30分钟~200分钟内升温至15℃~80℃的温度,保持该温度0分钟~360分钟的熟化工序。然后,优选将反应液冷却至室温,水洗后添加碱等中和剂,通过清洗、干燥从而得到目标的聚乙烯醇缩醛树脂。
本发明的聚乙烯醇缩醛树脂中,重要的是具有上述化学式(1)表示的结构单元。作为得到这样的聚乙烯醇缩醛树脂的方法,例如可以举出:对聚乙烯醇树脂,使用含3-甲基丁醛的醛进行缩醛化的方法。像这样将3-甲基丁醛用于缩醛化时,分子中的碳原子数在2~6的范围内,因而聚乙烯醇缩醛树脂的生产率也优异,进而形成在聚乙烯醇缩醛树脂的缩醛结构单元中的与两个氧原子键合的碳原子上还键合有异丙基的结构,从而得到特性的平衡性良好、具有优异的耐湿热性的涂膜。
另外,作为聚乙烯醇树脂的缩醛化所使用的醛,在不损害本发明的主旨的范围内,可以组合使用以下的醛。即,作为具有烷基或芳基等取代基的醛,例如有:乙醛、丙醛、丁醛、异丁醛、2-乙基丁醛、戊醛、新戊醛、己醛、2-乙基己醛、辛醛、壬醛、癸醛、十二烷基醛等脂肪醛及其烷基缩醛、环戊醛、甲基环戊醛、二甲基环戊醛、环己醛、甲基环己醛、二甲基环己醛、环己基乙醛等脂环醛及其烷基缩醛、环戊烯醛、环己烯醛等环式不饱和醛及其烷基缩醛、苯甲醛、甲基苯甲醛、二甲基苯甲醛、甲氧基苯甲醛、苯乙醛、苯丙醛、枯茗醛、萘醛、蒽醛、肉桂醛、巴豆醛、丙烯醛、7-辛烯-1-醛等芳香醛或含不饱和键的醛及其烷基缩醛、糠醛、甲基糠醛等杂环醛及其烷基缩醛等。
另外,本发明中,作为为了使聚乙烯醇树脂缩醛化而能够组合使用的、具有羟基、羧基、磺酸基或磷酸基作为官能团的醛,有乙醇醛、羟基丙醛、羟基丁醛、羟基戊醛、水杨醛、二羟基苯甲醛等含羟基醛及其烷基缩醛、乙醛酸及其金属盐或者铵盐、2-甲酰基乙酸及其金属盐或者铵盐、3-甲酰基丙酸及其金属盐或者铵盐、5-甲酰基戊酸及其金属盐或者铵盐、4-甲酰基苯氧乙酸及其金属盐或者铵盐、2-羧基苯甲醛及其金属盐或者铵盐、4-羧基苯甲醛及其金属盐或者铵盐、2,4-二羧基苯甲醛及其金属盐或者铵盐、苯甲醛-2-磺酸及其金属盐或者铵盐、苯甲醛-2,4-二磺酸及其金属盐或者铵盐、4-甲酰基苯氧基磺酸及其金属盐或者铵盐、3-甲酰基-1-丙烷磺酸及其金属盐或者铵盐、7-甲酰基-1-庚烷磺酸及其金属盐或者铵盐、4-甲酰基苯氧基膦酸及其金属盐或者铵盐等含酸醛及其烷基缩醛等。
进而,作为为了使聚乙烯醇树脂缩醛化而能够组合使用的、具有氨基、氰基、硝基或季铵盐作为官能团的醛,有氨基乙醛、二甲氨基乙醛、二乙氨基乙醛、氨基丙醛、二甲氨基丙醛、氨基丁醛、氨基戊醛、氨基苯甲醛、二甲氨基苯甲醛、乙基甲基氨基苯甲醛、二乙氨基苯甲醛、吡咯烷基乙醛、哌啶基乙醛、吡啶基乙醛、氰基乙醛、α-氰基丙醛、硝基苯甲醛、三甲基-对甲酰基苯基碘化铵、三乙基-对甲酰基苯基碘化铵、三甲基-2-甲酰基乙基碘化铵及其烷基缩醛等。
作为为了使聚乙烯醇树脂缩醛化而能够组合使用的、具有卤素作为官能团的醛,有氯乙醛、溴乙醛、氟乙醛、氯丙醛、溴丙醛、氟丙醛、氯丁醛、溴丁醛、氟丁醛、氯戊醛、溴戊醛、氟戊醛、氯苯甲醛、二氯苯甲醛、三氯苯甲醛、溴苯甲醛、二溴苯甲醛、三溴苯甲醛、氟苯甲醛、二氟苯甲醛、三氟苯甲醛、三氯甲基苯甲醛、三溴甲基苯甲醛、三氟甲基苯甲醛及其烷基缩醛等。例如可以组合使用甲醛(包含多聚甲醛)、乙醛(包含多聚乙醛)、丙醛、丁醛、戊醛、己醛、庚醛、2-乙基己醛、环己醛、糠醛、乙二醛、戊二醛、苯甲醛、2-甲基苯甲醛、3-甲基苯甲醛、4-甲基苯甲醛、对羟基苯甲醛、间羟基苯甲醛、苯基乙醛、β-苯基丙醛等。
这些之中,组合使用3-甲基丁醛以外的醛来进行聚乙烯醇树脂的缩醛化时,从得到的聚乙烯醇缩醛树脂的机械强度优异的方面考虑,优选为乙醛,从低吸湿性优异的方面考虑,优选为丁醛。另外,可以组合使用3-甲基丁醛、乙醛和丁醛这样的3种醛。通过使用乙醛进行缩醛化,上述化学式(2)表示的结构单元被导入聚乙烯醇缩醛树脂中,通过使用丁醛进行缩醛化,上述化学式(3)表示的结构单元被导入聚乙烯醇缩醛树脂中。
如组合使用丁醛和/或乙醛与3-甲基丁醛时那样,得到的聚乙烯醇缩醛树脂具有上述化学式(1)表示的结构单元以外的结构单元作为经缩醛化的结构单元时,相对于全部的经缩醛化的结构单元的总摩尔量,相当于利用3-甲基丁醛缩醛化的结构单元的上述化学式(1)表示的结构单元的比率优选为30摩尔%以上。具体而言,例如,聚乙烯醇缩醛树脂仅包含化学式(4):
(化学式(4)中、R为氢原子或具有任意碳原子数的烃基(例如,甲基或丙基),烃基中的氢可以被任意的原子或任意的官能团取代)表示的结构单元作为经缩醛化的结构单元时,相对于该化学式(4)表示的结构单元(全部的经缩醛化的结构单元)的总摩尔量,聚乙烯醇缩醛树脂中化学式(1)表示的结构单元优选为30摩尔%以上。
相对于聚乙烯醇缩醛树脂中全部的经缩醛化的结构单元的总摩尔量,相当于利用3-甲基丁醛缩醛化的结构单元的上述化学式(1)表示的结构单元的比率低于30摩尔%时,聚乙烯醇缩醛树脂的吸湿性变高,容易产生陶瓷坯片的储存时的尺寸变化和脱脂时的脱层。相当于利用3-甲基丁醛缩醛化的结构单元的上述化学式(1)表示的结构单元的比率优选为40摩尔%以上,进一步优选为50摩尔%以上。上述比率为通过以下计算式求得的。
[数学式1]
比率(%)=化学式(1)表示的结构单元的摩尔量/全部的经缩醛化的结构单元的总摩尔量×100
上述聚乙烯醇缩醛树脂所使用的醛优选为一元醛(一分子内1个醛基)。使用具有2个以上醛基的化合物进行缩醛化时,交联部位与未交联部位的应力松弛力不同,因此有时干燥后从聚对苯二甲酸乙二醇酯剥离后出现翘曲。因而,优选使用的醛仅为一元醛,即便使用具有2个以上醛基的化合物时,相对于聚乙烯醇树脂的乙烯醇单元,具有2个以上醛基的化合物的添加量优选低于0.005摩尔%,更优选为0.003摩尔%以下。
本发明的聚乙烯醇缩醛树脂可以含有α-烯烃单元。这样的聚乙烯醇缩醛树脂中,α-烯烃单元的含量的优选的下限为1摩尔%,优选的上限为20摩尔%。低于1摩尔%时,含有α-烯烃单元的效果变得不充分;大于20摩尔%时,由于疏水性变得过强而陶瓷粉末的分散性低下、作为原料的聚乙烯醇树脂的溶解性低下,存在聚乙烯醇缩醛树脂的制造变困难的担心。本说明书中,聚乙烯醇缩醛树脂中的α-烯烃单元的含量是指,相对于构成聚乙烯醇缩醛树脂的全部的结构单元的总摩尔量的、α-烯烃单元的摩尔量的含有比例。在这里,经缩醛化的结构单元以经缩醛化的乙烯醇单元的摩尔量(通常为经缩醛化的结构单元的摩尔量的2倍)算出上述总摩尔量。
本发明的聚乙烯醇缩醛树脂的玻璃化转变温度优选为72℃~100℃,更优选为75℃~95℃。聚乙烯醇缩醛树脂的玻璃化转变温度低于72℃时,机械强度变得不充分,另一方面,大于100℃时,存在加热压接性变差,容易出现脱层的倾向。
本发明的浆料组合物含有上述聚乙烯醇缩醛树脂、陶瓷粉末和有机溶剂。需要说明的是,浆料组合物中,聚乙烯醇缩醛树脂通常用作粘结剂树脂。本发明的聚乙烯醇缩醛树脂溶解于陶瓷坯片的制造工序中一般使用的乙醇与甲苯的1:1混合溶剂中时,溶液粘度也不会变得过高,因而含本发明的聚乙烯醇缩醛树脂的上述浆料组合物具有充分的涂覆性。另外,由上述浆料组合物可以有效地得到机械强度优异且具有良好的填充性的陶瓷坯片。
另外,本发明的浆料组合物中,作为上述粘结剂树脂,除了上述聚乙烯醇缩醛树脂以外,还可以含有丙烯酸类树脂、纤维素类树脂等。作为粘结剂树脂含有丙烯酸类树脂、纤维素类树脂等上述聚乙烯醇缩醛树脂以外的其它树脂时,上述聚乙烯醇缩醛树脂在占粘结剂树脂整体中所占的含量的优选的下限为30质量%。聚乙烯醇缩醛树脂的含量低于30质量%时,存在得到的陶瓷坯片的机械强度和加热压接性变得不充分的担心。
作为上述陶瓷粉末,没有特别的限制、例如可以举出:氧化铝、氧化锆、硅酸铝、氧化钛、氧化锌、钛酸钡、氧化镁、塞隆(sailon)、spinemulrite、碳化硅、氮化硅、氮化铝等的粉末。这些陶瓷粉末可以单独使用,也可以组合2种以上使用。相对于本发明的浆料组合物的总含量的、陶瓷粉末的含量的优选的上限为80质量%,优选的下限为30质量%。陶瓷粉末的含量少于30质量%时,得到的浆料组合物的粘度变得过低,陶瓷坯片成型时的处理性变差;另一方面,多于80质量%时,存在浆料组合物的粘度变得过高、混炼性低下的倾向。
作为上述有机溶剂,没有特别的限制,例如可以举出:丙酮、甲乙酮、二丙酮、二异丁酮等酮类,甲醇、乙醇、异丙醇、丁醇等醇类,甲苯、二甲苯等芳香烃类,丙酸甲酯、丙酸乙酯、丙酸丁酯、丁酸甲酯、丁酸乙酯、丁酸丁酯、戊酸甲酯、戊酸乙酯、戊酸丁酯、己酸甲酯、己酸乙酯、己酸丁酯、醋酸2-乙基己酯、丁酸2-乙基己酯等酯类,甲基溶纤剂、乙基溶纤剂、丁基溶纤剂、α-松油醇、丁基溶纤剂醋酸酯、丁基卡必醇醋酸酯等二元醇类,松油醇等萜类等。这些有机溶剂可以单独使用、也可以组合2种以上使用。尤其优选使用甲苯与乙醇的混合溶剂。相对于本发明的浆料组合物的总含量的、有机溶剂的含量优选为20质量%以上且低于70质量%。处于上述范围内时,可以赋予本发明的浆料组合物以合适的混炼性。有机溶剂的含量为70质量%以上时,粘度变得过低,陶瓷坯片成型时的处理性变差;另一方面,少于20质量%时,存在浆料组合物的粘度变得过高,混炼性低下的倾向。
本发明的浆料组合物在不损害本发明的效果的范围内,可以含有增塑剂、润滑剂、分散剂、抗静电剂、抗氧化剂等以往公知的添加剂。
对上述增塑剂的种类没有特别的限制,例如可以举出:邻苯二甲酸二辛酯、邻苯二甲酸苄基丁基酯、邻苯二甲酸二丁酯、邻苯二甲酸二己酯、邻苯二甲酸二(2-乙基己基)酯(DOP)、邻苯二甲酸二(2-乙基丁基)酯等邻苯二甲酸类增塑剂、己二酸二己酯、己二酸二(2-乙基己基)酯(DOA)等己二酸类增塑剂、乙二醇、二乙二醇、三乙二醇等二元醇类增塑剂、三乙二醇二丁酸酯、三乙二醇二(2-乙基丁酸酯)、三乙二醇二(2-乙基己酸酯)等二醇酯类增塑剂等,这些也可以组合2种以上使用。对增塑剂的含量没有特别的限制,相对于浆料组合物的总含量,优选为0.1质量%~10质量%,更优选为1质量%~8质量%。其中,从挥发性低、形成陶瓷坯片时容易保持柔软性的方面出发,优选为DOP、DOA和三乙二醇二(2-乙基己酸酯)。
作为使用本发明的聚乙烯醇缩醛树脂的浆料组合物的制造方法,没有特别的限制,例如可以采用:使用球磨机、开炼机(blendermill)、三辊磨等各种混合机将含有上述聚乙烯醇缩醛树脂的粘结剂树脂、陶瓷粉末、有机溶剂和根据需要添加的各种添加剂混合的方法。
本发明的浆料组合物通过具有如上所述的构成,能够制造具有充分的机械强度的薄膜陶瓷坯片。本发明包含使用这样的浆料组合物得到的陶瓷坯片。
作为本发明的陶瓷坯片的制造方法,没有特别的限制,可以利用以往公知的制造方法来制造,例如可以举出:使本发明的浆料组合物在聚对苯二甲酸乙二醇酯薄膜等剥离性的支撑体上流延成型,通过加热等使溶剂等蒸馏去除后,自支撑体剥离的方法等。
本发明的导电糊剂含有上述聚乙烯醇缩醛树脂和导电性粉末,优选含有上述聚乙烯醇缩醛树脂、导电性粉末和有机溶剂。
本发明的导电糊剂中,作为粘结剂树脂,除了上述聚乙烯醇缩醛树脂以外,还可以含有丙烯酸类树脂、纤维素类树脂等上述聚乙烯醇缩醛树脂以外的其它树脂。作为粘结剂树脂含有丙烯酸类树脂、纤维素类树脂等时,上述聚乙烯醇缩醛树脂在粘结剂树脂整体中所占的含量的优选的下限为30质量%。聚乙烯醇缩醛的含量低于30质量%时,存在层间的粘接性低下的倾向。
作为本发明的导电糊剂所使用的导电性粉末,只要是具有导电性的物质则没有特别的限制,例如可以举出:铜、镍、钯、铂、金、银等。相对于导电糊剂的总量的、导电性粉末的含量的优选的上限为70质量%,优选的下限为30质量%。导电性粉末的含量低于30质量%时,由于导电成分少、有机成分多,有时烧成后的收缩率变化大,并且容易残留碳成分。另一方面,导电性粉末的含量大于70质量%时,导电糊剂的粘度变得过高,存在涂覆性和印刷性低下的倾向。
作为本发明的导电糊剂所使用的有机溶剂,没有特别的限制,作为本发明的浆料组合物所使用的有机溶剂,可以使用与在上面例示的相同的溶剂。这些有机溶剂可以单独使用,也可以组合2种以上使用。相对于本发明的导电糊剂的总量的、有机溶剂的含量的优选的上限为70质量%,优选的下限为20质量%。有机溶剂的含量少于20质量%时,存在粘度变得过高,混炼性低下的倾向;另一方面,多于70质量%时,存在粘度变得过低,涂布导电糊剂时的处理性变差的倾向。
本发明的导电糊剂在不损害本发明的效果的范围内,可以含有增塑剂、润滑剂、分散剂、抗静电剂等以往公知的添加剂。
作为本发明的导电糊剂的制造方法,没有特别的限制,例如可以举出:使上述聚乙烯醇缩醛树脂与导电性粉末、有机溶剂、增塑剂、分散剂等混合的方法;更具体而言可以举出:使用球磨机、开炼机、三辊磨等各种混合机,使含有上述聚乙烯醇缩醛树脂的粘结剂树脂、导电性粉末、有机溶剂和根据需要添加的各种添加剂混合的方法。
通过将涂布有导电糊剂的陶瓷坯片层叠,可以制作多层陶瓷电容器。在这里,陶瓷坯片和导电糊剂中的至少一方为本发明的陶瓷坯片或本发明的导电糊剂即可,可以将涂布有不是本发明的导电糊剂的导电糊剂的本发明的陶瓷坯片层叠,也可以将涂布有本发明的导电糊剂的不是本发明的陶瓷坯片的陶瓷坯片层叠,还可以将涂布有本发明的导电糊剂的本发明的陶瓷坯片层叠。由此,使用本发明的陶瓷坯片和本发明的导电糊剂的至少一方而得到的多层陶瓷电容器也包含在本发明中。
作为本发明的多层陶瓷电容器的制造方法,没有特别的限制,可以采用以往公知的制造方法。例如可以举出:交替堆叠多张通过丝网印刷等在陶瓷坯片(本发明的陶瓷坯片等)的表面涂布构成内部电极的导电糊剂而成的物质,加热压接形成层叠体,将该层叠体中所包含的粘结剂成分等通过热分解去除后(脱脂处理),进行烧成,在得到的陶瓷烧成物的端面烧结外部电极的方法等。
对使用本发明的聚乙烯醇缩醛树脂的用途没有特别的限制,除陶瓷坯片、内部电极的粘结剂以外,例如可以举出:涂料的材料、热显影性感光材料。
实施例
以下举出实施例对本发明进行更详细的说明,但本发明不受这些实施例的任何限制。需要说明的是,以下的实施例中,若无特别的说明,“%”和“份”是指“质量%”和“质量份”。
聚乙烯醇缩醛树脂的诸物性的测定为利用以下的方法进行的。
(聚乙烯醇缩醛树脂的乙烯酯单元的含量、乙烯醇单元的含量和经缩醛化的乙烯醇单元的含量)
将聚乙烯醇缩醛树脂溶解于DMSO-d6(二甲基亚砜),测定1H-NMR谱图并算出。
(聚乙烯醇缩醛树脂的玻璃化转变点)
作为DSC(差示扫描量热计),使用SeikoInstrumentsInc.制EXTAR6000(RD220),将聚乙烯醇缩醛树脂在氮气中自30℃以10℃/分钟的升温速度升温至150℃后,冷却至30℃,再一次以10℃/分钟的升温速度升温至150℃。将再升温后的测定值设为玻璃化转变点。
(聚乙烯醇缩醛树脂的吸水率)
将厚度0.2mm×10cm×10cm的测定用样品在50℃下在减压条件下干燥6天,接着,测定将干燥后的样品在20℃的纯水中浸渍24小时的质量,根据下式求出吸水率。
[数学式2]
吸水率(质量%)=(浸渍后的质量-浸渍前的干燥后质量)/(浸渍前的干燥后质量)×100
(实施例1)
(聚乙烯醇缩醛树脂的制备)
在具备回流冷凝器、温度计和锚式搅拌叶片的内容积2L的玻璃制容器中,装入离子交换水1295g、聚乙烯醇(PVA-1:聚合度1700、皂化度99.0摩尔%)105g,将整体升温至95℃使聚乙烯醇完全溶解,制作聚乙烯醇水溶液(浓度7.5质量%)。边将制作的聚乙烯醇水溶液在旋转速度120rpm下持续搅拌、边用约30分钟慢慢冷却至13℃后,在该水溶液中添加3-甲基丁醛70.5g,进而添加作为缩醛化催化剂的酸催化剂的浓度20质量%的盐酸100mL,开始聚乙烯醇的缩醛化。进行15分钟的缩醛化后,用120分钟将整体升温至47℃,在47℃保持180分钟后,冷却至室温。将通过冷却析出的树脂过滤后,用离子交换水(相对于树脂为100倍量的离子交换水)清洗10次后,加入用于中和的0.3质量%氢氧化钠水溶液,在50℃下保持5小时后,进而用100倍量的离子交换水重复10次再清洗,脱水后,在40℃、减压条件下干燥18小时,得到聚乙烯醇缩醛树脂(PVIV-1)。得到的聚乙烯醇缩醛树脂(PVIV-1)中,用3-甲基丁醛缩醛化的乙烯醇单元的含量为69.0摩尔%(缩醛化度为69.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为30.0摩尔%。
(浆料组合物的制备)
将得到的聚乙烯醇缩醛树脂10质量份加入甲苯20质量份与乙醇20质量份的混合溶剂中,搅拌溶解,进而,作为增塑剂加入DOP8质量份,搅拌溶解。在得到的树脂溶液中加入作为陶瓷粉末的钛酸钡(堺化学工业株式会社制、BT-03(平均粒径0.3μm))100质量份,用球磨机混合48小时,得到浆料组合物。
(实施例2)
除了使用聚乙烯醇(PVA-2:聚合度800、皂化度99.0摩尔%)代替PVA-1,使用73.5g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-2)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为71.2摩尔%(缩醛化度为71.2摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为27.8摩尔%。接着,使用PVIV-2,与实施例1同样地得到浆料组合物。
(实施例3)
除了使用聚乙烯醇(PVA-3:聚合度2400、皂化度99.0摩尔%)代替PVA-1,使用70.5g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-3)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为68.4摩尔%(缩醛化度为68.4摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为30.6摩尔%。接着,使用PVIV-3,与实施例1同样地得到浆料组合物。
(实施例4)
除了使用聚乙烯醇(PVA-4:聚合度4300、皂化度99.0摩尔%)代替PVA-1,使用75.6g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-4)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为73.8摩尔%(缩醛化度为73.8摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为25.2摩尔%。接着,使用PVIV-4,与实施例1同样地得到浆料组合物。
(实施例5)
除了使用聚乙烯醇(PVA-5:聚合度1700、皂化度88.0摩尔%)代替PVA-1,使用64.6g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-5)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为71.2摩尔%(缩醛化度为71.2摩尔%),乙烯酯单元的含量为12.0摩尔%,乙烯醇单元的含量为16.8摩尔%。接着,使用PVIV-5,与实施例1同样地得到浆料组合物。
(实施例6)
除了使用聚乙烯醇(PVA-6:聚合度3500、皂化度88.0摩尔%)代替PVA-1,使用62.5g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-6)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为69.7摩尔%(缩醛化度为69.7摩尔%),乙烯酯单元的含量为12.0摩尔%,乙烯醇单元的含量为18.3摩尔%。接着,使用PVIV-6,与实施例1同样地得到浆料组合物。
(实施例7)
除了使用81.6g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-7)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为79.0摩尔%(缩醛化度为79.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为20.0摩尔%。接着,使用PVIV-7,与实施例1同样地得到浆料组合物。
(实施例8)
除了使用66.6g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-8)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为65.0摩尔%(缩醛化度为65.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为34.0摩尔%。接着,使用PVIV-8,与实施例1同样地得到浆料组合物。
(实施例9)
除了使用聚乙烯醇(PVA-7:聚合度500、皂化度99.0摩尔%)代替PVA-1,使用70.5g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-9)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为69.0摩尔%(缩醛化度为69.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为30.0摩尔%。接着,使用PVIV-9,与实施例1同样地得到浆料组合物。
(实施例10)
除了使用聚乙烯醇(PVA-8:聚合度5000、皂化度99.0摩尔%)代替PVA-1,使用71.5g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-10)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为70.0摩尔%(缩醛化度为70.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为29.0摩尔%。接着,使用PVIV-10,与实施例1同样地得到浆料组合物。
(实施例11)
除了作为醛使用3-甲基丁醛44.6g和丁醛30.5g以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-11)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为42.9摩尔%,用丁醛缩醛化的乙烯醇单元的含量为36.1摩尔%(缩醛化度为79.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为20.0摩尔%。接着,使用PVIV-11,与实施例1同样地得到浆料组合物。
(实施例12)
除了作为醛使用3-甲基丁醛42.6g和乙醛20.2g以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-12)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为41.0摩尔%,用乙醛缩醛化的乙烯醇单元的含量为38.0摩尔%(缩醛化度为79.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为20.0摩尔%。接着,使用PVIV-12,与实施例1同样地得到浆料组合物。
(比较例1)
除了作为醛使用丁醛65.0g以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVB-A)。用丁醛缩醛化的乙烯醇单元的含量为68.8摩尔%(缩醛化度为68.8摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为30.2摩尔%。接着,使用PVB-A,与实施例1同样地得到浆料组合物。
(比较例2)
除了使用聚乙烯醇(PVA-9:聚合度3500、皂化度99.0摩尔%)代替PVA-1,作为醛使用乙醛25.1g和丁醛31.0g以外,与实施例1同样地得到聚乙烯醇乙酰缩醛树脂(polyvinylacetacetalresin)(PVB-B)。用丁醛缩醛化的乙烯醇单元的含量为36.0摩尔%,用乙醛缩醛化的乙烯醇单元的含量为44.4摩尔%(缩醛化度为80.4摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为18.6摩尔%。接着,使用PVB-B,与实施例1同样地得到浆料组合物。
(比较例3)
除了使用聚乙烯醇(PVA-10:聚合度6500、皂化度88.0摩尔%)代替PVA-1,作为醛使用69.0g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-13)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为73.9摩尔%(缩醛化度为73.9摩尔%),乙烯酯单元的含量为12.0摩尔%,乙烯醇单元的含量为14.1摩尔%。接着,使用PVIV-13,试图与实施例1同样地制作浆料组合物,但由于分散不良,无法得到浆料组合物。
(比较例4)
除了使用聚乙烯醇(PVA-11:聚合度150、皂化度99.0摩尔%)代替PVA-1,作为醛使用69.0g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-14)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为66.8摩尔%(缩醛化度为66.8摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为32.2摩尔%。接着,使用PVIV-14,与实施例1同样地得到浆料组合物。
(比较例5)
除了使用聚乙烯醇(PVA-12:聚合度1700、皂化度69.0摩尔%)代替PVA-1,作为醛使用39.0g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-15)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为50.0摩尔%(缩醛化度为50.0摩尔%),乙烯酯单元的含量为31.0摩尔%,乙烯醇单元的含量为19.0摩尔%。接着,使用PVIV-15,与实施例1同样地得到浆料组合物。
(比较例6)
除了作为醛使用54.0g的3-甲基丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVIV-16)。用3-甲基丁醛缩醛化的乙烯醇单元的含量为53.6摩尔%(缩醛化度为53.6摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为45.4摩尔%。接着,使用PVIV-16,与实施例1同样地得到浆料组合物。
(比较例7)
除了作为醛使用45.0g的丁醛以外,与实施例1同样地,得到聚乙烯醇缩醛树脂(PVB-C)。用丁醛缩醛化的乙烯醇单元的含量为78.0摩尔%(缩醛化度为78.0摩尔%),乙烯酯单元的含量为1.0摩尔%,乙烯醇单元的含量为21.0摩尔%。接着,使用PVB-C,与实施例1同样地得到浆料组合物。
(陶瓷坯片的制作)
在经脱模处理的聚酯薄膜上,使用棒涂布机,以干燥后的厚度为1μm的方式涂覆由实施例1~12或比较例1~7制作的浆料组合物,在常温下风干1小时后,用热风干燥机在80℃下干燥3小时,接着在120℃下干燥2小时,得到陶瓷坯片。
(导电糊剂的制作)
将作为导电粉末的镍粉末(三井金属矿业株式会社制2020SS)100质量份、乙基纤维素(陶氏化学公司制STD-100)5质量份、和作为溶剂的松油醇-C(NipponTerpeneChemicals,Inc.制)60质量份混合后,用三辊磨混炼,得到导电糊剂。
(陶瓷烧成体的制作)
在由上述得到的陶瓷坯片的一面,利用丝网印刷法,以干燥后的厚度为约1.0μm的方式涂覆在上述得到的导电糊剂,干燥后形成导电层。将具有该导电层的陶瓷坯片切断成5cm见方,层叠100张,在温度70℃、压力150kg/cm2下加热和压接10分钟,得到层叠体。将得到的层叠体在氮气气氛下、以3℃/分钟的升温速度升温至400℃,保持5小时后,以5℃/分钟的升温速度升温至1350℃,保持10小时,得到陶瓷烧成体。
(评价)
(机械强度的评价)
将得到的陶瓷坯片自聚酯薄膜剥离,观察片材的状态,按以下所示3个等级进行评价。结果示于表1中。
A:在陶瓷坯片上未观察到裂缝、破裂。
B:观察到微小的裂缝、破裂。
C:观察到裂缝、破裂。
(储存时的尺寸稳定性评价)
将30cm×30cm的陶瓷坯片于23℃、65%RH的恒温恒湿下静置,测定制膜后与10天后的尺寸变化率,按照以下所示2个等级进行评价。结果示于表1中。
A:陶瓷坯片的尺寸变化率低于0.1%、且确认无翘曲。
B:陶瓷坯片的尺寸变化率在0.1%以上、和/或确认到翘曲。
(烧结体的脱层的评价)
将得到的陶瓷烧成体(冷却至常温后的物质)分成两半,用电子显微镜观察,观察陶瓷层与导电层之间的脱层的有无,按照以下所示3个等级进行评价。结果示于表1中。
A:无脱层。
B:观察到微小的脱层。
C:有脱层。
[表1]
产业上的可利用性
由本发明可以提供一种聚乙烯醇缩醛树脂,其能够得到具有充分的机械强度的陶瓷坯片,陶瓷坯片储存时的尺寸变化少,脱脂时不容易出现脱层。
Claims (11)
1.一种浆料组合物,其含有聚乙烯醇缩醛树脂、陶瓷粉末和有机溶剂,
所述聚乙烯醇缩醛树脂的聚合度为200以上且6000以下,乙烯酯单元的含量为0.01摩尔%~30摩尔%,缩醛化度为55摩尔%~83摩尔%,分子中具有化学式(1)表示的结构单元,其中,相对于全部的经缩醛化的结构单元的总摩尔量,含有40摩尔%以上的化学式(1)表示的结构单元:
2.根据权利要求1所述的浆料组合物,所述聚乙烯醇缩醛树脂的聚合度大于1500且为4500以下。
3.根据权利要求1或2所述的浆料组合物,所述聚乙烯醇缩醛树脂为使用含3-甲基丁醛的醛使聚乙烯醇树脂缩醛化而得到的。
4.根据权利要求1或2所述的浆料组合物,其中所述聚乙烯醇缩醛树脂分子中还具有化学式(2)和/或化学式(3)表示的结构单元:
5.一种陶瓷坯片,其为使用权利要求1~4任一项所述的浆料组合物而得到的。
6.一种导电糊剂,其含有聚乙烯醇缩醛树脂和导电性粉末,
所述聚乙烯醇缩醛树脂的聚合度为200以上且6000以下,乙烯酯单元的含量为0.01摩尔%~30摩尔%,缩醛化度为55摩尔%~83摩尔%,分子中具有化学式(1)表示的结构单元,其中,相对于全部的经缩醛化的结构单元的总摩尔量,含有40摩尔%以上的化学式(1)表示的结构单元:
7.根据权利要求6所述的导电糊剂,所述聚乙烯醇缩醛树脂的聚合度大于1500且为4500以下。
8.根据权利要求6或7所述的导电糊剂,所述聚乙烯醇缩醛树脂为使用含3-甲基丁醛的醛使聚乙烯醇树脂缩醛化而得到的。
9.根据权利要求6或7所述的导电糊剂,所述聚乙烯醇缩醛树脂的分子中还具有化学式(2)和/或化学式(3)表示的结构单元:
10.一种多层陶瓷电容器,其为使用权利要求5所述的陶瓷坯片而得到的。
11.一种多层陶瓷电容器,其为使用权利要求6~9任一项所述的导电糊剂而得到的。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510601404.0A CN105175590B (zh) | 2010-08-19 | 2011-08-12 | 聚乙烯醇缩醛树脂 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-183815 | 2010-08-19 | ||
JP2010183815 | 2010-08-19 | ||
PCT/JP2011/068459 WO2012023517A1 (ja) | 2010-08-19 | 2011-08-12 | ポリビニルアセタール樹脂、そのスラリー組成物、セラミックグリーンシート及び積層セラミックコンデンサ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510601404.0A Division CN105175590B (zh) | 2010-08-19 | 2011-08-12 | 聚乙烯醇缩醛树脂 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103068859A CN103068859A (zh) | 2013-04-24 |
CN103068859B true CN103068859B (zh) | 2015-11-25 |
Family
ID=45605171
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510601404.0A Expired - Fee Related CN105175590B (zh) | 2010-08-19 | 2011-08-12 | 聚乙烯醇缩醛树脂 |
CN201180040224.XA Expired - Fee Related CN103068859B (zh) | 2010-08-19 | 2011-08-12 | 聚乙烯醇缩醛树脂、其浆料组合物、陶瓷坯片和多层陶瓷电容器 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510601404.0A Expired - Fee Related CN105175590B (zh) | 2010-08-19 | 2011-08-12 | 聚乙烯醇缩醛树脂 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20130148263A1 (zh) |
EP (1) | EP2607390B1 (zh) |
JP (1) | JP5698750B2 (zh) |
KR (1) | KR101829788B1 (zh) |
CN (2) | CN105175590B (zh) |
TW (1) | TWI504613B (zh) |
WO (1) | WO2012023517A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5951522B2 (ja) * | 2012-03-28 | 2016-07-13 | 日本碍子株式会社 | セラミックスペースト及び積層体 |
JP6178093B2 (ja) * | 2013-03-29 | 2017-08-09 | 積水化学工業株式会社 | 変性ポリビニルアセタール樹脂 |
CN103274700A (zh) * | 2013-04-23 | 2013-09-04 | 云南银峰新材料有限公司 | 一种可丝网印刷的陶瓷介质浆料的制备方法 |
JP2015072901A (ja) * | 2013-09-06 | 2015-04-16 | 日本合成化学工業株式会社 | リチウムイオン二次電池電極用バインダー、リチウムイオン二次電池電極の製造方法、リチウムイオン二次電池電極、およびリチウムイオン二次電池 |
EP2851355A1 (de) * | 2013-09-18 | 2015-03-25 | Kuraray Europe GmbH | Verwendung von Polyvinylisoacetalen für Keramikformulierungen |
US20170008988A1 (en) * | 2014-02-17 | 2017-01-12 | Kuraray Co., Ltd. | Binder for formation of ceramic or for use in conductive paste, and use of same |
US9758662B2 (en) | 2014-12-08 | 2017-09-12 | Solutia Inc. | Poly(vinyl acetal) resin compositions, layers and interlayers having enhanced properties |
US9724899B2 (en) | 2014-12-08 | 2017-08-08 | Solutia Inc. | Poly(vinyl acetal) resin compositions, layers and interlayers having enhanced properties |
US9669605B2 (en) | 2014-12-08 | 2017-06-06 | Solutia Inc. | Poly(vinyl acetal) resin compositions, layers and interlayers having enhanced properties |
US9926431B2 (en) | 2014-12-08 | 2018-03-27 | Solutia Inc. | Poly(vinyl acetal) resin compositions, layers and interlayers having enhanced properties |
JP6719464B2 (ja) * | 2014-12-08 | 2020-07-08 | ソルティア・インコーポレーテッド | 向上した特性を有するポリ(ビニルアセタール)樹脂組成物、層、及び中間膜 |
CN104844739A (zh) * | 2015-05-15 | 2015-08-19 | 亿帆鑫富药业股份有限公司 | 可交联pvb及其生产方法、利用该可交联pvb生产可交联pvb胶片的方法 |
JP6924203B2 (ja) * | 2016-03-24 | 2021-08-25 | フエロ コーポレーション | 導電性ペースト、及び導電性トレースの形成方法 |
CN106147632A (zh) * | 2016-08-08 | 2016-11-23 | 强新正品(苏州)环保材料科技有限公司 | 一种导电胶粘剂 |
US11220562B2 (en) | 2017-10-10 | 2022-01-11 | Solutia Inc. | Poly(vinyl acetal) resin compositions, layers, and interlayers having enhanced properties |
JP7406373B2 (ja) * | 2018-03-30 | 2023-12-27 | 積水化学工業株式会社 | セラミックグリーンシート用変性ポリビニルアセタール樹脂 |
US10717862B2 (en) | 2018-07-11 | 2020-07-21 | Solutia Inc. | Poly(vinyl acetal) resin compositions, layers, and interlayers having enhanced properties |
JP7296836B2 (ja) * | 2018-09-27 | 2023-06-23 | 積水化学工業株式会社 | ポリビニルアセタール樹脂、セラミックグリーンシート用組成物、セラミックグリーンシート及び積層セラミックコンデンサ |
KR20210118408A (ko) * | 2019-01-29 | 2021-09-30 | 카오카부시키가이샤 | 세라믹 성형체로부터의 유기물 성분의 제거 방법 |
JP6821094B1 (ja) * | 2019-03-29 | 2021-01-27 | 積水化学工業株式会社 | セラミックグリーンシート用樹脂組成物、セラミックグリーンシート及び積層セラミックコンデンサ |
CN110407961B (zh) * | 2019-07-24 | 2022-08-02 | 长春工业大学 | 一种聚乙烯醇缩丁醛的制备方法 |
JP6836001B1 (ja) * | 2019-09-27 | 2021-02-24 | 積水化学工業株式会社 | ポリビニルアセタール樹脂 |
TW202121974A (zh) * | 2019-10-02 | 2021-06-16 | 日商可樂麗股份有限公司 | 水稻育苗用積層體、毯狀苗、水稻育苗箱、及水稻育苗箱之製造方法 |
JP6894571B1 (ja) * | 2020-03-27 | 2021-06-30 | 積水化学工業株式会社 | スラリー組成物 |
CN113912402B (zh) * | 2021-09-08 | 2022-08-05 | 潮州三环(集团)股份有限公司 | 一种用于陶瓷生坯的粘结剂 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3193022B2 (ja) * | 1999-09-14 | 2001-07-30 | 積水化学工業株式会社 | セラミックグリーンシート用スラリー組成物及びセラミックグリーンシート |
EP1627732B1 (en) * | 2004-08-18 | 2007-10-31 | FUJIFILM Corporation | Planographic printing plate precursor |
CN101426821A (zh) * | 2006-04-05 | 2009-05-06 | 日本合成化学工业株式会社 | 聚乙烯醇缩醛类树脂 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2269217A (en) * | 1938-01-29 | 1942-01-06 | Eastman Kodak Co | Mixed polyvinyl acetal resin |
GB566004A (en) * | 1942-02-11 | 1944-12-08 | Du Pont | Manufacture of polyvinyl acetal resins |
US2345946A (en) * | 1942-02-11 | 1944-04-04 | Du Pont | Preparation of polyvinyl acetal resins |
US5691101A (en) * | 1994-03-15 | 1997-11-25 | Kabushiki Kaisha Toshiba | Photosensitive composition |
JP3540436B2 (ja) * | 1995-06-02 | 2004-07-07 | 株式会社東芝 | 感光性組成物 |
US6255033B1 (en) * | 1999-07-30 | 2001-07-03 | Creo, Ltd. | Positive acting photoresist compositions and imageable element |
WO2004101465A1 (ja) * | 2003-05-19 | 2004-11-25 | Matsushita Electric Industrial Co., Ltd. | セラミックグリーンシートと積層セラミック物品及びその製造方法 |
JP4870919B2 (ja) | 2004-09-27 | 2012-02-08 | 積水化学工業株式会社 | セラミックグリーンシート用スラリー組成物、セラミックグリーンシート及び積層セラミックコンデンサ |
EP1854772B1 (de) * | 2006-05-10 | 2013-03-27 | Kuraray Europe GmbH | Verfahren zur Herstellung von keramischen Grünfolien mit acetalisierten Polyvinylalkoholen |
JP2008133371A (ja) | 2006-11-28 | 2008-06-12 | Sekisui Chem Co Ltd | ポリビニルアセタール樹脂及びセラミックグリーンシート |
JP5503144B2 (ja) * | 2007-04-11 | 2014-05-28 | 積水化学工業株式会社 | セラミック成型体の製造方法 |
EP2138531B1 (en) | 2007-04-11 | 2014-10-29 | Sekisui Chemical Co., Ltd. | Method for production of crosslinked polyvinyl acetal resin, and crosslinked polyvinyl acetal resin |
JP5179308B2 (ja) * | 2007-10-03 | 2013-04-10 | 株式会社クラレ | ポリビニルアセタール |
-
2011
- 2011-08-12 JP JP2012529589A patent/JP5698750B2/ja active Active
- 2011-08-12 KR KR1020137006874A patent/KR101829788B1/ko active IP Right Grant
- 2011-08-12 EP EP11818159.3A patent/EP2607390B1/en active Active
- 2011-08-12 WO PCT/JP2011/068459 patent/WO2012023517A1/ja active Application Filing
- 2011-08-12 US US13/817,041 patent/US20130148263A1/en not_active Abandoned
- 2011-08-12 CN CN201510601404.0A patent/CN105175590B/zh not_active Expired - Fee Related
- 2011-08-12 CN CN201180040224.XA patent/CN103068859B/zh not_active Expired - Fee Related
- 2011-08-19 TW TW100129743A patent/TWI504613B/zh not_active IP Right Cessation
-
2015
- 2015-10-13 US US14/881,826 patent/US9550909B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3193022B2 (ja) * | 1999-09-14 | 2001-07-30 | 積水化学工業株式会社 | セラミックグリーンシート用スラリー組成物及びセラミックグリーンシート |
EP1627732B1 (en) * | 2004-08-18 | 2007-10-31 | FUJIFILM Corporation | Planographic printing plate precursor |
CN101426821A (zh) * | 2006-04-05 | 2009-05-06 | 日本合成化学工业株式会社 | 聚乙烯醇缩醛类树脂 |
Also Published As
Publication number | Publication date |
---|---|
KR20130100132A (ko) | 2013-09-09 |
TW201219419A (en) | 2012-05-16 |
JPWO2012023517A1 (ja) | 2013-10-28 |
EP2607390A1 (en) | 2013-06-26 |
EP2607390A4 (en) | 2014-08-13 |
KR101829788B1 (ko) | 2018-02-19 |
US20130148263A1 (en) | 2013-06-13 |
CN105175590B (zh) | 2017-10-03 |
EP2607390B1 (en) | 2016-06-22 |
WO2012023517A1 (ja) | 2012-02-23 |
CN105175590A (zh) | 2015-12-23 |
JP5698750B2 (ja) | 2015-04-08 |
TWI504613B (zh) | 2015-10-21 |
US20160032131A1 (en) | 2016-02-04 |
CN103068859A (zh) | 2013-04-24 |
US9550909B2 (en) | 2017-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103068859B (zh) | 聚乙烯醇缩醛树脂、其浆料组合物、陶瓷坯片和多层陶瓷电容器 | |
CN103842313B (zh) | 浆料组合物、陶瓷生片和层叠陶瓷电容器 | |
JP5702311B2 (ja) | セラミックグリーンシート用スラリー組成物、セラミックグリーンシート及び積層セラミックコンデンサ | |
JP5400986B2 (ja) | ポリオキシアルキレン変性ビニルアセタール系重合体及びそれを含有する組成物 | |
JP6162962B2 (ja) | ポリオキシアルキレン変性ビニルアセタール系重合体、その製造方法及び組成物 | |
CN103596988B (zh) | 烷基改性乙烯醇缩醛系聚合物和组合物 | |
JP5592470B2 (ja) | ポリビニルアセタール樹脂を含有するセラミックグリーンシート用スラリー組成物 | |
JP2007138115A (ja) | セラミック成形用変性ポリビニルアセタール樹脂及びセラミックペースト | |
JP4886350B2 (ja) | ポリビニルアセタール樹脂組成物 | |
CN103946926A (zh) | 导电糊剂及层叠陶瓷电容器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20210812 |