CN103842313B - 浆料组合物、陶瓷生片和层叠陶瓷电容器 - Google Patents
浆料组合物、陶瓷生片和层叠陶瓷电容器 Download PDFInfo
- Publication number
- CN103842313B CN103842313B CN201280047876.0A CN201280047876A CN103842313B CN 103842313 B CN103842313 B CN 103842313B CN 201280047876 A CN201280047876 A CN 201280047876A CN 103842313 B CN103842313 B CN 103842313B
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- China
- Prior art keywords
- mole
- polyvinyl acetal
- acetal resin
- ceramic green
- paste compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000919 ceramic Substances 0.000 title claims abstract description 96
- 150000001875 compounds Chemical class 0.000 title claims abstract description 37
- 239000003985 ceramic capacitor Substances 0.000 title description 14
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims abstract description 98
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 84
- 239000011354 acetal resin Substances 0.000 claims abstract description 82
- 229920006324 polyoxymethylene Polymers 0.000 claims abstract description 82
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 33
- 239000000126 substance Substances 0.000 claims abstract description 24
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 13
- 150000002148 esters Chemical group 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims description 26
- 238000005238 degreasing Methods 0.000 abstract description 9
- 238000004321 preservation Methods 0.000 abstract description 4
- AMIMRNSIRUDHCM-UHFFFAOYSA-N Isopropylaldehyde Chemical compound CC(C)C=O AMIMRNSIRUDHCM-UHFFFAOYSA-N 0.000 description 50
- -1 phenylacetaldehyde acetal Chemical class 0.000 description 50
- 229920005989 resin Polymers 0.000 description 39
- 239000011347 resin Substances 0.000 description 39
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 36
- 239000004372 Polyvinyl alcohol Substances 0.000 description 30
- 150000001299 aldehydes Chemical class 0.000 description 30
- 239000000203 mixture Substances 0.000 description 30
- 229920002451 polyvinyl alcohol Polymers 0.000 description 30
- 239000002002 slurry Substances 0.000 description 24
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical group OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 18
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 150000003863 ammonium salts Chemical class 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 12
- 238000007127 saponification reaction Methods 0.000 description 12
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 230000032798 delamination Effects 0.000 description 11
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 11
- 239000004902 Softening Agent Substances 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000003292 glue Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 238000010792 warming Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 230000007704 transition Effects 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- DTUQWGWMVIHBKE-UHFFFAOYSA-N Benzeneacetaldehyde Natural products O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 238000003795 desorption Methods 0.000 description 6
- 229940100595 phenylacetaldehyde Drugs 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 150000002500 ions Chemical group 0.000 description 5
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003377 acid catalyst Substances 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000254 damaging effect Effects 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- NMPVEAUIHMEAQP-UHFFFAOYSA-N 2-Bromoacetaldehyde Chemical compound BrCC=O NMPVEAUIHMEAQP-UHFFFAOYSA-N 0.000 description 2
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 2
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 2
- YGHRJJRRZDOVPD-UHFFFAOYSA-N 3-methylbutanal Chemical compound CC(C)CC=O YGHRJJRRZDOVPD-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N Glycolaldehyde Chemical compound OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001241 acetals Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229940107816 ammonium iodide Drugs 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- WTWBUQJHJGUZCY-UHFFFAOYSA-N cuminaldehyde Chemical compound CC(C)C1=CC=C(C=O)C=C1 WTWBUQJHJGUZCY-UHFFFAOYSA-N 0.000 description 2
- KSMVZQYAVGTKIV-UHFFFAOYSA-N decanal Chemical compound CCCCCCCCCC=O KSMVZQYAVGTKIV-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- HFJRKMMYBMWEAD-UHFFFAOYSA-N dodecanal Chemical compound CCCCCCCCCCCC=O HFJRKMMYBMWEAD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- NUKZAGXMHTUAFE-UHFFFAOYSA-N methyl hexanoate Chemical compound CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- NUJGJRNETVAIRJ-UHFFFAOYSA-N octanal Chemical compound CCCCCCCC=O NUJGJRNETVAIRJ-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- 229920006267 polyester film Polymers 0.000 description 2
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- 239000010409 thin film Substances 0.000 description 2
- DAXJNUBSBFUTRP-RTQNCGMRSA-N (8r,9s,10r,13s,14s)-6-(hydroxymethyl)-10,13-dimethyl-7,8,9,11,12,14,15,16-octahydro-6h-cyclopenta[a]phenanthrene-3,17-dione Chemical group O=C1C=C[C@]2(C)[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CC(CO)C2=C1 DAXJNUBSBFUTRP-RTQNCGMRSA-N 0.000 description 1
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- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- QJJDJWUCRAPCOL-UHFFFAOYSA-N 1-ethenoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOC=C QJJDJWUCRAPCOL-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- GEICDMWIZIQEEI-UHFFFAOYSA-N 2,3-dibromobenzaldehyde Chemical compound BrC1=CC=CC(C=O)=C1Br GEICDMWIZIQEEI-UHFFFAOYSA-N 0.000 description 1
- LLMLNAVBOAMOEE-UHFFFAOYSA-N 2,3-dichlorobenzaldehyde Chemical compound ClC1=CC=CC(C=O)=C1Cl LLMLNAVBOAMOEE-UHFFFAOYSA-N 0.000 description 1
- WDBAXYQUOZDFOJ-UHFFFAOYSA-N 2,3-difluorobenzaldehyde Chemical compound FC1=CC=CC(C=O)=C1F WDBAXYQUOZDFOJ-UHFFFAOYSA-N 0.000 description 1
- IXWOUPGDGMCKGT-UHFFFAOYSA-N 2,3-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1O IXWOUPGDGMCKGT-UHFFFAOYSA-N 0.000 description 1
- UIFVCPMLQXKEEU-UHFFFAOYSA-N 2,3-dimethylbenzaldehyde Chemical compound CC1=CC=CC(C=O)=C1C UIFVCPMLQXKEEU-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- ZSDQQJHSRVEGTJ-UHFFFAOYSA-N 2-(6-amino-1h-indol-3-yl)acetonitrile Chemical compound NC1=CC=C2C(CC#N)=CNC2=C1 ZSDQQJHSRVEGTJ-UHFFFAOYSA-N 0.000 description 1
- FLCWJWNCSHIREG-UHFFFAOYSA-N 2-(diethylamino)benzaldehyde Chemical compound CCN(CC)C1=CC=CC=C1C=O FLCWJWNCSHIREG-UHFFFAOYSA-N 0.000 description 1
- GRWPTSXPZYCYOM-UHFFFAOYSA-N 2-(dimethylamino)acetaldehyde Chemical compound CN(C)CC=O GRWPTSXPZYCYOM-UHFFFAOYSA-N 0.000 description 1
- DGPBVJWCIDNDPN-UHFFFAOYSA-N 2-(dimethylamino)benzaldehyde Chemical compound CN(C)C1=CC=CC=C1C=O DGPBVJWCIDNDPN-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- UNNGUFMVYQJGTD-UHFFFAOYSA-N 2-Ethylbutanal Chemical compound CCC(CC)C=O UNNGUFMVYQJGTD-UHFFFAOYSA-N 0.000 description 1
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- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- PKZJLOCLABXVMC-UHFFFAOYSA-N 2-Methoxybenzaldehyde Chemical compound COC1=CC=CC=C1C=O PKZJLOCLABXVMC-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- AJMJPGWUPHIMKQ-UHFFFAOYSA-N 2-[2-(2-butanoyloxyethoxy)ethoxy]ethyl butanoate Chemical compound CCCC(=O)OCCOCCOCCOC(=O)CCC AJMJPGWUPHIMKQ-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical group OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- LYIIBVSRGJSHAV-UHFFFAOYSA-N 2-aminoacetaldehyde Chemical compound NCC=O LYIIBVSRGJSHAV-UHFFFAOYSA-N 0.000 description 1
- FXWFZIRWWNPPOV-UHFFFAOYSA-N 2-aminobenzaldehyde Chemical compound NC1=CC=CC=C1C=O FXWFZIRWWNPPOV-UHFFFAOYSA-N 0.000 description 1
- FGEPRNXUNITOCW-UHFFFAOYSA-N 2-aminobutanal Chemical compound CCC(N)C=O FGEPRNXUNITOCW-UHFFFAOYSA-N 0.000 description 1
- NDOPHXWIAZIXPR-UHFFFAOYSA-N 2-bromobenzaldehyde Chemical compound BrC1=CC=CC=C1C=O NDOPHXWIAZIXPR-UHFFFAOYSA-N 0.000 description 1
- HAIGSNHRJAADFJ-UHFFFAOYSA-N 2-bromobutanal Chemical compound CCC(Br)C=O HAIGSNHRJAADFJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
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- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- AAYRWMCIKCRHIN-UHFFFAOYSA-N propane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CCCS(O)(=O)=O AAYRWMCIKCRHIN-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
提供一种浆料组合物,其获得的陶瓷生片具有充分的机械强度,保存时的尺寸变化少,且在脱脂初期难以产生层间剥离。一种浆料组合物,其含有聚乙烯醇缩醛树脂、相对于前述聚乙烯醇缩醛树脂为10~1000ppm的2-甲基丙酸,以及有机溶剂,所述聚乙烯醇缩醛树脂的聚合度为500以上且6000以下,乙烯基酯单元的含量为0.01~30摩尔%,缩醛化度为50~83摩尔%,在分子中具有相对于全部被缩醛化的结构单元的总摩尔量为30%以上的化学式(1)所示的结构单元。
Description
技术领域
本发明涉及含有聚乙烯醇缩醛树脂的浆料组合物、陶瓷生片和层叠陶瓷电容器。
背景技术
制造层叠陶瓷电容器时,通常采用如下所述的工序。首先,向分散有陶瓷粉末的有机溶剂中添加聚乙烯醇缩丁醛树脂等粘结剂树脂和增塑剂,利用球磨机等均匀混合,由此制备陶瓷生片用浆料组合物,将所制备的浆料组合物在聚对苯二甲酸乙二醇酯薄膜等剥离性的支撑体上流延成型,通过加热等蒸馏去除溶剂等,然后从支撑体剥离,从而制造陶瓷生片。
接着,交替重叠多张通过丝网印刷等在陶瓷生片的表面涂布有成为内部电极的导电糊剂而得的层,加热压接得到层叠体。进而,通过各工序形成层叠体,并切断为规定形状。然后,进行使此层叠体中包含的粘结剂成分等热分解而去除的处理、即脱脂处理后,经由在烧成而得到的陶瓷烧成物的端面烧结外部电极的工序,由此来制造层叠陶瓷电容器。因此,对于上述浆料组合物,要求制备操作的良好操作性,对于上述陶瓷生片,要求能够承受各工序的强度。
近年来,伴随着电子设备的多功能化、小型化,对层叠陶瓷电容器正在要求大容量化、小型化。与此相对应,作为用于陶瓷生片的陶瓷粉末,正在尝试使用0.5μm以下的微细粒径的粉末,在剥离性的支撑体上涂覆为5μm以下这样的薄膜状。
然而,使用细微粒径的陶瓷粉末时,由于填充密度、表面积增加,因此使用的粘结剂树脂量增加,与此相伴地,陶瓷生片用浆料组合物的粘度也增大,因此有时涂覆变得困难,或者产生陶瓷粉末本身的分散不良。另一方面,在陶瓷生片制作时的各工序中,由于负载拉伸、弯曲等应力,因此为了能够承受这样的应力而使用聚合度高的树脂作为粘结剂树脂。
专利文献1中,公开了由含有聚乙烯醇缩醛树脂、陶瓷粉末、以及有机溶剂的陶瓷生片用浆料组合物获得的陶瓷生片的机械强度优异,所述聚乙烯醇缩醛树脂的聚合度为超过2400且4500以下、乙烯基酯单元量为1~20摩尔%、缩醛化度为55~80摩尔%。
然而,最近正在要求陶瓷生片的进一步薄层化,在利用上述陶瓷浆料组合物制作超薄层的陶瓷生片时,其厚度若为2μm以下,则会产生容易引起片浸蚀(sheetattack)现象这样的问题。
此处,片浸蚀现象是指,在获得的陶瓷生片上印刷成为内部电极层的导电糊剂时,因导电糊剂中的有机溶剂而使陶瓷生片所包含的粘结剂树脂溶解,在陶瓷生片中产生破损等缺陷的现象,发生该片浸蚀现象时,层叠陶瓷电容器的电性能、可靠性降低,成品率显著降低。
专利文献2中,公开了一种聚乙烯醇缩醛树脂组合物,其特征在于,其是将皂化度为80摩尔%以上且数均聚合度为1000~4000的聚乙烯醇树脂缩醛化而获得的聚乙烯醇缩醛树脂,缩醛化度为60~75摩尔%,且被乙醛缩醛化的部分与被丁醛缩醛化的部分之比(被丁醛缩醛化而消失的羟基的摩尔数/被乙醛缩醛化而消失的羟基的摩尔数)为0.1~2。
然而,层叠陶瓷电容器的小型化是有限度的,为了使芯片大容量化,或者保持容量而小型化,在生片的薄层化的基础上,还正在要求多层化。随着这种多层小型化,生片保存时的吸湿性变为问题。即,保存中粘结剂树脂发生吸湿从而引起尺寸变化,或者由于层叠多层薄膜,因此若每1层的水分量多,则脱脂时水分一下子蒸发而产生被称为脱层(delamination)的层间剥离。因此,生片保存时的调湿或者脱脂条件的调节变得非常重要。
例如,被乙醛缩醛化的聚乙烯醇缩醛的玻璃化转变温度高,且具有充分的机械强度,但由于乙醛的疏水性低,因此对于所例示的与丁醛的混合缩醛化物而言,吸湿性也高,不满足上述问题。另外,对于基于丁醛的缩醛化物而言,也不满足充分的低吸湿性。
如此,专利文献1、专利文献2中并未公开兼具生片保存时的尺寸变化少、且脱脂时难以产生层间剥离这样的性质的聚乙烯醇缩醛树脂。
现有技术文献
专利文献
专利文献1:日本特开2006-089354号公报
专利文献2:日本特开2008-133371号公报
发明内容
发明要解决的问题
本发明鉴于上述现状,目的在于:提供一种浆料组合物,其获得的陶瓷生片具有充分的机械强度,保存时的尺寸变化少,且脱脂初期难以产生层间剥离。
用于解决问题的方案
本发明人等经过深入研究,结果查明如下所述的聚乙烯醇缩醛树脂的玻璃化转变温度高,且显示出低吸水性,从而完成了本发明,所述聚乙烯醇缩醛树脂的聚合度为500以上且6000以下、乙烯基酯单元的含量为0.01~30摩尔%、缩醛化度为50~83摩尔%、且被包含2-甲基丙醛的醛进行了缩醛化。
即,本发明涉及一种浆料组合物,其含有聚乙烯醇缩醛树脂、相对于前述聚乙烯醇缩醛树脂为10~1000ppm的2-甲基丙酸、以及有机溶剂,所述聚乙烯醇缩醛树脂的聚合度为500以上且6000以下,乙烯基酯单元的含量为0.01~30摩尔%,缩醛化度为50~83摩尔%,在分子中具有相对于全部被缩醛化的结构单元的总摩尔量为30%以上的化学式(1)所示的结构单元。
前述聚乙烯醇缩醛树脂优选的是,在分子中还具有化学式(2)和/或化学式(3)所示的结构单元。
本发明的浆料组合物优选的是,还含有陶瓷粉末。
本发明还涉及一种陶瓷生片,其是使用前述浆料组合物得到的。
本发明还涉及一种层叠陶瓷电容器,其是使用前述陶瓷生片得到的。
发明的效果
根据本发明的浆料组合物,可得到具有充分的机械强度、保存时的尺寸变化少的陶瓷生片。另外,根据该陶瓷生片,可得到在脱脂初期难以产生层间剥离的层叠陶瓷电容器。
具体实施方式
以下详细说明本发明。
本发明中使用的聚乙烯醇缩醛树脂的聚合度为500以上且6000以下。若聚合度低于500,则在制作陶瓷生片时,机械强度变得不充分;若聚合度超过6000,则无法充分溶解于有机溶剂,或者溶液粘度变得过高,涂覆性、分散性降低。优选的下限为1000,优选的上限为4500。进一步优选的是,下限为1500,上限为3500。
上述聚乙烯醇缩醛树脂可以通过使用醛将聚合度为500以上且6000以下的聚乙烯醇树脂缩醛化来制造。
需要说明的是,上述聚合度可由聚乙烯醇缩醛树脂的制造中使用的聚乙烯醇树脂的粘度平均聚合度、聚乙烯醇缩醛树脂的粘度平均聚合度两者来求出。即,由于聚合度不会因缩醛化而发生变化,因此聚乙烯醇树脂与将该聚乙烯醇缩醛化而获得的聚乙烯醇缩醛树脂的聚合度相同。虽然没有特别限定,但聚乙烯醇树脂的粘度平均聚合度是指按照JISK6726求出的平均聚合度。另外,混合使用2种以上的聚乙烯醇树脂作为聚乙烯醇树脂时,是指混合后的聚乙烯醇树脂整体的表观上的粘度平均聚合度。另一方面,聚乙烯醇缩醛树脂的聚合度是指按照JISK6728中记载的方法测定的粘度平均聚合度。此处,聚乙烯醇缩醛树脂为2种以上的聚乙烯醇缩醛树脂的混合物时,也是指混合后的聚乙烯醇缩醛树脂整体的表观上的粘度平均聚合度。
上述聚乙烯醇缩醛树脂的乙烯基酯单元的含量的下限为0.01摩尔%,上限为30摩尔%。低于0.01摩尔%时,聚乙烯醇缩醛树脂中的羟基的分子内及分子间的氢键增加,陶瓷生片用浆料组合物的粘度变得过高,并且在用于导电糊剂的有机溶剂中的溶解性变得过高,变得容易出现片浸蚀现象。超过30摩尔%时,由于聚乙烯醇缩醛树脂的玻璃化转变温度下降,柔软性变得过强,因此陶瓷生片的处理性、机械强度、以及加热压接时的尺寸稳定性变差。优选的下限为0.5摩尔%,优选的上限为23摩尔%,进一步优选的上限为20摩尔%。需要说明的是,乙烯基酯单元的含量为0.01~30摩尔%的聚乙烯醇缩醛树脂可通过将乙烯基酯单元的含量为0.01~30摩尔%的聚乙烯醇树脂、即皂化度为70~99.99摩尔%的聚乙烯醇树脂缩醛化而获得。聚乙烯醇树脂的皂化度的优选的下限为77摩尔%,进一步优选的下限为80摩尔%,优选的上限为99.5摩尔%。
上述聚乙烯醇缩醛树脂的缩醛化度的下限为50摩尔%,上限为83摩尔%。低于50摩尔%时,聚乙烯醇缩醛树脂的亲水性高,变得难以溶于有机溶剂,进而,在保存时发生吸水而引起陶瓷生片的尺寸变化,成为脱脂初期的层间剥离的原因。超过83摩尔%时,残留的羟基变少,聚乙烯醇缩醛树脂的强韧性受到损害,并且从生产率、反应性的观点出发,也会难以在工业上获得,导致生产率的降低。优选的下限为55摩尔%,更优选的下限为60摩尔%,优选的上限为80摩尔%。
为了将上述聚乙烯醇缩醛树脂的缩醛化度调节为50~83摩尔%,需要适当调整醛相对于聚乙烯醇树脂的添加量、以及添加醛和酸催化剂后的反应时间等。另外,相对于聚乙烯醇100质量份,优选添加20~150质量份的醛。
聚乙烯醇缩醛树脂的缩醛化度可以通过使聚乙烯醇缩醛树脂溶于DMSO-d6(二甲亚砜)并测定1H-NMR光谱来算出。
本发明中使用的聚乙烯醇缩醛树脂在分子中具有相对于全部被缩醛化的结构单元的总摩尔量为30%以上的化学式(1)所示的结构单元。
由于上述化学式(1)所示结构单元形成与2个氧原子键合的碳原子进而与异丙基键合的结构,因此具有规定量以上的该结构单元的聚乙烯醇缩醛树脂的物性的平衡优异,制成涂膜时的耐湿热性也优异。另一方面,上述化学式(1)所示结构单元相对于聚乙烯醇缩醛树脂中的全部被缩醛化的结构单元的比率低于30%时,吸湿性变高,成为生片的尺寸变化、脱脂时脱层的原因。上述化学式(1)所示的结构单元的比率优选为40%以上,进一步优选为50%以上。对比率的上限没有特别限制,也可以为100%,即所有被缩醛化的结构单元均为上述化学式(1)所示的结构单元。上述聚乙烯醇缩醛树脂可以通过使用包含2-甲基丙醛的醛将聚乙烯醇树脂缩醛化来制造。
本发明中使用的聚乙烯醇缩醛树脂优选的是,在分子中还具有化学式(2)和/或化学式(3)所示的结构单元。
通过具有化学式(2)所示的结构单元,所得的聚乙烯醇缩醛树脂的机械强度提高。另外,通过具有化学式(3)所示的结构单元,所得的聚乙烯醇缩醛树脂的低吸湿性提高。上述化学式(2)和/或化学式(3)所示的结构单元的比率通常为70%以下,优选为60%以下,进一步优选为50%以下。对比率的下限没有特别限制,优选为10%以上。上述聚乙烯醇缩醛树脂可以通过使用在2-甲基丙醛的基础上还包含乙醛和/或正丁醛的醛将聚乙烯醇树脂缩醛化来制造。
本发明中使用的聚乙烯醇缩醛树脂的玻璃化转变温度优选为72~100℃,更优选为75~95℃。玻璃化转变温度低于72℃时,机械强度变低,高于100℃时,有热压接性变差而成为脱层的原因的倾向。
本发明中使用的聚乙烯醇缩醛树脂通常将聚乙烯醇树脂作为原料来制造。上述聚乙烯醇树脂可以通过现有公知的方法、即将乙烯基酯系单体聚合并将获得的聚合体皂化而得到。作为将乙烯基酯系单体聚合的方法,可以应用溶液聚合法、本体聚合法、悬浮聚合法、乳液聚合法等现有公知的方法。作为聚合引发剂,根据聚合方法,可适当选择偶氮系引发剂、过氧化物系引发剂、氧化还原系引发剂等。皂化反应可以应用现有公知的使用碱催化剂或酸催化剂的醇解、水解等,其中,将甲醇作为溶剂并使用苛性钠(NaOH)催化剂的皂化反应简便,是最优选的。
作为乙烯基酯系单体,例如可列举出甲酸乙烯酯、乙酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、异丁酸乙烯酯、新戊酸乙烯酯、叔碳酸乙烯酯、己酸乙烯酯、辛酸乙烯酯、月桂酸乙烯酯、棕榈酸乙烯酯、硬脂酸乙烯酯、油酸乙烯酯、苯甲酸乙烯酯等,特别优选乙酸乙烯酯。
另外,将前述乙烯基酯系单体聚合时,在不损害本发明主旨的范围内,也可以与其他单体共聚。因此,本发明中的聚乙烯醇树脂为还包括由乙烯醇单元与其他单体单元构成的聚合物的概念。作为其他单体的例子,例如可列举出乙烯、丙烯、正丁烯、异丁烯等α-烯烃;丙烯酸及其盐;丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸异丙酯、丙烯酸正丁酯、丙烯酸异丁酯、丙烯酸叔丁酯、丙烯酸-2-乙基己酯、丙烯酸十二烷基酯、丙烯酸十八烷基酯等丙烯酸酯类;甲基丙烯酸及其盐;甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸异丙酯、甲基丙烯酸正丁酯、甲基丙烯酸异丁酯、甲基丙烯酸叔丁酯、甲基丙烯酸-2-乙基己酯、甲基丙烯酸十二烷基酯、甲基丙烯酸十八烷基酯等甲基丙烯酸酯类;丙烯酰胺、N-甲基丙烯酰胺、N-乙基丙烯酰胺、N,N-二甲基丙烯酰胺、双丙酮丙烯酰胺、丙烯酰胺丙磺酸及其盐、丙烯酰胺丙基二甲基胺及其酸盐或季盐、N-羟甲基丙烯酰胺及其衍生物等丙烯酰胺衍生物;甲基丙烯酰胺、N-甲基甲基丙烯酰胺、N-乙基甲基丙烯酰胺、甲基丙烯酰胺丙磺酸及其盐、甲基丙烯酰胺丙基二甲基胺及其酸盐或季盐、N-羟甲基甲基丙烯酰胺及其衍生物等甲基丙烯酰胺衍生物;甲基乙烯基醚、乙基乙烯基醚、正丙基乙烯基醚、异丙基乙烯基醚、正丁基乙烯基醚、异丁基乙烯基醚、叔丁基乙烯基醚、十二烷基乙烯基醚、硬脂基乙烯基醚等乙烯基醚类;丙烯腈、甲基丙烯腈等腈类;氯乙烯、氟乙烯等卤化乙烯;偏二氯乙烯、偏而氟乙烯等偏二卤化乙烯;乙酸烯丙酯、烯丙基氯等烯丙基化合物;马来酸及其盐、酯或酸酐;乙烯基三甲氧基硅烷等乙烯基甲硅烷化合物;乙酸异丙烯酯等。这些单体通常以相对于乙烯基酯系单体为低于10摩尔%的比例来使用。
其他单体单元为α-烯烃单元时,其含量的优选下限为1摩尔%,优选上限为20摩尔%。低于1摩尔%时,含有上述α-烯烃的效果变得不充分,超过20摩尔%时,疏水性变得过强而陶瓷粉末的分散性降低,或者由于聚乙烯醇树脂的溶解性降低而缩醛化反应变困难。
作为用于缩醛化的酸催化剂,没有特别限定,有机酸和无机酸的任一种均可使用,例如可列举出乙酸、对甲苯磺酸、硝酸、硫酸、盐酸等。其中,优选使用盐酸、硫酸、硝酸,特别优选使用盐酸、硝酸。
本发明中使用的聚乙烯醇缩醛树脂可以通过如下方法得到。首先,在80~100℃的温度范围内制备浓度3~15质量%的聚乙烯醇树脂的水溶液,然后用10~60分钟缓慢进行冷却。温度低至-10~40℃时,添加醛和酸催化剂,一边将温度保持恒定,一边进行10~300分钟缩醛化反应。优选的是,其后包括用30~200分钟将反应液升温至15~80℃的温度并将该温度保持0~360分钟的熟化工序。接着,将反应液冷却至优选为室温并进行水洗,然后添加碱等中和剂,进行清洗、干燥,由此获得目标的聚乙烯醇缩醛树脂。
本发明中,使用2-甲基丙醛作为用于将聚乙烯醇树脂缩醛化的醛,由此能够将化学式(1)所示的结构单元导入到聚乙烯醇缩醛树脂中。但是,在不损害本发明特性的范围内,也可以使用以下醛。例如,甲醛(包括多聚甲醛)、乙醛、丙醛、戊醛、异戊醛、己醛、2-乙基丁醛、新戊醛、辛醛、2-乙基己醛、壬醛、癸醛、十二醛等脂肪族醛及其烷基缩醛;环戊醛、甲基环戊醛、二甲基环戊醛、环己醛、甲基环己醛、二甲基环己醛、环己基乙醛等脂环族醛及其烷基缩醛;环戊烯醛、环己烯醛等环式不饱和醛及其烷基缩醛;苯甲醛、甲基苯甲醛、二甲基苯甲醛、甲氧基苯甲醛、苯基乙醛、苯基丙醛、枯醛、萘基甲醛、蒽甲醛、肉桂醛、巴豆醛、丙烯醛、7-辛烯基-1-醛等芳香族或含不饱和键的醛及其烷基缩醛;糠醛、甲基糠醛等杂环醛及其烷基缩醛;等。
另外,本发明中,作为能够用于将聚乙烯醇树脂缩醛化的、具有羟基、羧酸基、磺酸基或磷酸基等作为官能团的醛,可列举出羟基乙醛、羟基丙醛、羟基丁醛、羟基戊醛、水杨醛、二羟基苯甲醛等含羟基醛及其烷基缩醛;乙醛酸及其金属盐或者铵盐、2-甲酰乙酸及其金属盐或者铵盐、3-甲酰丙酸及其金属盐或者铵盐、5-甲酰戊酸及其金属盐或者铵盐、4-甲酰苯氧基乙酸及其金属盐或者铵盐、2-羧基苯甲醛及其金属盐或者铵盐、4-羧基苯甲醛及其金属盐或者铵盐、2,4-二羧基苯甲醛及其金属盐或者铵盐;苯甲醛-2-磺酸及其金属盐或者铵盐、苯甲醛-2,4-二磺酸及其金属盐或者铵盐、4-甲酰苯氧基磺酸及其金属盐或者铵盐、3-甲酰-1-丙磺酸及其金属盐或者铵盐、7-甲酰-1-己磺酸及其金属盐或者铵盐;4-甲酰苯氧基膦酸及其金属盐或者铵盐;等含酸的醛及其烷基缩醛;等。
进而,作为能够用于将聚乙烯醇树脂缩醛化的、具有氨基、氰基、硝基或季铵盐等作为官能团的醛,可列举出氨基乙醛、二甲基氨基乙醛、二乙基氨基乙醛、氨基丙醛、二甲基氨基丙醛、氨基丁醛、氨基戊醛、氨基苯甲醛、二甲基氨基苯甲醛、乙基甲基氨基苯甲醛、二乙基氨基苯甲醛、吡咯烷基乙醛、哌啶基乙醛、吡啶基乙醛、氰基乙醛、α-氰基丙醛、硝基苯甲醛、三甲基对甲酰苯基碘化铵、三乙基对甲酰苯基碘化铵、三甲基-2-甲酰乙基碘化铵及其烷基缩醛等。
作为能够用于将聚乙烯醇树脂缩醛化的、具有卤素作为官能团的醛,可列举出氯乙醛、溴乙醛、氟乙醛、氯丙醛、溴丙醛、氟丙醛、氯丁醛、溴丁醛、氟丁醛、氯戊醛、溴戊醛、氟戊醛、氯苯甲醛、二氯苯甲醛、三氯苯甲醛、溴苯甲醛、二溴苯甲醛、三溴苯甲醛、氟苯甲醛、二氟苯甲醛、三氟苯甲醛、三氯甲基苯甲醛、三溴甲基苯甲醛、三氟甲基苯甲醛及其烷基缩醛等。其中,在组合使用除了2-甲基丙醛之外的醛进行缩醛化反应时,如上所述,优选使用乙醛和/或正丁醛。
上述聚乙烯醇缩醛树脂的制造中使用的醛优选为单醛(一分子内有1个醛基)。用具有2个以上醛基的化合物进行缩醛化时,交联部位与未交联部位的应力解除力不同,因此有时制膜时会发生翘曲。因此,使用的醛优选仅为单醛,即使在使用具有2个以上醛基的化合物时,也优选添加相对于聚乙烯醇树脂的乙烯醇单元比0.005摩尔%少的量、更优选添加0.003摩尔%以下的量来进行缩醛化。
本发明中使用的聚乙烯醇缩醛树脂含有10~1000ppm的2-甲基丙酸。通过含有少量2-甲基丙酸,陶瓷粉末的分散性提高。2-甲基丙酸的含量低于10ppm的聚乙烯醇缩醛树脂在制造时的清洗条件变得过于苛刻,而且有时会产生所得的烧成体的陶瓷层与导电层之间的脱层,是不优选的。另一方面,2-甲基丙酸的含量超过1000ppm时,会有由本发明的浆料所得的生片的强度降低,或者产生烧结体的脱层的倾向,是不优选的。
本发明的浆料组合物除了上述聚乙烯醇缩醛树脂之外,还含有有机溶剂。作为有机溶剂,没有特别限定,例如可列举出丙酮、甲乙酮、二丙酮、二异丁酮等酮类;甲醇、乙醇、异丙醇、丁醇等醇类;甲苯、二甲苯等芳香族烃类;丙酸甲酯、丙酸乙酯、丙酸丁酯、丁酸甲酯、丁酸乙酯、丁酸丁酯、戊酸甲酯、戊酸乙酯、戊酸丁酯、己酸甲酯、己酸乙酯、己酸丁酯、乙酸2-乙基己酯、丁酸2-乙基己酯等酯类;甲基溶纤剂、乙基溶纤剂、丁基溶纤剂、α-萜品醇、丁基溶纤剂乙酸酯、丁基卡必醇乙酸酯等二醇类或萜类。这些有机溶剂可以单独使用,也可以组合使用2种以上。有机溶剂的含量相对于本发明的浆料组合物总量的上限为80质量%,优选为70质量%,下限为20质量%。只要为上述范围内,就能够赋予本发明的浆料组合物适度的混炼性。比80质量%多时,粘度变得过低,将片进行成型时的处理性变差,比20质量%少时,浆料组合物的粘度变得过高,有混炼性降低的倾向。
尤其,上述浆料组合物中还含有陶瓷粉末的浆料组合物在溶解于通常用于陶瓷生片的制造工序的乙醇与甲苯的1:1混合溶剂时,由于含有赋予适度的溶液粘度的聚乙烯醇缩醛树脂,因此将该浆料组合物作为原料,能够得到显示充分的涂覆性、机械强度,且具有良好的填充性的陶瓷生片。
作为上述陶瓷粉末,没有特别限定,例如可列举出氧化铝、氧化锆、硅酸铝、氧化钛、氧化锌、钛酸钡、氧化镁、赛隆(sialon)、尖晶石莫来石(スピネムルライト)、碳化硅、氮化硅、氮化铝等粉末。这些陶瓷粉末可以单独使用,也可以组合使用2种以上。陶瓷粉末的含量相对于含有上述陶瓷粉末的浆料组合物总量的上限为80质量%,下限为30质量%。比30质量%少时,粘度变得过低,将陶瓷生片进行成型时的处理性变差,比80质量%多时,浆料组合物的粘度变得过高,有混炼性降低的倾向。
含有上述陶瓷粉末的浆料组合物除了上述聚乙烯醇缩醛树脂之外还含有丙烯酸系树脂、纤维素系树脂作为粘结剂树脂。此时,上述聚乙烯醇缩醛树脂在粘结剂树脂总体中所占的含量的优选下限为30质量%。低于30质量%时,有时获得的陶瓷生片的机械强度、加热压接性变得不充分。
含有上述陶瓷粉末的浆料组合物还可以根据需要而添加增塑剂。对添加的增塑剂的种类没有特别限定,例如可列举出邻苯二甲酸二辛酯、邻苯二甲酸苄基丁酯、邻苯二甲酸二丁酯、邻苯二甲酸二己酯、邻苯二甲酸二(2-乙基丁酯)、邻苯二甲酸二(2-乙基己酯)(DOP)等邻苯二甲酸系增塑剂;己二酸二己酯、己二酸二(2-乙基己酯)(DOA)等己二酸系增塑剂;乙二醇、二乙二醇、三乙二醇等二醇系增塑剂;三乙二醇二丁酸酯、三乙二醇二(2-乙基丁酸酯)、三乙二醇二(2-乙基己酸酯)等二醇酯系增塑剂;等,这些也可以组合使用2种以上。这些当中,从挥发性低、易于保持片的柔软性的方面出发,适宜为DOP、DOA、三乙二醇-2-乙基己酸酯。对增塑剂的用量没有特别限定,相对于浆料组合物的总量,优选使用0.1~10质量%,更适宜为1~8质量%。
在不损害本发明效果的范围内,含有上述陶瓷粉末的浆料组合物除了上述粘结剂树脂、增塑剂之外,也可以含有润滑剂、分散剂、抗静电剂、抗氧化剂等现有公知的添加剂。
作为制造含有上述陶瓷粉末的浆料组合物的方法,没有特别限定,例如可列举出:使用球磨机、开炼机、3辊等各种混合机将含有上述聚乙烯醇缩醛树脂的粘结剂树脂、陶瓷粉末、有机溶剂以及根据需要而添加的各种添加剂进行混合的方法。
含有上述陶瓷粉末的浆料组合物能够制造具有充分的机械强度的薄膜陶瓷生片。作为陶瓷生片的制造方法,没有特别限定,可以通过现有公知的制造方法来制造,例如可列举出:将含有上述陶瓷粉末的浆料组合物在聚对苯二甲酸乙二醇酯薄膜等剥离性的支撑体上流延成型,并通过加热等蒸馏去除溶剂等,然后从支撑体剥离的方法等。
通过在上述陶瓷生片上涂布导电糊剂并层叠,能够制作层叠陶瓷电容器。如此,使用本发明的陶瓷生片和导电糊剂而获得的层叠陶瓷电容器也是本发明之一。
作为本发明的层叠陶瓷电容器的制造方法,没有特别限定,可以通过现有公知的制造方法来制造,例如可列举出:交替重叠多张通过丝网印刷等在本发明的陶瓷生片的表面涂布有成为内部电极的导电糊剂而得的层,加热压接而得到层叠体,使该层叠体中所包含的粘结剂成分等热分解而去除(脱脂处理),然后在烧成而获得的陶瓷烧成物的端面烧结外部电极的方法等。
实施例
以下,列举出实施例来进一步详细说明本发明,但本发明不受这些实施例的任何限定。需要说明的是,以下实施例中,若无特别说明,则“%”和“份”是指“质量%”和“质量份”。
聚乙烯醇缩醛树脂的各物性的测定按照以下方法来进行。
(聚乙烯醇缩醛树脂的乙酸乙烯酯单元的含量、乙烯醇单元的含量以及缩醛化度)
根据1H-NMR算出。
(玻璃化转变温度)
作为DSC(差示扫描量热计),使用SeikoInstrumentsInc.制造的EXTAR6000(RD220),在氮气中使聚乙烯醇缩醛树脂从30℃以10℃/分钟的升温速度升温至150℃后,冷却至30℃,再次以10℃/分钟的升温速度升温至150℃。采用再升温后的测定值作为玻璃化转变温度。
(吸水率)
将厚度0.2mm、大小10cm×10cm的测定用试样在减压下以50℃干燥6天,接着,测定将干燥后的试样在20℃的纯水中浸渍24小时时的质量,根据下式求出吸水率。
吸水率(质量%)=[(浸渍后的质量-浸渍前的干燥后质量)/(浸渍前的干燥后质量)]×100
(聚乙烯醇缩醛树脂中的2-甲基丙酸的含量)
用热脱附GC-MS在以下条件下对聚乙烯醇缩醛树脂中的2-甲基丙酸的含量进行定量。
热脱附条件
脱附温度:100℃
脱附时间:10min.
Trap温度:-30℃
脱附温度:260℃
脱附保持时间:30min.
(GC条件)
柱箱温度:从40℃升温至240℃
载气:He,1.0mL/min.
样品量:50mg(冻结粉碎品)
<实施例1>
(聚乙烯醇缩醛树脂的制备)
向具备回流冷凝器、温度计和锚型搅拌叶片的、内容积为2升的玻璃制容器中加入离子交换水1295g、聚乙烯醇(PVA-1:聚合度1700、皂化度98.8摩尔%)105g,将整体升温至95℃使聚乙烯醇完全溶解,得到聚乙烯醇水溶液(浓度7.5质量%)。一边将获得的聚乙烯醇水溶液以转速120rpm持续搅拌,一边用约30分钟缓慢冷却至13℃,然后向该水溶液中添加2-甲基丙醛60.0g,进而添加缩醛化催化剂即浓度20质量%的盐酸100ml,引发聚乙烯醇的缩醛化。进行15分钟缩醛化后,用120分钟将反应体系升温至47℃,在47℃下保持180分钟,然后冷却至室温。将通过冷却析出的树脂利用过滤进行分离,用相对于树脂为100倍量的离子交换水清洗10次后,为了中和而加入0.3质量%氢氧化钠溶液,在50℃下保持5小时。进而,用100倍量的离子交换水反复进行10次再清洗,脱水后在40℃、减压下干燥18小时,得到聚乙烯醇缩醛树脂(PVIB-1)。分析获得的聚乙烯醇缩醛树脂(PVIB-1),被2-甲基丙醛缩醛化的结构单元的含量(缩醛化度)为70.9摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为27.9摩尔%。将得到的聚乙烯醇缩醛树脂10质量份加入到甲苯20质量份与乙醇20质量份的混合溶剂中,进而加入作为增塑剂的DOP8质量份并搅拌溶解。向得到的树脂溶液中加入作为陶瓷粉末的钛酸钡(SAKAICHEMICALINDUSTRYCO.,LTD.制造、BT-03(平均粒径0.3μm))100质量份,用球磨机混合48小时,由此得到陶瓷生片用浆料组合物。
<实施例2>
使用PVA-2(聚合度800、皂化度98.4摩尔%)代替PVA-1,使用2-甲基丙醛61.5g,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVIB-2)。缩醛化度为71.7摩尔%,乙酸乙烯酯单元的含量为1.6摩尔%,乙烯醇单元的含量为26.7摩尔%。接着,使用PVIB-2,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<实施例3>
使用PVA-3(聚合度2400、皂化度98.8摩尔%)代替PVA-1,使用2-甲基丙醛59.6g,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVIB-3)。缩醛化度为70.3摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为28.5摩尔%。接着,使用PVIB-3,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<实施例4>
使用PVA-4(聚合度4000、皂化度98.9摩尔%)代替PVA-1,使用2-甲基丙醛65.1g,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVIB-4)。缩醛化度为75.6摩尔%,乙酸乙烯酯单元的含量为1.1摩尔%,乙烯醇单元的含量为23.3摩尔%。接着,使用PVIB-4,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<实施例5>
使用PVA-5(聚合度1700、皂化度88.0摩尔%)代替PVA-1,使用2-甲基丙醛50.6g,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVIB-5)。缩醛化度为71.2摩尔%,乙酸乙烯酯单元的含量为12.0摩尔%,乙烯醇单元的含量为16.8摩尔%。接着,使用PVIB-5,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<实施例6>
使用2-甲基丙醛35.5g和正丁醛30.5g作为醛,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVIB-6)。被2-甲基丙醛缩醛化的结构单元的含量为41.8摩尔%,被正丁醛缩醛化的结构单元的含量为35.1摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为21.9摩尔%。接着,使用PVIB-6,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<实施例7>
使用2-甲基丙醛30.5g和乙醛20.4g作为醛,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVIB-7)。被2-甲基丙醛缩醛化的结构单元的含量为41.6摩尔%,被乙醛缩醛化的结构单元的含量为37.6摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为19.6摩尔%。接着,使用PVIB-7,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例1>
使用正丁醛58.4g代替2-甲基丙醛作为醛,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVB-A)。缩醛化度为68.6摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为30.2摩尔%。接着,使用PVB-A,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例2>
使用正丁醛60.5g代替2-甲基丙醛作为醛,除此之外与实施例2同样操作,得到聚乙烯醇缩醛树脂(PVB-B)。缩醛化度为71.2摩尔%,乙酸乙烯酯单元的含量为1.6摩尔%,乙烯醇单元的含量为27.2摩尔%。接着,使用PVB-B,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例3>
使用正丁醛58.7g代替2-甲基丙醛作为醛,除此之外与实施例3同样操作,得到聚乙烯醇缩醛树脂(PVB-C)。缩醛化度为68.7摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为30.1摩尔%。接着,使用PVB-C,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例4>
使用正丁醛35.8g和乙醛19.5g代替2-甲基丙醛作为醛,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVB-D)。被正丁醛缩醛化的结构单元的含量为40.0摩尔%,被乙醛缩醛化的结构单元的含量为36.9摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为21.9摩尔%。接着,使用PVB-D,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例5>
使用2-甲基丙醛18.5g和正丁醛47.8g作为醛,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVB-E)。被2-甲基丙醛缩醛化的结构单元的含量为21.6摩尔%,被正丁醛缩醛化的结构单元的含量为55.3摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为21.9摩尔%。接着,使用PVB-E,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例6>
使用2-甲基丙醛20.2g和乙醛29.5g作为醛,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVB-F)。被2-甲基丙醛缩醛化的结构单元的含量为23.0摩尔%,被乙醛缩醛化的结构单元的含量为56.2摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为19.6摩尔%。接着,使用PVB-F,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例7>
使用2-甲基丙醛41.2g,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVB-G)。缩醛化度为48.3摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为50.5摩尔%。接着,使用PVB-G,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例8>
使用PVA-6(聚合度400、皂化度98.8摩尔%)代替PVA-1,使用2-甲基丙醛60.3g,除此之外与实施例1同样操作,得到聚乙烯醇缩醛树脂(PVB-H)。缩醛化度为70.8摩尔%,乙酸乙烯酯单元的含量为1.2摩尔%,乙烯醇单元的含量为28.0摩尔%。接着,使用PVB-H,与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例9>
进一步重复40次对实施例1中得到的PVIB-1用离子交换水的再清洗,除此之外与实施例1同样操作,得到陶瓷生片用浆料组合物。
<比较例10>
将实施例1中得到的PVIB-1用离子交换水的再清洗设为1次,除此之外与实施例1同样操作,得到陶瓷生片用浆料组合物。
(陶瓷生片的制造)
将实施例1~7和比较例1~10中获得的陶瓷生片用浆料组合物用棒涂机涂覆在进行过脱模处理的聚酯薄膜上,使得干燥厚度为1μm,在常温下风干1小时,然后用热风干燥机在80℃下干燥3小时,接着在120℃下干燥2小时,得到陶瓷生片。
(评价)
(机械强度的评价)
将获得的陶瓷生片从聚酯薄膜剥离,观察陶瓷生片的状态,按照以下3个阶段进行评价。结果示于表1。
○:陶瓷生片中未观察到碎片、破损。
△:观察到少许碎片、破损。
×:明确观察到碎片、破损。
(保存时的尺寸稳定性评价)
将30cm×30cm的陶瓷生片静置于23℃、65%RH的高温恒湿层,测定制膜后和10天后的尺寸变化率,按照以下2个阶段进行评价。结果示于表1。
○:陶瓷生片的尺寸变化率低于0.1%且未确认到翘曲。
×:陶瓷生片的尺寸变化率为0.1%以上,或者确认到翘曲。
(导电糊剂的制作)
将作为导电粉末的镍粉末(2020SS、三井金属矿业株式会社制造)100质量份、乙基纤维素(TheDowChemicalCompany制造、STD-100)5质量份、作为溶剂的萜品醇-C(NipponTerpeneChemicals,Inc.制造)60质量份混合后,用3辊进行混炼,得到导电糊剂。
(陶瓷烧结体的制造)
通过丝网印刷法将上述获得的导电糊剂涂覆在上述获得的陶瓷生片的单面,使得干燥后的厚度约为1.0μm,使其干燥而形成导电层。将具有该导电层的陶瓷生片切割为5cm见方,重叠100张,在温度70℃、压力150kg/cm2下加热压接10分钟,得到层叠体。将获得的层叠体在氮气气氛下以升温速度3℃/分钟升温至400℃并保持5小时,然后进一步以升温速度5℃/分钟升温至1350℃并保持10小时,由此得到陶瓷烧结体。
(烧结体的脱层的评价)
将该烧结体冷却至常温后,切下一半并用电子显微镜进行观察,观察陶瓷层与导电层之间是否有脱层,按照以下3个阶段进行评价。结果示于表1。
○:无脱层。
△:可观察到少许脱层。
×:有脱层。
[表1]
产业上的可利用性
根据本发明的浆料组合物,可得到具有充分的机械强度、保存时的尺寸变化少的陶瓷生片。另外,根据该陶瓷生片,可得到在脱脂初期难以产生层间剥离的层叠陶瓷电容器。
Claims (7)
1.一种浆料组合物,其含有聚乙烯醇缩醛树脂、相对于所述聚乙烯醇缩醛树脂为10~1000ppm的2-甲基丙酸、以及有机溶剂,所述聚乙烯醇缩醛树脂的聚合度为500以上且6000以下,乙烯基酯单元的含量为0.01~30摩尔%,缩醛化度为50~83摩尔%,在分子中具有相对于全部被缩醛化的结构单元的总摩尔量为30%以上的化学式(1)所示的结构单元,
2.根据权利要求1所述的浆料组合物,其中,所述聚乙烯醇缩醛树脂在分子中还具有化学式(2)和/或化学式(3)所示的结构单元,
3.根据权利要求1所述的浆料组合物,其还含有陶瓷粉末。
4.根据权利要求2所述的浆料组合物,其中具有化学式(2)所示的结构单元。
5.根据权利要求2所述的浆料组合物,其中具有化学式(3)所示的结构单元。
6.根据权利要求2所述的浆料组合物,其中具有化学式(2)和化学式(3)所示的结构单元。
7.一种陶瓷生片,其是使用权利要求3所述的浆料组合物得到的。
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