CN102898959A - 一种可光固化的粘合剂组合物及其用途 - Google Patents
一种可光固化的粘合剂组合物及其用途 Download PDFInfo
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- CN102898959A CN102898959A CN2011102111081A CN201110211108A CN102898959A CN 102898959 A CN102898959 A CN 102898959A CN 2011102111081 A CN2011102111081 A CN 2011102111081A CN 201110211108 A CN201110211108 A CN 201110211108A CN 102898959 A CN102898959 A CN 102898959A
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- methyl
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- acryloxy
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- acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/048—Polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J113/00—Adhesives based on rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (15)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110211108.1A CN102898959B (zh) | 2011-07-25 | 2011-07-25 | 一种可光固化的粘合剂组合物及其用途 |
TW101122345A TWI564359B (zh) | 2011-07-25 | 2012-06-22 | 可光固化之黏合劑組合物及其用途 |
KR1020147002131A KR102013467B1 (ko) | 2011-07-25 | 2012-07-05 | 광경화성 접착제 조성물 및 그의 용도 |
EP12818272.2A EP2736988B1 (en) | 2011-07-25 | 2012-07-05 | Photocurable adhesive composition and use of the same |
CN201280036197.3A CN103797077B (zh) | 2011-07-25 | 2012-07-05 | 可光固化的粘合剂组合物及其用途 |
JP2014521918A JP6046135B2 (ja) | 2011-07-25 | 2012-07-05 | 光硬化性接着剤組成物およびその使用 |
PCT/CN2012/078228 WO2013013566A1 (en) | 2011-07-25 | 2012-07-05 | Photocurable adhesive composition and use of the same |
US14/162,288 US9663685B2 (en) | 2011-07-25 | 2014-01-23 | Photocurable adhesive composition and use of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110211108.1A CN102898959B (zh) | 2011-07-25 | 2011-07-25 | 一种可光固化的粘合剂组合物及其用途 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102898959A true CN102898959A (zh) | 2013-01-30 |
CN102898959B CN102898959B (zh) | 2016-07-06 |
Family
ID=47571456
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110211108.1A Active CN102898959B (zh) | 2011-07-25 | 2011-07-25 | 一种可光固化的粘合剂组合物及其用途 |
CN201280036197.3A Active CN103797077B (zh) | 2011-07-25 | 2012-07-05 | 可光固化的粘合剂组合物及其用途 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280036197.3A Active CN103797077B (zh) | 2011-07-25 | 2012-07-05 | 可光固化的粘合剂组合物及其用途 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9663685B2 (zh) |
EP (1) | EP2736988B1 (zh) |
JP (1) | JP6046135B2 (zh) |
KR (1) | KR102013467B1 (zh) |
CN (2) | CN102898959B (zh) |
TW (1) | TWI564359B (zh) |
WO (1) | WO2013013566A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103541236A (zh) * | 2013-10-23 | 2014-01-29 | 合肥聚合辐化技术有限公司 | 一种柔性抗蚀印花粘合剂及其制备方法 |
CN107949590A (zh) * | 2015-07-30 | 2018-04-20 | 电化株式会社 | 组合物和粘合剂组合物 |
CN107960098A (zh) * | 2015-11-05 | 2018-04-24 | 株式会社Lg化学 | 光学用粘合剂组合物及光学用粘合膜 |
CN107964375A (zh) * | 2016-10-19 | 2018-04-27 | 迪睿合株式会社 | 连接体的制造方法 |
CN108138008A (zh) * | 2015-09-28 | 2018-06-08 | 泽费罗斯股份有限公司 | 具有基底和粘合涂层的粘合结构体 |
CN108676519A (zh) * | 2013-03-06 | 2018-10-19 | 琳得科株式会社 | 压敏粘合片 |
WO2022205417A1 (en) * | 2021-04-02 | 2022-10-06 | Henkel Ag & Co. Kgaa | Radiation curable (meth) acrylic adhesive composition |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105765024A (zh) * | 2013-11-26 | 2016-07-13 | 株式会社E-Tec | 光硬化型粘着剂组合物、粘着片及层叠体 |
WO2016106062A1 (en) * | 2014-12-23 | 2016-06-30 | Bridgestone Americas Tire Operations, Llc | Actinic radiation curable polymeric mixtures, cured polymeric mixtures and related processes |
KR101822253B1 (ko) | 2015-02-04 | 2018-01-25 | 주식회사 엘지화학 | 점착제 조성물 |
KR102511230B1 (ko) | 2015-06-02 | 2023-03-17 | 닛산 가가쿠 가부시키가이샤 | 무용제형 광경화성 접착제용 조성물 |
KR102385234B1 (ko) * | 2015-09-15 | 2022-04-12 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
CN105315929A (zh) * | 2015-11-23 | 2016-02-10 | 苏州盖德精细材料有限公司 | 一种聚丙烯酸酯uv胶及其制备方法 |
EP3390006B1 (en) | 2015-12-17 | 2021-01-27 | Bridgestone Americas Tire Operations, LLC | Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing |
WO2018081053A1 (en) | 2016-10-27 | 2018-05-03 | Bridgestone Americas Tire Operations, Llc | Processes for producing cured polymeric products by additive manufacturing |
US11306217B2 (en) * | 2016-12-08 | 2022-04-19 | Lg Chem, Ltd. | Method for bonding substrate and substrate for display manufactured by the same |
CN110869457B (zh) * | 2017-07-06 | 2022-09-16 | 株式会社Lg化学 | 复合材料的制备方法 |
CN113874458A (zh) * | 2019-05-22 | 2021-12-31 | 3M创新有限公司 | 包含具有(甲基)丙烯酰基或乙烯基醚基团的多官能组分的聚异丁烯粘合剂 |
KR102466644B1 (ko) * | 2021-03-23 | 2022-11-16 | 주식회사 엘엠에스 | 점착제 조성물 및 광학 점착제 |
DE102021130504A1 (de) | 2021-11-22 | 2023-05-25 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Strahlungshärtbare Stempelmasse, Verwendung der Masse und Verfahren zur Herstellung von gemusterten Erzeugnissen |
CN114806418B (zh) * | 2022-04-06 | 2022-12-16 | 广东鼎立森新材料有限公司 | 一种用于触摸屏的oca光学胶的制备及其应用 |
Citations (5)
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JP2005060465A (ja) * | 2003-08-08 | 2005-03-10 | Bridgestone Corp | 光硬化性シール材用組成物及びそれを用いたシール層付き部材 |
US20070037911A1 (en) * | 2005-08-11 | 2007-02-15 | Bridgestone Corporation | Adhesive composition and process for adhesion using the adhesive composition |
CN101370879A (zh) * | 2006-01-13 | 2009-02-18 | 电气化学工业株式会社 | 固化性树脂组合物、表面保护方法、临时固定方法及剥离方法 |
WO2009067113A1 (en) * | 2007-11-20 | 2009-05-28 | Henkel Ag & Co. Kgaa | Low-voiding die attach film, semiconductor package, and processes for making and using same |
CN102533132A (zh) * | 2010-12-31 | 2012-07-04 | 第一毛织株式会社 | 用于显示器的光学透明粘合剂和包括该粘合剂的电子装置 |
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AU633410B2 (en) | 1990-04-20 | 1993-01-28 | Toppan Forms Co., Ltd. | Adhesive composition for temporary adhesive bonding of paper sheets |
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JP4170861B2 (ja) * | 2003-09-04 | 2008-10-22 | 電気化学工業株式会社 | 光硬化性樹脂組成物 |
US7241540B2 (en) * | 2004-04-27 | 2007-07-10 | Kraton Polymers U.S. Llc | Photocurable compositions and flexographic printing plates comprising the same |
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CN102161732B (zh) | 2006-01-13 | 2012-11-21 | 电气化学工业株式会社 | 固化性树脂组合物、表面保护方法、临时固定方法及剥离方法 |
JP2009531516A (ja) * | 2006-03-29 | 2009-09-03 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 放射線−硬化性ゴム系接着剤/シーラント |
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-
2011
- 2011-07-25 CN CN201110211108.1A patent/CN102898959B/zh active Active
-
2012
- 2012-06-22 TW TW101122345A patent/TWI564359B/zh active
- 2012-07-05 WO PCT/CN2012/078228 patent/WO2013013566A1/en unknown
- 2012-07-05 KR KR1020147002131A patent/KR102013467B1/ko active IP Right Grant
- 2012-07-05 JP JP2014521918A patent/JP6046135B2/ja not_active Expired - Fee Related
- 2012-07-05 EP EP12818272.2A patent/EP2736988B1/en not_active Not-in-force
- 2012-07-05 CN CN201280036197.3A patent/CN103797077B/zh active Active
-
2014
- 2014-01-23 US US14/162,288 patent/US9663685B2/en not_active Expired - Fee Related
Patent Citations (5)
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JP2005060465A (ja) * | 2003-08-08 | 2005-03-10 | Bridgestone Corp | 光硬化性シール材用組成物及びそれを用いたシール層付き部材 |
US20070037911A1 (en) * | 2005-08-11 | 2007-02-15 | Bridgestone Corporation | Adhesive composition and process for adhesion using the adhesive composition |
CN101370879A (zh) * | 2006-01-13 | 2009-02-18 | 电气化学工业株式会社 | 固化性树脂组合物、表面保护方法、临时固定方法及剥离方法 |
WO2009067113A1 (en) * | 2007-11-20 | 2009-05-28 | Henkel Ag & Co. Kgaa | Low-voiding die attach film, semiconductor package, and processes for making and using same |
CN102533132A (zh) * | 2010-12-31 | 2012-07-04 | 第一毛织株式会社 | 用于显示器的光学透明粘合剂和包括该粘合剂的电子装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108676519A (zh) * | 2013-03-06 | 2018-10-19 | 琳得科株式会社 | 压敏粘合片 |
CN108676519B (zh) * | 2013-03-06 | 2021-05-11 | 琳得科株式会社 | 压敏粘合片 |
CN103541236A (zh) * | 2013-10-23 | 2014-01-29 | 合肥聚合辐化技术有限公司 | 一种柔性抗蚀印花粘合剂及其制备方法 |
CN107949590A (zh) * | 2015-07-30 | 2018-04-20 | 电化株式会社 | 组合物和粘合剂组合物 |
CN107949590B (zh) * | 2015-07-30 | 2020-08-11 | 电化株式会社 | 组合物和粘合剂组合物 |
CN108138008A (zh) * | 2015-09-28 | 2018-06-08 | 泽费罗斯股份有限公司 | 具有基底和粘合涂层的粘合结构体 |
CN107960098A (zh) * | 2015-11-05 | 2018-04-24 | 株式会社Lg化学 | 光学用粘合剂组合物及光学用粘合膜 |
CN107960098B (zh) * | 2015-11-05 | 2020-06-05 | 株式会社Lg化学 | 光学用粘合剂组合物及光学用粘合膜 |
CN107964375A (zh) * | 2016-10-19 | 2018-04-27 | 迪睿合株式会社 | 连接体的制造方法 |
WO2022205417A1 (en) * | 2021-04-02 | 2022-10-06 | Henkel Ag & Co. Kgaa | Radiation curable (meth) acrylic adhesive composition |
Also Published As
Publication number | Publication date |
---|---|
CN102898959B (zh) | 2016-07-06 |
US9663685B2 (en) | 2017-05-30 |
EP2736988A1 (en) | 2014-06-04 |
JP2014525960A (ja) | 2014-10-02 |
CN103797077B (zh) | 2016-06-08 |
TWI564359B (zh) | 2017-01-01 |
WO2013013566A1 (en) | 2013-01-31 |
JP6046135B2 (ja) | 2016-12-14 |
US20140131306A1 (en) | 2014-05-15 |
TW201305304A (zh) | 2013-02-01 |
KR20140039064A (ko) | 2014-03-31 |
EP2736988A4 (en) | 2015-06-24 |
KR102013467B1 (ko) | 2019-08-22 |
CN103797077A (zh) | 2014-05-14 |
EP2736988B1 (en) | 2019-04-24 |
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