CN102884877B - 具有多个翅片间距的冷却装置 - Google Patents

具有多个翅片间距的冷却装置 Download PDF

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Publication number
CN102884877B
CN102884877B CN201180023141.XA CN201180023141A CN102884877B CN 102884877 B CN102884877 B CN 102884877B CN 201180023141 A CN201180023141 A CN 201180023141A CN 102884877 B CN102884877 B CN 102884877B
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China
Prior art keywords
fin
heat
fins
cooling
fin group
Prior art date
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Active
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CN201180023141.XA
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English (en)
Chinese (zh)
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CN102884877A (zh
Inventor
深井宽之
桥本信行
山田裕
池田匡视
岛田守
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication of CN102884877A publication Critical patent/CN102884877A/zh
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201180023141.XA 2010-05-18 2011-05-18 具有多个翅片间距的冷却装置 Active CN102884877B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-114357 2010-05-18
JP2010114357A JP4948625B2 (ja) 2010-02-08 2010-05-18 複数のフィンピッチを有する冷却装置
PCT/JP2011/061365 WO2011145640A1 (ja) 2010-05-18 2011-05-18 複数のフィンピッチを有する冷却装置

Publications (2)

Publication Number Publication Date
CN102884877A CN102884877A (zh) 2013-01-16
CN102884877B true CN102884877B (zh) 2015-09-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180023141.XA Active CN102884877B (zh) 2010-05-18 2011-05-18 具有多个翅片间距的冷却装置

Country Status (5)

Country Link
US (1) US20130112373A1 (enExample)
EP (1) EP2574159B1 (enExample)
JP (1) JP4948625B2 (enExample)
CN (1) CN102884877B (enExample)
WO (1) WO2011145640A1 (enExample)

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TWI811045B (zh) * 2022-07-29 2023-08-01 艾姆勒科技股份有限公司 具有不等表面積鰭片組的車用水冷散熱板、以及具有其的封閉式車用水冷散熱器
TWI812374B (zh) * 2022-07-29 2023-08-11 艾姆勒科技股份有限公司 具有不等間距鰭片組的車用水冷散熱板、以及具有其的封閉式車用水冷散熱器
US11965702B1 (en) 2022-10-21 2024-04-23 Amulaire Thermal Technology, Inc. Low pressure drop automotive liquid-cooling heat dissipation plate and enclosed automotive liquid-cooling cooler having the same
US12194831B2 (en) 2022-10-11 2025-01-14 Amulaire Thermal Technology, Inc. Vehicle water-cooling heat sink plate having fin sets with different fin pitch distances

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JP5560182B2 (ja) * 2010-12-27 2014-07-23 株式会社日立製作所 冷却装置およびそれを備えた電力変換装置
JP5627632B2 (ja) * 2012-04-18 2014-11-19 三菱電機株式会社 熱交換器およびヒートポンプ装置
EP2933593A4 (en) 2012-12-11 2016-11-02 Furukawa Electric Co Ltd COOLING DEVICE
CN204632747U (zh) * 2012-12-14 2015-09-09 古河电气工业株式会社 冷却装置
JP2014135350A (ja) * 2013-01-09 2014-07-24 Ntec Co Ltd ヒートシンク
JP6097648B2 (ja) * 2013-07-10 2017-03-15 株式会社日立製作所 電力変換装置及びこれを搭載した鉄道車両
CN103369932B (zh) * 2013-07-16 2017-02-08 湖南智热技术股份有限公司 一种功率器件散热器的散热片排布方法及散热器
US10351442B2 (en) 2013-12-18 2019-07-16 Brita Lp Flow control device for filter as you pour system
US10654725B2 (en) 2013-12-18 2020-05-19 Brita Lp Filter assembly for filter as you pour filtration
US10604420B2 (en) 2013-12-18 2020-03-31 Brita Lp Method and apparatus for reservoir free and ventless water filtering
AU2014366924B9 (en) 2013-12-18 2019-10-24 Brita Lp Lid for filter-as-you-pour container system
US11066311B2 (en) 2013-12-18 2021-07-20 Brita I.P Method of using a filter media for filtration
CN103994674B (zh) * 2014-06-04 2015-12-02 无锡杰尔压缩机有限公司 不等间距管片式热交换器
US20150361922A1 (en) 2014-06-13 2015-12-17 Honeywell International Inc. Heat exchanger designs using variable geometries and configurations
JP2016009003A (ja) * 2014-06-23 2016-01-18 株式会社リコー 冷却装置、画像投射装置、電子機器
WO2015198642A1 (ja) * 2014-06-23 2015-12-30 日本電気株式会社 ヒートシンク及びヒートシンクを用いた放熱方法
EP3220090B1 (en) * 2014-11-10 2019-10-16 Furukawa Electric Co., Ltd. Heat sink
JP6447149B2 (ja) * 2015-01-13 2019-01-09 富士通株式会社 熱交換器、冷却ユニット、及び電子機器
JP2016178208A (ja) * 2015-03-20 2016-10-06 日本電気株式会社 ヒートシンク、放熱構造、冷却構造及び装置
CN106304768A (zh) * 2015-06-02 2017-01-04 中兴通讯股份有限公司 插箱及其插卡
US10427951B2 (en) 2015-08-20 2019-10-01 Brita Lp Water purification filter and system
CN208865250U (zh) 2015-09-30 2019-05-17 碧然德公司 滤芯、过滤器组件和流体容器
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US10343931B2 (en) 2015-09-30 2019-07-09 Brita Lp Filter cartridge placement in filter as you pour system
JP2017112151A (ja) * 2015-12-14 2017-06-22 富士電機株式会社 パワーユニットの冷却構造
CN107105595A (zh) * 2016-02-19 2017-08-29 恩佐科技股份有限公司 利用散热体排列达低风压需求、低噪音、高效能的散热器
US10386124B2 (en) * 2016-02-22 2019-08-20 Kentuckiana Curb Company, Inc. Dual pass opposed (reverse) flow cooling coil with improved performance
TWM526264U (zh) * 2016-03-21 2016-07-21 Taiwan Microloops Corp 液冷式散熱裝置及其散熱結構
JP6868633B2 (ja) * 2016-09-23 2021-05-12 住友精密工業株式会社 冷却装置
CN107239120B (zh) 2017-05-18 2021-11-30 北京嘉楠捷思信息技术有限公司 一种电子设备
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JP6749293B2 (ja) * 2017-08-09 2020-09-02 ダイキン工業株式会社 冷凍装置の室外ユニット
CN109994442A (zh) * 2017-12-29 2019-07-09 鸿富锦精密工业(武汉)有限公司 散热装置及应用所述散热装置的电子装置
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JP2019176594A (ja) * 2018-03-28 2019-10-10 株式会社日立産機システム 電力変換装置
CN110608552A (zh) * 2018-06-15 2019-12-24 杭州三花微通道换热器有限公司 换热系统
JP2020040468A (ja) * 2018-09-07 2020-03-19 株式会社デンソー ヘッドアップディスプレイ装置
WO2020170717A1 (ja) * 2019-02-19 2020-08-27 ソニー株式会社 光源装置および投射型表示装置
CN111916410A (zh) * 2019-05-10 2020-11-10 株洲中车时代电气股份有限公司 一种散热器
CN110475466B (zh) * 2019-09-23 2021-04-13 阳光电源股份有限公司 一种风冷散热器以及电气设备
CN111442681B (zh) * 2020-04-30 2025-04-11 大唐环境产业集团股份有限公司 一种翅片管及换热器
EP3933435B1 (en) 2020-06-30 2025-10-08 Leica Geosystems AG Reality capture device with different climate zones for cooling
CN112588225A (zh) * 2020-10-30 2021-04-02 浙江中科玖源新材料有限公司 一种釜内温度均衡的聚酰亚胺反应釜
KR102673363B1 (ko) * 2023-07-24 2024-06-07 임종수 고성능 프로세서를 위한 냉각 구조

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811045B (zh) * 2022-07-29 2023-08-01 艾姆勒科技股份有限公司 具有不等表面積鰭片組的車用水冷散熱板、以及具有其的封閉式車用水冷散熱器
TWI812374B (zh) * 2022-07-29 2023-08-11 艾姆勒科技股份有限公司 具有不等間距鰭片組的車用水冷散熱板、以及具有其的封閉式車用水冷散熱器
US12194831B2 (en) 2022-10-11 2025-01-14 Amulaire Thermal Technology, Inc. Vehicle water-cooling heat sink plate having fin sets with different fin pitch distances
US11965702B1 (en) 2022-10-21 2024-04-23 Amulaire Thermal Technology, Inc. Low pressure drop automotive liquid-cooling heat dissipation plate and enclosed automotive liquid-cooling cooler having the same

Also Published As

Publication number Publication date
JP2011181882A (ja) 2011-09-15
US20130112373A1 (en) 2013-05-09
JP4948625B2 (ja) 2012-06-06
EP2574159B1 (en) 2018-02-21
EP2574159A4 (en) 2016-11-30
WO2011145640A1 (ja) 2011-11-24
EP2574159A1 (en) 2013-03-27
CN102884877A (zh) 2013-01-16

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