JP4948625B2 - 複数のフィンピッチを有する冷却装置 - Google Patents
複数のフィンピッチを有する冷却装置 Download PDFInfo
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- JP4948625B2 JP4948625B2 JP2010114357A JP2010114357A JP4948625B2 JP 4948625 B2 JP4948625 B2 JP 4948625B2 JP 2010114357 A JP2010114357 A JP 2010114357A JP 2010114357 A JP2010114357 A JP 2010114357A JP 4948625 B2 JP4948625 B2 JP 4948625B2
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
1´、31´ 冷却装置
2、12、22、32 受熱ブロック
2´、32´ 受熱ブロック
3、23 ヒートパイプ
3´ ヒートパイプ
4、14、24、34 第1放熱フィン群
4´、34´ 第1放熱フィン群
4a、14a、24a、34a 第1フィン
4a´、34a´ 第1フィン
5、15、25、35 第2放熱フィン群
5´、35´ 第2放熱フィン群
5a、25a、35a 第2フィン
5a´、35a´ 第2フィン
26、36 第3放熱フィン群
26a、36a 第3フィン
Claims (6)
- 発熱素子に熱的に接続された受熱ブロックと、前記受熱ブロックに熱的に接続されたフィンを複数有する放熱フィン群とを備え、前記受熱ブロックと平行な方向に冷却風の流れが設定された冷却装置であって、
前記放熱フィン群が、前記冷却風の流れ方向に沿って複数縦列配置され、前記複数の放熱フィン群のうち、前記冷却風の風上側に配置された放熱フィン群のフィンピッチが、前記冷却風の風下側に配置された放熱フィン群のフィンピッチよりも大きく、
前記複数の放熱フィン群の群間隙の位置は、前記複数の放熱フィン群を風上から風下まで複数の一枚板のフィンで形成した1つの放熱フィン群とした場合に、当該1つの放熱フィン群のフィン表面の風上と風下の温度差を、前記複数の放熱フィン群の数で等分に分割する、当該1つの放熱フィン群のフィンの表面温度の位置としたことを特徴とする冷却装置。 - 発熱素子に熱的に接続された受熱ブロックと、前記受熱ブロックの表面に立設されたフィンを複数有する放熱フィン群とを備え、前記受熱ブロックと平行な方向に冷却風の流れが設定された冷却装置であって、
前記放熱フィン群が、前記冷却風の流れ方向に沿って複数縦列配置され、前記複数の放熱フィン群のうち、前記冷却風の風上側に配置された放熱フィン群のフィンピッチが、前記冷却風の風下側に配置された放熱フィン群のフィンピッチよりも大きく、
前記複数の放熱フィン群の群間隙の位置は、前記複数の放熱フィン群を風上から風下まで複数の一枚板のフィンで形成した1つの放熱フィン群とした場合に、当該1つの放熱フィン群のフィン表面の風上と風下の温度差を、前記複数の放熱フィン群の数で等分に分割する、当該1つの放熱フィン群のフィンの表面温度の位置としたことを特徴とする冷却装置。 - 発熱素子に熱的に接続された受熱ブロックと、前記受熱ブロックの表面に立設された複数のヒートパイプと、前記ヒートパイプへ取り付けられたフィンを複数有する放熱フィン群とを備え、前記受熱ブロックと平行な方向に冷却風の流れが設定された冷却装置であって、
前記放熱フィン群が、前記冷却風の流れ方向に沿って複数縦列配置され、前記複数の放熱フィン群のうち、前記冷却風の風上側に配置された放熱フィン群のフィンピッチが、前記冷却風の風下側に配置された放熱フィン群のフィンピッチよりも大きく、
前記複数の放熱フィン群の群間隙の位置は、前記複数の放熱フィン群を風上から風下まで複数の一枚板のフィンで形成した1つの放熱フィン群とした場合に、当該1つの放熱フィン群のフィン表面の風上と風下の温度差を、前記複数の放熱フィン群の数で等分に分割する、当該1つの放熱フィン群のフィンの表面温度の位置としたことを特徴とする冷却装置。 - 前記風上側に配置された放熱フィン群のフィンピッチが、前記風下側に配置された放熱フィン群のフィンピッチの整数倍であることを特徴とする請求項1乃至3のいずれか1項に記載の冷却装置。
- 前記風上側に配置された放熱フィン群のフィンの長さが、前記風下側に配置された放熱フィン群のフィンの長さよりも短いことを特徴とする請求項1乃至3のいずれか1項に記載の冷却装置。
- 前記ヒートパイプが、側面視U字状またはL字状であることを特徴とする請求項3に記載の冷却装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010114357A JP4948625B2 (ja) | 2010-02-08 | 2010-05-18 | 複数のフィンピッチを有する冷却装置 |
US13/698,639 US20130112373A1 (en) | 2010-05-18 | 2011-05-18 | Cooling device with a plurality of fin pitches |
EP11783574.4A EP2574159B1 (en) | 2010-05-18 | 2011-05-18 | Cooling device with a plurality of fin pitches |
CN201180023141.XA CN102884877B (zh) | 2010-05-18 | 2011-05-18 | 具有多个翅片间距的冷却装置 |
PCT/JP2011/061365 WO2011145640A1 (ja) | 2010-05-18 | 2011-05-18 | 複数のフィンピッチを有する冷却装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2010025839 | 2010-02-08 | ||
JP2010025839 | 2010-02-08 | ||
JP2010114357A JP4948625B2 (ja) | 2010-02-08 | 2010-05-18 | 複数のフィンピッチを有する冷却装置 |
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JP2011181882A JP2011181882A (ja) | 2011-09-15 |
JP2011181882A5 JP2011181882A5 (ja) | 2011-11-17 |
JP4948625B2 true JP4948625B2 (ja) | 2012-06-06 |
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JP2010114357A Active JP4948625B2 (ja) | 2010-02-08 | 2010-05-18 | 複数のフィンピッチを有する冷却装置 |
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US (1) | US20130112373A1 (ja) |
EP (1) | EP2574159B1 (ja) |
JP (1) | JP4948625B2 (ja) |
CN (1) | CN102884877B (ja) |
WO (1) | WO2011145640A1 (ja) |
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2010
- 2010-05-18 JP JP2010114357A patent/JP4948625B2/ja active Active
-
2011
- 2011-05-18 WO PCT/JP2011/061365 patent/WO2011145640A1/ja active Application Filing
- 2011-05-18 EP EP11783574.4A patent/EP2574159B1/en active Active
- 2011-05-18 CN CN201180023141.XA patent/CN102884877B/zh active Active
- 2011-05-18 US US13/698,639 patent/US20130112373A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014017488A (ja) * | 2013-07-10 | 2014-01-30 | Hitachi Ltd | 電力変換装置及びこれを搭載した鉄道車両 |
EP2825011A2 (en) | 2013-07-10 | 2015-01-14 | Hitachi Ltd. | Traction converter and railway vehicle |
Also Published As
Publication number | Publication date |
---|---|
CN102884877A (zh) | 2013-01-16 |
EP2574159B1 (en) | 2018-02-21 |
CN102884877B (zh) | 2015-09-30 |
US20130112373A1 (en) | 2013-05-09 |
JP2011181882A (ja) | 2011-09-15 |
EP2574159A4 (en) | 2016-11-30 |
EP2574159A1 (en) | 2013-03-27 |
WO2011145640A1 (ja) | 2011-11-24 |
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