BR112015013210A2 - aparelho de resfriamento - Google Patents

aparelho de resfriamento

Info

Publication number
BR112015013210A2
BR112015013210A2 BR112015013210A BR112015013210A BR112015013210A2 BR 112015013210 A2 BR112015013210 A2 BR 112015013210A2 BR 112015013210 A BR112015013210 A BR 112015013210A BR 112015013210 A BR112015013210 A BR 112015013210A BR 112015013210 A2 BR112015013210 A2 BR 112015013210A2
Authority
BR
Brazil
Prior art keywords
heat
pipe unit
cooling air
pipes
cooling
Prior art date
Application number
BR112015013210A
Other languages
English (en)
Inventor
Yamada Hiroshi
Isemura Masakazu
Hashimoto Nobuyuki
Okamoto Tsuyoshi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of BR112015013210A2 publication Critical patent/BR112015013210A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

resumo patente de invenção para: "aparelho de resfriamento". a presente invenção refere-se a um aparelho de resfriamento fornecido que pode impedir um aumento no espaço de instalação e um aumento em consumo de potência e pode aumentar a capacidade de resfriamento no lado a jusante. um aparelho de resfriamento (1) da presente invenção inclui um bloco de recebimento de calor (11) que está conectado termicamente a um elemento de aquecimento (10- 1 a 10-8), um grupo de tubos de calor (12) que está conectado termicamente ao bloco de recebimento de calor e um grupo de aletas de dissipação de calor (13), que está conectado termicamente à pluralidade de tubos de calor. o grupo de tubos de calor (12) tem uma unidade de tubo de calor (12-1) disposta a montante de um ar de resfriamento, sendo que a unidade de tubo de calor (12-1) é substituída por uma pluralidade de tubos de calor (12a), dispostos de maneira substancialmente perpendicular à direção de fluxo f do ar de resfriamento, e uma unidade de tubo de calor (12-2) disposta a jusante do ar de resfriamento (f), sendo que a unidade de tubo de calor (12-2) é constituída de uma pluralidade de tubos de calor (12b) dispostos de maneira substancialmente paralela à direção de fluxo (f) do ar de resfriamento.
BR112015013210A 2012-12-14 2013-12-13 aparelho de resfriamento BR112015013210A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012273325 2012-12-14
PCT/JP2013/083431 WO2014092176A1 (ja) 2012-12-14 2013-12-13 冷却装置

Publications (1)

Publication Number Publication Date
BR112015013210A2 true BR112015013210A2 (pt) 2017-07-11

Family

ID=50934457

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015013210A BR112015013210A2 (pt) 2012-12-14 2013-12-13 aparelho de resfriamento

Country Status (5)

Country Link
EP (1) EP2933832A4 (pt)
JP (1) JP5654180B2 (pt)
CN (1) CN204632747U (pt)
BR (1) BR112015013210A2 (pt)
WO (1) WO2014092176A1 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5560182B2 (ja) * 2010-12-27 2014-07-23 株式会社日立製作所 冷却装置およびそれを備えた電力変換装置
JP6062516B1 (ja) * 2015-09-18 2017-01-18 古河電気工業株式会社 ヒートシンク
JP6782326B2 (ja) * 2019-04-17 2020-11-11 古河電気工業株式会社 ヒートシンク

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223814A (ja) * 1997-02-07 1998-08-21 Hitachi Cable Ltd 半導体素子冷却用ヒートパイプ式ヒートシンク
JPH10321779A (ja) * 1997-05-21 1998-12-04 Hitachi Ltd ヒートパイプ式冷却装置
JP2000161880A (ja) * 1998-11-26 2000-06-16 Toshiba Corp ヒートパイプ式冷却器
JP4948625B2 (ja) * 2010-02-08 2012-06-06 古河電気工業株式会社 複数のフィンピッチを有する冷却装置
JP5581119B2 (ja) * 2010-06-07 2014-08-27 株式会社日立製作所 冷却装置，電力変換装置，鉄道車両
JP5560182B2 (ja) * 2010-12-27 2014-07-23 株式会社日立製作所 冷却装置およびそれを備えた電力変換装置

Also Published As

Publication number Publication date
CN204632747U (zh) 2015-09-09
JPWO2014092176A1 (ja) 2017-01-12
EP2933832A1 (en) 2015-10-21
WO2014092176A1 (ja) 2014-06-19
JP5654180B2 (ja) 2015-01-14
EP2933832A4 (en) 2016-09-21

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2544 DE 08-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.