JP5654180B2 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP5654180B2 JP5654180B2 JP2014514256A JP2014514256A JP5654180B2 JP 5654180 B2 JP5654180 B2 JP 5654180B2 JP 2014514256 A JP2014514256 A JP 2014514256A JP 2014514256 A JP2014514256 A JP 2014514256A JP 5654180 B2 JP5654180 B2 JP 5654180B2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- cooling air
- pipe unit
- receiving block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
10−1,10−2,10−3,10−4 発熱素子
10−4,10−5,10−6,10−8 発熱素子
11 受熱ブロック
11a,11b 面
12 ヒートパイプ群
12−1,12−2,12−3 ヒートパイプユニット
12−1’ ヒートパイプユニット
12A,12B,12C ヒートパイプ
12A’,12A” ヒートパイプ
13 放熱フィン群
13−1,13−2 フィンユニット
13A,13B フィン
20 冷却装置
21 ヒートパイプ列
22 ヒートパイプ列
30 ヒートパイプ
40 ヒートパイプ
121 固定部
121’ 固定部
122,123 延出部
122’,123’ 延出部
Claims (5)
- 発熱素子に熱的に接続される受熱ブロックと、
前記受熱ブロックに熱的に接続されたヒートパイプ群と、
前記ヒートパイプ群を構成する複数のヒートパイプに熱的に接続された放熱フィン群とを備え、
前記ヒートパイプ群は、
冷却風の上流に配置され、前記冷却風の流れ方向に対して直角に配置された複数のヒートパイプで構成される第1ヒートパイプユニットと、
前記冷却風の下流に配置され、前記冷却風の流れ方向に平行に配置された複数のヒートパイプで構成される第2ヒートパイプユニットと、を有し、
前記第1ヒートパイプユニットは、U字型又はL字型の複数の第1ヒートパイプで構成され、
前記第1ヒートパイプは、前記受熱ブロックに固定される第1固定部と、前記第1固定部の少なくとも一端から延出する第1延出部とを有し、
前記第1固定部と前記第1延出部とで特定される面が、前記冷却風の流れ方向に直角となるように配置され、
前記第2ヒートパイプユニットは、U字型又はL字型の複数の第2ヒートパイプで構成され、
前記第2ヒートパイプは、前記受熱ブロックに固定される第3固定部と、前記第3固定部の少なくとも一端から延出する第4延出部とを有し、
前記第3固定部と前記第4延出部とで特定される面が、前記冷却風の流れ方向に平行となるように配置されることを特徴とする冷却装置。 - 前記第1ヒートパイプユニットは、前記複数の第1ヒートパイプが列設されてなり、
前記第1ヒートパイプが所定ピッチで配列された一のヒートパイプ列と、前記所定ピッチとは異なるピッチで前記ヒートパイプが配列された他のヒートパイプ列とを有することを特徴とする、請求項1記載の冷却装置。 - 前記一のヒートパイプ列における配列ピッチが、前記放熱フィンの幅寸法の1/α(αは2以上の整数)であり、
前記他のヒートパイプ列における配列ピッチが、前記放熱フィンの幅寸法の1/β(β≠α、βは2以上の整数)であることを特徴とする、請求項2記載の冷却装置。 - 前記一のヒートパイプ列と前記他のヒートパイプ列が、前記冷却風の流れ方向に交互に配置されることを特徴とする、請求項2記載の冷却装置。
- 前記第2ヒートパイプユニットは、所定ピッチで配列された複数の第2ヒートパイプが列設されてなることを特徴とする、請求項1記載の冷却装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014514256A JP5654180B2 (ja) | 2012-12-14 | 2013-12-13 | 冷却装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012273325 | 2012-12-14 | ||
JP2012273325 | 2012-12-14 | ||
PCT/JP2013/083431 WO2014092176A1 (ja) | 2012-12-14 | 2013-12-13 | 冷却装置 |
JP2014514256A JP5654180B2 (ja) | 2012-12-14 | 2013-12-13 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5654180B2 true JP5654180B2 (ja) | 2015-01-14 |
JPWO2014092176A1 JPWO2014092176A1 (ja) | 2017-01-12 |
Family
ID=50934457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014514256A Active JP5654180B2 (ja) | 2012-12-14 | 2013-12-13 | 冷却装置 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2933832A4 (ja) |
JP (1) | JP5654180B2 (ja) |
CN (1) | CN204632747U (ja) |
BR (1) | BR112015013210A2 (ja) |
WO (1) | WO2014092176A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6062516B1 (ja) * | 2015-09-18 | 2017-01-18 | 古河電気工業株式会社 | ヒートシンク |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5560182B2 (ja) * | 2010-12-27 | 2014-07-23 | 株式会社日立製作所 | 冷却装置およびそれを備えた電力変換装置 |
JP6782326B2 (ja) | 2019-04-17 | 2020-11-11 | 古河電気工業株式会社 | ヒートシンク |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10321779A (ja) * | 1997-05-21 | 1998-12-04 | Hitachi Ltd | ヒートパイプ式冷却装置 |
JP2000161880A (ja) * | 1998-11-26 | 2000-06-16 | Toshiba Corp | ヒートパイプ式冷却器 |
JP2011181882A (ja) * | 2010-02-08 | 2011-09-15 | Furukawa Electric Co Ltd:The | 複数のフィンピッチを有する冷却装置 |
JP2011259536A (ja) * | 2010-06-07 | 2011-12-22 | Hitachi Ltd | 冷却装置,電力変換装置,鉄道車両 |
JP2012138439A (ja) * | 2010-12-27 | 2012-07-19 | Hitachi Ltd | 冷却装置およびそれを備えた電力変換装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10223814A (ja) * | 1997-02-07 | 1998-08-21 | Hitachi Cable Ltd | 半導体素子冷却用ヒートパイプ式ヒートシンク |
-
2013
- 2013-12-13 BR BR112015013210A patent/BR112015013210A2/pt not_active IP Right Cessation
- 2013-12-13 CN CN201390000855.3U patent/CN204632747U/zh not_active Expired - Lifetime
- 2013-12-13 JP JP2014514256A patent/JP5654180B2/ja active Active
- 2013-12-13 EP EP13861981.2A patent/EP2933832A4/en not_active Withdrawn
- 2013-12-13 WO PCT/JP2013/083431 patent/WO2014092176A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10321779A (ja) * | 1997-05-21 | 1998-12-04 | Hitachi Ltd | ヒートパイプ式冷却装置 |
JP2000161880A (ja) * | 1998-11-26 | 2000-06-16 | Toshiba Corp | ヒートパイプ式冷却器 |
JP2011181882A (ja) * | 2010-02-08 | 2011-09-15 | Furukawa Electric Co Ltd:The | 複数のフィンピッチを有する冷却装置 |
JP2011259536A (ja) * | 2010-06-07 | 2011-12-22 | Hitachi Ltd | 冷却装置,電力変換装置,鉄道車両 |
JP2012138439A (ja) * | 2010-12-27 | 2012-07-19 | Hitachi Ltd | 冷却装置およびそれを備えた電力変換装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6062516B1 (ja) * | 2015-09-18 | 2017-01-18 | 古河電気工業株式会社 | ヒートシンク |
US10598441B2 (en) | 2015-09-18 | 2020-03-24 | Furukawa Electric Co., Ltd. | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
WO2014092176A1 (ja) | 2014-06-19 |
EP2933832A4 (en) | 2016-09-21 |
EP2933832A1 (en) | 2015-10-21 |
BR112015013210A2 (pt) | 2017-07-11 |
CN204632747U (zh) | 2015-09-09 |
JPWO2014092176A1 (ja) | 2017-01-12 |
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