CN102741750A - 感光性树脂组合物、感光性干膜及图案形成方法 - Google Patents
感光性树脂组合物、感光性干膜及图案形成方法 Download PDFInfo
- Publication number
- CN102741750A CN102741750A CN2010800612830A CN201080061283A CN102741750A CN 102741750 A CN102741750 A CN 102741750A CN 2010800612830 A CN2010800612830 A CN 2010800612830A CN 201080061283 A CN201080061283 A CN 201080061283A CN 102741750 A CN102741750 A CN 102741750A
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- China
- Prior art keywords
- monomer
- compound
- based polymer
- vinyl based
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009297144 | 2009-12-28 | ||
JP2009-297144 | 2009-12-28 | ||
PCT/JP2010/073532 WO2011081131A1 (ja) | 2009-12-28 | 2010-12-27 | 感光性樹脂組成物、感光性ドライフィルムおよびパターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102741750A true CN102741750A (zh) | 2012-10-17 |
CN102741750B CN102741750B (zh) | 2017-03-01 |
Family
ID=44226536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080061283.0A Active CN102741750B (zh) | 2009-12-28 | 2010-12-27 | 感光性树脂组合物、感光性干膜及图案形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8647807B2 (zh) |
JP (1) | JP5685180B2 (zh) |
KR (1) | KR101851407B1 (zh) |
CN (1) | CN102741750B (zh) |
TW (1) | TWI501036B (zh) |
WO (1) | WO2011081131A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104541203B (zh) * | 2012-07-10 | 2021-06-08 | 株式会社微处理 | 感光性树脂组合物、感光性干膜、图案形成方法、印刷布线板及其制造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01280748A (ja) * | 1988-05-06 | 1989-11-10 | Fuji Yakuhin Kogyo Kk | ポジ型感光性組成物 |
US5624781A (en) * | 1993-05-28 | 1997-04-29 | Kansai Paint Co., Ltd. | Positive type anionic electrodeposition photo-resist composition and process for pattern formation using said composition |
CN101121762A (zh) * | 2006-08-11 | 2008-02-13 | 成都科瑞聚数码科技有限公司 | 一种碱溶性聚合物及其制备方法 |
CN101182366A (zh) * | 2004-12-30 | 2008-05-21 | 财团法人工业技术研究院 | 碱可溶树脂与包含该树脂的感旋光性组合物 |
JP2009282512A (ja) * | 2008-04-23 | 2009-12-03 | Mitsubishi Rayon Co Ltd | 感光性樹脂組成物およびパターン形成方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0727208B2 (ja) * | 1987-04-20 | 1995-03-29 | 富士写真フイルム株式会社 | 感光性組成物 |
JPH05107757A (ja) | 1991-10-19 | 1993-04-30 | Canon Inc | 感光性樹脂組成物 |
JPH05107756A (ja) | 1991-10-19 | 1993-04-30 | Canon Inc | 感光性樹脂組成物 |
CA2085868A1 (en) * | 1991-12-25 | 1993-06-26 | Mitsubishi Chemical Corporation | Photosensitive composition |
JPH05224407A (ja) | 1992-02-10 | 1993-09-03 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
JP3203842B2 (ja) | 1992-11-30 | 2001-08-27 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
JP3186923B2 (ja) * | 1993-05-28 | 2001-07-11 | 関西ペイント株式会社 | ポジ型感光性アニオン電着レジスト組成物及びこの組成物を用いたパターンの形成方法 |
JP2003156843A (ja) | 2001-11-21 | 2003-05-30 | Sumitomo Chem Co Ltd | 感放射線性樹脂組成物 |
JP4063053B2 (ja) | 2002-01-25 | 2008-03-19 | Jsr株式会社 | 2層積層膜およびこれを用いたパターン形成方法 |
US6790582B1 (en) | 2003-04-01 | 2004-09-14 | Clariant Finance Bvi Limited | Photoresist compositions |
JP5110279B2 (ja) * | 2007-12-20 | 2012-12-26 | Jsr株式会社 | 感放射線性樹脂組成物、および層間絶縁膜とその製造方法 |
KR100913058B1 (ko) * | 2008-08-25 | 2009-08-20 | 금호석유화학 주식회사 | 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자 |
-
2010
- 2010-12-27 WO PCT/JP2010/073532 patent/WO2011081131A1/ja active Application Filing
- 2010-12-27 TW TW099146135A patent/TWI501036B/zh active
- 2010-12-27 KR KR1020127018467A patent/KR101851407B1/ko active IP Right Grant
- 2010-12-27 CN CN201080061283.0A patent/CN102741750B/zh active Active
- 2010-12-27 US US13/519,495 patent/US8647807B2/en active Active
- 2010-12-27 JP JP2011502576A patent/JP5685180B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01280748A (ja) * | 1988-05-06 | 1989-11-10 | Fuji Yakuhin Kogyo Kk | ポジ型感光性組成物 |
US5624781A (en) * | 1993-05-28 | 1997-04-29 | Kansai Paint Co., Ltd. | Positive type anionic electrodeposition photo-resist composition and process for pattern formation using said composition |
CN101182366A (zh) * | 2004-12-30 | 2008-05-21 | 财团法人工业技术研究院 | 碱可溶树脂与包含该树脂的感旋光性组合物 |
CN101121762A (zh) * | 2006-08-11 | 2008-02-13 | 成都科瑞聚数码科技有限公司 | 一种碱溶性聚合物及其制备方法 |
JP2009282512A (ja) * | 2008-04-23 | 2009-12-03 | Mitsubishi Rayon Co Ltd | 感光性樹脂組成物およびパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI501036B (zh) | 2015-09-21 |
WO2011081131A1 (ja) | 2011-07-07 |
KR101851407B1 (ko) | 2018-04-23 |
US8647807B2 (en) | 2014-02-11 |
CN102741750B (zh) | 2017-03-01 |
JPWO2011081131A1 (ja) | 2013-05-13 |
US20130004895A1 (en) | 2013-01-03 |
JP5685180B2 (ja) | 2015-03-18 |
KR20130006594A (ko) | 2013-01-17 |
TW201126270A (en) | 2011-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Saitama Prefecture, Japan Applicant after: Micro Process Inc. Applicant after: Yongguang Chemical Industry Co., Ltd., Taiwan Applicant after: Mitsubishi Reiyon Co., Ltd. Address before: Saitama Prefecture, Japan Applicant before: Micro Process Inc. Applicant before: Yongguang Chemical Industry Co., Ltd., Taiwan Applicant before: Mitsubishi Reiyon Co., Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION Free format text: FORMER OWNER: EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION MITSUBISHI REIYON CO., LTD. Effective date: 20140903 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140903 Address after: Saitama Prefecture, Japan Applicant after: Micro Process Inc. Applicant after: WIKO, Taiwan, China Address before: Saitama Prefecture, Japan Applicant before: Micro Process Inc. Applicant before: WIKO, Taiwan, China Applicant before: Mitsubishi Reiyon Co., Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant |