CN102740612A - 软硬结合电路板的制作方法 - Google Patents
软硬结合电路板的制作方法 Download PDFInfo
- Publication number
- CN102740612A CN102740612A CN2011100922373A CN201110092237A CN102740612A CN 102740612 A CN102740612 A CN 102740612A CN 2011100922373 A CN2011100922373 A CN 2011100922373A CN 201110092237 A CN201110092237 A CN 201110092237A CN 102740612 A CN102740612 A CN 102740612A
- Authority
- CN
- China
- Prior art keywords
- bending
- coverlay
- opening
- zone
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
软性电路板 | 100 |
第一导电线路 | 101 |
第二导电线路 | 102 |
第一绝缘层 | 103 |
弯折区域 | 104 |
固定区域 | 105 |
第一成型区 | 106 |
第二成型区 | 107 |
第一覆盖膜 | 121 |
第二覆盖膜 | 122 |
第一屏蔽层 | 131 |
第二屏蔽层 | 132 |
第三覆盖膜 | 133 |
第四覆盖膜 | 134 |
第一可剥层 | 141 |
第二可剥层 | 142 |
第一胶片 | 151 |
第一铜箔 | 152 |
第二胶片 | 153 |
第二铜箔 | 154 |
第一空隙 | 155 |
第二空隙 | 156 |
第一开口 | 110 |
第二开口 | 112 |
第三开口 | 113 |
第一外层线路 | 161 |
第二外层线路 | 162 |
导通孔 | 163 |
第一防焊层 | 171 |
第二防焊层 | 172 |
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110092237.3A CN102740612B (zh) | 2011-04-13 | 2011-04-13 | 软硬结合电路板的制作方法 |
TW100113449A TWI407865B (zh) | 2011-04-13 | 2011-04-19 | 軟硬結合電路板之製作方法 |
US13/441,932 US9198304B2 (en) | 2011-04-13 | 2012-04-09 | Method for manufacturing rigid-flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110092237.3A CN102740612B (zh) | 2011-04-13 | 2011-04-13 | 软硬结合电路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102740612A true CN102740612A (zh) | 2012-10-17 |
CN102740612B CN102740612B (zh) | 2014-11-05 |
Family
ID=46995120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110092237.3A Active CN102740612B (zh) | 2011-04-13 | 2011-04-13 | 软硬结合电路板的制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9198304B2 (zh) |
CN (1) | CN102740612B (zh) |
TW (1) | TWI407865B (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104218015A (zh) * | 2013-05-30 | 2014-12-17 | 宏启胜精密电子(秦皇岛)有限公司 | 封装结构及其制作方法 |
CN104349598A (zh) * | 2013-08-05 | 2015-02-11 | 北大方正集团有限公司 | 一种阶梯电路板作方法、阶梯电路板 |
CN106061107A (zh) * | 2016-08-08 | 2016-10-26 | 广州杰赛科技股份有限公司 | 具电磁屏蔽膜的刚挠结合线路板及其制备方法 |
CN106102351A (zh) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | 一种覆盖膜保护电磁波屏蔽膜刚挠结合板的制作方法 |
CN107333392A (zh) * | 2017-07-24 | 2017-11-07 | 深圳市深印柔性电路有限公司 | 制程稳定可靠的软硬结合板及其制作方法 |
CN108024447A (zh) * | 2015-12-29 | 2018-05-11 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN110072328A (zh) * | 2019-04-01 | 2019-07-30 | 友达光电(苏州)有限公司 | 一种软性电路板 |
CN111132455A (zh) * | 2018-10-30 | 2020-05-08 | 台湾积体电路制造股份有限公司 | 电路载体及其制造方法 |
CN112449477A (zh) * | 2019-08-27 | 2021-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板的制造方法及电路板 |
CN112739034A (zh) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | 一种局部减铜法代替选镀的软硬结合电池保护板工艺 |
CN112817471A (zh) * | 2019-11-18 | 2021-05-18 | 北京小米移动软件有限公司 | 柔性屏、终端设备及柔性屏的制造方法 |
WO2022052352A1 (zh) * | 2020-09-09 | 2022-03-17 | 深南电路股份有限公司 | 复合电路板及其制作方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI544844B (zh) * | 2012-10-16 | 2016-08-01 | A hardware and software circuit board with impedance control structure | |
CN102917543B (zh) * | 2012-10-17 | 2015-02-11 | 无锡江南计算技术研究所 | 高低落差板防钻偏方法 |
WO2015015975A1 (ja) * | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 多層基板および多層基板の製造方法 |
US10798819B2 (en) | 2016-10-31 | 2020-10-06 | Commscope, Inc. Of North Carolina | Flexible printed circuit to mitigate cracking at through-holes |
CN110662342B (zh) * | 2018-06-28 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | 软硬结合板及其制作方法 |
CN109688730B (zh) * | 2019-02-02 | 2020-04-28 | 维沃移动通信有限公司 | 一种软硬结合板的制作方法及软硬结合板 |
KR20200120349A (ko) * | 2019-04-12 | 2020-10-21 | 동우 화인켐 주식회사 | 연성 인쇄회로 기판 |
CN114071987B (zh) * | 2020-07-29 | 2023-03-21 | 北大方正集团有限公司 | Smt贴片机、埋铜方法、装置和介质 |
TW202211748A (zh) * | 2020-09-11 | 2022-03-16 | 巨擘科技股份有限公司 | 能被精確剝除之多層基板結構及其製造方法 |
CN113038738A (zh) * | 2021-01-27 | 2021-06-25 | 红板(江西)有限公司 | 厚铜软硬结合板填胶工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05243737A (ja) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | フレキシブル・リジッド・プリント配線板 |
JP2001015917A (ja) * | 1999-06-30 | 2001-01-19 | Toshiba Corp | リジッドフレックスプリント配線板の製造方法 |
JP2005340270A (ja) * | 2004-05-24 | 2005-12-08 | Matsushita Electric Works Ltd | 積層板用プリプレグ、積層板並びにそれを用いたフレキシブルプリント配線板及びフレックスリジッドプリント配線板 |
CN1809251A (zh) * | 2005-01-20 | 2006-07-26 | 三星电机株式会社 | 制造刚性的柔性印刷电路板的方法 |
CN1816258A (zh) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | 制造软硬复合电路板的方法 |
CN101518163A (zh) * | 2006-09-21 | 2009-08-26 | 株式会社大昌电子 | 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法 |
CN101990355A (zh) * | 2009-07-30 | 2011-03-23 | 欣兴电子股份有限公司 | 软硬线路板及其工艺 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2946726C2 (de) * | 1979-11-20 | 1982-05-19 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung |
US4931134A (en) * | 1989-08-15 | 1990-06-05 | Parlex Corporation | Method of using laser routing to form a rigid/flex circuit board |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
US8071883B2 (en) * | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
TWI351245B (en) * | 2008-02-15 | 2011-10-21 | Zhen Ding Technology Co Ltd | Method for manufacturing rigid-flexible printed circuit board |
TWI367703B (en) * | 2008-04-18 | 2012-07-01 | Zhen Ding Technology Co Ltd | Method for manufacturing a printed circuit board having different thicknesses |
-
2011
- 2011-04-13 CN CN201110092237.3A patent/CN102740612B/zh active Active
- 2011-04-19 TW TW100113449A patent/TWI407865B/zh active
-
2012
- 2012-04-09 US US13/441,932 patent/US9198304B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05243737A (ja) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | フレキシブル・リジッド・プリント配線板 |
JP2001015917A (ja) * | 1999-06-30 | 2001-01-19 | Toshiba Corp | リジッドフレックスプリント配線板の製造方法 |
JP2005340270A (ja) * | 2004-05-24 | 2005-12-08 | Matsushita Electric Works Ltd | 積層板用プリプレグ、積層板並びにそれを用いたフレキシブルプリント配線板及びフレックスリジッドプリント配線板 |
CN1809251A (zh) * | 2005-01-20 | 2006-07-26 | 三星电机株式会社 | 制造刚性的柔性印刷电路板的方法 |
CN1816258A (zh) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | 制造软硬复合电路板的方法 |
CN101518163A (zh) * | 2006-09-21 | 2009-08-26 | 株式会社大昌电子 | 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法 |
CN101990355A (zh) * | 2009-07-30 | 2011-03-23 | 欣兴电子股份有限公司 | 软硬线路板及其工艺 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104218015A (zh) * | 2013-05-30 | 2014-12-17 | 宏启胜精密电子(秦皇岛)有限公司 | 封装结构及其制作方法 |
CN104349598A (zh) * | 2013-08-05 | 2015-02-11 | 北大方正集团有限公司 | 一种阶梯电路板作方法、阶梯电路板 |
CN108024447B (zh) * | 2015-12-29 | 2019-08-30 | Oppo广东移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN108024447A (zh) * | 2015-12-29 | 2018-05-11 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN106102351A (zh) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | 一种覆盖膜保护电磁波屏蔽膜刚挠结合板的制作方法 |
CN106102351B (zh) * | 2016-07-05 | 2018-09-21 | 惠州市金百泽电路科技有限公司 | 一种覆盖膜保护电磁波屏蔽膜刚挠结合板的制作方法 |
CN106061107A (zh) * | 2016-08-08 | 2016-10-26 | 广州杰赛科技股份有限公司 | 具电磁屏蔽膜的刚挠结合线路板及其制备方法 |
CN107333392A (zh) * | 2017-07-24 | 2017-11-07 | 深圳市深印柔性电路有限公司 | 制程稳定可靠的软硬结合板及其制作方法 |
CN111132455A (zh) * | 2018-10-30 | 2020-05-08 | 台湾积体电路制造股份有限公司 | 电路载体及其制造方法 |
US11006532B2 (en) | 2018-10-30 | 2021-05-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Circuit carrier and manifacturing method thereof |
CN111132455B (zh) * | 2018-10-30 | 2021-12-03 | 台湾积体电路制造股份有限公司 | 电路载体及其制造方法 |
US11665834B2 (en) | 2018-10-30 | 2023-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electronic assembly having circuit carrier and manufacturing method thereof |
CN110072328A (zh) * | 2019-04-01 | 2019-07-30 | 友达光电(苏州)有限公司 | 一种软性电路板 |
CN110072328B (zh) * | 2019-04-01 | 2020-07-17 | 友达光电(苏州)有限公司 | 一种软性电路板 |
CN112449477A (zh) * | 2019-08-27 | 2021-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板的制造方法及电路板 |
CN112817471A (zh) * | 2019-11-18 | 2021-05-18 | 北京小米移动软件有限公司 | 柔性屏、终端设备及柔性屏的制造方法 |
WO2022052352A1 (zh) * | 2020-09-09 | 2022-03-17 | 深南电路股份有限公司 | 复合电路板及其制作方法 |
CN112739034A (zh) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | 一种局部减铜法代替选镀的软硬结合电池保护板工艺 |
Also Published As
Publication number | Publication date |
---|---|
US9198304B2 (en) | 2015-11-24 |
CN102740612B (zh) | 2014-11-05 |
US20120260501A1 (en) | 2012-10-18 |
TW201242463A (en) | 2012-10-16 |
TWI407865B (zh) | 2013-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102740612B (zh) | 软硬结合电路板的制作方法 | |
CN102487577B (zh) | 软硬结合电路板的制作方法 | |
CN109429443B (zh) | 软硬结合电路板的制作方法 | |
CN103456643A (zh) | Ic载板及其制作方法 | |
CN103635005A (zh) | 软硬结合电路基板、软硬结合电路板及制作方法 | |
CN102573278A (zh) | 多层布线基板 | |
CN105722317A (zh) | 刚挠结合印刷电路板及其制作方法 | |
CN103327738A (zh) | 软硬结合电路板及其制作方法 | |
CN102196668B (zh) | 电路板制作方法 | |
CN104768318B (zh) | 软硬结合电路板及其制作方法 | |
CN106061107A (zh) | 具电磁屏蔽膜的刚挠结合线路板及其制备方法 | |
CN113423172B (zh) | 软硬结合电路板及其制作方法 | |
CN103635007A (zh) | 软硬结合电路基板、软硬结合电路板及制作方法 | |
JP2009099773A (ja) | シールド付回路配線基板 | |
CN206118157U (zh) | 具电磁屏蔽膜的刚挠结合线路板 | |
CN113973420A (zh) | 软硬结合板及软硬结合板的制作方法 | |
CN101547573B (zh) | 具有断差结构的电路板的制作方法 | |
CN104936381A (zh) | 柔性印刷电路板的制造方法及其中间产物 | |
CN109548272B (zh) | 耐弯折fpc及其制造方法 | |
CN101340775A (zh) | 软性电路板及其制造方法 | |
TWI445479B (zh) | 軟硬結合電路板及其製作方法 | |
CN113498249A (zh) | 软硬结合电路板及其制备方法 | |
US7942999B2 (en) | Fabrication method of rigid-flex circuit board | |
KR101887754B1 (ko) | 리지드 플렉시블 회로기판 제조방법 | |
TWI469705B (zh) | 軟硬結合電路板及其製作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CP03 | Change of name, title or address |