CN102714071A - 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法 - Google Patents

包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法 Download PDF

Info

Publication number
CN102714071A
CN102714071A CN2010800614573A CN201080061457A CN102714071A CN 102714071 A CN102714071 A CN 102714071A CN 2010800614573 A CN2010800614573 A CN 2010800614573A CN 201080061457 A CN201080061457 A CN 201080061457A CN 102714071 A CN102714071 A CN 102714071A
Authority
CN
China
Prior art keywords
composition
conductive particles
conductive
nanoparticles
pressure sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800614573A
Other languages
English (en)
Chinese (zh)
Inventor
小吉米·R·巴兰
珍妮·M·布鲁斯
杰弗里·W·麦卡琴
哈因·斯克拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102714071A publication Critical patent/CN102714071A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2010800614573A 2009-11-20 2010-11-19 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法 Pending CN102714071A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26293409P 2009-11-20 2009-11-20
US61/262,934 2009-11-20
PCT/US2010/057399 WO2011063217A2 (en) 2009-11-20 2010-11-19 Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making

Publications (1)

Publication Number Publication Date
CN102714071A true CN102714071A (zh) 2012-10-03

Family

ID=44060360

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800614573A Pending CN102714071A (zh) 2009-11-20 2010-11-19 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法

Country Status (5)

Country Link
US (1) US9153354B2 (enExample)
EP (1) EP2502239A4 (enExample)
JP (1) JP5690352B2 (enExample)
CN (1) CN102714071A (enExample)
WO (1) WO2011063217A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016169190A1 (zh) * 2015-04-24 2016-10-27 京东方科技集团股份有限公司 导电胶组合物及其制备方法、封框胶、以及显示面板
CN106605271A (zh) * 2014-08-29 2017-04-26 贺利氏德国有限两合公司 导电组合物
CN109233684A (zh) * 2017-05-09 2019-01-18 3M创新有限公司 导电粘合剂
CN112789323A (zh) * 2018-10-02 2021-05-11 昭和电工材料株式会社 树脂组合物、固化物及半导体器件

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8871853B2 (en) 2010-02-11 2014-10-28 3M Innovative Properties Company Resin system comprising dispersed multimodal surface-modified nanoparticles
KR20130058002A (ko) * 2010-04-20 2013-06-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체성의 표면-개질된 나노입자를 함유하는 감압 접착제
DE102011118720A1 (de) * 2011-11-16 2013-05-16 Admedes Schuessler Gmbh Ethanollöslicher, elektrisch leitender Kleber
EP2855614B1 (en) 2012-05-29 2021-10-13 Conpart AS Isotropic conductive adhesive
US20140170427A1 (en) * 2012-12-13 2014-06-19 Carestream Health, Inc. Anticorrosion agents for transparent conductive film
JP2017066407A (ja) * 2013-11-27 2017-04-06 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
JP6106148B2 (ja) * 2013-11-27 2017-03-29 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
CN104951156A (zh) * 2014-03-31 2015-09-30 宸盛光电有限公司 电容式触控装置
RU2685216C2 (ru) * 2014-11-24 2019-04-16 Ют-Баттелле, Ллк Способы реактивной трехмерной печати путем экструзии
CN108698851B (zh) * 2016-03-31 2020-11-10 日产化学工业株式会社 被膜形成用组合物及其制造方法
WO2017170275A1 (ja) * 2016-03-31 2017-10-05 日産化学工業株式会社 両親媒性の有機シラン化合物が結合した無機酸化物微粒子、その有機溶媒分散液及び被膜形成用組成物
DE102016205702B4 (de) * 2016-04-06 2017-12-14 Siemens Healthcare Gmbh Röntgendetektor mit Schutzelement und Klebeelement
US10224304B2 (en) 2016-09-22 2019-03-05 Apple Inc. Conductive adhesive film structures
KR102309135B1 (ko) * 2017-03-06 2021-10-07 데쿠세리아루즈 가부시키가이샤 수지 조성물, 수지 조성물의 제조 방법, 및 구조체
US10434704B2 (en) 2017-08-18 2019-10-08 Ppg Industries Ohio, Inc. Additive manufacturing using polyurea materials
US12384097B2 (en) 2017-08-18 2025-08-12 Ppg Industries Ohio, Inc. Additive manufacturing using reactive compositions
MX2021009610A (es) 2019-02-11 2021-10-26 Ppg Ind Ohio Inc Sistemas multicapa y métodos para elaborar sistemas multicapa.
US12434434B2 (en) 2019-02-11 2025-10-07 Ppg Industries Ohio, Inc. Methods of making chemically resistant sealing components
CN113677504B (zh) 2019-02-11 2023-09-15 Ppg工业俄亥俄公司 密封帽的3d打印
WO2020198673A1 (en) * 2019-03-28 2020-10-01 Carbo Ceramics Inc. Composition and process for pelletizing carbon-based materials for proppant and industrial applications

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1886469A (zh) * 2003-11-25 2006-12-27 3M创新有限公司 含有表面改性的纳米粒子的溶液
CN1962060A (zh) * 2005-11-08 2007-05-16 财团法人工业技术研究院 金属纳米光催化剂复合材料及其制法
CN101058418A (zh) * 2007-04-12 2007-10-24 上海交通大学 聚甲基丙烯酸缩水甘油酯及其衍生物修饰的碳纳米管及其制备方法
US20080214698A1 (en) * 2004-12-30 2008-09-04 3M Innovative Properties Company Polymer Blends Including Surface-Modified Nanoparticles and Methods of Making the Same
CN101508418A (zh) * 2009-03-17 2009-08-19 中国科学院长春应用化学研究所 一种制备铂/碳纳米管杂化材料的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992160A (en) * 1974-06-27 1976-11-16 Owens-Corning Fiberglas Corporation Combinations of particulate metal and particulate glass
US6586483B2 (en) 2001-01-08 2003-07-01 3M Innovative Properties Company Foam including surface-modified nanoparticles
JP5060692B2 (ja) * 2001-07-13 2012-10-31 株式会社日本触媒 異方導電性材料
JP2004155957A (ja) 2002-11-07 2004-06-03 Three M Innovative Properties Co 異方導電性接着剤及びフィルム
JP2004189938A (ja) 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
JP4391836B2 (ja) 2004-01-19 2009-12-24 積水化学工業株式会社 被覆導電粒子、異方性導電材料及び導電接続構造体
CA2573397A1 (en) 2004-07-19 2006-01-26 Elutex Ltd. Modified conductive surfaces having active substances attached thereto
JP4563110B2 (ja) 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
DE102004043573B3 (de) 2004-09-09 2006-04-20 Ulrich Clauss Lamelle für ein Sonnenschutzrollo
CN101243130B (zh) 2005-08-05 2011-12-07 3M创新有限公司 显示具有改善的流动性的组合物
US7531595B2 (en) * 2006-03-08 2009-05-12 3M Innovative Properties Company Pressure-sensitive adhesive containing silica nanoparticles
EP2044163B1 (en) 2006-07-24 2012-04-25 3M Innovative Properties Company Electrically conductive pressure sensitive adhesives
US20080085410A1 (en) * 2006-10-06 2008-04-10 General Electric Company Composition and associated method
KR100882735B1 (ko) 2007-03-19 2009-02-06 도레이새한 주식회사 이방성 전도필름 및 이의 접착방법
DE102007044302A1 (de) * 2007-09-17 2009-03-19 Bühler PARTEC GmbH Verfahren zur Dispergierung von feinteiligen anorganischen Pulvern in flüssigen Medien unter Verwendung von reaktiven Siloxanen
WO2010077583A1 (en) 2008-12-30 2010-07-08 3M Innovative Properties Company Composite particles and method of forming
WO2010077773A1 (en) 2008-12-30 2010-07-08 3M Innovative Properties Company Lubricant composition and method of forming
US20120100373A1 (en) 2009-06-26 2012-04-26 Shinbach Madeline P Method of milling particles with nanoparticles and milled free-flowing powder

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1886469A (zh) * 2003-11-25 2006-12-27 3M创新有限公司 含有表面改性的纳米粒子的溶液
US20080214698A1 (en) * 2004-12-30 2008-09-04 3M Innovative Properties Company Polymer Blends Including Surface-Modified Nanoparticles and Methods of Making the Same
CN1962060A (zh) * 2005-11-08 2007-05-16 财团法人工业技术研究院 金属纳米光催化剂复合材料及其制法
CN101058418A (zh) * 2007-04-12 2007-10-24 上海交通大学 聚甲基丙烯酸缩水甘油酯及其衍生物修饰的碳纳米管及其制备方法
CN101508418A (zh) * 2009-03-17 2009-08-19 中国科学院长春应用化学研究所 一种制备铂/碳纳米管杂化材料的方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106605271A (zh) * 2014-08-29 2017-04-26 贺利氏德国有限两合公司 导电组合物
CN106605271B (zh) * 2014-08-29 2019-03-22 贺利氏德国有限两合公司 导电组合物
WO2016169190A1 (zh) * 2015-04-24 2016-10-27 京东方科技集团股份有限公司 导电胶组合物及其制备方法、封框胶、以及显示面板
CN109233684A (zh) * 2017-05-09 2019-01-18 3M创新有限公司 导电粘合剂
CN112789323A (zh) * 2018-10-02 2021-05-11 昭和电工材料株式会社 树脂组合物、固化物及半导体器件
CN112789323B (zh) * 2018-10-02 2024-02-02 株式会社力森诺科 树脂组合物、固化物及半导体器件

Also Published As

Publication number Publication date
WO2011063217A3 (en) 2011-09-29
EP2502239A2 (en) 2012-09-26
US9153354B2 (en) 2015-10-06
JP2013511813A (ja) 2013-04-04
JP5690352B2 (ja) 2015-03-25
US20120313056A1 (en) 2012-12-13
WO2011063217A2 (en) 2011-05-26
EP2502239A4 (en) 2015-01-28

Similar Documents

Publication Publication Date Title
CN102714071A (zh) 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法
TWI342245B (enExample)
TWI665165B (zh) 銀微粒子分散體、銀微粒子及其製造方法以及接合用組成物
CN101522344B (zh) 银粒子复合粉末、银粒子复合粉末分散液、银烧成膜和/或其制造方法
TWI579365B (zh) 導電膠
WO2014068798A1 (ja) スクリーン印刷用導電性接着剤並びに無機素材の接合体及びその製造方法
CN110088039A (zh) 不含粗大粒子的氮化铝粉末
TW201819546A (zh) 導電性塗層複合體及其製造方法
TW201829652A (zh) 凹版轉印用導電性糊劑、導電性圖案的形成方法以及導電性基板的製造方法
TWI686447B (zh) 轉印印刷用導電性墨水
JPS6386205A (ja) 導電性組成物
JP7269565B2 (ja) 導電性インキ組成物及び導電性積層体
TWI744314B (zh) 導電性墨水
KR102011153B1 (ko) 태양 전지 전극용 페이스트 조성물
US20140048748A1 (en) Graphene nanoribbon composites and methods of making the same
JP2021034587A (ja) 放熱性アクリル樹脂積層体及びその製造方法
WO2019142633A1 (ja) 接合用組成物
CN115734557A (zh) 复合导热材料和电子设备
JP7661077B2 (ja) 表面改質された六方晶窒化ホウ素粒子、およびその製造方法。
JP2007051187A (ja) 微小粒子含有組成物
JP4208705B2 (ja) 金属粉末の製造方法
JP2005163141A (ja) 銅粉末及びその製造方法並びにそれを配合した流動性組成物、それを用いた電極
WO2021095771A1 (ja) 硫酸バリウム分散体、塗料、塗膜、およびフィルム
JP2024537022A (ja) サブミクロンの表面改質金属酸化物粒子

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20121003