JP2007051187A - 微小粒子含有組成物 - Google Patents
微小粒子含有組成物 Download PDFInfo
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- 239000010419 fine particle Substances 0.000 title claims abstract description 99
- 239000000203 mixture Substances 0.000 title claims abstract description 85
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 101
- 239000002245 particle Substances 0.000 claims abstract description 74
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 49
- 239000011159 matrix material Substances 0.000 claims abstract description 11
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- 229920000642 polymer Polymers 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 6
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- 239000011248 coating agent Substances 0.000 claims description 5
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
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- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- YKFRUJSEPGHZFJ-UHFFFAOYSA-N N-trimethylsilylimidazole Chemical compound C[Si](C)(C)N1C=CN=C1 YKFRUJSEPGHZFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 amic group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical class C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
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- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- DOYSNKVXNZSWCT-UHFFFAOYSA-N disilanyl(phenyl)silane Chemical compound [SiH3][SiH2][SiH2]C1=CC=CC=C1 DOYSNKVXNZSWCT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
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- 239000003999 initiator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- LWFWUJCJKPUZLV-UHFFFAOYSA-N n-trimethylsilylacetamide Chemical compound CC(=O)N[Si](C)(C)C LWFWUJCJKPUZLV-UHFFFAOYSA-N 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- PYJJCSYBSYXGQQ-UHFFFAOYSA-N trichloro(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl PYJJCSYBSYXGQQ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
【解決手段】(a)体積平均粒径が1nm以上、100nm以下であって、全体の体積基準で99%以上の微小粒子が粒径1.0μm以下であり、式(1):{(粒径が体積基準でのモード径以下の微小粒子の体積)/(残余の微小粒子の体積)}で表される値が1.0以上であるシリカ微小粒子と、(b)該シリカ微小粒子を分散する有機組成物からなるマトリクス材料と、を有することを特徴とする。つまり、粒径が小さい微粒子が相対的に多く含有されていることで、粒径が大きな微粒子の間に相対的に粒径が小さな微粒子が入り込み、「ころ」の様な効果が発揮されることで転がり抵抗が小さくなるので、粒子間の相対移動が容易になり、流動性が向上するものと考えられる。
【選択図】なし
Description
全体の体積基準で95%以上の粒子が粒径1.0μm以下であり、
式(1):{(粒径が体積基準でのモード径以下の粒子の体積)/(残余の粒子の体積)}で表される値が1.0以上である微小粒子と、
(b)該微小粒子を分散する有機組成物からなるマトリクス材料と、を有することを特徴とする。
本発明の微小粒子含有組成物を製造するは特に限定しない。例えば、表面が疎水性の微小粒子はそのまま有機組成物と混ぜることで目的とする微小粒子含有組成物を得ることができる。
シリカ微小粒子(100.0質量部のスノーテックスOL)と、有機組成物(24.0質量部のエポキシ樹脂としてのZX−1059、220.0質量部の有機溶媒としてのプロピレングリコールモノメチルエーテル、1.5質量部のKBM−503)とを混合した後、120℃で5時間保持することでプロピレングリコールモノメチルエーテルを揮発させて不透明でゲル状の微小粒子含有組成物を調製した。
30mm×60mmの方形のガラス板の長辺下側に厚さ50μmの両面テープを貼り付け、20mm×80mmの方形のガラス板の上に載せた。両面テープを貼り付けていない一辺(短辺)にシリンジを用いて万遍なく微小粒子含有組成物をディスペンスした。ディスペンスした直後を基準として対辺まで(20mm)到達した時間を測定した。
Claims (9)
- (a)体積平均粒径が1nm以上、100nm以下であって、
全体の体積基準で95%以上の粒子が粒径1.0μm以下であり、
式(1):{(粒径が体積基準でのモード径以下の粒子の体積)/(残余の粒子の体積)}で表される値が1.0以上である微小粒子と、
(b)該微小粒子を分散する有機組成物からなるマトリクス材料と、を有することを特徴とする微小粒子含有有機組成物。 - 前記微小粒子はシリカから構成されているか、又は、シリカを含有するかのいずれかである請求項1に記載の微小粒子含有有機組成物。
- 前記有機組成物はシランカップリング剤及び/又はシリル化剤からなる表面改質剤を含有する請求1又は2に記載の微小粒子含有有機組成物。
- 前記有機組成物はエポキシ基、オキセタン基、水酸基、ブロックされたイソシアネート基、アミノ基、ハーフエステル基、アミック基、カルボキシ基及び炭素-炭素二重結合基を化学構造中に有する高分子前駆体を含有する請求項1〜3のいずれかに記載の微小粒子含有組成物。
- 前記有機組成物はラジカル重合開始剤、アニオン重合開始剤及びカチオン重合開始剤のうちから選択される1種以上の重合開始剤を含有する請求項1〜4のいずれかに記載の微小粒子含有組成物。
- 前記高分子前駆体はエポキシ樹脂前駆体を含有し、前記重合開始剤は該エポキシ樹脂前駆体の硬化剤を含有する請求項4又は5に記載の微小粒子含有組成物。
- 前記有機組成物は有機溶媒を含有する請求項1〜6のいずれかに記載の微小粒子含有組成物。
- 半導体封止材、コーティング剤、塗料、接着剤、電子基板に用いられるワニス、プリプレグ及び絶縁フィルムに含有される請求項1〜7のいずれかに記載の微小粒子含有組成物。
- 前記シリカ微小粒子は金属ケイ素と酸素とを反応させる方法にて製造されている請求項1〜8のいずれかに記載の微小粒子含有組成物。
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Cited By (8)
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JP2007197655A (ja) * | 2005-05-30 | 2007-08-09 | Admatechs Co Ltd | 微小粒子含有組成物及びその製造方法 |
JP2008248007A (ja) * | 2007-03-29 | 2008-10-16 | Admatechs Co Ltd | 樹脂組成物添加用無機粉末及び樹脂組成物 |
JP2008248004A (ja) * | 2007-03-29 | 2008-10-16 | Admatechs Co Ltd | 樹脂組成物添加用無機粉末及び樹脂組成物 |
JP2009185132A (ja) * | 2008-02-04 | 2009-08-20 | Sekisui Chem Co Ltd | 電子部品用接着剤及び電子部品用接着剤の製造方法 |
DE102011004994A1 (de) | 2010-03-03 | 2012-04-12 | Tokyo Printing & Equipment Trading Co., Ltd. | Mantel eines Druck- bzw. Transferzylinders für Bogenoffset-Druckmaschinen |
JP2015004009A (ja) * | 2013-06-21 | 2015-01-08 | 味の素株式会社 | 樹脂組成物 |
WO2023136331A1 (ja) | 2022-01-13 | 2023-07-20 | 日産化学株式会社 | 粒度分布を有するシリカゾル及びその製造方法 |
CN116496738A (zh) * | 2023-05-04 | 2023-07-28 | 深圳市安伯斯科技有限公司 | 一种低粘度可低温快速固化的底部填充胶及其制备方法 |
Citations (4)
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