CN102684064B - 光模块的制造方法 - Google Patents

光模块的制造方法 Download PDF

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Publication number
CN102684064B
CN102684064B CN201210070077.7A CN201210070077A CN102684064B CN 102684064 B CN102684064 B CN 102684064B CN 201210070077 A CN201210070077 A CN 201210070077A CN 102684064 B CN102684064 B CN 102684064B
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China
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mentioned
load
optical element
optical
substrate
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Expired - Fee Related
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CN201210070077.7A
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Chinese (zh)
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CN102684064A (zh
Inventor
依田薰
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Citizen Watch Co Ltd
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Citizen Watch Co Ltd
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    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
CN201210070077.7A 2011-03-18 2012-03-16 光模块的制造方法 Expired - Fee Related CN102684064B (zh)

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JP2011060916A JP5636319B2 (ja) 2011-03-18 2011-03-18 光モジュールの製造方法

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JP5847473B2 (ja) * 2011-07-21 2016-01-20 シチズンホールディングス株式会社 光モジュール
JP5230829B1 (ja) * 2012-03-09 2013-07-10 株式会社フジクラ 水分の除去方法、光ファイバの半田付け方法、及び、半導体レーザモジュールの製造方法
JP5925062B2 (ja) * 2012-06-18 2016-05-25 シチズンホールディングス株式会社 光モジュール及び光モジュールの製造方法
DE102015002176A1 (de) * 2015-02-24 2016-08-25 Jenoptik Laser Gmbh Verfahren zum Herstellen eines Diodenlasers und Diodenlaser
US10126504B2 (en) * 2015-05-27 2018-11-13 The United States Of America, As Represented By The Secretary Of The Navy Antireflective surface structures for active and passive optical fiber
CN105711224B (zh) * 2016-03-25 2017-11-24 湖南新中合光电科技股份有限公司 一种光分路器晶圆贴片系统

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JP3655179B2 (ja) * 1999-10-20 2005-06-02 富士通株式会社 半導体チップ素子
JP2002111113A (ja) * 2000-09-28 2002-04-12 Hitachi Ltd 光モジュール
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