JP5636319B2 - 光モジュールの製造方法 - Google Patents
光モジュールの製造方法 Download PDFInfo
- Publication number
- JP5636319B2 JP5636319B2 JP2011060916A JP2011060916A JP5636319B2 JP 5636319 B2 JP5636319 B2 JP 5636319B2 JP 2011060916 A JP2011060916 A JP 2011060916A JP 2011060916 A JP2011060916 A JP 2011060916A JP 5636319 B2 JP5636319 B2 JP 5636319B2
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- JP
- Japan
- Prior art keywords
- bonding
- load
- optical
- substrate
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011060916A JP5636319B2 (ja) | 2011-03-18 | 2011-03-18 | 光モジュールの製造方法 |
| EP12159734.8A EP2500757B1 (en) | 2011-03-18 | 2012-03-15 | Method of manufacturing optical module |
| US13/422,656 US9214446B2 (en) | 2011-03-18 | 2012-03-16 | Method of manufacturing optical module |
| CN201210070077.7A CN102684064B (zh) | 2011-03-18 | 2012-03-16 | 光模块的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011060916A JP5636319B2 (ja) | 2011-03-18 | 2011-03-18 | 光モジュールの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012198295A JP2012198295A (ja) | 2012-10-18 |
| JP2012198295A5 JP2012198295A5 (enExample) | 2014-02-20 |
| JP5636319B2 true JP5636319B2 (ja) | 2014-12-03 |
Family
ID=45936772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011060916A Expired - Fee Related JP5636319B2 (ja) | 2011-03-18 | 2011-03-18 | 光モジュールの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9214446B2 (enExample) |
| EP (1) | EP2500757B1 (enExample) |
| JP (1) | JP5636319B2 (enExample) |
| CN (1) | CN102684064B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5847473B2 (ja) * | 2011-07-21 | 2016-01-20 | シチズンホールディングス株式会社 | 光モジュール |
| JP5230829B1 (ja) * | 2012-03-09 | 2013-07-10 | 株式会社フジクラ | 水分の除去方法、光ファイバの半田付け方法、及び、半導体レーザモジュールの製造方法 |
| JP5925062B2 (ja) * | 2012-06-18 | 2016-05-25 | シチズンホールディングス株式会社 | 光モジュール及び光モジュールの製造方法 |
| DE102015002176A1 (de) * | 2015-02-24 | 2016-08-25 | Jenoptik Laser Gmbh | Verfahren zum Herstellen eines Diodenlasers und Diodenlaser |
| US10126504B2 (en) * | 2015-05-27 | 2018-11-13 | The United States Of America, As Represented By The Secretary Of The Navy | Antireflective surface structures for active and passive optical fiber |
| CN105711224B (zh) * | 2016-03-25 | 2017-11-24 | 湖南新中合光电科技股份有限公司 | 一种光分路器晶圆贴片系统 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5393697A (en) * | 1994-05-06 | 1995-02-28 | Industrial Technology Research Institute | Composite bump structure and methods of fabrication |
| US5568892A (en) * | 1994-06-16 | 1996-10-29 | Lucent Technologies Inc. | Alignment and bonding techniques |
| JPH10208269A (ja) | 1997-01-28 | 1998-08-07 | Toshiba Corp | 光ピックアップヘッド及びその製造方法並びに製造装置 |
| JP3655179B2 (ja) * | 1999-10-20 | 2005-06-02 | 富士通株式会社 | 半導体チップ素子 |
| JP2002111113A (ja) * | 2000-09-28 | 2002-04-12 | Hitachi Ltd | 光モジュール |
| JP3790995B2 (ja) * | 2004-01-22 | 2006-06-28 | 有限会社ボンドテック | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
| JP2007133011A (ja) * | 2005-11-08 | 2007-05-31 | Nec Corp | 光結合構造およびその製造方法、光モジュール |
| JP4349475B2 (ja) * | 2009-03-19 | 2009-10-21 | 三菱電機株式会社 | 光モジュールの製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102684064A (zh) | 2012-09-19 |
| EP2500757B1 (en) | 2018-06-27 |
| CN102684064B (zh) | 2016-12-14 |
| EP2500757A1 (en) | 2012-09-19 |
| US9214446B2 (en) | 2015-12-15 |
| JP2012198295A (ja) | 2012-10-18 |
| US20120234458A1 (en) | 2012-09-20 |
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