JP6157356B2 - 光集積デバイス - Google Patents
光集積デバイス Download PDFInfo
- Publication number
- JP6157356B2 JP6157356B2 JP2013543030A JP2013543030A JP6157356B2 JP 6157356 B2 JP6157356 B2 JP 6157356B2 JP 2013543030 A JP2013543030 A JP 2013543030A JP 2013543030 A JP2013543030 A JP 2013543030A JP 6157356 B2 JP6157356 B2 JP 6157356B2
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- JP
- Japan
- Prior art keywords
- optical
- spacer
- wavelength conversion
- integrated device
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/0147—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on thermo-optic effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0092—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for nonlinear frequency conversion, e.g. second harmonic generation [SHG] or sum- or difference-frequency generation outside the laser cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
Description
また、本発明は、基板上に搭載される部品を高温で加熱することなく、精度良くかつ高集積度で実装できる光集積デバイスを提供することを目的とする。
Claims (5)
- 金属材料からなる第1及び第3の接合部を上面に有する基板と、
前記第1の接合部と接合された第1の金属膜を下面に有し、金属材料からなる第2の接合部を上面に有し、且つ第1の素子と光学的に結合する光素子と、
前記第2の接合部と接合された第2の金属膜を下面に有し、前記光素子に積層され、且つ前記光素子と熱膨張係数が異なる電気素子と、
前記第3の接合部と接合された第3の金属膜を下面に有し、金属材料からなる第4の接合部及びベタパターンを上面に有するスペーサと、を有し、
前記第1の素子は、前記第4の接合部と接合された第4の金属膜を下面に有し、前記スペーサの上面における中心からずれた位置に接合され、
前記ベタパターンは、前記第4の接合部が形成された領域以外の前記スペーサの上面に形成され、前記第4の接合部と同じ高さを有し、前記スペーサの上部から前記スペーサに加えられる加圧力を均等化させ、
前記第1から第4の接合部と前記第1から第4の金属膜とは、それぞれ、金属原子の共有結合により接合されている、
ことを特徴とする光集積デバイス。 - 前記第1の素子はレーザ素子であり、前記光素子は前記レーザ素子のレーザ光を波長変換して出射する波長変換素子である、請求項1に記載の光集積デバイス。
- 前記電気素子は、前記波長変換素子の温度制御を行う温度制御用ICである、請求項2に記載の光集積デバイス。
- 前記第1から第4の接合部は、Auからなるマイクロバンプ構造を有し、前記第1から第4の金属膜はAu膜である、請求項1〜3の何れか一項に記載の光集積デバイス。
- 前記ベタパターンは、前記第4の接合部が形成された領域を当該領域の前記光素子に向かい合う端部を除いて取り囲むように形成されている、請求項1〜4の何れか一項に記載の光集積デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011246169 | 2011-11-10 | ||
JP2011246169 | 2011-11-10 | ||
PCT/JP2012/079019 WO2013069743A1 (ja) | 2011-11-10 | 2012-11-08 | 光集積デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013069743A1 JPWO2013069743A1 (ja) | 2015-04-02 |
JP6157356B2 true JP6157356B2 (ja) | 2017-07-05 |
Family
ID=48290113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013543030A Active JP6157356B2 (ja) | 2011-11-10 | 2012-11-08 | 光集積デバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US9631781B2 (ja) |
EP (1) | EP2779332A4 (ja) |
JP (1) | JP6157356B2 (ja) |
CN (1) | CN103931063B (ja) |
WO (1) | WO2013069743A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3240125B1 (en) | 2014-12-26 | 2020-04-08 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
DE102015002176A1 (de) | 2015-02-24 | 2016-08-25 | Jenoptik Laser Gmbh | Verfahren zum Herstellen eines Diodenlasers und Diodenlaser |
EP3294145A4 (en) * | 2015-05-08 | 2019-01-09 | Samark Technology LLC | NEEDLE IMAGING APPARATUS |
CN109326685B (zh) * | 2017-08-01 | 2023-03-03 | 群创光电股份有限公司 | 显示装置的制造方法 |
US11979194B2 (en) * | 2019-02-21 | 2024-05-07 | King Abdullah University Of Science And Technology | Large-area waveguided photodetection for optical wireless communication |
WO2021145931A1 (en) * | 2020-01-16 | 2021-07-22 | Sri International | Integrated vacuum cell assemblies |
CN113470578B (zh) * | 2020-03-31 | 2022-06-17 | 北京小米移动软件有限公司 | 显示驱动模组、显示面板和电子设备 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1255382A (en) | 1984-08-10 | 1989-06-06 | Masao Kawachi | Hybrid optical integrated circuit with alignment guides |
JPS6146911A (ja) | 1984-08-10 | 1986-03-07 | Nippon Telegr & Teleph Corp <Ntt> | 導波形光モジユ−ル |
EP0638829B1 (en) * | 1993-08-09 | 1999-11-24 | Nippon Telegraph And Telephone Corporation | Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit, and process for fabricating platform |
JPH10270496A (ja) * | 1997-03-27 | 1998-10-09 | Hitachi Ltd | 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法 |
GB2395066A (en) * | 2002-11-01 | 2004-05-12 | Optitune Plc | Flip chip bonding and passive alignment of optical devices |
JP3790995B2 (ja) | 2004-01-22 | 2006-06-28 | 有限会社ボンドテック | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
JP4383274B2 (ja) | 2004-06-30 | 2009-12-16 | Necエレクトロニクス株式会社 | 半導体装置および半導体ウエハの製造方法 |
JP2006054259A (ja) * | 2004-08-10 | 2006-02-23 | Toshiba Corp | 光半導体モジュールとその製造方法、およびそれを用いた半導体装置 |
JP2007072206A (ja) | 2005-09-07 | 2007-03-22 | Nec Corp | 電気・光混載モジュール及びその製造方法 |
JP2008130969A (ja) * | 2006-11-24 | 2008-06-05 | Seiko Epson Corp | レーザ光源装置の駆動方法、レーザ光源装置、画像表示装置、モニタ装置、照明装置 |
US20080181558A1 (en) | 2007-01-31 | 2008-07-31 | Hartwell Peter G | Electronic and optical circuit integration through wafer bonding |
US20090051046A1 (en) | 2007-08-24 | 2009-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method for the same |
JP5388503B2 (ja) | 2007-08-24 | 2014-01-15 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
KR100924552B1 (ko) * | 2007-11-30 | 2009-11-02 | 주식회사 하이닉스반도체 | 반도체 패키지용 기판 및 이를 갖는 반도체 패키지 |
JP2010056139A (ja) | 2008-08-26 | 2010-03-11 | Toshiba Corp | 積層型半導体装置 |
JP2011109002A (ja) * | 2009-11-20 | 2011-06-02 | Citizen Holdings Co Ltd | 集積デバイスおよび集積デバイスの製造方法 |
US8859337B2 (en) * | 2009-12-15 | 2014-10-14 | Soitec | Thermal matching in semiconductor devices using heat distribution structures |
US8399292B2 (en) * | 2010-06-30 | 2013-03-19 | International Business Machines Corporation | Fabricating a semiconductor chip with backside optical vias |
US9316788B2 (en) * | 2010-10-14 | 2016-04-19 | Rwth Aachen | Laser to chip coupler |
US9028083B2 (en) * | 2010-12-29 | 2015-05-12 | 3M Innovative Properties Company | Phosphor reflector assembly for remote phosphor LED device |
-
2012
- 2012-11-08 EP EP12847313.9A patent/EP2779332A4/en not_active Withdrawn
- 2012-11-08 CN CN201280055252.3A patent/CN103931063B/zh not_active Expired - Fee Related
- 2012-11-08 US US14/357,212 patent/US9631781B2/en active Active
- 2012-11-08 JP JP2013543030A patent/JP6157356B2/ja active Active
- 2012-11-08 WO PCT/JP2012/079019 patent/WO2013069743A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JPWO2013069743A1 (ja) | 2015-04-02 |
WO2013069743A1 (ja) | 2013-05-16 |
CN103931063B (zh) | 2017-04-19 |
CN103931063A (zh) | 2014-07-16 |
EP2779332A1 (en) | 2014-09-17 |
US9631781B2 (en) | 2017-04-25 |
EP2779332A4 (en) | 2015-11-25 |
US20140362577A1 (en) | 2014-12-11 |
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