CN102646656A - 显示装置 - Google Patents

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CN102646656A
CN102646656A CN201110084958XA CN201110084958A CN102646656A CN 102646656 A CN102646656 A CN 102646656A CN 201110084958X A CN201110084958X A CN 201110084958XA CN 201110084958 A CN201110084958 A CN 201110084958A CN 102646656 A CN102646656 A CN 102646656A
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anisotropic conductive
chip
electric property
district
property coupling
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吴淇铭
黄振勋
栾大年
吕文璋
江明盛
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E Ink Holdings Inc
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E Ink Holdings Inc
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Abstract

本发明提出一种显示装置，包括显示面板、至少一块异方性导电胶以及至少一个芯片。显示面板具有周边线路区，并且异方性导电胶粘贴于显示面板的周边线路区。此外，芯片配置在异方性导电胶上，并且每个芯片面对异方性导电胶的表面具有电性耦接区。电性耦接区设有多个电性耦接部，并且这些电性耦接部通过异方性导电胶而电性耦接到周边线路区。电性耦接区的外围边界与芯片的外围边界之间存有间距，并且电性耦接区位于异方性导电胶的粘贴范围内，而异方性导电胶的粘贴范围位于芯片的外围边界内。这种显示装置具有较佳的可靠度。

Description

显示装置
技术领域
本发明是有关于一种显示装置，且特别是有关于一种采用覆晶接合技术的显示装置。
背景技术
随着平面显示科技的进步与发展，平面显示装置的应用已逐渐普及。早期的平面显示装置都是用刚性基板作为承载基板，所以不具可挠性。为了有效减少平面显示装置的重量及厚度，近年来发展出了可挠性显示装置。而且，可挠性显示装置除了有重量轻且厚度薄的优点外，还具有可挠曲且不易破损的优点，因此可挠性显示装置的制造已成为重要的发展趋势。
图1是现有的一种将芯片接合于显示装置的周边线路区的示意图，而图2是现有显示装置中异方性导电胶自基板剥离的示意图。请先参照图1，现有的显示装置100包括基板110，而基板110的周边线路区112设有异方性导电胶120以及芯片130。芯片130设有多个凸块132，并且这些凸块132通过异方性导电胶120而电性耦接到周边线路区112。而且，为确保所有凸块132都能与周边线路区112电性耦接，异方性导电胶120的粘贴范围需涵盖整个芯片130的底面131。
现有技术是通过热压设备的热压头140将芯片130固定于周边线路区112的。在进行热压时，热压头140涵盖整个芯片130，以将芯片130热压于异方性导电胶120之上，促使异方性导电胶120受热固化。然而，由于热压头140无法完全涵盖异方性导电胶120的粘贴范围A1，所以位于热压头140加热范围A2外的异方性导电胶120容易因为受热不均而导致固化不完全。如图2所示，未完全固化的异方性导电胶120容易自基板110剥离。尤其是对于可挠性显示装置而言，固化不完全的异方性导电胶120更容易因为可挠性基板的挠曲而自基板110剥离，甚至造成周边线路受损。因此，现有显示装置100的可靠度较差。
发明内容
本发明提供一种显示装置，以提高可靠度。
为达到上述优点，本发明提供一种显示装置，其包括显示面板、至少一块异方性导电胶以及至少个一芯片。显示面板具有周边线路区，并且异方性导电胶粘贴于显示面板的周边线路区。此外，芯片配置在异方性导电胶上，并且每个芯片面对异方性导电胶的表面具有电性耦接区，而该电性耦接区设有多个电性耦接部，这些电性耦接部通过异方性导电胶而电性耦接到周边线路区。电性耦接区的外围边界与芯片的外围边界之间存有间距，并且电性耦接区位于异方性导电胶的粘贴范围内，而异方性导电胶的粘贴范围位于芯片的外围边界内。
在本发明的一个实施例中，前述的显示面板是液晶显示面板、双稳态显示面板、有机发光二极管显示面板或者电浆显示面板。
在本发明的一个实施例中，前述的显示面板的形成有该周边线路区的基板是玻璃基板、塑胶基板或者金属基板。
在本发明的一个实施例中，前述的电性耦接部包括多个凸块。
在本发明的显示装置中，由于将异方性导电胶的粘贴范围限制在位于芯片的外围边界内，所以在进行热固化制程时，异方性导电胶可被固化完全，这样可避免未被完全固化的部份异方性导电胶导致线路受损。因此，本发明的显示装置具有较佳的可靠度。
为让本发明的上述和其它目的、特征和优点能更明显易懂，下文特举较佳实施例，并配合所附图式，作详细说明如下。
附图说明
图1是现有的一种将芯片接合于显示装置的周边线路区的示意图。
图2是现有显示装置中异方性导电胶自基板剥离的示意图。
图3是本发明实施例的显示装置的示意图。
图4是图3中芯片底面以及异方性导电胶的涂布范围的示意图。
图5是本发明实施例中将芯片接合于显示装置的周边电路区的示意图。
图中100、300.显示装置，110、311.基板，112、312.周边线路区，120、320.异方性导电胶，130、330.芯片，131.底面，132.凸块，140、240.热压头，310.显示面板，332.表面，334.电性耦接区，336.电性耦接部，A1、R1.粘贴范围，A2、R2.加热范围，B1、B2.外围边界，D.间距。
具体实施方式
图3是本发明实施例的显示装置的示意图，图4是图3中芯片底面以及异方性导电胶的涂布范围的示意图。请参照图3和图4，本实施例的显示装置300包括显示面板310、至少一块异方性导电胶320以及至少一个芯片330。显示面板310可以是双稳态显示面板、液晶显示面板、有机发光二极管显示面板或电浆显示面板，但不以此为限。异方性导电胶320的数量例如是与芯片330的数量相对应，而在图3中异方性导电胶320与芯片330的数量分别以一个为例。
承上述，显示面板310具有周边线路区312，并且异方性导电胶320粘贴于显示面板310的周边线路区312。具体而言，周边线路区312是位于显示面板310的基板311上，并且周边线路区312例如设有多个芯片接垫（图未示），以供电性连接到芯片330。粘贴于周边线路区312的异方性导电胶320覆盖这些芯片接垫。此外，上述基板311可以是刚性基板或可挠性基板，如玻璃基板、塑胶基板或者金属基板等，但不以此为限，要看设计需求而定。
上述芯片330配置在异方性导电胶320上，并且每个芯片330面对异方性导电胶320的表面332具有电性耦接区334，而该电性耦接区334设有与芯片接垫相对应的多个电性耦接部336。电性耦接部336例如是凸块，而这些电性耦接部336通过异方性导电胶320而电性耦接到周边线路区312的芯片接垫。
在本实施例中，电性耦接区334的范围例如是包含所有电性耦接部336的最小范围，电性耦接区334的外围边界如图4中标号B1所指的虚线所示。值得注意的是，电性耦接区334的外围边界B1与芯片330的外围边界B2之间存有间距D，并且电性耦接区334位于异方性导电胶320的粘贴范围R1内，而异方性导电胶320的粘贴范围R1位于芯片330的外围边界B2内。也就是说，异方性导电胶320的粘贴范围R1是涵盖整个电性耦接区334，并且未超出芯片330所涵盖的范围。     图5是本发明实施例中将芯片接合于显示装置的周边电路区的示意图。请参照图4和图5，本实施例的显示装置300因限制异方性导电胶320的粘贴范围R1位于芯片330的外围边界B2内，所以在进行芯片贴合制程时，热压设备的热压头240可以完全涵盖异方性导电胶320的粘贴范围R1，所以可确保所有的异方性导电胶320均位于热压头140的加热范围R2内，以避免异方性导电胶320固化不完全。因此，本实施例的显示装置300可有效解决现有技术中异方性导电胶固化不完全而容易剥离的情形，进而防止线路因异方性导电胶的剥离而受损。换句话说，本实施例的显示装置300具有较佳的可靠度。
以上所述，仅是本发明的实施例而已，并非对本发明作任何形式上的限制，虽然本发明已以实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (4)

1.一种显示装置，其特征在于：所述显示装置包括显示面板、至少一块异方性导电胶以及至少一个芯片，所述显示面板具有周边线路区，所述异方性导电胶粘贴于所述显示面板的周边线路区，所述芯片配置在所述异方性导电胶上，并且每个所述芯片面对所述异方性导电胶的表面具有电性耦接区，所述电性耦接区设有多个电性耦接部，这些电性耦接部通过所述异方性导电胶而电性耦接到所述周边线路区，其中所述电性耦接区的外围边界与所述芯片的外围边界之间存有间距，并且所述电性耦接区位于所述异方性导电胶的粘贴范围内，而所述异方性导电胶的粘贴范围位于所述芯片的外围边界内。
2.根据权利要求1所述的显示装置，其特征在于：所述显示面板是液晶显示面板、双稳态显示面板、有机发光二极管显示面板或者电浆显示面板。
3.根据权利要求1所述的显示装置，其特征在于：所述显示面板的形成所述周边线路区的基板是玻璃基板、塑胶基板或者金属基板。
4.根据权利要求1所述的显示装置，其特征在于：所述电性耦接部包括多个凸块。
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