CN1026133C - 微波等离子体化学气相沉积装置 - Google Patents
微波等离子体化学气相沉积装置 Download PDFInfo
- Publication number
- CN1026133C CN1026133C CN89108774.5A CN89108774A CN1026133C CN 1026133 C CN1026133 C CN 1026133C CN 89108774 A CN89108774 A CN 89108774A CN 1026133 C CN1026133 C CN 1026133C
- Authority
- CN
- China
- Prior art keywords
- film
- chamber
- etching
- window
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005229 chemical vapour deposition Methods 0.000 title claims description 7
- 238000005530 etching Methods 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000000151 deposition Methods 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims description 24
- 239000002994 raw material Substances 0.000 claims description 18
- 230000007797 corrosion Effects 0.000 claims description 17
- 238000005260 corrosion Methods 0.000 claims description 17
- 230000004913 activation Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 21
- 239000007789 gas Substances 0.000 description 77
- 238000000034 method Methods 0.000 description 38
- 229910021417 amorphous silicon Inorganic materials 0.000 description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 238000002955 isolation Methods 0.000 description 12
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 12
- 239000011261 inert gas Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000008246 gaseous mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000036470 plasma concentration Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 101100441092 Danio rerio crlf3 gene Proteins 0.000 description 1
- -1 He gas Chemical compound 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP88-294740 | 1988-11-24 | ||
| JP63294740A JPH02141578A (ja) | 1988-11-24 | 1988-11-24 | 堆積膜形成装置 |
| JP294740/88 | 1988-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1043348A CN1043348A (zh) | 1990-06-27 |
| CN1026133C true CN1026133C (zh) | 1994-10-05 |
Family
ID=17811694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN89108774.5A Expired - Fee Related CN1026133C (zh) | 1988-11-24 | 1989-11-24 | 微波等离子体化学气相沉积装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4995341A (enExample) |
| JP (1) | JPH02141578A (enExample) |
| CN (1) | CN1026133C (enExample) |
| DE (1) | DE3938830A1 (enExample) |
| FR (1) | FR2639474B1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5114770A (en) * | 1989-06-28 | 1992-05-19 | Canon Kabushiki Kaisha | Method for continuously forming functional deposited films with a large area by a microwave plasma cvd method |
| DE69030140T2 (de) * | 1989-06-28 | 1997-09-04 | Canon Kk | Verfahren und Anordnung zur kontinuierlichen Bildung einer durch Mikrowellen-Plasma-CVD niedergeschlagenen grossflächigen Dünnschicht |
| US5130170A (en) * | 1989-06-28 | 1992-07-14 | Canon Kabushiki Kaisha | Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation |
| US5236511A (en) * | 1990-03-16 | 1993-08-17 | Schott Glaswerke | Plasma CVD process for coating a dome-shaped substrate |
| US5443645A (en) * | 1990-05-19 | 1995-08-22 | Canon Kabushiki Kaisha | Microwave plasma CVD apparatus comprising coaxially aligned multiple gas pipe gas feed structure |
| JP2714247B2 (ja) * | 1990-10-29 | 1998-02-16 | キヤノン株式会社 | マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する方法及び装置 |
| JP2824808B2 (ja) * | 1990-11-16 | 1998-11-18 | キヤノン株式会社 | マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する装置 |
| US5629054A (en) * | 1990-11-20 | 1997-05-13 | Canon Kabushiki Kaisha | Method for continuously forming a functional deposit film of large area by micro-wave plasma CVD method |
| JP2810532B2 (ja) * | 1990-11-29 | 1998-10-15 | キヤノン株式会社 | 堆積膜形成方法及び堆積膜形成装置 |
| JPH04329881A (ja) * | 1991-05-01 | 1992-11-18 | Canon Inc | マイクロ波プラズマcvd法による堆積膜形成装置 |
| US5919310A (en) * | 1991-10-07 | 1999-07-06 | Canon Kabushiki Kaisha | Continuously film-forming apparatus provided with improved gas gate means |
| US5204272A (en) * | 1991-12-13 | 1993-04-20 | United Solar Systems Corporation | Semiconductor device and microwave process for its manufacture |
| EP0595159B1 (de) * | 1992-10-26 | 1997-12-29 | Schott Glaswerke | Verfahren und Vorrichtung zur Beschichtung der Innenfläche stark gewölbter im wesentlichen kalottenförmiger Substrate mittels CVD |
| US5366585A (en) * | 1993-01-28 | 1994-11-22 | Applied Materials, Inc. | Method and apparatus for protection of conductive surfaces in a plasma processing reactor |
| US6835523B1 (en) | 1993-05-09 | 2004-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for fabricating coating and method of fabricating the coating |
| US6171674B1 (en) | 1993-07-20 | 2001-01-09 | Semiconductor Energy Laboratory Co., Ltd. | Hard carbon coating for magnetic recording medium |
| JP3659512B2 (ja) * | 1993-12-20 | 2005-06-15 | キヤノン株式会社 | 光起電力素子及びその形成方法及びその形成装置 |
| US6096389A (en) * | 1995-09-14 | 2000-08-01 | Canon Kabushiki Kaisha | Method and apparatus for forming a deposited film using a microwave CVD process |
| DE19601436A1 (de) * | 1996-01-17 | 1997-07-24 | Siegfried Dr Ing Straemke | Verfahren und Vorrichtung zur Oberflächenbehandlung von Werkstücken |
| DE19701696C2 (de) * | 1997-01-20 | 1999-02-18 | Fraunhofer Ges Forschung | Vorrichtung und Verfahren zur Beschichtung eines Substrates mittels eines chemischen Gasphasenabscheideverfahrens |
| DE102004045046B4 (de) * | 2004-09-15 | 2007-01-04 | Schott Ag | Verfahren und Vorrichtung zum Aufbringen einer elektrisch leitfähigen transparenten Beschichtung auf ein Substrat |
| CN106166763A (zh) * | 2008-07-14 | 2016-11-30 | 艾利丹尼森公司 | 切割涂胶标签的装置和方法 |
| US20100196591A1 (en) * | 2009-02-05 | 2010-08-05 | Applied Materials, Inc. | Modular pvd system for flex pv |
| EP2216831A1 (en) * | 2009-02-05 | 2010-08-11 | Applied Materials, Inc. | Modular PVD system for flex PV |
| CN112723862B (zh) * | 2020-12-29 | 2022-11-22 | 太原理工大学 | 简单低耗制备高熵氧化物陶瓷材料的方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55131175A (en) * | 1979-03-30 | 1980-10-11 | Toshiba Corp | Surface treatment apparatus with microwave plasma |
| DE3244391A1 (de) * | 1982-12-01 | 1984-06-07 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zur beschichtung von substraten durch plasmapolymerisation |
| JPS6052014A (ja) * | 1983-08-31 | 1985-03-23 | Mitsubishi Electric Corp | 半導体製造装置 |
| JPS60128265A (ja) * | 1983-12-14 | 1985-07-09 | Nec Corp | 気相薄膜形成装置 |
| EP0151754B1 (en) * | 1984-02-14 | 1991-12-18 | Energy Conversion Devices, Inc. | An improved method of making a photoconductive member |
| US4715927A (en) * | 1984-02-14 | 1987-12-29 | Energy Conversion Devices, Inc. | Improved method of making a photoconductive member |
| US4566403A (en) * | 1985-01-30 | 1986-01-28 | Sovonics Solar Systems | Apparatus for microwave glow discharge deposition |
| JPS62104438U (enExample) * | 1985-12-23 | 1987-07-03 | ||
| JP2791770B2 (ja) * | 1986-09-09 | 1998-08-27 | キヤノン株式会社 | マイクロ波プラズマcvd法による機能性堆積膜の形成装置 |
| JPH0676664B2 (ja) * | 1986-12-09 | 1994-09-28 | キヤノン株式会社 | マイクロ波プラズマcvd法による機能性堆積膜の形成装置 |
| JPH01198478A (ja) * | 1988-02-01 | 1989-08-10 | Canon Inc | マイクロ波プラズマcvd装置 |
-
1988
- 1988-11-24 JP JP63294740A patent/JPH02141578A/ja active Pending
-
1989
- 1989-11-21 US US07/439,817 patent/US4995341A/en not_active Expired - Lifetime
- 1989-11-23 DE DE3938830A patent/DE3938830A1/de active Granted
- 1989-11-23 FR FR8915429A patent/FR2639474B1/fr not_active Expired - Fee Related
- 1989-11-24 CN CN89108774.5A patent/CN1026133C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2639474B1 (fr) | 1994-02-11 |
| DE3938830C2 (enExample) | 1991-05-02 |
| FR2639474A1 (fr) | 1990-05-25 |
| DE3938830A1 (de) | 1990-05-31 |
| JPH02141578A (ja) | 1990-05-30 |
| US4995341A (en) | 1991-02-26 |
| CN1043348A (zh) | 1990-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
| OR01 | Other related matters | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |