CN102576689B - 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法 - Google Patents

基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法 Download PDF

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Publication number
CN102576689B
CN102576689B CN201080041623.3A CN201080041623A CN102576689B CN 102576689 B CN102576689 B CN 102576689B CN 201080041623 A CN201080041623 A CN 201080041623A CN 102576689 B CN102576689 B CN 102576689B
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China
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substrate
holding
dust
substrate holder
holder
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Expired - Fee Related
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CN201080041623.3A
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English (en)
Chinese (zh)
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CN102576689A (zh
Inventor
菅谷功
长南纯一
前田荣裕
田中庆一
保多智之
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201080041623.3A 2009-07-21 2010-07-21 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法 Expired - Fee Related CN102576689B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2009-170513 2009-07-21
JP2009170513 2009-07-21
JP2009253440 2009-11-04
JP2009-253440 2009-11-04
JP2009253439 2009-11-04
JP2009-253439 2009-11-04
JP2010023510 2010-02-04
JP2010-023510 2010-02-04
PCT/JP2010/004675 WO2011010460A1 (ja) 2009-07-21 2010-07-21 基板処理システム、基板ホルダ、基板ホルダ対、基板接合装置およびデバイスの製造方法

Publications (2)

Publication Number Publication Date
CN102576689A CN102576689A (zh) 2012-07-11
CN102576689B true CN102576689B (zh) 2015-06-03

Family

ID=43498942

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080041623.3A Expired - Fee Related CN102576689B (zh) 2009-07-21 2010-07-21 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法

Country Status (8)

Country Link
US (1) US20120214290A1 (https=)
EP (1) EP2458629B1 (https=)
JP (1) JP5686097B2 (https=)
KR (1) KR101746241B1 (https=)
CN (1) CN102576689B (https=)
IN (1) IN2012DN01482A (https=)
TW (1) TWI593048B (https=)
WO (1) WO2011010460A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5485958B2 (ja) * 2011-09-16 2014-05-07 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
US10115862B2 (en) 2011-12-27 2018-10-30 eLux Inc. Fluidic assembly top-contact LED disk
JP5521066B1 (ja) * 2013-01-25 2014-06-11 東京エレクトロン株式会社 接合装置及び接合システム
KR102247936B1 (ko) * 2013-10-30 2021-05-04 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조 방법
CN104733366B (zh) * 2015-03-27 2017-07-25 北京七星华创电子股份有限公司 一种支撑脚装置
US20180130705A1 (en) * 2016-11-07 2018-05-10 Corning Incorporated Delayed Via Formation in Electronic Devices
CN107146768B (zh) * 2017-06-16 2018-03-23 英特尔产品（成都）有限公司 用于安放物品的装置和对准装置
KR20200134708A (ko) 2019-05-23 2020-12-02 삼성전자주식회사 웨이퍼 본딩 장치
JP7334258B2 (ja) * 2019-11-01 2023-08-28 東京エレクトロン株式会社 基板洗浄装置および基板洗浄方法
JP7579092B2 (ja) * 2020-09-11 2024-11-07 キヤノン株式会社 異物除去装置、リソグラフィ装置、および物品製造方法
CN116995024A (zh) * 2022-04-26 2023-11-03 重庆康佳光电科技有限公司 晶圆取放装置及刻蚀设备、晶圆拾取方法

Citations (3)

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CN1936678A (zh) * 2005-09-02 2007-03-28 株式会社日立工业设备技术 基板组装装置和基板组装方法
WO2009057710A1 (ja) * 2007-10-30 2009-05-07 Nikon Corporation 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法
JP5178990B2 (ja) * 2003-06-03 2013-04-10 キャタピラー インコーポレイテッド エンジン出力損失の補償

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US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JPH0359189U (https=) * 1989-10-11 1991-06-11
JPH05217973A (ja) * 1992-02-06 1993-08-27 Nippon Steel Corp 半導体基板貼付装置
JP3191139B2 (ja) * 1994-12-14 2001-07-23 株式会社日立製作所 試料保持装置
JP3137080B2 (ja) * 1998-06-24 2001-02-19 日本電気株式会社 レチクル収納容器
JP2000091247A (ja) * 1998-09-14 2000-03-31 Tokyo Electron Ltd プラズマ処理装置
JP2003273187A (ja) * 2002-03-12 2003-09-26 Matsushita Electric Ind Co Ltd 薄板材の移載方法及び装置
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
JP2006344613A (ja) * 2003-06-24 2006-12-21 Shin-Etsu Engineering Co Ltd 基板貼り合わせ装置
JP2005032553A (ja) * 2003-07-14 2005-02-03 Renesas Technology Corp Ｉｃソケットおよび半導体装置の検査方法
JP2005203645A (ja) * 2004-01-19 2005-07-28 Nitto Denko Corp 基板貼り合わせ方法及び基板貼り合わせ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5178990B2 (ja) * 2003-06-03 2013-04-10 キャタピラー インコーポレイテッド エンジン出力損失の補償
CN1936678A (zh) * 2005-09-02 2007-03-28 株式会社日立工业设备技术 基板组装装置和基板组装方法
WO2009057710A1 (ja) * 2007-10-30 2009-05-07 Nikon Corporation 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法

Also Published As

Publication number Publication date
EP2458629A1 (en) 2012-05-30
EP2458629B1 (en) 2019-05-15
JP5686097B2 (ja) 2015-03-18
US20120214290A1 (en) 2012-08-23
JPWO2011010460A1 (ja) 2012-12-27
KR101746241B1 (ko) 2017-06-12
TWI593048B (zh) 2017-07-21
CN102576689A (zh) 2012-07-11
IN2012DN01482A (https=) 2015-06-05
WO2011010460A1 (ja) 2011-01-27
EP2458629A4 (en) 2017-04-12
TW201126639A (en) 2011-08-01
KR20120048640A (ko) 2012-05-15

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