IN2012DN01482A - - Google Patents

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Publication number
IN2012DN01482A
IN2012DN01482A IN1482DEN2012A IN2012DN01482A IN 2012DN01482 A IN2012DN01482 A IN 2012DN01482A IN 1482DEN2012 A IN1482DEN2012 A IN 1482DEN2012A IN 2012DN01482 A IN2012DN01482 A IN 2012DN01482A
Authority
IN
India
Prior art keywords
substrate
dust
substrate holder
flow
semiconductor substrates
Prior art date
Application number
Inventor
Isao Sugaya
Junichi Chonan
Hidehiro Maeda
Keiichi Tanaka
Tomoyuki Yasuda
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of IN2012DN01482A publication Critical patent/IN2012DN01482A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto

Abstract

Provided is a substrate processing system that can restrict flow of dust to regions where semiconductor substrates are mounted, when semiconductor substrates are layered using a pair of substrate holders. The substrate processing system includes a substrate holder system that causes a first substrate holder holding a first substrate and a second substrate holder holding a second substrate to face each other and sandwiches the first substrate and the second substrate, and a processing apparatus that holds the substrate holder system. At least one of the substrate holder system and the processing apparatus includes a dust flow inhibiting mechanism that inhibits flow of dust into a region sandwiching the first substrate and the second substrate.
IN1482DEN2012 2009-07-21 2010-07-21 IN2012DN01482A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009170513 2009-07-21
JP2009253440 2009-11-04
JP2009253439 2009-11-04
JP2010023510 2010-02-04
PCT/JP2010/004675 WO2011010460A1 (en) 2009-07-21 2010-07-21 Substrate processing system, substrate holder, substrate holder pair, substrate joining apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
IN2012DN01482A true IN2012DN01482A (en) 2015-06-05

Family

ID=43498942

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1482DEN2012 IN2012DN01482A (en) 2009-07-21 2010-07-21

Country Status (8)

Country Link
US (1) US20120214290A1 (en)
EP (1) EP2458629B1 (en)
JP (1) JP5686097B2 (en)
KR (1) KR101746241B1 (en)
CN (1) CN102576689B (en)
IN (1) IN2012DN01482A (en)
TW (1) TWI593048B (en)
WO (1) WO2011010460A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5485958B2 (en) * 2011-09-16 2014-05-07 東京エレクトロン株式会社 Joining method, program, computer storage medium, joining apparatus and joining system
US10115862B2 (en) 2011-12-27 2018-10-30 eLux Inc. Fluidic assembly top-contact LED disk
JP5521066B1 (en) * 2013-01-25 2014-06-11 東京エレクトロン株式会社 Joining apparatus and joining system
US9921490B2 (en) * 2013-10-30 2018-03-20 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
CN104733366B (en) * 2015-03-27 2017-07-25 北京七星华创电子股份有限公司 A kind of support feet
US20180130705A1 (en) * 2016-11-07 2018-05-10 Corning Incorporated Delayed Via Formation in Electronic Devices
CN107146768B (en) * 2017-06-16 2018-03-23 英特尔产品（成都）有限公司 For laying the device and alignment device of article
KR20200134708A (en) 2019-05-23 2020-12-02 삼성전자주식회사 Wafer bonding apparatus
CN116995024A (en) * 2022-04-26 2023-11-03 重庆康佳光电科技有限公司 Wafer picking and placing device, etching equipment and wafer picking method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JPH0359189U (en) * 1989-10-11 1991-06-11
JPH05217973A (en) * 1992-02-06 1993-08-27 Nippon Steel Corp Semiconductor substrate adhering device
JP3191139B2 (en) * 1994-12-14 2001-07-23 株式会社日立製作所 Sample holding device
JP3137080B2 (en) * 1998-06-24 2001-02-19 日本電気株式会社 Reticle storage container
JP2000091247A (en) * 1998-09-14 2000-03-31 Tokyo Electron Ltd Plasma processing device
JP2003273187A (en) * 2002-03-12 2003-09-26 Matsushita Electric Ind Co Ltd Method and equipment for transferring thin plate material
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
JP2006344613A (en) * 2003-06-24 2006-12-21 Shin-Etsu Engineering Co Ltd Substrate sticking apparatus
JP2005032553A (en) * 2003-07-14 2005-02-03 Renesas Technology Corp Ic socket and inspection method of semiconductor device
JP2005203645A (en) * 2004-01-19 2005-07-28 Nitto Denko Corp Substrate laminating method and substrate laminating apparatus
JP4107316B2 (en) * 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー Board bonding equipment
TWI471971B (en) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method

Also Published As

Publication number Publication date
CN102576689A (en) 2012-07-11
KR20120048640A (en) 2012-05-15
WO2011010460A1 (en) 2011-01-27
US20120214290A1 (en) 2012-08-23
EP2458629A1 (en) 2012-05-30
JP5686097B2 (en) 2015-03-18
KR101746241B1 (en) 2017-06-12
JPWO2011010460A1 (en) 2012-12-27
EP2458629A4 (en) 2017-04-12
TWI593048B (en) 2017-07-21
TW201126639A (en) 2011-08-01
EP2458629B1 (en) 2019-05-15
CN102576689B (en) 2015-06-03

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