JPH05217973A - Semiconductor substrate adhering device - Google Patents

Abstract

PURPOSE:To not generate an air bubble without adhering a moisture, dust, or the like to between two sheets of semiconductor substrates by a method wherein a device for manufacturing a multilayer device is received in a container and the inside thereof is held in an inactive gas atmosphere condition. CONSTITUTION:Respective mechanisms such as adhesive members 11, 12, supporting members 17, 18, or the like are received in a chamber 3. The chamber 3 is provided with a pump 4 so that the entire inside of the chamber 3 can be made in an inactive gas atmosphere condition. The pump 4 is provided with a gas generator 5 for generating inactive gas. The inactive gas derived from the gas generator 5 is supplied into the chamber 3 by the pump 4. Thus, it is possible to prevent a generation of an air bubble, an adhesion of a moisture, dust, or the like, and a generation of an incompletely adhering part in a normal pressure between the two semiconductor substrates.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate attaching apparatus for attaching two semiconductor substrates to each other when manufacturing a multilayer device.

[0002]

2. Description of the Related Art Multilayer devices such as SOI (Silicon O
As one of methods for manufacturing a semiconductor laminated substrate having an n insulator structure or the like, there is a method of bonding two semiconductor substrates to each other. When two semiconductor substrates made of mirror-polished silicon or the like are brought into contact with each other under polished conditions, a strong semiconductor laminated substrate, that is, a so-called multilayer device is obtained. In this method, since it is not necessary to interpose a different substance such as an adhesive between the semiconductor substrates, the subsequent high temperature treatment and various chemical treatments can be performed in the same manner as one semiconductor substrate. Further, in this method, both semiconductor substrates having various impurity temperatures, thicknesses, diffusion layers, etc. can be directly bonded at a relatively low temperature to form a single semiconductor substrate, which is not possible by an epitaxial growth method or the like. The device structure which was As a device for bonding two semiconductor substrates for that purpose, Japanese Patent Application No. 2-26448 is used.
As described in No. 9, a technique has been proposed in which both semiconductor substrates are aligned and brought into contact with each other from the center of both semiconductor substrates.

[0003]

However, in the method of manufacturing a multi-layer device by bonding two semiconductor substrates to each other as described above, even if the semiconductor devices are manufactured in a clean atmosphere, the bonding of the two semiconductor substrates is not performed. There is a problem that moisture, dust, or the like is attached to the mating surfaces, or bubbles are generated, so that the adhesion between the two semiconductor substrates is deteriorated and the yield and reliability of the multilayer device are deteriorated. ..

Therefore, the present invention provides a semiconductor substrate sticking apparatus capable of sticking both semiconductor substrates with good adhesion without adhering moisture or dust between the two semiconductor substrates and without generating bubbles. The purpose is to provide.

[0005]

In order to solve the above problems, a semiconductor substrate attaching apparatus according to the present invention is an apparatus for producing a multi-layer device in which two semiconductor substrates are attached, and the apparatus is housed. And a means for maintaining the inside of the container in an inert gas atmosphere. The semiconductor substrate sticking device is a pair of sticking members each having a pair of sticking surfaces for holding two semiconductor substrates, and one sticking surface is deformable into a convex curved surface and a flat surface and the other sticking surface is A pair of sticking members whose sticking surfaces are deformable or fixed to a convex curved surface and a flat surface, and at least one of the pair of sticking members are moved to be held on each of the sticking surfaces. A driving means for bringing the centers of the two semiconductor substrates into contact with each other, and a deformation imparting means for deforming a deformable attaching surface of the attaching surfaces holding the semiconductor substrates, respectively, from a convex curved surface to a flat surface. It is desirable to have more. Further, the semiconductor substrate sticking device is a pair of sticking members each having a pair of sticking surfaces for holding two semiconductor substrates, wherein one sticking surface is deformable into a convex curved surface and a flat surface and the other sticking surface is A pair of sticking members whose sticking surfaces are deformable or fixed to a convex curved surface and a flat surface, and a mark which is provided in advance on both the semiconductor substrates held on the sticking surfaces, respectively. Detecting means for detecting, storage means for storing the position of each mark of the both semiconductor substrates detected by the detecting means, and at least one of the pair of sticking members are moved and held on both sticking surfaces respectively. The driving means for adjusting the relative positions of the two semiconductor substrates to bring the substantially central portions of the semiconductor substrates into contact with each other, and the position data of each mark of the two semiconductor substrates stored by the storage means. Control means for controlling the driving means to align the two semiconductor substrates, and deformation for deforming a deformable sticking surface from a convex curved surface to a flat surface of the sticking surfaces holding the both semiconductor substrates respectively. It is desirable that the device further includes an applying unit. Further, it is preferable that the sticking member having the deformable sticking surface is formed of a shape memory alloy, and the deformation giving means is constituted by a heating means. Further, it is preferable that the sticking member having the deformable sticking surface is formed of an elastic body, and the deformation applying means is constituted by a pressure bonding means.

[0006]

According to the semiconductor substrate attaching apparatus of the present invention configured as described above, it is an apparatus for producing a multi-layer device in which two semiconductor substrates are attached to each other, and a container for accommodating the device and the container. Since the inside of the container is kept in an inert gas atmosphere, the inside of the container is dried with N ₂ or He, for example.
It is possible to bond two semiconductor substrates by holding them in an inert gas atmosphere, such as air bubbles at normal pressure between the two semiconductor substrates, adhesion of moisture or dust, and incomplete bonding. It is possible to prevent the occurrence of, and it is possible to bond with good adhesion. Therefore, it is possible to increase the yield and increase the reliability of the multilayer device manufactured by bonding two semiconductor substrates together. Further, according to the semiconductor substrate sticking apparatus configured as described above, before sticking, at least one sticking surface of the pair of sticking members has a convex curved surface, and these sticking surfaces hold two semiconductor substrates respectively. When the driving means causes the centers of both semiconductor substrates to come into contact with each other and the attaching surface is deformed from the convex curved surface to the flat surface by the deformation imparting means, both semiconductor substrates gradually adhere to each other from the center to the outer peripheral portion. And on top of that
Since the container for accommodating the apparatus and the means for maintaining the inside of the container in an inert gas atmosphere are provided, it is possible to maintain the inside of the container in an inert gas atmosphere of, for example, dry N ₂ or He. Since it is possible to bond two semiconductor substrates, it is possible to prevent air bubbles under normal pressure between both semiconductor substrates, adhesion of moisture and dust, and incomplete bonding to prevent the bonding. Can be matched. Therefore, it is possible to increase the yield and increase the reliability of the multilayer device manufactured by bonding two semiconductor substrates together. Further, according to the semiconductor sticking apparatus configured as described above, the position of each mark on both semiconductor substrates detected by the detection unit is stored by the storage unit, and the position data of each mark stored in this storage unit is stored. Based on this, the drive means is controlled by the control means, whereby the positioning of the two semiconductor substrates is performed very accurately before the two semiconductor substrates are brought into close contact with each other by the pair of sticking members, and further, a container capable of housing the device is provided. Since the inside of the container is provided with an inert gas atmosphere, the inside of the container is kept in an inert gas atmosphere such as dry N ₂ or He,
Two semiconductor substrates can be bonded to each other, and it is possible to prevent air bubbles from being generated between the two semiconductor substrates under normal pressure, adhesion of moisture and dust, and an incompletely bonded portion, which results in good adhesion. It can be pasted. Therefore, 2
It is possible to increase the yield and reliability of a multilayer device manufactured by bonding a plurality of semiconductor substrates together.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the semiconductor substrate sticking apparatus according to the present invention will be described below with reference to FIGS. FIG. 1 and FIG. 2 show before and during contact of two semiconductor substrates 1 and 2 by a pair of adhesive members 11 and 12, respectively. 3 to 6 are front views of the entire semiconductor substrate attaching apparatus when aligning the two semiconductor substrates 1 and 2. Further, FIG. 7 is a plan view of the semiconductor substrates 1 and 2, and FIG. 8 is a block diagram showing a configuration of an alignment control system.

As shown in FIG. 1, the semiconductor substrate sticking apparatus of this embodiment is provided with a pair of sticking members 11 and 12.
These pasting members 11 and 12 have the same structure and are arranged to face each other. The pasting members 11 and 12 are made of a shape memory alloy in a disk shape, and their front surfaces serve as pasting surfaces 13 and 14 for holding both the semiconductor substrates 1 and 2. The outer diameters of the adhesive members 11 and 12 are about 10 mm larger than the outer diameters of the semiconductor substrates 1 and 2.

As shown in FIG. 1, before the two semiconductor substrates 1 and 2 are brought into close contact with each other, the sticking member 11, under normal temperature of the environment in which this semiconductor substrate sticking apparatus is used.
12 is deformed so that the attaching surfaces 13 and 14 have convex curved surfaces. Although these convex curved surfaces are ideally spherical surfaces, they are cylindrical surfaces in this embodiment. It should be noted that the curvature is exaggerated in the drawings, and actually the attachment surfaces 13 and 14 are
The difference in height between the central portion and the outer peripheral portion is about 2 to 3 mm.

Further, as shown in FIG. 2, when the two semiconductor substrates 1 and 2 are in close contact with each other, the shape memory alloy sticking member 1 is used.
The restored shapes stored in Nos. 1 and 12 are the sticking surface 1 of them.
The shapes of 3 and 14 are flat surfaces.

It should be noted that suction holes 15 and 16 for vacuum suction are provided in the sticking members 11 and 12, and they are opened in the sticking surfaces 13 and 14. And the pasting member 11,
12 is a support member 17, so as not to hinder its deformation.
It is supported by 18. Also, the sticking members 11, 1
Heaters 19 and 20 as heating means are attached to the support members 17 and 18 on the back surface side of 2.

Then, as shown in FIGS. 3 to 6, the supporting members 17 and 18 are horizontally attached to the driving means 21 and 22, respectively. The supporting members 17 and 18 can be freely moved in the left-right a direction, the up-down b direction, and the front-rear direction (the direction perpendicular to the plane of the drawing is not shown) by these drive means 21 and 22, respectively, and further in the horizontal plane. It is configured to be rotatable in the c direction.

Further, each mechanism such as the attaching members 11, 12 and the supporting members 17, 18 is housed in the chamber 3. This chamber 3 has this chamber 3
As shown in the figure, a pump 4 for bringing the entire interior into an inert gas atmosphere is provided. Further, the pump 4 is equipped with a gas generator 5 for generating an inert gas such as dry N ₂ or He.
By this, the inert gas from the gas generator 5 is supplied into the chamber 3. Therefore, the inside of the chamber 3 can always be kept in an atmosphere of an inert gas such as dry N ₂ or He, and the bonding of the two semiconductor substrates 1 and 2 can be performed always with a dry N ₂ or He or the like. It can be performed under an active gas atmosphere.

As described above, in the semiconductor substrate sticking apparatus of this embodiment, the above-mentioned mechanisms are housed in the chamber 3 provided with the pump 4 and the gas generator 5, so that the inside of the chamber 3 is always dried with N _2. It can be maintained in an inert gas atmosphere such as He and He. Therefore, the two semiconductor substrates 1 and ₂ can be bonded to each other in an atmosphere of an inert gas such as dry N ₂ or He, so that bubbles are generated between the semiconductor substrates 1 and 2 and moisture, dust, etc. Adhesion can be prevented.

Next, the operation of the semiconductor substrate sticking apparatus configured as described above will be described. First, as shown in FIG. 1, the adhesive member 11,
12 is deformed together, and the pasting surfaces 13 and 14 thereof are convex curved surfaces. The deformation is caused by incorporating the deforming drive unit inside the support members 17 and 18, or the pasting members 11 and 18.
It can be performed by pressing 12 onto a deformation mold. Adhesive surfaces 13 and 14 of the deformed adhesive members 11 and 12
The semiconductor substrates 1 and 2 are placed on the substrate 1 and held by vacuum suction by the suction holes 15 and 16. As a result, the semiconductor substrates 1 and 2 are deformed into a convex shape along the attachment surfaces 13 and 14. Here, the inside of the chamber 3 is maintained in a dry inert gas atmosphere of N ₂ or He by the pump 4 and the gas generator 5.

After the semiconductor substrates 1 and 2 to be described later are aligned with each other, the attaching members 11 and 12 are moved by the driving means 21 and 22 and approached. When the centers of the semiconductor substrates 1 and 2 come into contact with each other, the movement of the attaching members 11 and 12 is stopped. Then, the attachment member 1 is heated by the heaters 19 and 20.
When 1 and 12 are heated and reach a specific temperature, as shown in FIG. 2, the attaching members 11 and 12 are restored and deformed so that the attached shapes, that is, the attaching surfaces 13 and 14 are flat surfaces.

As described above, by deforming the sticking surfaces 13 and 14 of the sticking members 11 and 12 from the convex curved surface to the flat surface, the two semiconductor substrates 1 and 2 are brought into close contact with each other, and the sticking surface 1
Adhesion is completed when 3 and 14 are completely flat.

According to this adhesion operation, dry N ₂ and H
In an atmosphere of an inert gas such as e, the two semiconductor substrates 1 and 2 are gradually brought into close contact with each other as the attaching surfaces 13 and 14 are deformed. No air bubbles are trapped in the air. Further, since a pressing force is applied to the entire semiconductor substrates 1 and 2 at the time of contact, an incomplete bonding portion may occur between the semiconductor substrates 1 and 2, or the semiconductor substrates 1 and 2 may be separated from the outer peripheral portion. There is nothing to do. Furthermore, since lateral force does not act on both semiconductor substrates 1 and 2, both semiconductor substrates 1 and 2 do not laterally shift relative to each other.

Since the above-described operation is performed by the pump 4 and the gas generator 5 in the chamber 3 which is always in an atmosphere of an inert gas such as dry N ₂ or He, the two semiconductor substrates 1 When the two are bonded together, it is possible to prevent the generation of bubbles and the adhesion of water and dust between the semiconductor substrates 1 and 2, and it is possible to bond the semiconductor substrates with extremely good adhesion.

Next, the alignment of the two semiconductor substrates 1 and 2 will be described with reference to FIGS. 3 to 8. First, as shown in FIGS. 3 to 6, a mounting member 30 formed of a rigid body is arranged near the bonding position, and a pair of cameras 31 and 32 are provided at both upper and lower ends of the mounting member 30. It is installed facing each other. These cameras 31, 32
Can use a CCD camera, for example. As shown in FIG. 3, the camera 31 captures an image of the semiconductor substrate 2 held on the attachment surface 14, and as shown in FIG.
Takes an image of the semiconductor substrate 1 held on the attachment surface 13.

Further, as shown in FIG. 7, two marks P and Q for alignment are provided in advance on the bonding surfaces of the semiconductor substrates 1 and 2. Incidentally, these marks P and Q
May use a mark such as a semiconductor substrate exposure by a stepper (reduction projection exposure apparatus).

Further, as shown in FIG.
The image signal from 32 is input to the control unit 40, transmitted from the control unit 40 to the storage unit 41, and stored in different storage areas of the storage unit 41. Here, the storage unit 41 can use, for example, an image memory. Then, the control unit 40 compares the position data of the marks P and Q of the two semiconductor substrates 1 and 2 stored in the storage unit 41, respectively, and sends a control signal to the driving means 21 and 22 based on this.

Next, the operation of the semiconductor substrate sticking apparatus configured as described above will be described. First, as shown in FIG.
At the time of aligning the semiconductor substrate 2, the attaching member 11 and the semiconductor substrate 1 are retracted by the driving unit 21, the semiconductor substrate 2 is imaged by the camera 31, and the image is stored in the storage unit 41.

Further, as shown in FIG. 4, when aligning the semiconductor substrate 1, the sticking member 1 is driven by the driving means 22.
2 and the semiconductor substrate 2 are evacuated, and by the camera 32,
The semiconductor substrate 1 is imaged and the image is stored in the storage unit 41.

Then, the control unit 40 compares the position data of the marks P and Q of the semiconductor substrate 1 stored in the storage unit 41 with the position data of the marks P and Q of the semiconductor substrate 2, and based on the position data. And sends a control signal to the driving means 21 and 22. As a result, as shown in FIG.
The bonding members 11 and 12 are moved by 22 and the two semiconductor substrates 1 and 2 are aligned in an atmosphere of an inert gas such as dry N ₂ or He.

In this way, the marks P on both semiconductor substrates 1 and 2 are
Since it is based on the position data of Q, both semiconductor substrates 1,
The positioning of the two can be performed extremely accurately, thereby preventing the generation of defective products. Also,
Based on the position data, it is also possible to perform position adjustment so that the positions of the marks P and Q on both the semiconductor substrates 1 and 2 are separated by a predetermined distance. In this case, the distance numerical value may be input to the control unit 40 from the outside. Furthermore, the sticking surface 1
The lateral deviation error between the two semiconductor substrates 1 and 2 on Nos. 3 and 14 appears as position data, and the mounting error of the cameras 31 and 32 may be input in advance as position data. Therefore, based on the position data, those errors are absorbed. can do.
Since the sticking members 11 and 12 are rotatable in the direction of arrow c in the horizontal plane and the two marks P and Q are provided on both semiconductor substrates 1 and 2, the semiconductor substrates 1 and 2 are rotated in the horizontal plane. Alignment can also be done.

After the alignment as described above, as shown in FIG. 6, the attaching members 11, 1 are driven by the driving means 21, 22.
2 are brought close to each other to bring both semiconductor substrates 1 and 2 into contact with each other.
Then, as described above with reference to FIG. 2, the two semiconductor substrates 1 and 2 are brought into close contact with each other.

Although one embodiment of the present invention has been described above, the present invention is not limited to the embodiment, and various effective modifications can be made based on the technical idea of the present invention.
For example, in the embodiment, both attachment surfaces are configured to be deformable into a convex curved surface and a flat surface, but one of them may be a fixed flat surface. Further, in the embodiment, the pair of driving means for moving the pair of sticking members respectively is provided, but the driving means may move one of the sticking members.

When the pasting member is formed of a shape memory alloy, the heating means as the deformation imparting means is not limited to the heater of the embodiment, but may be the entire heating by a heating chamber or the like.
Further, it is possible to adopt a configuration in which the attaching member is formed of an elastic body that is elastically deformable, and the attaching surface is deformed into a convex curved surface and a flat surface. In this case, crimping means is used as the deformation imparting means.

In the embodiment of the present invention, the pump and the gas generator are used to bring the inside of the container accommodating the device into the inert gas atmosphere, but the present invention is not limited to this, and the device is not limited thereto. A container that can be stored, that is, a so-called chamber is in an inert gas atmosphere state, and a means for maintaining the inert gas atmosphere state may be provided. As the inert gas, various effective inert gases other than dry N ₂ and He can be used.

[0031]

As described above, according to the present invention, 2
An apparatus for manufacturing a multi-layered device in which a plurality of semiconductor substrates are bonded together, comprising a container for housing the device and means for holding the container in an inert gas atmosphere,
It is possible to bond two semiconductor substrates by holding the inside of the container in an atmosphere of an inert gas such as dry N ₂ or He, and to generate air bubbles between both semiconductor substrates under normal pressure, moisture and dust. It is possible to prevent adhesion such as adhesion and the generation of incompletely bonded parts, and to bond them with good adhesiveness, and to align two semiconductor substrates from the central part to the outer peripheral part with high accuracy and extremely. It can be attached with good adhesion. Therefore, it is possible to increase the yield and increase the reliability of the multilayer device manufactured by bonding two semiconductor substrates together.

[Brief description of drawings]

FIG. 1 is an enlarged front view of a pair of pasting members before adhering a semiconductor substrate in an embodiment of a semiconductor substrate pasting apparatus according to the present invention.

FIG. 2 is an enlarged front view of a pair of pasting members when the semiconductor substrate is in close contact in the above embodiment.

FIG. 3 is a front view of the entire device showing the operation of the driving means when aligning the semiconductor substrate in one embodiment of the semiconductor substrate attaching device according to the present invention.

FIG. 4 is a front view of the entire apparatus showing the operation of the driving means when aligning the semiconductor substrate in the above embodiment.

FIG. 5 is a front view of the entire apparatus showing the operation of the driving means when aligning the semiconductor substrate in the above embodiment.

FIG. 6 is a front view of the entire apparatus showing the operation of the driving means when aligning the semiconductor substrate in the above embodiment.

FIG. 7 is a plan view of a semiconductor substrate used in an example.

FIG. 8 is a block diagram showing a configuration of a positioning control system in the embodiment.

[Explanation of symbols]

 1, 2 Semiconductor Substrate 3 Chamber 4 Pump 5 Gas Generation Device 11, 12 Sticking Member 13, 14 Sticking Surface 15, 16 Suction Hole 17, 18 Supporting Member 19, 20 Heater 21, 22 Driving Means 30 Mounting Material 31, 32 Camera 40 Control unit 41 Storage unit P, Q mark

Claims (5)

[Claims] 1. An apparatus for manufacturing a multi-layer device in which two semiconductor substrates are bonded together, comprising a container for housing the device and means for maintaining the inside of the container in an inert gas atmosphere. A semiconductor substrate sticking device characterized by: 2. A pair of sticking members each having a pair of sticking surfaces for holding two semiconductor substrates, wherein one sticking surface is deformable into a convex curved surface and a flat surface, and the other sticking surface. Is a pair of sticking members composed of a flat surface that is deformable or fixed to a convex curved surface and a flat surface, and at least one of the pair of sticking members is moved,
Driving means for contacting the substantially central portions of the two semiconductor substrates held on the both attaching surfaces with each other, and a deformable attaching surface of the attaching surfaces for holding the both semiconductor substrates from a convex curved surface to a flat surface. The semiconductor substrate sticking apparatus according to claim 1, further comprising a deformation imparting means for deforming the semiconductor substrate. 3. A pair of sticking members having a pair of sticking surfaces for respectively holding two semiconductor substrates, wherein one sticking surface is deformable into a convex curved surface and a flat surface, and the other sticking surface. Detects a pair of sticking members composed of a flat surface that is deformable or fixed to a convex curved surface and a flat surface, and marks provided in advance on the semiconductor substrates held on the sticking surfaces. Detecting means, storage means for storing the position of each mark of the both semiconductor substrates detected by the detecting means, and at least one of the pair of sticking members are moved, and each of the sticking surfaces is held by the sticking surface. Drive means for adjusting the relative positions of the two semiconductor substrates so that the centers of the semiconductor substrates come into contact with each other, and the drive means is controlled based on the position data of each mark of the two semiconductor substrates stored by the storage means. Then, a control means for aligning the both semiconductor substrates, and a deformation imparting means for deforming a deformable sticking surface of the sticking surfaces holding the both semiconductor substrates from a convex curved surface to a flat surface, The semiconductor substrate sticking apparatus according to claim 1, further comprising: 4. The semiconductor substrate attachment according to claim 2 or 3, wherein the attachment member having the deformable attachment surface is formed of a shape memory alloy, and the deformation imparting means is constituted by a heating means. apparatus. 5. The semiconductor substrate sticking apparatus according to claim 2, wherein the sticking member having the deformable sticking surface is formed of an elastic body, and the deformation imparting means is constituted by a pressure bonding means. ..