JP2005032553A - Ic socket and inspection method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket capable of preventing short-circuiting between the leads by installing a recessed part in a plate into which a contact pin is inserted, and to provide an inspection method of a semiconductor device. <P>SOLUTION: The IC socket is equipped with a pin alignment plate 6 fit on a socket body which is a part of a base part, through which the contact pin 1 connecting an electrode on a board and an IC lead 13 of an IC frame acting as a semiconductor element is inserted, and the recessed part 16 acting as a recovery part of conductive foreign matters 17 installed in the pin alignment plate 6 positioned in the surroundings of the contact pin 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC (Integrated Circuit) socket and a semiconductor device inspection method, and more particularly, to an IC socket and a semiconductor device inspection method for connecting a semiconductor element having a plurality of leads to a circuit board.
[0002]
[Prior art]
Examples of conventional IC socket and semiconductor device inspection means include those described in Japanese Utility Model Laid-Open No. 6-75689 (conventional example 1) and Japanese Patent Laid-Open No. 7-114960 (conventional example 2).
[0003]
In Conventional Example 1, an insulating separator configured by a convex shape for entering between the leads of the IC and electrically and mechanically separating the leads is provided, and each contact of the IC socket is accommodated by this insulating separator. An IC test lead press having a structure that guides toward the lead of the IC is disclosed.
[0004]
In the conventional example 2, a dust discharge duct for dropping dust generated from the lead or the IC package main body is provided in an IC socket main body having a contact that makes pressure contact with the lead of the IC package, and the upper end of the dust discharge duct is An IC socket having dust discharging means arranged so as to open at the lower portion of the lead existing portion is disclosed.
[0005]
[Patent Document 1]
Japanese Utility Model Publication No. 6-75689 [0006]
[Patent Document 2]
Japanese Patent Laid-Open No. 7-114960
[Problems to be solved by the invention]
However, the above-described IC socket has the following problems.
[0008]
When the semiconductor device is attached to the IC socket, the semiconductor device is attached onto a plate having a planar shape attached to the base portion. At this time, conductive foreign matter or the like adhering to the IC lead adheres to the plate.
[0009]
Here, in order to bring the IC lead into contact with the contact pin, if it is pressed against a flat base or plate, foreign matter sandwiched between the lead and the plate spreads and extends across a plurality of leads. Will exist. As a result, a plurality of leads are short-circuited. For example, in an IC socket for inspection, the defect determination increases and the inspection yield decreases. In addition, in the IC socket for mounting, this short circuit directly causes a failure of the device.
[0010]
On the other hand, the insulating separator in Conventional Example 1 is for guiding each contact of the IC socket toward the corresponding IC lead, and no means for collecting foreign matter is disclosed.
[0011]
Further, regarding the prior art 2, the idea of providing a recess in the plate around the contact pin to collect foreign matter is not disclosed, which is different from the present invention.
[0012]
The present invention has been made in view of the above problems, and an object of the present invention is to provide an IC socket capable of preventing a short circuit between leads by providing a recess in a plate through which a contact pin is inserted. An object of the present invention is to provide a semiconductor device inspection method.
[0013]
[Means for Solving the Problems]
An IC socket according to the present invention includes a base portion having a through hole for receiving a contact pin for connecting an electrode on a substrate and a lead of a semiconductor element, a plate attached to the base portion and through which the contact pin is inserted, and a contact pin And a concave dust collecting portion provided on a plate located around the periphery of the plate.
[0014]
A method for inspecting a semiconductor device according to the present invention includes a plate in which a contact pin is inserted on a base portion of an IC socket in which a contact pin reaching an electrode on a substrate is inserted, and a recess is formed around the insertion portion of the contact pin. And mounting the semiconductor device on the plate, and pressing the lead of the semiconductor device toward the contact pin to connect the electrode and the lead while introducing dust into the recess.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of an IC socket and semiconductor device inspection method according to the present invention will be described below with reference to FIGS.
[0016]
FIG. 1 is a plan view of an IC frame. 2 is a cross-sectional view taken along the line II in FIG. The IC frame 11 includes an IC package 12 and an IC lead 13 as shown in FIGS. Here, the frame 11 can be attached to the IC socket by fitting the positioning hole 14 (round hole and long hole) into a positioning pin of the IC socket described later.
[0017]
FIG. 3 is a cross-sectional view showing a state in which the IC socket according to the present embodiment is arranged on a circuit board. 4 is a cross-sectional view showing a state in which the IC frame is pressed against the IC socket shown in FIG.
[0018]
In general, an IC socket is used not only for a final inspection process of a semiconductor device but also for mounting.
[0019]
As shown in FIGS. 3 and 4, the IC socket according to the present embodiment has a through hole that receives the contact pin 1 that connects the electrode 9 </ b> A on the board substrate 9 and the IC lead 13 of the IC frame 11 as a semiconductor element. And a pin alignment plate 6 as a plate that is attached to the socket body 2 and through which the contact pins 1 are inserted.
[0020]
A pin presser 3 is installed on the socket body 2 to fix the contact pin 1. Further, as described above, the frame is positioned by passing the frame positioning pins 5 through the positioning holes 14 provided in the IC frame 11. The socket body 2 and the board substrate 9 are aligned using the board positioning pins 4 and fixed using the mounting screws 10. As a result, the contact pin 1 and the electrode 9A are connected.
[0021]
Here, the pin alignment plate 6 plays a role as a template by inserting the contact pins 1 to align the positions of the tips of the pins to prevent displacement.
[0022]
Actually, when the IC lead 13 is pressed against the contact pin 1, as shown in FIG. 4, the IC pressing cover 7 is closed, and the state where the cover 7 is closed is held by the latch 8. As a result, the contact pin 1 and the IC lead 13 come into contact with each other, and the IC lead 13 and the electrode 9A are connected via the pin.
[0023]
In the conventional IC socket, the pin alignment plate 6 has a planar shape, and when the IC lead 13 is pressed against the contact pin 1, conductive foreign matter (dust) existing between the lead 13 and the alignment plate 6. However, it will be in the state of being sandwiched between both (sandwiched state). As a result, dust spreads to the area including the adjacent contact pins, causing a short circuit.
[0024]
When the contact pin is short-circuited, for example, when the IC socket is an IC socket for inspection of the IC frame 11, even if no short-circuit defect has actually occurred in the IC frame 11, an erroneous short-circuit Defect determination is made, and as a result, the test yield decreases. Further, for example, in the case of an IC socket for mounting, the short circuit directly causes a device failure.
[0025]
On the other hand, the IC socket according to the present embodiment is provided with a recess 16 as a dust collecting portion in the pin alignment plate 6 positioned around the contact pin 1.
[0026]
FIG. 5 is an enlarged cross-sectional view showing the pressing portion of the lead 13 in FIGS. 3 and 4.
[0027]
6, FIG. 7, and FIG. 8 are views showing the II-II section, the III-III section, and the IV-IV section in FIG. 5, respectively.
[0028]
As shown in FIGS. 5 to 8, the recess 16 is formed by providing a first protrusion on the outer peripheral portion of the through hole of the contact pin 1 and a second protrusion at a position away from the position by a certain distance. It is a groove. The second protrusion includes a protrusion plate 15 as a protrusion that protrudes larger than the first protrusion. In addition, the broken line in FIG. 8 has shown the boundary part of the flat part of a plate, and the 1st and 2nd protrusion.
[0029]
FIG. 9 is a diagram showing a state where the IC lead 13 is pressed against the contact pin 1 in the pressing portion shown in FIG.
[0030]
In the IC socket according to the present embodiment, by adopting the above-described structure, the IC lead 13 is attached to the contact pin 1 while collecting the conductive foreign matter 17 (dust) in the recess 16 as shown in FIG. Can be pressed. As a result, the conductive foreign material 17 is collected in the recess 16 and does not reach the adjacent contact pin 1. Therefore, short-circuiting of the contact pin 1 can be prevented, and as described above, it is possible to suppress a decrease in inspection yield and a device defect.
[0031]
Further, in the conventional IC socket for inspection, the above short circuit problem due to the conductive foreign matter has been dealt with by frequently cleaning the socket. However, in the IC socket according to the present embodiment, the The number of cleanings and the amount of work per operation can be reduced. As a result, the product cost can be reduced.
[0032]
Here, the height of the protrusion plate 15 is preferably larger than the protruding amount of the contact pin 1 from the pin alignment plate 6.
[0033]
As a result, the IC lead 13 first comes into contact with the protruding plate 15. Accordingly, since the IC lead 13 near the protrusion plate 15 is pressed more strongly, the conductive foreign matter 17 adhering to the contact pin 1 or the like is more reliably transferred to the recess 16 between the pin 1 and the plate 15. Can lead to.
[0034]
FIG. 10 is a plan view showing the arrangement of the contact pins 1 and the protruding plates 15.
[0035]
As shown in FIG. 10, the protruding plates 15 are preferably arranged alternately (staggered arrangement) on one side of the contact pins 1.
[0036]
As a result, the space extending on both sides of the recess 16 (in FIG. 10, the left and right sides of the projection plate 15) can be expanded while the foreign material 17 is guided to the recess 16 by the projection plate 15. The probability that the introduced foreign matter reaches the adjacent contact pin 1 can be reduced.
[0037]
Moreover, it is preferable that the pressing member 7A (pressing means) of the IC presser lid 7 has a cutout portion 7B in a region on the side not having the protruding plate 15.
[0038]
Thereby, the IC lead 13 on the side having the protruding plate 15 can be strongly pressed, so that the foreign matter 17 can be more reliably guided to the concave portion 16 between the contact pin 1 and the plate 15.
[0039]
In the present embodiment, the above-described method for inspecting an IC frame (semiconductor device) (or a method for mounting an IC socket on the frame) is summarized as follows. That is, in the inspection method (or mounting method), the contact pin 1 is inserted on the socket body 2 of the IC socket through which the contact pin 1 reaching the electrode 9A on the board substrate 9 is inserted, and the contact pin 1 is inserted. A pin aligning plate 6 having a recess 16 around the periphery of the portion, a step of attaching the IC frame 11 on the aligning plate 6 (FIG. 3), and pressing the IC lead 13 of the IC frame 11 toward the contact pin 1 And a step (FIGS. 4 and 9) for connecting the electrode 9A and the IC lead 13 while introducing dust into the recess 16.
[0040]
Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
[0041]
【The invention's effect】
According to the present invention, it is possible to prevent foreign matters from adhering to the electrodes of the semiconductor element, and thus it is possible to prevent short-circuit defects in the IC socket.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC frame.
FIG. 2 is a cross-sectional view taken along the line II in FIG.
FIG. 3 is a cross-sectional view showing a state in which an IC socket according to one embodiment of the present invention is arranged on a circuit board.
4 is a cross-sectional view showing a state in which an IC frame is pressed against the IC socket shown in FIG. 3;
5 is an enlarged cross-sectional view showing a pressing portion of the lead in FIGS. 3 and 4. FIG.
6 is a cross-sectional view taken along the line II-II in FIG.
7 is a cross-sectional view taken along line III-III in FIG.
8 is a cross-sectional view taken along the line IV-IV in FIG.
9 is a cross-sectional view showing a state in which the foreign matter is collected in the recess while pressing the IC frame against the IC socket in the pressing portion shown in FIG.
FIG. 10 is a plan view showing the arrangement of contact pins and protrusions of an IC socket according to one embodiment of the present invention.
[Explanation of symbols]
1 Contact pin, 2 Socket body, 3 Pin presser, 4 Board positioning pin, 5 Frame positioning pin, 6 Pin alignment plate, 7 IC presser cover, 7A Press member, 7B Notch, 8 Latch, 9 Board substrate, 9A Electrode 10 mounting screws, 11 IC frame, 12 IC package, 13 IC lead, 14 positioning hole, 15 protrusion plate, 16 recess (groove), 17 conductive foreign matter.

Claims (5)

A base portion having a through hole for receiving a contact pin connecting an electrode on a substrate and a lead of a semiconductor element;
A plate attached to the base portion and through which the contact pin is inserted;
An IC socket including a concave dust collecting portion provided on the plate located around the contact pin. Forming the dust collecting part by providing a protrusion on the plate;
The IC socket according to claim 1, wherein a height of the protruding portion is larger than a protruding amount of the contact pin from the plate. A plurality of the contact pins;
The IC socket according to claim 1 or 2, wherein the dust collecting portions are alternately arranged on one side of the contact pin. The IC socket further includes a pressing unit that extends on the plurality of contact pins and presses the lead electrode toward the contact pins.
The IC socket according to claim 3, wherein the pressing means has a notch in a region on the side not having the protrusion. The contact pin is inserted on the base portion of the IC socket through which the contact pin reaching the electrode on the substrate is inserted, and a plate having a recess is provided around the insertion portion of the contact pin, and the semiconductor device is provided on the plate Attaching the step,
A method of inspecting a semiconductor device, comprising: pressing the lead of the semiconductor device toward the contact pin, and connecting the electrode and the lead while introducing dust into the recess.

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