JP6587493B2 - 接着ヘッド及びそれを用いた半導体製造装置 - Google Patents
接着ヘッド及びそれを用いた半導体製造装置 Download PDFInfo
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- JP6587493B2 JP6587493B2 JP2015203884A JP2015203884A JP6587493B2 JP 6587493 B2 JP6587493 B2 JP 6587493B2 JP 2015203884 A JP2015203884 A JP 2015203884A JP 2015203884 A JP2015203884 A JP 2015203884A JP 6587493 B2 JP6587493 B2 JP 6587493B2
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Description
また、図1〜図5を参照して説明した半導体製造装置100における接着ヘッド103には、半導体デバイス113の表面に設けられた第1のアライメントを認識するためのアライメント認識領域と、半導体デバイス113を真空チャックするための第1の中空部とが別個に設けられていた。しかしながら、アライメント認識領域が真空発生器に通じた中空部としての機能を兼ねていてもよい。
101、601:接着ユニット
102:中空部
103、603:接着ヘッド
104:第1の中空部
105:支持部
106:第2の中空部
107:制御部
109:第1の撮像部
111:第2の撮像部
113:半導体デバイス
115:被搭載体
201、203、301、303、407、409、507、509:アライメント認識領域
401、501:接着部
403、503:固定部
605:第1の開口部
607:ミラー
609:第2の開口部
611:中空部
Claims (13)
- 半導体デバイスと接触する部分に弾性部材を含み、
前記半導体デバイスの被接触面に光学的に読み取り可能に設けられたマーカーを検出可能とする一つ以上のアライメントマーク認識領域を有し、
前記弾性部材は、
前記弾性部材を貫通する第1の開口部と、
前記弾性部材を貫通する、前記第1の開口部から隔てられた第2の開口部と、
を有し、
前記第1の開口部は、前記半導体デバイスを保持し、
前記一つ以上のアライメントマーク認識領域のうちの一つは、前記第2の開口部と重なる、接着ヘッド。 - 前記弾性部材は、前記第2の開口部に代えて切り欠き部を有する、請求項1に記載の接着ヘッド。
- 前記弾性部材は、前記弾性部材を貫通し、前記第1の開口部及び前記第2の開口部から隔てられた第3の開口部を有し、
前記一つ以上のアライメントマーク認識領域のうちの別の一つは、前記第3の開口部に重なる、請求項1に記載の接着ヘッド。 - 前記第1の開口部は、真空発生器に連結するように構成されている、請求項1に記載の接着ヘッド。
- 前記弾性部材に連結される透光性の固定部をさらに備える、請求項1乃至4の何れか一項に記載の接着ヘッド。
- 半導体デバイスと接触する部分に弾性部材を含み、前記半導体デバイスの被接触面に光学的に読み取り可能に設けられた第1のマーカーを検出可能とする一つ以上のアライメントマーク認識領域を有する接着ヘッド、及び前記接着ヘッドを保持する支持部を有する接着ユニットと、
前記アライメントマーク認識領域を通して前記第1のマーカーを認識し、前記第1のマーカーの位置に基づいて前記接着ユニットの移動及び回転を制御する制御部と、
を備え、
前記弾性部材は、第1の切り欠き部を有し、
前記一つ以上のアライメントマーク認識領域のうちの一つは、前記第1の切り欠き部と重なる、半導体製造装置。 - 前記弾性部材は第2の切り欠き部を有し、
前記一つ以上のアライメントマーク認識領域のうちの別の一つは、前記第2の切り欠き部と重なる、請求項6に記載の半導体製造装置。 - 前記接着ヘッドは、前記弾性部材に連結される透光性の固定部をさらに備える、請求項6に記載の半導体製造装置。
- 前記弾性部材は、第1の中空部を有し、
前記支持部は、一端が真空発生器に連結するように構成され、他端が前記第1の中空部に連結するように構成された第2の中空部を有する、請求項8に記載の半導体製造装置。 - 前記透光性の固定部は、前記第1の中空部と連結される第3の中空部を備える、請求項9に記載の半導体製造装置。
- 前記接着ヘッドは、
前記弾性部材を固定する透光性の固定部をさらに備え、
前記弾性部材は、第1の中空部を有し、
前記透光性の固定部は、前記第1の中空部に連結される第2の中空部を有する、請求項6に記載の半導体製造装置。 - 前記第1のマーカーを撮像する撮像部をさらに備え、
前記制御部は、前記撮像部によって撮像された前記第1のマーカーの画像に基づいて、前記第1のマーカーの位置を認識する、請求項6乃至11の何れか一項に記載の半導体製造装置。 - 前記制御部は、基板の表面に設けられた第2のマーカーを認識し、前記第2のマーカーの位置に基づいて、前記接着ユニットを移動及び回転を制御する、請求項6乃至12の何れか一項に記載の半導体製造装置。
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CN201610859571.XA CN106952853B (zh) | 2015-10-15 | 2016-09-28 | 接合头及利用它的半导体制造装置 |
KR1020160129190A KR20170044587A (ko) | 2015-10-15 | 2016-10-06 | 접착 헤드 및 이를 이용한 반도체 제조 장치 |
TW105132621A TWI705512B (zh) | 2015-10-15 | 2016-10-07 | 接合頭及使用其之半導體製造裝置 |
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