CN102473710B - 叉指状竖直平行电容器 - Google Patents
叉指状竖直平行电容器 Download PDFInfo
- Publication number
- CN102473710B CN102473710B CN201080036668.1A CN201080036668A CN102473710B CN 102473710 B CN102473710 B CN 102473710B CN 201080036668 A CN201080036668 A CN 201080036668A CN 102473710 B CN102473710 B CN 102473710B
- Authority
- CN
- China
- Prior art keywords
- metal wire
- interdigitated
- type
- metal
- interdigitated configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/86—Electrodes with an enlarged surface, e.g. formed by texturisation having horizontal extensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/548,484 US8378450B2 (en) | 2009-08-27 | 2009-08-27 | Interdigitated vertical parallel capacitor |
US12/548,484 | 2009-08-27 | ||
PCT/US2010/046742 WO2011031512A2 (en) | 2009-08-27 | 2010-08-26 | Interdigitated vertical parallel capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102473710A CN102473710A (zh) | 2012-05-23 |
CN102473710B true CN102473710B (zh) | 2016-05-25 |
Family
ID=43623599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080036668.1A Expired - Fee Related CN102473710B (zh) | 2009-08-27 | 2010-08-26 | 叉指状竖直平行电容器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8378450B2 (zh) |
JP (1) | JP5657002B2 (zh) |
CN (1) | CN102473710B (zh) |
DE (1) | DE112010003418B4 (zh) |
GB (1) | GB2485693B (zh) |
TW (1) | TW201140785A (zh) |
WO (1) | WO2011031512A2 (zh) |
Families Citing this family (29)
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US8432662B2 (en) * | 2009-01-30 | 2013-04-30 | Headway Technologies, Inc. | Ceramic capacitor and method of manufacturing same |
JP5621357B2 (ja) * | 2010-06-30 | 2014-11-12 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP5569354B2 (ja) * | 2010-11-17 | 2014-08-13 | 富士通セミコンダクター株式会社 | キャパシタおよび半導体装置 |
US8493708B2 (en) * | 2011-02-21 | 2013-07-23 | International Business Machines Corporation | Capacitor structure |
DE102011053536B4 (de) * | 2011-09-12 | 2019-06-19 | X-Fab Semiconductor Foundries Ag | Halbleiterbauelement mit einem Metallisierungssystem |
US9250148B2 (en) | 2012-03-22 | 2016-02-02 | California Institute Of Technology | Multi-directional environmental sensors |
SG11201404773YA (en) * | 2012-03-22 | 2014-10-30 | California Inst Of Techn | Micro -and nanoscale capacitors that incorporate an array of conductive elements having elongated bodies |
US9269492B2 (en) * | 2012-10-02 | 2016-02-23 | Qualcomm Incorporated | Bone frame, low resistance via coupled metal oxide-metal (MOM) orthogonal finger capacitor |
US8901710B2 (en) * | 2013-02-27 | 2014-12-02 | International Business Machines Corporation | Interdigitated capacitors with a zero quadratic voltage coefficient of capacitance or zero linear temperature coefficient of capacitance |
US9059305B2 (en) * | 2013-03-04 | 2015-06-16 | International Business Machines Corporation | Planar qubits having increased coherence times |
JP6133688B2 (ja) * | 2013-05-27 | 2017-05-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN105264623A (zh) | 2013-06-10 | 2016-01-20 | 加州理工学院 | 用于提供耐高温的超级电容器的系统和方法 |
US20140367827A1 (en) * | 2013-06-17 | 2014-12-18 | Qualcomm Incorporated | Metal capacitor with inner first terminal and outer second terminal |
CN103337491B (zh) * | 2013-06-26 | 2016-01-27 | 中国科学院计算技术研究所 | 一种用于全向连接的金属电容及布图方法 |
US9202785B2 (en) | 2013-11-08 | 2015-12-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three dimensional integrated circuit capacitor having vias |
CN104319098B (zh) * | 2014-09-17 | 2017-04-05 | 中国科学院物理研究所 | 叉指电容的制备方法及形成相邻的蒸镀图案的方法 |
US9520358B2 (en) * | 2014-10-30 | 2016-12-13 | Qualcomm Incorporated | Via structure for optimizing signal porosity |
US20160343796A1 (en) * | 2015-05-22 | 2016-11-24 | Mediatek Inc. | Capacitor structure and method for forming the same |
US9520461B1 (en) * | 2015-08-28 | 2016-12-13 | Texas Instruments Incorporated | Integrated circuit with lateral flux capacitor |
JP6360229B2 (ja) * | 2017-04-20 | 2018-07-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US10269490B2 (en) | 2017-05-01 | 2019-04-23 | Qualcomm Incorporated | Metal-oxide-metal capacitor using vias within sets of interdigitated fingers |
US11489038B2 (en) * | 2017-08-29 | 2022-11-01 | Micron Technology, Inc. | Capacitors having vertical contacts extending through conductive tiers |
US10163758B1 (en) | 2017-10-30 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method for the same |
EP3514828B1 (en) * | 2018-01-19 | 2021-08-25 | Socionext Inc. | Semiconductor integrated circuitry |
CN112368831A (zh) * | 2018-09-21 | 2021-02-12 | 华为技术有限公司 | 一种集成电路 |
US10692967B1 (en) * | 2018-12-04 | 2020-06-23 | Analog Devices, Inc. | High density self-routing metal-oxide-metal capacitor |
CN110164878B (zh) * | 2019-06-10 | 2022-05-03 | 惠科股份有限公司 | 阵列基板及其制备方法 |
TWI831224B (zh) * | 2022-05-26 | 2024-02-01 | 瑞昱半導體股份有限公司 | 金屬氧化物金屬電容結構 |
Family Cites Families (41)
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US7029A (en) * | 1850-01-15 | Winnowing-machike | ||
US7024A (en) * | 1850-01-15 | Machinery tor towguzng and grooving | ||
US8018A (en) * | 1851-04-01 | Improvement in seed-planters | ||
US5208725A (en) * | 1992-08-19 | 1993-05-04 | Akcasu Osman E | High capacitance structure in a semiconductor device |
US7200930B2 (en) * | 1994-11-15 | 2007-04-10 | Formfactor, Inc. | Probe for semiconductor devices |
US5583359A (en) * | 1995-03-03 | 1996-12-10 | Northern Telecom Limited | Capacitor structure for an integrated circuit |
US5939766A (en) * | 1996-07-24 | 1999-08-17 | Advanced Micro Devices, Inc. | High quality capacitor for sub-micrometer integrated circuits |
US6822312B2 (en) * | 2000-04-07 | 2004-11-23 | Koninklijke Philips Electronics N.V. | Interdigitated multilayer capacitor structure for deep sub-micron CMOS |
US6690570B2 (en) * | 2000-09-14 | 2004-02-10 | California Institute Of Technology | Highly efficient capacitor structures with enhanced matching properties |
US6653681B2 (en) * | 2000-12-30 | 2003-11-25 | Texas Instruments Incorporated | Additional capacitance for MIM capacitors with no additional processing |
US6980414B1 (en) * | 2004-06-16 | 2005-12-27 | Marvell International, Ltd. | Capacitor structure in a semiconductor device |
US6909127B2 (en) * | 2001-06-27 | 2005-06-21 | Intel Corporation | Low loss interconnect structure for use in microelectronic circuits |
DE10217566A1 (de) | 2002-04-19 | 2003-11-13 | Infineon Technologies Ag | Halbleiterbauelement mit integrierter, eine Mehrzahl an Metallisierungsebenen aufweisende Kapazitätsstruktur |
CA2395900A1 (en) * | 2002-08-12 | 2004-02-12 | Christopher Andrew Devries | Matched vertical capacitors |
US7095072B2 (en) * | 2003-01-16 | 2006-08-22 | Nec Electronics Corporation | Semiconductor device with wiring layers forming a capacitor |
US6963122B1 (en) * | 2003-02-21 | 2005-11-08 | Barcelona Design, Inc. | Capacitor structure and automated design flow for incorporating same |
US6819542B2 (en) * | 2003-03-04 | 2004-11-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interdigitated capacitor structure for an integrated circuit |
TW594979B (en) * | 2003-07-03 | 2004-06-21 | Nanya Technology Corp | Memory device with vertical transistors and deep trench capacitors and method of fabricating the same |
US7259956B2 (en) * | 2003-12-19 | 2007-08-21 | Broadcom Corporation | Scalable integrated circuit high density capacitors |
FR2870042B1 (fr) * | 2004-05-07 | 2006-09-29 | St Microelectronics Sa | Structure capacitive de circuit integre |
US7768044B2 (en) * | 2004-07-30 | 2010-08-03 | Agere Systems Inc. | Metal capacitor stacked with a MOS capacitor to provide increased capacitance density |
US7154734B2 (en) | 2004-09-20 | 2006-12-26 | Lsi Logic Corporation | Fully shielded capacitor cell structure |
MY136744A (en) * | 2004-10-14 | 2008-11-28 | Silterra Malaysia Sdn Bhd | An improved on-chip capacitor |
JP4343085B2 (ja) * | 2004-10-26 | 2009-10-14 | Necエレクトロニクス株式会社 | 半導体装置 |
US7009832B1 (en) * | 2005-03-14 | 2006-03-07 | Broadcom Corporation | High density metal-to-metal maze capacitor with optimized capacitance matching |
JP2006261455A (ja) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | 半導体装置およびmimキャパシタ |
TWI258865B (en) * | 2005-03-29 | 2006-07-21 | Realtek Semiconductor Corp | Longitudinal plate capacitor structure |
US20060261439A1 (en) | 2005-05-17 | 2006-11-23 | Chih-Fu Chien | Capacitor structure |
US7339225B2 (en) * | 2005-05-20 | 2008-03-04 | Faraday Technology Corp. | Capacitor structure |
US7202548B2 (en) * | 2005-09-13 | 2007-04-10 | Via Technologies, Inc. | Embedded capacitor with interdigitated structure |
JP2007081132A (ja) * | 2005-09-14 | 2007-03-29 | Sharp Corp | 半導体集積回路 |
US7768055B2 (en) * | 2005-11-30 | 2010-08-03 | International Business Machines Corporation | Passive components in the back end of integrated circuits |
US20070181973A1 (en) * | 2006-02-06 | 2007-08-09 | Cheng-Chou Hung | Capacitor structure |
US7473955B1 (en) * | 2006-03-07 | 2009-01-06 | Alvand Technologies, Inc. | Fabricated cylinder capacitor for a digital-to-analog converter |
US7274085B1 (en) * | 2006-03-09 | 2007-09-25 | United Microelectronics Corp. | Capacitor structure |
TW200739898A (en) * | 2006-04-13 | 2007-10-16 | Jmicron Technology Corp | Three-dimensional capacitor structure |
TWI299206B (en) * | 2006-06-16 | 2008-07-21 | Realtek Semiconductor Corp | X-shaped semiconductor capacitor structure |
KR100800928B1 (ko) | 2006-08-30 | 2008-02-04 | 동부일렉트로닉스 주식회사 | 반도체 소자의 캐패시터 구조체 |
JP2008226998A (ja) * | 2007-03-09 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
JP2008235498A (ja) * | 2007-03-20 | 2008-10-02 | Renesas Technology Corp | 半導体装置 |
US7812424B2 (en) * | 2007-12-21 | 2010-10-12 | Infineon Technologies Ag | Moisture barrier capacitors in semiconductor components |
-
2009
- 2009-08-27 US US12/548,484 patent/US8378450B2/en not_active Expired - Fee Related
-
2010
- 2010-08-26 WO PCT/US2010/046742 patent/WO2011031512A2/en active Application Filing
- 2010-08-26 JP JP2012526966A patent/JP5657002B2/ja not_active Expired - Fee Related
- 2010-08-26 TW TW099128669A patent/TW201140785A/zh unknown
- 2010-08-26 GB GB1201195.3A patent/GB2485693B/en not_active Expired - Fee Related
- 2010-08-26 DE DE112010003418.4T patent/DE112010003418B4/de not_active Expired - Fee Related
- 2010-08-26 CN CN201080036668.1A patent/CN102473710B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20110049674A1 (en) | 2011-03-03 |
JP2013503487A (ja) | 2013-01-31 |
DE112010003418B4 (de) | 2018-09-20 |
WO2011031512A3 (en) | 2011-06-23 |
GB201201195D0 (en) | 2012-03-07 |
WO2011031512A2 (en) | 2011-03-17 |
CN102473710A (zh) | 2012-05-23 |
JP5657002B2 (ja) | 2015-01-21 |
TW201140785A (en) | 2011-11-16 |
US8378450B2 (en) | 2013-02-19 |
GB2485693A (en) | 2012-05-23 |
DE112010003418T5 (de) | 2012-08-23 |
GB2485693B (en) | 2014-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171108 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171108 Address after: American New York Patentee after: Core USA second LLC Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 Termination date: 20190826 |
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CF01 | Termination of patent right due to non-payment of annual fee |