MY136744A - An improved on-chip capacitor - Google Patents

An improved on-chip capacitor

Info

Publication number
MY136744A
MY136744A MYPI20044235A MYPI20044235A MY136744A MY 136744 A MY136744 A MY 136744A MY PI20044235 A MYPI20044235 A MY PI20044235A MY PI20044235 A MYPI20044235 A MY PI20044235A MY 136744 A MY136744 A MY 136744A
Authority
MY
Malaysia
Prior art keywords
capacitor
layer
frame
capacitance
frames
Prior art date
Application number
MYPI20044235A
Inventor
Cheah Chin Boon
Original Assignee
Silterra Malaysia Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silterra Malaysia Sdn Bhd filed Critical Silterra Malaysia Sdn Bhd
Priority to MYPI20044235A priority Critical patent/MY136744A/en
Priority to US11/242,058 priority patent/US7342766B2/en
Publication of MY136744A publication Critical patent/MY136744A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

AN ON-CHIP CAPACITOR HAVING PLURALITY OF CAPACITOR LAYERS@EACH CAPACITOR LAYER COMPRISING A PAIR OF FRAMES, SUCH THAT A FIRST FRAME OF THE PAIR IS ELECTRICALLY CONNECTED TO FIRST FRAMES ON EACH OTHER CAPACITOR LAYER AND A SECOND FRAME OF THE PAIR IS ELECTRICALLY CONNECTED TO SECOND FRAMES ON EACH OTHER CAPACITOR LAYER; A PLURALITY OF TINES PROJECTING FROM EACH FRAME WITHIN THE RESPECTIVE CAPACITOR LAYER, THE TINES FROM EACH FRAME MESHING SO AS TO FORM AN ARRAY OF SEQUENTIALLY ALTERNATING TINES FROM EACH FRAME TO PROVIDE A LAYER CAPACITANCE WITHIN THE CAPACITOR LAYER, WHEREIN THEMULTI-LAYER CAPACITOR FURTHER INCLUDES A PLURALITY OF PROJECTIONS FROM SAID TINES, SAID PROJECTIONS EXTENDING BETWEEN FRAMES OF ADJACENT CAPACITOR LAYERS SO AS TO PROVIDE AN INTERSTITIAL CAPACITANCE BETWEEN THE CAPACITOR LAYERS, WHEREIN THE TOTAL CAPACITANCE OF THE ON-CHIP CAPACITOR IN THE SUM OF EACH LAYER CAPACITANCE AND EACH INTERSTITIAL CAPACITANCE.
MYPI20044235A 2004-10-14 2004-10-14 An improved on-chip capacitor MY136744A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI20044235A MY136744A (en) 2004-10-14 2004-10-14 An improved on-chip capacitor
US11/242,058 US7342766B2 (en) 2004-10-14 2005-10-04 On-chip capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20044235A MY136744A (en) 2004-10-14 2004-10-14 An improved on-chip capacitor

Publications (1)

Publication Number Publication Date
MY136744A true MY136744A (en) 2008-11-28

Family

ID=36179834

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20044235A MY136744A (en) 2004-10-14 2004-10-14 An improved on-chip capacitor

Country Status (2)

Country Link
US (1) US7342766B2 (en)
MY (1) MY136744A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8378450B2 (en) * 2009-08-27 2013-02-19 International Business Machines Corporation Interdigitated vertical parallel capacitor
WO2012056607A1 (en) * 2010-10-26 2012-05-03 パナソニック株式会社 Capacitance array body and signal processing device comprising same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2973499B2 (en) * 1990-09-13 1999-11-08 松下電器産業株式会社 Chip type solid electrolytic capacitor
US6266227B1 (en) * 1998-08-26 2001-07-24 Kyocera Corporation Thin-film capacitor
US6356429B2 (en) * 1999-02-18 2002-03-12 Tdk Corporation Capacitor
JP2006261455A (en) * 2005-03-17 2006-09-28 Fujitsu Ltd Semiconductor device and mim caspacitor

Also Published As

Publication number Publication date
US7342766B2 (en) 2008-03-11
US20060081904A1 (en) 2006-04-20

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