CN102443391B - 控制烧成的荧光体结构成分比例的方法、荧光体及发光装置 - Google Patents

控制烧成的荧光体结构成分比例的方法、荧光体及发光装置 Download PDF

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Publication number
CN102443391B
CN102443391B CN201110113052.6A CN201110113052A CN102443391B CN 102443391 B CN102443391 B CN 102443391B CN 201110113052 A CN201110113052 A CN 201110113052A CN 102443391 B CN102443391 B CN 102443391B
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China
Prior art keywords
phosphor
light
present
red
red phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110113052.6A
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English (en)
Chinese (zh)
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CN102443391A (zh
Inventor
庄渊仁
温正雄
林志龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Chi Mei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW099133379A external-priority patent/TW201213506A/zh
Priority claimed from TW099135364A external-priority patent/TWI393763B/zh
Priority claimed from TW099135365A external-priority patent/TWI393764B/zh
Priority claimed from TW100110357A external-priority patent/TWI431098B/zh
Application filed by Chi Mei Corp filed Critical Chi Mei Corp
Publication of CN102443391A publication Critical patent/CN102443391A/zh
Application granted granted Critical
Publication of CN102443391B publication Critical patent/CN102443391B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
CN201110113052.6A 2010-09-30 2011-05-03 控制烧成的荧光体结构成分比例的方法、荧光体及发光装置 Expired - Fee Related CN102443391B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
TW099133379A TW201213506A (en) 2010-09-30 2010-09-30 Phosphor and luminous device
TW099133379 2010-09-30
TW099135364A TWI393763B (zh) 2010-10-15 2010-10-15 A phosphor and a light emitting device
TW099135365 2010-10-15
TW099135365A TWI393764B (zh) 2010-10-15 2010-10-15 A phosphor and a light emitting device
TW099135364 2010-10-15
TW100110357A TWI431098B (zh) 2011-03-25 2011-03-25 精確控制燒成之螢光體結構成分比例的方法、其製得之螢光體及含有該螢光體之發光裝置
TW100110357 2011-03-25

Publications (2)

Publication Number Publication Date
CN102443391A CN102443391A (zh) 2012-05-09
CN102443391B true CN102443391B (zh) 2014-07-16

Family

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CN201110113052.6A Expired - Fee Related CN102443391B (zh) 2010-09-30 2011-05-03 控制烧成的荧光体结构成分比例的方法、荧光体及发光装置

Country Status (3)

Country Link
US (1) US9200197B2 (https=)
JP (1) JP5269163B2 (https=)
CN (1) CN102443391B (https=)

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KR20120121588A (ko) * 2011-04-27 2012-11-06 삼성전자주식회사 발광소자 패키지 및 이의 제조방법
JP6061331B2 (ja) * 2011-11-15 2017-01-18 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法、発光装置および画像表示装置
EP2767573B1 (en) * 2012-12-14 2016-09-28 Denka Company Limited Phosphor, method for producing same, and light emitting device
CN102994079A (zh) * 2012-12-21 2013-03-27 北京有色金属研究总院 氮氧化物橙-红色荧光物质，包括其的发光膜或发光片及发光器件
JP6528418B2 (ja) * 2014-01-29 2019-06-12 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置
JP2015196708A (ja) * 2014-03-31 2015-11-09 三菱化学株式会社 蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置
US10590342B2 (en) * 2016-08-25 2020-03-17 Nichia Corporation Nitride fluorescent material, method of producing nitride fluorescent material and light emitting device
JP6669147B2 (ja) 2016-10-31 2020-03-18 日亜化学工業株式会社 発光装置
JP2020109850A (ja) * 2016-10-31 2020-07-16 日亜化学工業株式会社 発光装置の製造方法
JP2020012010A (ja) * 2016-11-15 2020-01-23 デンカ株式会社 赤色蛍光体及び発光装置
JP7310977B2 (ja) * 2017-10-25 2023-07-19 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
JP7155507B2 (ja) * 2017-10-25 2022-10-19 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
WO2023176564A1 (ja) * 2022-03-15 2023-09-21 デンカ株式会社 蛍光体粉末、蛍光体粉末の製造方法、及び発光装置

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Also Published As

Publication number Publication date
CN102443391A (zh) 2012-05-09
JP5269163B2 (ja) 2013-08-21
JP2012077300A (ja) 2012-04-19
US20120080704A1 (en) 2012-04-05
US9200197B2 (en) 2015-12-01

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SE01 Entry into force of request for substantive examination
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Effective date of registration: 20201028

Address after: Tokyo, Japan

Patentee after: DENKA Co.,Ltd.

Address before: Tainan City, Taiwan, China

Patentee before: CHI MEI Corp.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140716