JP5756540B2 - 蛍光体及び発光装置 - Google Patents
蛍光体及び発光装置 Download PDFInfo
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- JP5756540B2 JP5756540B2 JP2014053989A JP2014053989A JP5756540B2 JP 5756540 B2 JP5756540 B2 JP 5756540B2 JP 2014053989 A JP2014053989 A JP 2014053989A JP 2014053989 A JP2014053989 A JP 2014053989A JP 5756540 B2 JP5756540 B2 JP 5756540B2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 145
- 239000002245 particle Substances 0.000 claims description 66
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 24
- 230000005284 excitation Effects 0.000 claims description 13
- 239000002994 raw material Substances 0.000 description 27
- 238000005245 sintering Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 230000014759 maintenance of location Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 229910052788 barium Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 229910052712 strontium Inorganic materials 0.000 description 6
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000000295 emission spectrum Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229940110728 nitrogen / oxygen Drugs 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- -1 nitrogen-containing compound Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000695 excitation spectrum Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000003891 oxalate salts Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical group [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
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Description
以下の実施形態を用いて本発明を説明するが、本発明はこれに限定されるものではない。
(1)蛍光体の輝度及び色度座標:
蛍光体の輝度及び色度座標は、波長455nmの光を発するように設定した株式会社トプコンテクノハウスの輝度計(SR−3A)を用いて測定した。測定値の測定誤差は±0.3%以内とする。
主波長は、Jobin YVONのFluoro Max−3によって測定した。主波長とは、波長455nmの光によって励起される蛍光体の発光スペクトルにおいて発光強度最大の波長を意味する。
(3−1a)機器:
測定は、誘導結合プラズマ(ICP)原子発光分光計(ULTIMA−2型、Jobin Yvon Technology)を用いて行った。
0.1gのサンプルを正確に秤量し、白金坩堝内に入れた。1gのNa2CO3を白金坩堝に添加し、サンプルと均一に混合した。次いで、混合物を1200℃の高温炉によって融合させた(加熱条件:温度を室温から1200℃まで2時間かけて上昇させ、1200℃で5時間保持した)。次いで、融合生成物を冷却し、25mlのHCl(36%)等の酸性溶液中に添加した後、加熱して溶液が透明になるまで溶解させた。次いで、溶液を冷却後、100mL容のPFAメスフラスコ内に入れ、純水をフラスコの標線まで適量(quantitatively)添加した。
窒素/酸素分析装置(株式会社堀場製作所、EMGA−620W)。
20mgの蛍光体をSnカプセルに入れた後、カプセルを坩堝に入れ、測定した。
蛍光体を空気中に置き、高温で長時間焼成する(400℃、12時間)。
輝度保持率とは、信頼性試験後の輝度値に対する信頼性試験前の輝度値の比率を指し、(信頼性試験前の輝度値/信頼性試験後の輝度値)×100%に等しい。
Sr金属(3N7、99.97%)及びBa金属(2N、99%)を粉砕した後、純窒素雰囲気中それぞれ750℃及び700℃で24時間焼結して、それぞれSr3N2及びBa3N2を形成した。
実施形態1〜実施形態11及び比較例1〜比較例3の蛍光体を、Ba3N2、Sr3N2、Si3N4及びEu2O3の使用量が異なる以外は同様の方法で合成した。実施形態1の蛍光体の合成方法を例として以下に説明する。
Claims (10)
- 蛍光体であって、組成式(BaaSr1−a)2−zSi5ObNn:EuZ(0.03<a<0.75、a≠1−a、0<b<1、7<n<9、0.03<z<0.3である)の組成を有する、蛍光体。
- 0.3≦a≦0.7、0<b<1、7<n<9、0.04≦z≦0.2である、請求項1に記載の蛍光体。
- Ba:Sr:Euが0.1〜1.45:0.5〜1.7:0.05〜0.2である、請求項1〜2のいずれか1項に記載の蛍光体。
- Ba:Sr:Euが0.7〜1.25:0.62〜1.24:0.06〜0.13である、請求項1〜3のいずれか1項に記載の蛍光体。
- 前記蛍光体が波長455nmの励起光によって励起される場合、該蛍光体からの放出光のCIE 1931色度座標(x,y)が0.45≦x≦0.72、0.2≦y≦0.5である、請求項1〜4のいずれか1項に記載の蛍光体。
- 複数の蛍光体粒子を含む、請求項1〜5のいずれか1項に記載の蛍光体。
- 前記蛍光体粒子の平均粒径(D50)が6.2μmを超え乃至14.4μm未満である、請求項1〜6のいずれか1項に記載の蛍光体。
- 前記蛍光体粒子の10%粒径(D10)が3.4μmを超え乃至8.3μm未満である、請求項1〜7のいずれか1項に記載の蛍光体。
- 前記蛍光体粒子の各々が長軸及び短軸を有し、該長軸は該蛍光体粒子の表面上の任意の2点間の最も長い距離であり、該短軸は、該長軸と垂直に交差する、該蛍光体粒子の表面上の同一線上の任意の2点間の最も長い距離であり、該短軸に対する該長軸の比率が1.24を超え乃至4.1未満である、請求項1〜8のいずれか1項に記載の蛍光体。
- 発光装置であって、
半導体発光素子と、
請求項1〜9のいずれか1項に記載の蛍光体と、
を備え、前記蛍光体が前記半導体発光素子から放出される励起光によって励起され、該励起光を転換して、該励起光の励起波長とは異なる放出波長を有する放出光を発する、発光装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102110885 | 2013-03-27 | ||
TW102110885A TWI464238B (zh) | 2013-03-27 | 2013-03-27 | 螢光體與發光裝置 |
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Publication Number | Publication Date |
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JP2014189796A JP2014189796A (ja) | 2014-10-06 |
JP5756540B2 true JP5756540B2 (ja) | 2015-07-29 |
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US (1) | US9397272B2 (ja) |
JP (1) | JP5756540B2 (ja) |
CN (1) | CN104073251A (ja) |
TW (1) | TWI464238B (ja) |
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JP6288061B2 (ja) * | 2015-12-10 | 2018-03-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
US10283933B1 (en) * | 2017-10-23 | 2019-05-07 | The Board Of Trustees Of The University Of Illinois | Transistor laser electrical and optical bistable switching |
JP6508368B2 (ja) * | 2018-02-07 | 2019-05-08 | 日亜化学工業株式会社 | 発光装置 |
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JP4009828B2 (ja) | 2002-03-22 | 2007-11-21 | 日亜化学工業株式会社 | 窒化物蛍光体及びその製造方法 |
AU2003221442A1 (en) | 2002-03-22 | 2003-10-08 | Nichia Corporation | Nitride phosphor and method for preparation thereof, and light emitting device |
JP2004018545A (ja) * | 2002-06-12 | 2004-01-22 | Konica Minolta Holdings Inc | 蛍光体 |
JP2004131583A (ja) | 2002-10-10 | 2004-04-30 | Fuji Photo Film Co Ltd | El蛍光体粉末およびel蛍光素子 |
MY149573A (en) * | 2002-10-16 | 2013-09-13 | Nichia Corp | Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor |
JP4207537B2 (ja) * | 2002-11-08 | 2009-01-14 | 日亜化学工業株式会社 | 蛍光体および発光装置 |
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-
2013
- 2013-03-27 TW TW102110885A patent/TWI464238B/zh active
- 2013-08-08 CN CN201310342647.8A patent/CN104073251A/zh active Pending
- 2013-11-12 US US14/077,285 patent/US9397272B2/en not_active Expired - Fee Related
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JP2014189796A (ja) | 2014-10-06 |
TW201437330A (zh) | 2014-10-01 |
US20140291712A1 (en) | 2014-10-02 |
CN104073251A (zh) | 2014-10-01 |
US9397272B2 (en) | 2016-07-19 |
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