CN102369581A - 柔性线缆和传输系统 - Google Patents
柔性线缆和传输系统 Download PDFInfo
- Publication number
- CN102369581A CN102369581A CN2010800155411A CN201080015541A CN102369581A CN 102369581 A CN102369581 A CN 102369581A CN 2010800155411 A CN2010800155411 A CN 2010800155411A CN 201080015541 A CN201080015541 A CN 201080015541A CN 102369581 A CN102369581 A CN 102369581A
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- Prior art keywords
- signal
- flexible cable
- differential
- shield member
- sequential
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 58
- 238000006073 displacement reaction Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000001143 conditioned effect Effects 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 208000013586 Complex regional pain syndrome type 1 Diseases 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- ONDSBJMLAHVLMI-UHFFFAOYSA-N trimethylsilyldiazomethane Chemical compound C[Si](C)(C)[CH-][N+]#N ONDSBJMLAHVLMI-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0838—Parallel wires, sandwiched between two insulating layers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
- H01B11/10—Screens specially adapted for reducing interference from external sources
- H01B11/1091—Screens specially adapted for reducing interference from external sources with screen grounding means, e.g. drain wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-080964 | 2009-03-30 | ||
JP2009080964 | 2009-03-30 | ||
PCT/JP2010/002318 WO2010116684A1 (ja) | 2009-03-30 | 2010-03-30 | フレキシブルケーブル、および、伝送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102369581A true CN102369581A (zh) | 2012-03-07 |
CN102369581B CN102369581B (zh) | 2013-06-12 |
Family
ID=42935982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010800155411A Active CN102369581B (zh) | 2009-03-30 | 2010-03-30 | 柔性线缆和传输系统 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8669483B2 (zh) |
EP (1) | EP2402959B1 (zh) |
JP (1) | JP5409776B2 (zh) |
CN (1) | CN102369581B (zh) |
WO (1) | WO2010116684A1 (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103625113A (zh) * | 2012-08-22 | 2014-03-12 | 兄弟工业株式会社 | 图像记录设备 |
CN103858526A (zh) * | 2013-05-23 | 2014-06-11 | 华为技术有限公司 | 一种线路板与在pcb基板上形成线路的方法 |
CN105555016A (zh) * | 2015-12-29 | 2016-05-04 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN105657958A (zh) * | 2015-12-29 | 2016-06-08 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN106033688A (zh) * | 2015-02-25 | 2016-10-19 | 纬创资通股份有限公司 | 排线结构 |
CN107039386A (zh) * | 2012-06-27 | 2017-08-11 | 联发科技股份有限公司 | 组装印刷电路板及引线架封装 |
TWI614768B (zh) * | 2016-11-02 | 2018-02-11 | 和碩聯合科技股份有限公司 | 資料傳輸線及資料傳輸裝置 |
CN110944097A (zh) * | 2018-09-21 | 2020-03-31 | 佳能株式会社 | 传输电路和电子设备 |
WO2021057857A1 (zh) * | 2019-09-26 | 2021-04-01 | 中兴通讯股份有限公司 | 一种电路板及通信设备 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011258433A (ja) * | 2010-06-10 | 2011-12-22 | Sumitomo Electric Ind Ltd | シールドフラットケーブルの製造方法、および、この製造方法に用いるシールドテープ |
US20140168926A1 (en) * | 2011-01-05 | 2014-06-19 | Thomson Licensing | Controlled impedance flex circuit |
US10426035B2 (en) | 2012-06-27 | 2019-09-24 | Mediatek Inc. | SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern |
JP6146998B2 (ja) * | 2012-12-21 | 2017-06-14 | キヤノン株式会社 | 電子機器 |
US20140268538A1 (en) * | 2013-03-13 | 2014-09-18 | Silicon Graphics International Corp. | Jbod cable |
JP2017059517A (ja) * | 2015-02-27 | 2017-03-23 | セイコーエプソン株式会社 | 電子機器、およびプリンター |
US9530540B1 (en) * | 2015-07-14 | 2016-12-27 | Component User Industry Co., Ltd. | SATA cable |
TWI683613B (zh) * | 2017-02-10 | 2020-01-21 | 華碩電腦股份有限公司 | 電路佈設結構 |
US10427439B2 (en) | 2017-09-11 | 2019-10-01 | Apple Inc. | Substrate marking for sealing surfaces |
TWM555550U (zh) * | 2017-09-29 | 2018-02-11 | Bellwether Electronic Corp | 長直高頻傳輸電纜 |
CN108109740A (zh) * | 2017-12-16 | 2018-06-01 | 亳州联滔电子有限公司 | 扁平线缆及其制造方法 |
JP7208739B2 (ja) * | 2018-08-10 | 2023-01-19 | 株式会社ジャパンディスプレイ | 表示装置および配線基板 |
US10951053B2 (en) | 2018-09-10 | 2021-03-16 | Apple Inc. | Portable electronic device |
KR20210009972A (ko) * | 2019-07-18 | 2021-01-27 | 삼성전자주식회사 | 플렉서블 케이블 |
EP3879624B1 (en) * | 2020-03-11 | 2022-03-23 | Schleifring GmbH | Stripline connections |
TWI727838B (zh) * | 2020-06-24 | 2021-05-11 | 貝爾威勒電子股份有限公司 | 電纜結構 |
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JP3564053B2 (ja) * | 2000-10-06 | 2004-09-08 | キヤノン株式会社 | フレキシブルケーブル |
CN1560877A (zh) * | 2004-03-11 | 2005-01-05 | 禾昌兴业股份有限公司 | 特性阻抗85~115ω软性排线结构 |
CN1722311A (zh) * | 2004-08-13 | 2006-01-18 | 达昌电子科技(苏州)有限公司 | 一种排线结构 |
CN2922071Y (zh) * | 2006-01-07 | 2007-07-11 | 达昌电子科技(苏州)有限公司 | 可挠式软性排线 |
CN201017706Y (zh) * | 2007-03-28 | 2008-02-06 | 鸿富资讯股份有限公司 | 可产生不同阻抗的排线包覆结构 |
TWM327527U (en) * | 2007-08-28 | 2008-02-21 | Wen Te Electronics Co Ltd | Improved structure for flexible flat cable |
TWM352752U (en) * | 2008-09-12 | 2009-03-11 | P Two Ind Inc | Flexible bus cable |
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JPH0529739A (ja) * | 1991-07-19 | 1993-02-05 | Tatsuta Electric Wire & Cable Co Ltd | フレキシブルプリント回路基板 |
JP3424958B2 (ja) * | 1993-01-26 | 2003-07-07 | 住友電気工業株式会社 | シールドフラットケーブル及びその製造方法 |
JP3672056B2 (ja) * | 1995-08-18 | 2005-07-13 | 松下電器産業株式会社 | タイミング信号発生回路 |
JP4876335B2 (ja) * | 2001-06-08 | 2012-02-15 | 大日本印刷株式会社 | フラットケーブル用被覆材およびそれを用いたフラットケーブル |
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JP4207998B2 (ja) | 2006-08-07 | 2009-01-14 | ソニー株式会社 | フラットケーブル装置 |
KR100843220B1 (ko) * | 2006-12-19 | 2008-07-02 | 삼성전자주식회사 | 동일 평면상 엘.씨 벨런싱이 달성된 인쇄회로기판 |
CN101370351B (zh) * | 2007-08-17 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | 软性电路板 |
JP2009080964A (ja) | 2007-09-25 | 2009-04-16 | Toshiba Corp | 燃料電池 |
TWM342597U (en) * | 2008-05-08 | 2008-10-11 | Tennrich Int Corp | Easily flexible transmission line with improved characteristic impedance |
US8110744B2 (en) * | 2008-08-19 | 2012-02-07 | Apple Inc. | Flexible shielded cable |
JP2011204503A (ja) * | 2010-03-26 | 2011-10-13 | Hitachi Cable Fine Tech Ltd | フレキシブルフラットケーブル |
-
2010
- 2010-03-30 CN CN2010800155411A patent/CN102369581B/zh active Active
- 2010-03-30 WO PCT/JP2010/002318 patent/WO2010116684A1/ja active Application Filing
- 2010-03-30 EP EP10761390.3A patent/EP2402959B1/en active Active
- 2010-03-30 US US13/260,816 patent/US8669483B2/en active Active
- 2010-03-30 JP JP2011508232A patent/JP5409776B2/ja active Active
Patent Citations (7)
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JP3564053B2 (ja) * | 2000-10-06 | 2004-09-08 | キヤノン株式会社 | フレキシブルケーブル |
CN1560877A (zh) * | 2004-03-11 | 2005-01-05 | 禾昌兴业股份有限公司 | 特性阻抗85~115ω软性排线结构 |
CN1722311A (zh) * | 2004-08-13 | 2006-01-18 | 达昌电子科技(苏州)有限公司 | 一种排线结构 |
CN2922071Y (zh) * | 2006-01-07 | 2007-07-11 | 达昌电子科技(苏州)有限公司 | 可挠式软性排线 |
CN201017706Y (zh) * | 2007-03-28 | 2008-02-06 | 鸿富资讯股份有限公司 | 可产生不同阻抗的排线包覆结构 |
TWM327527U (en) * | 2007-08-28 | 2008-02-21 | Wen Te Electronics Co Ltd | Improved structure for flexible flat cable |
TWM352752U (en) * | 2008-09-12 | 2009-03-11 | P Two Ind Inc | Flexible bus cable |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107039386A (zh) * | 2012-06-27 | 2017-08-11 | 联发科技股份有限公司 | 组装印刷电路板及引线架封装 |
CN103625113B (zh) * | 2012-08-22 | 2016-02-03 | 兄弟工业株式会社 | 图像记录设备 |
CN103625113A (zh) * | 2012-08-22 | 2014-03-12 | 兄弟工业株式会社 | 图像记录设备 |
CN103858526A (zh) * | 2013-05-23 | 2014-06-11 | 华为技术有限公司 | 一种线路板与在pcb基板上形成线路的方法 |
CN106033688B (zh) * | 2015-02-25 | 2018-05-08 | 纬创资通股份有限公司 | 排线结构 |
US10217545B2 (en) | 2015-02-25 | 2019-02-26 | Wistron Corp. | Cable structure |
CN106033688A (zh) * | 2015-02-25 | 2016-10-19 | 纬创资通股份有限公司 | 排线结构 |
CN105555016A (zh) * | 2015-12-29 | 2016-05-04 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN105555016B (zh) * | 2015-12-29 | 2018-07-06 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN105657958A (zh) * | 2015-12-29 | 2016-06-08 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
TWI614768B (zh) * | 2016-11-02 | 2018-02-11 | 和碩聯合科技股份有限公司 | 資料傳輸線及資料傳輸裝置 |
CN110944097A (zh) * | 2018-09-21 | 2020-03-31 | 佳能株式会社 | 传输电路和电子设备 |
CN110944097B (zh) * | 2018-09-21 | 2022-08-02 | 佳能株式会社 | 传输电路和电子设备 |
WO2021057857A1 (zh) * | 2019-09-26 | 2021-04-01 | 中兴通讯股份有限公司 | 一种电路板及通信设备 |
Also Published As
Publication number | Publication date |
---|---|
EP2402959A1 (en) | 2012-01-04 |
EP2402959A4 (en) | 2017-09-13 |
JPWO2010116684A1 (ja) | 2012-10-18 |
US8669483B2 (en) | 2014-03-11 |
CN102369581B (zh) | 2013-06-12 |
EP2402959B1 (en) | 2021-12-01 |
US20120020416A1 (en) | 2012-01-26 |
JP5409776B2 (ja) | 2014-02-05 |
WO2010116684A1 (ja) | 2010-10-14 |
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