CN102334383B - 平面发光装置 - Google Patents
平面发光装置 Download PDFInfo
- Publication number
- CN102334383B CN102334383B CN201080009660.6A CN201080009660A CN102334383B CN 102334383 B CN102334383 B CN 102334383B CN 201080009660 A CN201080009660 A CN 201080009660A CN 102334383 B CN102334383 B CN 102334383B
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- planar
- anode
- cathode
- auxiliary electrode
- transparency carrier
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- 239000012044 organic layer Substances 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 22
- 238000009826 distribution Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000004088 simulation Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000027756 respiratory electron transport chain Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007323 disproportionation reaction Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- -1 such as Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
- H10K59/1795—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
填充物的粒径[μm] | 含量[质量%] | 短路的出现或不出现 |
不可获得 | 0 | 出现 |
5 | 0.3 | 出现 |
10 | 0.3 | 出现 |
15 | 0.3 | 出现 |
20 | 0.3 | 出现 |
20 | 3.0 | 出现 |
20 | 6.0 | 不出现 |
30 | 3.0 | 不出现 |
30 | 6.0 | 不出现 |
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-044274 | 2009-02-26 | ||
JP2009044274A JP5541872B2 (ja) | 2009-02-26 | 2009-02-26 | 面状発光装置および照明器具 |
PCT/JP2010/052983 WO2010098392A1 (ja) | 2009-02-26 | 2010-02-25 | 面状発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102334383A CN102334383A (zh) | 2012-01-25 |
CN102334383B true CN102334383B (zh) | 2015-02-11 |
Family
ID=42665596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080009660.6A Active CN102334383B (zh) | 2009-02-26 | 2010-02-25 | 平面发光装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8648382B2 (zh) |
EP (1) | EP2403317A4 (zh) |
JP (1) | JP5541872B2 (zh) |
KR (1) | KR101372987B1 (zh) |
CN (1) | CN102334383B (zh) |
WO (1) | WO2010098392A1 (zh) |
Families Citing this family (37)
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WO2012014759A1 (en) * | 2010-07-26 | 2012-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, lighting device, and manufacturing method of light-emitting device |
JP5799492B2 (ja) * | 2010-10-05 | 2015-10-28 | セイコーエプソン株式会社 | 照明装置 |
JP5830711B2 (ja) * | 2010-10-25 | 2015-12-09 | パナソニックIpマネジメント株式会社 | 発光モジュール |
JP5948052B2 (ja) * | 2010-12-28 | 2016-07-06 | 株式会社半導体エネルギー研究所 | 照明装置 |
JP5842088B2 (ja) * | 2011-02-21 | 2016-01-13 | パナソニックIpマネジメント株式会社 | 有機elデバイス及び有機elデバイスの製造方法 |
JP2012186080A (ja) * | 2011-03-07 | 2012-09-27 | Panasonic Corp | 面状発光装置およびその製造方法 |
JP2012186079A (ja) * | 2011-03-07 | 2012-09-27 | Panasonic Corp | 面状発光装置 |
TWI460852B (zh) * | 2011-03-07 | 2014-11-11 | Panasonic Corp | 面狀發光裝置 |
WO2012133715A1 (ja) * | 2011-03-29 | 2012-10-04 | Necライティング株式会社 | 有機el発光装置、有機el発光装置の製造方法及び有機el照明装置 |
JP5684370B2 (ja) * | 2011-03-29 | 2015-03-11 | Necライティング株式会社 | 有機el発光装置、有機el発光装置の製造方法及び有機el照明装置 |
US8829556B2 (en) * | 2011-09-01 | 2014-09-09 | General Electric Company | Thermal management in large area flexible OLED assembly |
EP2763502A4 (en) * | 2011-09-30 | 2015-12-30 | Idemitsu Kosan Co | PLANAR LIGHT-EMITTING DEVICE |
WO2013065547A1 (ja) * | 2011-11-02 | 2013-05-10 | コニカミノルタ株式会社 | 有機el照明装置およびその製造方法 |
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JP5957266B2 (ja) * | 2012-03-30 | 2016-07-27 | 株式会社カネカ | 有機elモジュール |
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JP6043113B2 (ja) * | 2012-07-18 | 2016-12-14 | 株式会社カネカ | 有機el装置の製造方法 |
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US9748511B2 (en) * | 2013-05-23 | 2017-08-29 | Oledworks Gmbh | Light-emitting device with alternating arrangement of anode pads and cathode pads |
DE102013110449B4 (de) * | 2013-09-20 | 2019-10-24 | Osram Oled Gmbh | Bauelement und Verfahren zum Herstellen eines Bauelementes |
CN103702467B (zh) * | 2013-12-13 | 2018-07-24 | 固安翌光科技有限公司 | 一种oled照明光源 |
JP2017068895A (ja) * | 2014-02-10 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 有機エレクトロルミネッセンス素子及び照明装置 |
JP6300231B2 (ja) | 2014-06-25 | 2018-03-28 | パナソニック株式会社 | 有機el素子 |
CN106664754B (zh) * | 2014-08-29 | 2018-11-02 | 住友化学株式会社 | 有机电致发光元件 |
CN105702875B (zh) | 2014-12-11 | 2018-04-27 | 财团法人工业技术研究院 | 发光元件、电极结构与其制作方法 |
WO2016132870A1 (ja) * | 2015-02-20 | 2016-08-25 | 株式会社カネカ | 有機elパネル |
JP2016170963A (ja) * | 2015-03-12 | 2016-09-23 | パイオニア株式会社 | 発光装置 |
TWI548131B (zh) * | 2015-04-30 | 2016-09-01 | Wisechip Semiconductor Inc | Available for organic light emitting diode modules |
US10868252B2 (en) | 2015-09-10 | 2020-12-15 | Showa Denko Materials Co., Ltd. | Organic electronics material and use thereof |
JP6598074B2 (ja) * | 2016-08-01 | 2019-10-30 | パナソニックIpマネジメント株式会社 | 放電装置およびこれの製造方法 |
KR102652261B1 (ko) * | 2016-12-07 | 2024-03-27 | 엘지디스플레이 주식회사 | 유기발광소자를 이용한 조명장치 |
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CN107887421B (zh) * | 2017-10-30 | 2021-03-05 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
JP2019196516A (ja) * | 2018-05-09 | 2019-11-14 | Jx金属株式会社 | 銅箔、積層体及び電子機器 |
CN108598131B (zh) * | 2018-05-23 | 2021-01-29 | 京东方科技集团股份有限公司 | 发光基板及其制作方法、发光装置及其制作方法 |
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JP4967606B2 (ja) * | 2006-11-02 | 2012-07-04 | コニカミノルタホールディングス株式会社 | 有機elパネルの製造方法 |
JP2008123882A (ja) | 2006-11-14 | 2008-05-29 | Harison Toshiba Lighting Corp | 有機el素子 |
WO2008102867A1 (ja) * | 2007-02-22 | 2008-08-28 | Konica Minolta Holdings, Inc. | 有機エレクトロルミネッセンス素子、有機エレクトロルミネッセンス素子の製造方法 |
JP4798050B2 (ja) * | 2007-04-03 | 2011-10-19 | 株式会社豊田自動織機 | スキャナ用光源 |
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2009
- 2009-02-26 JP JP2009044274A patent/JP5541872B2/ja active Active
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2010
- 2010-02-25 EP EP10746271A patent/EP2403317A4/en not_active Withdrawn
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- 2010-02-25 CN CN201080009660.6A patent/CN102334383B/zh active Active
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- 2010-02-25 WO PCT/JP2010/052983 patent/WO2010098392A1/ja active Application Filing
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CN1832642A (zh) * | 2004-12-24 | 2006-09-13 | 株式会社丰田自动织机 | 电致发光元件 |
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Also Published As
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EP2403317A1 (en) | 2012-01-04 |
US20140097424A1 (en) | 2014-04-10 |
KR20110129442A (ko) | 2011-12-01 |
WO2010098392A1 (ja) | 2010-09-02 |
US8648382B2 (en) | 2014-02-11 |
US9076981B2 (en) | 2015-07-07 |
JP5541872B2 (ja) | 2014-07-09 |
EP2403317A4 (en) | 2013-03-13 |
JP2010198980A (ja) | 2010-09-09 |
US20120007134A1 (en) | 2012-01-12 |
KR101372987B1 (ko) | 2014-03-11 |
CN102334383A (zh) | 2012-01-25 |
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