CN102311092A - 用于制造减振的构件的方法 - Google Patents

用于制造减振的构件的方法 Download PDF

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Publication number
CN102311092A
CN102311092A CN2011101863067A CN201110186306A CN102311092A CN 102311092 A CN102311092 A CN 102311092A CN 2011101863067 A CN2011101863067 A CN 2011101863067A CN 201110186306 A CN201110186306 A CN 201110186306A CN 102311092 A CN102311092 A CN 102311092A
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zone
micron
nano
structured
structural detail
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Chinese (zh)
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R.埃伦普福特
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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CN2011101863067A 2010-07-06 2011-07-05 用于制造减振的构件的方法 Pending CN102311092A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010030960.5 2010-07-06
DE102010030960.5A DE102010030960B4 (de) 2010-07-06 2010-07-06 Verfahren zur Herstellung eines schwingungsgedämpften Bauteils

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CN102311092A true CN102311092A (zh) 2012-01-11

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KR (1) KR101877713B1 (de)
CN (1) CN102311092A (de)
DE (1) DE102010030960B4 (de)
FR (1) FR2962429B1 (de)
IT (1) ITMI20111202A1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104062342A (zh) * 2013-03-19 2014-09-24 罗伯特·博世有限公司 检测气体的传感器装置、检测气体的传感器装置运行方法和检测气体的传感器装置制造方法
CN105340369A (zh) * 2013-02-06 2016-02-17 伊利诺伊大学评议会 具有容纳室的可拉伸的电子系统
US10192830B2 (en) 2013-02-06 2019-01-29 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
JP2019503277A (ja) * 2016-01-13 2019-02-07 日本テキサス・インスツルメンツ株式会社 応力による影響を受け易いｍｅｍｓをパッケージングするための構造及び方法
US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011003195B4 (de) 2011-01-26 2019-01-10 Robert Bosch Gmbh Bauteil und Verfahren zum Herstellen eines Bauteils
US8946833B2 (en) * 2012-10-22 2015-02-03 Freescale Semiconductor, Inc. Packaging for semiconductor sensor devices and methods
DE102013206524A1 (de) * 2013-04-12 2014-10-16 Robert Bosch Gmbh Bauelement, Nutzen und Verfahren zum Herstellen eines Bauelements
DE102014202821B4 (de) * 2014-02-17 2023-03-30 Robert Bosch Gmbh Gehäuse für ein mikromechanisches Sensorelement
DE102016003944B4 (de) 2016-04-06 2021-10-21 Masa GmbH Vorrichtung zur Qualitätsüberwachung an einer Steinformmaschine
DE102017200162A1 (de) * 2017-01-09 2018-07-12 Robert Bosch Gmbh Verfahren zum Herstellen eines mikroelektromechanischen Bauteils und Wafer-Anordnung
DE102019204761A1 (de) * 2019-04-03 2020-10-08 Robert Bosch Gmbh Verfahren zur Anordnung einer optischen Einrichtung und Kameraeinrichtung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040188782A1 (en) * 2003-03-27 2004-09-30 Denso Corporation Semiconductor device having multiple substrates
US20070222005A1 (en) * 2006-03-13 2007-09-27 Infineon Technologies Ag Integrated circuit having a semiconductor sensor device and method for producing the same
CN101053086A (zh) * 2004-09-07 2007-10-10 英飞凌科技股份公司 具有腔罩和传感器芯片的半导体传感器器件及其制造方法
CN101151943A (zh) * 2005-03-17 2008-03-26 西门子威迪欧汽车电子股份公司 刚性-柔性的印制电路板
CN101547551A (zh) * 2008-03-28 2009-09-30 欧陆汽车有限责任公司 印刷电路板和制造印刷电路板的方法
US20090282915A1 (en) * 2008-05-13 2009-11-19 Denso Corporation Physical quantity sensor and method of making the same
CN101599467A (zh) * 2008-04-22 2009-12-09 微部件公司 组装电子元件的设备
CN101679019A (zh) * 2007-06-15 2010-03-24 罗伯特·博世有限公司 集成有振动隔离装置的预成型壳体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10259795A1 (de) * 2002-12-19 2004-07-08 Siemens Ag Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges
DE10332303A1 (de) * 2003-07-16 2005-02-17 Robert Bosch Gmbh Halterung für Bauteile
JP4831949B2 (ja) 2004-09-08 2011-12-07 株式会社デンソー 物理量センサ装置
DE102005002813B4 (de) * 2005-01-20 2006-10-19 Robert Bosch Gmbh Steuermodul

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040188782A1 (en) * 2003-03-27 2004-09-30 Denso Corporation Semiconductor device having multiple substrates
CN101053086A (zh) * 2004-09-07 2007-10-10 英飞凌科技股份公司 具有腔罩和传感器芯片的半导体传感器器件及其制造方法
CN101151943A (zh) * 2005-03-17 2008-03-26 西门子威迪欧汽车电子股份公司 刚性-柔性的印制电路板
US20070222005A1 (en) * 2006-03-13 2007-09-27 Infineon Technologies Ag Integrated circuit having a semiconductor sensor device and method for producing the same
CN101679019A (zh) * 2007-06-15 2010-03-24 罗伯特·博世有限公司 集成有振动隔离装置的预成型壳体
CN101547551A (zh) * 2008-03-28 2009-09-30 欧陆汽车有限责任公司 印刷电路板和制造印刷电路板的方法
CN101599467A (zh) * 2008-04-22 2009-12-09 微部件公司 组装电子元件的设备
US20090282915A1 (en) * 2008-05-13 2009-11-19 Denso Corporation Physical quantity sensor and method of making the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105340369A (zh) * 2013-02-06 2016-02-17 伊利诺伊大学评议会 具有容纳室的可拉伸的电子系统
US10192830B2 (en) 2013-02-06 2019-01-29 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
CN104062342A (zh) * 2013-03-19 2014-09-24 罗伯特·博世有限公司 检测气体的传感器装置、检测气体的传感器装置运行方法和检测气体的传感器装置制造方法
JP2019503277A (ja) * 2016-01-13 2019-02-07 日本テキサス・インスツルメンツ株式会社 応力による影響を受け易いｍｅｍｓをパッケージングするための構造及び方法

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ITMI20111202A1 (it) 2012-01-07
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DE102010030960A1 (de) 2012-01-12
KR20120004335A (ko) 2012-01-12

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