ITMI20111202A1 - Procedimento per la produzione di un componente con attenuazione divibrazioni - Google Patents

Procedimento per la produzione di un componente con attenuazione divibrazioni

Info

Publication number
ITMI20111202A1
ITMI20111202A1 ITMI20111202A ITMI20111202A1 IT MI20111202 A1 ITMI20111202 A1 IT MI20111202A1 IT MI20111202 A ITMI20111202 A IT MI20111202A IT MI20111202 A1 ITMI20111202 A1 IT MI20111202A1
Authority
IT
Italy
Prior art keywords
divibration
attenuation
procedure
production
component
Prior art date
Application number
Other languages
English (en)
Italian (it)
Inventor
Ricardo Ehrenpfordt
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20111202A1 publication Critical patent/ITMI20111202A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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ITMI20111202 2010-07-06 2011-06-29 Procedimento per la produzione di un componente con attenuazione divibrazioni ITMI20111202A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010030960.5A DE102010030960B4 (de) 2010-07-06 2010-07-06 Verfahren zur Herstellung eines schwingungsgedämpften Bauteils

Publications (1)

Publication Number Publication Date
ITMI20111202A1 true ITMI20111202A1 (it) 2012-01-07

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KR (1) KR101877713B1 (de)
CN (1) CN102311092A (de)
DE (1) DE102010030960B4 (de)
FR (1) FR2962429B1 (de)
IT (1) ITMI20111202A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011003195B4 (de) 2011-01-26 2019-01-10 Robert Bosch Gmbh Bauteil und Verfahren zum Herstellen eines Bauteils
US8946833B2 (en) * 2012-10-22 2015-02-03 Freescale Semiconductor, Inc. Packaging for semiconductor sensor devices and methods
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KR20120004335A (ko) 2012-01-12
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