CN102311092A - Be used to make the method for the member of vibration damping - Google Patents

Be used to make the method for the member of vibration damping Download PDF

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Publication number
CN102311092A
CN102311092A CN2011101863067A CN201110186306A CN102311092A CN 102311092 A CN102311092 A CN 102311092A CN 2011101863067 A CN2011101863067 A CN 2011101863067A CN 201110186306 A CN201110186306 A CN 201110186306A CN 102311092 A CN102311092 A CN 102311092A
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zone
micron
nano
structured
structural detail
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R.埃伦普福特
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
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    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
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  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Vibration Prevention Devices (AREA)

Abstract

The present invention relates to be used to make the method for the member of vibration damping; Member has micron or nano-structured structural detail; The substrate of the perimeter with regional and at least one rigidity that at least one rigid internal is regional, at least one is flexible wherein is provided, and the rigid internal zone is surrounded by the perimeter of rigidity by the flexible zone encirclement and the zone of flexibility.Said in addition method comprise with at least one micron or the first nano-structured structural detail be applied on the rigid internal zone and make micron or nano-structured first structural detail and rigid internal regional and/or carry out electric this two steps that contact with the perimeter of rigidity.In order to prevent that micron or the first nano-structured structural detail from receiving vibration effect, the vibration damping material is applied on the first perhaps nano-structured structural detail of micron.The present invention relates to a kind of corresponding member in addition.

Description

Be used to make the method for the member of vibration damping
Technical field
The present invention relates to a kind of method and a kind of such member that is used to make member with at least one micron or nano-structured first structural detail.
Background technology
Usually with the sensor packaging of micromechanics in housing.Have so-called " leaded (the leaded) " housing of housing of contact feet and having between the housing of contact-making surface so-called " not having lead-in wire (the leadless) " housing at this and distinguishing.Especially the sensor with micromechanics is encased in the so-called preformed of base house (Premold) housing of prefabricated injection moulding, subsequently with lid with this preformed housings close.
According to the infield, the sensor of micromechanics can stand different loads.Especially the sensor of micromechanics can stand vibrational loading such as the ESP sensor in the controller.
A kind of scheme that prevents that sensor from receiving these vibrations is that sensor is placed on the metallic plate, and this metallic plate then is bearing on the colloid layer.Another kind of scheme obtains describing in open source literature DE 10 2,005 041 577, in this open source literature, weakens the external vibration of violating original idea through wire element.
Summary of the invention
Theme of the present invention is, a kind of method that is used to make the member with micron or nano-structured structural detail is provided, and this method may further comprise the steps:
-substrate of the perimeter with regional and at least one rigidity that at least one rigid internal is regional, at least one is flexible is provided, wherein said rigid internal zone is surrounded by the zone of said flexibility and the zone of said flexibility is surrounded by the perimeter of said rigidity;
-at least one micron or the first nano-structured structural detail are applied on the said rigid internal zone;
-make said micron or nano-structured first structural detail and said rigid internal regional and/or carry out electric the contact with the perimeter of said rigidity, and
-the vibration damping material is applied on the first perhaps nano-structured structural detail of said micron.
At this, " flexible zone " this notion refers in particular under the effect of identical power than said " rigid internal zone " more flexible and/or that more can expand and/or more can be out of shape zone with said " perimeter of rigidity ".Such as said " flexible zone " under the effect of identical power than the elasticity of said " rigid internal zone " and said " perimeter of rigidity " and/or can dilatancy and/or can morphotropism big factor five especially ten.
The vibration damping material refers in particular to a kind of material on meaning of the present invention, this material can absorb especially vibrational energy and be converted into internal energy such as friction of mechanical energy.
Micron on the meaning of the present invention or nano-structured structural detail especially can be meant to have the structural detail of inner being in>=1nm to the interior physical dimension of the scope of≤100 μ m.The physical dimension of said inside is meant the size of the inner structure of structural detail such as pitting, contact pin or printed conductor at this.Such structural detail is used in the microsystems technology or is used in the micro electronmechanical system.
" electric contact " not only can be meant direct contact within the scope of the invention but also can be meant indirect contact.Such as; A structural detail can carry out with the electrical contact that is in the said zone by means of the electrical contact that is on the said structural detail with direct electric contact the between the zone, and the electrical contact of wherein said structural detail contacts with the electrical contact in said zone and collides in other words.Indirect electric contact gear ratio between structural detail and the zone be as can carrying out in the following manner, and promptly the electrical contact of said structural detail is connected with the electrical contact in said zone such as the material of printed conductor or lead or the conduction adhesive such as conduction such as another structural detail, electric conductor through another element at least.
Can advantageously make the micron with vibration damping or the member of nano-structured structural detail through said by method of the present invention.Through the use of vibration damping material, this-compare with air vibration damping or spring damping-can improve effectiveness in vibration suppression significantly.In addition, can advantageously come individually the vibration damping situation to be adjusted through the material chosen of vibration damping material.In addition, a special advantage is, can obtain damping effect through said along all direction in spaces by structure of the present invention.This allows again in fact to use such member in each place to use.In addition, such member can have the little size of member than traditional metallic plate with colloid supporting.In addition, saidly can advantageously implement with less cost and fewer purpose process steps by method of the present invention.
In the scope of a kind of embodiment of said method, said vibration damping material is the combination of gel, foamed material, pellet, elastomer or these materials.Such as said vibration damping material can be foamed material, and this foamed material is based on plastics, and said plastics are then selected from the material group that constitutes by polypropylene, polyethylene, polyethylene terephthalate, polyurethane and these materials.Especially said foamed material can (at the scene) when applying and/or after applying formation.Therefore, can advantageously obtain the connection of form fit.But can arrange so equally, promptly said foamed material constituted before being applied on the perhaps nano-structured structural detail of said micron.
But said vibration damping material also can be a pellet.Such as said vibration damping material can be sand or pulverous material.Because the pellet great majority have higher density, so said pellet can be advantageously extraly as blank (Masse) and improvement vibration and damping property when pellet is used as the vibration damping material.
In addition, said vibration damping material also can be an elastomer, such as the thermoplastic elastomer body.Elastomer can improve vibration and damping property equally.Especially said elastomer can constitute when applying and after applying (at the scene) or apply in the state heated in other words in plasticity under the situation of using the thermoplastic elastomer body.Therefore, can advantageously obtain the connection of form fit equally.
In the scope of the another kind of embodiment of said method, said vibration damping material is a gel.The use of gel provides such advantage, and promptly its majority is transparent.After applying, can check by implementation quality thus, be used to guarantee to exist the connection of form fit.In addition, gel can have outstanding tack and can under the situation that does not increase the adhesive force agent, adhere to thus.In addition, gel can carry out plastic deformation at normal temperatures and therefore also can advantageously be coated on the member of temperature-sensitive with the form fit ways of connecting.Especially said vibration damping material can be a silica gel.
Said vibration damping material is in such as having>=5000mPas to≤10000mPas especially>=2000mPas to≤8000mPas such as the>=3000mPas viscosity in the scope of≤4500mPas; This point is especially confirmed by means of DIN EN ISO 3219; And/or have be in>=20mm/10 to≤100mm/10 especially>=40mm/10 to≤80mm/10 such as the>=60mm/10 consistency index in the scope of≤80mm/10; This point is especially confirmed (penetrating the 9.38g hollow cone) by means of DIN ISO 2137; And/or have be in 2>=to≤6.5 especially>=2.5 to≤3 such as the dielectric constant in>=2.6 to≤2.8 the scope; Especially by means of DIN VDE 0303 T4,50Hz confirms this point.Through the viscosity of said vibration damping material, can be advantageously adjust the vibration damping situation according to the requirement of the said micron or nano-structured first structural detail.
Preferably said vibration damping material is applied on the said micron or nano-structured first structural detail with the form fit ways of connecting.Especially can said vibration damping material so be applied on the said micron or nano-structured first structural detail, make said vibration damping material especially said micron or the first nano-structured structural detail covered with the form fit ways of connecting.
At this, " covering " this notion comprises that on meaning of the present invention the outer surface that before applying said vibration damping material, opens wide that said vibration damping material contact hides corresponding element in other words is such as surface and side.
In case of necessity; That is to say that as long as said micron or the first nano-structured structural detail have than the little basal plane in said rigid internal zone so said vibration damping material just can cover said rigid internal zone and subregion said micron or the nano-structured first structural detail adjacency extraly.
In the scope of the another kind of embodiment of said method, said vibration damping material partly or completely covers the zone of said flexibility extraly.Can cover said micron or nano-structured first structural detail and be covered with said rigid internal zone in case of necessity such as said vibration damping material with the subregion of the said micron or the nano-structured first structural detail adjacency and the zone of said flexibility.
In the scope of a kind of embodiment of said method; Said vibration damping material so is applied on the said micron or nano-structured first structural detail, makes said vibration damping material cover said micron or nano-structured first structural detail and subregion that the zone with said flexibility of the perimeter of the zone of that cover said rigid internal zone in case of necessity and the subregion said micron or the nano-structured first structural detail adjacency and said flexibility and said rigidity surrounds.In this way, the said micron or nano-structured first structural detail can be advantageously decoupling from the vibration of outside particularly well.
Applying such as can be of vibration damping material by means of distributing (Dispensen) such as carrying out such as stencil paper printing, serigraphy or spatula with dispense needles or by means of printing.
Especially when applying the vibration damping material, can use the drip molding of the shape of confirming the vibration damping material.
In this case; Said drip molding can be to be configured in the shaped structure on the perimeter of said rigidity or can be applied on the perimeter of said rigidity and drip molding that can remove again, such as sieve especially stencil paper printing mask (Schablonendruckmaske).
Can so be configured on the perimeter of said rigidity such as said shaped structure, make said shaped structure surround or around the subregion of the perimeter and zone said flexibility the adjacency of said rigidity in other words, the zone of said flexibility.
In the scope of the another kind of embodiment of said method, said drip molding is configured to frame structure.Preferred said frame structure so is configured on the perimeter of said rigidity at this, makes said frame structure limit said damping material and especially fences up, gives its packet boundary and/or to its frame that frames up with it.The surface of the perimeter of the said rigidity dorsad of especially said frame structure is high about the surface in the said dorsad rigid internal zone of the plane of the perimeter of the said rigidity structural detail perhaps more nano-structured than said micron.Can have about the plane of the perimeter of said rigidity such as said frame structure be in>=100 μ m are to≤5000 μ m especially>=300 μ m to≤2000 μ m and such as the height of>=600 μ m in the scope of≤1200 μ m.
In the scope of the another kind of embodiment of said method, said shaped structure is configured to stream and ends structure (Flie stoppstruktur)." stream ends structure " especially can be meant a kind of structure within the scope of the invention, and this structure has defined the elongation of said vibration damping material through capillary effect.Ending structure such as said stream can be breach, groove, gap, slit or projection.Said stream end structure especially can have about the plane of the perimeter of said rigidity be in>=10 μ m are to≤200 μ m especially>=20 μ m to≤80 μ m and such as the degree of depth or the height of>=40 μ m in the scope of≤60 μ m.Depth-width ratio can be in>=2 with≤100 scope in especially can be in>=10 with≤80 scope in and such as be in>=20 with≤60 scope in.
In addition; By in the scope of method of the present invention, second structural detail that can at least one micron is perhaps nano-structured is such as on the perimeter that is applied to said micron or the first nano-structured structural detail, said rigid internal zone or said rigidity said.As long as said micron or the second nano-structured structural detail are applied on the perimeter of said rigidity, the so said micron second perhaps nano-structured structural detail is preferably to vibrating insensitive micron or nano-structured structural detail.
Especially said shaped structure can comprise that at this at least one is especially to vibrating insensitive micron or nano-structured second structural detail and/or at least one printed conductor.Can constitute by a plurality of (root) micron or nano-structured second structural detail and/or printed conductor such as said shaped structure.Therefore, can advantageously improve space availability ratio system integration density in other words and reduce extra materials demand.Said printed conductor can be configured on the said substrate or join in the said substrate and/or be applied on the said substrate.The said micron second perhaps nano-structured structural detail is such as being applied on the perimeter that especially is applied to said rigidity on the said substrate with said micron or the first nano-structured structural detail simultaneously.
In the scope of the another kind of embodiment of said method, said drip molding is a template, this template is applied on the perimeter of said rigidity and after applying said vibration damping material again template to be removed before applying said vibration damping material.Such as said drip molding can be template; This template so constitutes; Thereby when applying said vibration damping material, said vibration damping material is coated on the said micron or nano-structured first structural detail; On that be coated to said rigid internal zone in case of necessity and the subregion said micron or the nano-structured first structural detail adjacency, and be coated on the zone of said flexibility in case of necessity and be coated in case of necessity on the subregion that the zone with said flexibility of the perimeter of said rigidity surrounds.
In the scope of the another kind of embodiment of said method, said template can heat.Can obtain the border sclerosis portion of gel and the shape stability of raising gel in this way.Therefore can advantageously simplify taking off of template and applying these operations and when taking off template, preventing the fracture of damping material of the encapsulate substances of explained later.
Can state micron or nano-structured first structural detail and said vibration damping material with the case cover residence and (and cover the zone of said flexibility in case of necessity; Cover said rigid internal zone in case of necessity, cover in case of necessity said rigidity the perimeter and/or cover said micron or the second nano-structured structural detail in case of necessity).Such as said housing can be the housing of die casting, the case cover of precompressed casting or the lid of precompressed casting.
The preferred said micron or nano-structured first structural detail and said vibration damping material (and the zone of said flexibility in case of necessity; Said in case of necessity rigid internal zone, the perimeter of said rigidity and/or said in case of necessity micron or the second nano-structured structural detail in case of necessity) cover layer processed by encapsulate substances covers.
In addition, in the scope of the another kind of embodiment of said method, said method comprises such method step: encapsulate substances is applied on the said vibration damping material.Therefore the preformed housing that advantageously abandonment cost is intensive.In this case, said encapsulate substances also can be applied on the said shaped structure and/or be applied on the part of perimeter of said rigidity.Preferably said encapsulate substances is applied on the vibration damping material, said vibration damping material that then cover said micron or nano-structured first structural detail and cover said rigid internal zone in case of necessity with the subregion said micron or the nano-structured first structural detail adjacency.Especially can said encapsulate substances be applied on the vibration damping material subregion that the zone with said flexibility of the perimeter of said vibration damping material zone and the said rigidity with the subregion said micron or the nano-structured first structural detail adjacency and said flexibility that then cover said micron or nano-structured first structural detail and cover said rigid internal zone in case of necessity surrounds.
This provides such advantage, and promptly the zone of said flexibility is not protected by the outer cover (Einhausung) of the sealing of said encapsulate substances and the said structural detail performance through having vibration damping.
Applying of said encapsulate substances can be carried out by means of distribution, printing, immersion, spraying, casting, die casting and/or process for stamping.Therefore said encapsulate substances especially can be formed substance, perfusion material, die casting material, injection moulding material, transfer modling material and/or punching press material.Advantageously, said encapsulate substances form fit ground after applying is connected with the perimeter of said vibration damping material and/or said shaped structure and/or said rigidity.
Said encapsulate substances can sclerosis after applying.This can spilling and/or under the effect of heat and/or ultra-violet radiation, carry out in case of necessity through crosslinked through solvent.Preferred said hardening process is carried out by means of ultra-violet radiation for the member of temperature-sensitive.
Said encapsulate substances can comprise at least a composition of from the material group that is made up of epoxy resin, polyacrylate, polyformaldehyde and/or silicone, selecting.In addition, said encapsulate substances can comprise filler.
Can advantageously regulate the material behavior of said encapsulate substances in this way.Preferred employed encapsulate substances has small conductive capability, lower thermal conductivity factor, higher homogenieity, lower refractive index and/or in hardening process, has small shrinkage factor.
Said substrate is such as being printed circuit board (PCB).Especially said substrate can have multiple-printed circuit board (PCB) hollow plate.Can comprise a kind of material such as said substrate, this material is selected from the material group that constitutes by copper, epoxides, epoxides-glass tissue, copper-tungsten alloy or these materials.The rigid internal zone of especially said substrate and/or the perimeter of rigidity can comprise a kind of in these materials or several.
The zone of said flexibility can have the function of pure machinery at this.Zone such as said flexibility can be used as spring element, is used to capture the vibration of generation.Except the function of machinery, the zone of said flexibility can have electric function extraly.Zone such as said flexibility can comprise one or many printed conductors.Especially said printed conductor can so constitute, and makes the said printed circuit cable of said rigid internal zone passage carry out electric the contact with the perimeter of said rigidity.Especially said printed conductor can be configured to corrugated at this.The stress that can advantageously cause vibration thus compensates.
The zone of the flexibility of said substrate is such as processing, promptly such as through stamping-out, laser technology or milling one or more space being joined in the said substrate in the following manner.
Especially said rigid internal zone can be in another especially higher plane under parallel mobile situation with respect to the perimeter of said rigidity.The effectiveness in vibration suppression of the level that can advantageously obtain thus to be improved.
In addition, the perimeter of said rigid internal zone and/or said rigidity can have ledge, and this ledge surpasses the part in the zone of said flexibility.Can the surface of the side direction of said member be optimized in this way.
Such as can a space that said rigid internal zone is surrounded being joined in the said substrate.In order to construct the zone of said flexibility; Can use flexible material to come this space of filling like this and/or (as layer) that crimp (verpressen) is carried out in this space, make the material of said flexibility touch the perimeter of said rigid internal zone and said rigidity such as the plastics of flexibility.Especially pour into a mould and/or (as layer) comes crimp with the plastics of the flexible especially thermoplastic flexibility of plastics in this space.Such as the plastics of said flexibility can be based on polyimides such as have-O-,=CO ,-S-, SO 2-,-(CH) 2-,-C (CF 3) 2-or the plastics of few candy siloxanes-pad (Oligosiloxane-Spacern).
As replacement scheme or additional project; For the zone of between the perimeter of said rigid internal zone and said rigidity, constructing said flexibility so joins one or more space in the said substrate, make said rigid internal zone keep being connected through one or more substrate section that does not interspace with the perimeter of said rigidity.Said space and/or the said substrate section that does not interspace especially can be configured to corrugated at this.This especially confirms it is favourable for capturing vibration.In order to prevent that said micron or nano-structured structural detail from receiving ambient influnence, advantageously verified, also pour into a mould or hide said space in this case with the especially flexible especially flexible thermoplastic plastics of plastics of flexible material.Such as said space can with based on polyimides such as have-O-,=CO ,-S-, SO 2-,-(CH) 2-,-C (CF 3) 2-perhaps the plastics of few candy siloxanes-pad (Oligosiloxane-Spacern) are poured into a mould.
In order to make the member that has about parallel mobile rigid internal zone, the perimeter of said rigidity, such as heating and pushed from the plane of the perimeter of said rigidity in said rigid internal zone to the zone of the flexibility processed by the thermoplastic material in the zone of said flexibility.
As replacement scheme or additional project, said rigid internal zone is in order to compensate system vibration and can be equipped with a kind of blank extraly.Said rigid internal zone can with said micron or the nano-structured opposed side of structural detail on have a kind of blank.Can realize through metal body such as said blank.
Can said micron or the first nano-structured structural detail be applied on the said rigid internal zone through pasting.Through the adhesive of conduction or the use of Flip Chip (Flip-Chip Technik), can simultaneously electricly touch said micron or the first nano-structured structural detail at this.
But can arrange so equally; Be that said rigid internal zone has and is used to admit and/or the support of fixing said micron or nano-structured first structural detail, wherein said micron or the first nano-structured structural detail be inserted in the said support.Such as said support can be the recess in the said rigid internal zone.Here advantage is, needn't use any adhesive to adhere to and to fix, because said vibration damping material can be fixed said micron or the first nano-structured structural detail.
In order when applying the said micron or nano-structured first structural detail, can simultaneously electricly to touch said micron or the first nano-structured structural detail; Can have electric contact-making surface such as said micron or the first nano-structured structural detail, this electric contact-making surface carries out electric the contact with the said in other words support in said rigid internal zone when applying the said micron or nano-structured first structural detail.
As replacement scheme or additional project, said micron or the first nano-structured structural detail can connect (lead-in wire contact) through the lead-in wire bonding and carry out electric contact.Bonding connects such as constituting through miniature solder technology.Can set up through going between with electric contact the between the said substrate such as said micron or the first nano-structured structural detail, said lead-in wire is such as welding together with said micron or the contact-making surface of nano-structured first structural detail and the contact-making surface (pad) of said substrate.
The perimeter of said rigidity can with have said micron or the nano-structured said in other words vibration damping material of first structural detail and be equipped with electrical contact on the opposed side of a side of said shaped structure in other words.Through this electrical contact can with other printed circuit board (PCB) between set up soldering and be connected.Said soldering connects such as carrying out through faying face (soldering point) and solder flux and/or soldered ball (L tball).Said soldering connect such as can as (English: " Land Grid Array ") when using LGA (pad grid array) through faying face (soldering point) or as when the use BGA (BGA) (English: " Ball Grid Array ") carry out through soldered ball.Connect the spacing that especially can regulate between the regional and adjacent printed circuit board (PCB) of said rigid internal through said soldering.Therefore, such as structural detail, can correspondingly adjust said soldering and connect for high vibration.Such as said rigid internal zone and spacing between the adjacent printed circuit board (PCB) under the situation of using the LGA housing, can be in>=10 μ m to≤200 μ m especially>=40 μ m to the scope of≤100 μ m in and under the situation of use BGA housing, can be in>=10 μ m arrive≤400 μ m especially>=80 μ m arrive in the scope of≤300 μ m.
In the scope of the another kind of embodiment of said method; A kind of substrate with perimeter of regional, flexible zone of a plurality of rigid internal and rigidity is provided; Wherein each rigid internal zone is surrounded by the zone of a flexibility and zone that should flexibility is surrounded by the perimeter of a rigidity again; Wherein on said rigid internal zone, correspondingly apply at least one micron or the first nano-structured structural detail; Wherein said micron or the first nano-structured structural detail then carry out electric the contact with the perimeter of a rigid internal zone and/or a rigidity respectively; Wherein on the said micron or nano-structured first structural detail, apply the vibration damping material, wherein be applied to encapsulate substances on the said vibration damping material in case of necessity and with said device such as being divided into individual system through sawing.This can advantageously simultaneously make a plurality of members as multiple hollow plate.Therefore can advantageously shorten process chain and reduce material consumption.
Said micron or the first and/or second nano-structured structural detail, the especially said micron or nano-structured first structural detail are such as being the semiconductor structure element.Especially said micron or the nano-structured especially said micron of first and/or second structural detail or nano-structured first structural detail can be from by selecting peculiar integrated circuit (ASICS), sensor element and these systems, circuit of micron or nanometer micro mechanical system (NEMS, MEMS), application scheme and the group that combination of elements constituted.Can be from by pressure sensor such as said micron or the nano-structured especially said micron of first and/or second structural detail or nano-structured first structural detail; Acceleration transducer; Temperature sensor; The rotational speed rate sensor; Mass flow sensor; Magnetic sensor; Gas sensor; Hall sensor; Humidity sensor; APS sensor (English: " Active Pixel Sensor "); Ccd sensor (English: " Charge Coupled Device Sensor "); CIS sensor (English: " Contact Image Sensor "); Diac sensor (English: " Diode for alternating current "); DPS sensor (English: " Digital Pixel Sensor "); Electron multiplier; Logic array; GTO IGCT (English: " Gate Turn Off Thyristor "); Semiconductor relay; Semiconductor memory; Microprocessor; The neuromorphic microwafer; Photoelectrical coupler; PSD sensor (English: " Position Sensitive Device "); Solar cell; The operational amplifier of current feedback coupling; IGCT; The photoelectricity IGCT; The IGCT adjuster; The IGCT tetrode; The IGCT tower; TOF sensor (English: " Time of Flight Sensor "); Select in the components and parts group that direct access storage constitutes.Advantageously, will be applied to the structural detail of vibration sensing on the said rigid internal zone.To vibrate on the perimeter that insensitive structural detail also can be applied to said rigidity and in case of necessity can be extraly with the shaped structure of the moulding that acts on the vibration damping material.A kind of exemplary embodiments possibly be the acceleration transducer of vibration damping and the magnetic sensor of non-vibration damping.
Another theme of the present invention relates to a kind of member; Especially such as member electric and/or machinery through making by method of the present invention; Such as the member of electromechanics, this member comprises substrate, at least one micron or nano-structured first structural detail and vibration damping material.Said substrate has the perimeter of regional and at least one rigidity that at least one rigid internal is regional, at least one is flexible; Wherein said rigid internal zone is surrounded by the zone of said flexibility and the zone of said flexibility is surrounded by the perimeter of said rigidity, and wherein said micron or the first nano-structured structural detail are arranged on the said rigid internal zone and have carried out electric contact and wherein said vibration damping material is covered with said micron or the first nano-structured structural detail with the perimeter of said rigid internal zone and/or said rigidity.
Through the use of vibration damping material ,-compare with air vibration damping or spring damping-effectiveness in vibration suppression can advantageously be improved significantly.In addition, can advantageously come individually to adjust the vibration damping situation through the material chosen of vibration damping material.In addition, a special advantage is, can obtain damping effect through said along all direction in spaces by structure of the present invention.This allows again in fact to use such member in each place to use.In addition, such member can have the little structure size of member than traditional metallic plate that is provided with the colloid supporting.About said other advantage by member of the present invention at this clearly with reference to combining the said advantage of explaining by method of the present invention.
In the scope of a kind of embodiment of said member, said vibration damping material is the combination of gel, foamed material, pellet, elastomer or these materials.
Such as said vibration damping material can be foam, and this foam is based on plastics, and said plastics are then selected from the material group that constitutes by polypropylene, polyethylene, polyethylene terephthalate, polyurethane and these materials.
But said vibration damping material also can be a pellet, such as sand or pulverous material.
In addition, said vibration damping material also can be an elastomer, such as the thermoplastic elastomer body.
In the scope of the another kind of embodiment of said member, said vibration damping material is a gel.Especially said vibration damping material can be a silica gel.
Said vibration damping material is in such as having>=5000mPas to≤10000mPas especially>=2000mPas to≤8000mPas such as the>=3000mPas viscosity in the scope of≤4500mPas; This point is especially confirmed by means of DIN EN ISO 3219; And/or have be in>=20mm/10 to≤100mm/10 especially>=40mm/10 to≤80mm/10 such as the>=60mm/10 consistency index the in≤80mm/10 scope; This point is especially confirmed (penetrating the 9.38g hollow cone) by means of DIN ISO 2137; And/or have be in 2>=to≤6.5 especially>=2.5 to≤3 such as the dielectric constant in>=2.6 to≤2.8 the scope; Especially by means of DIN VDE 0303 T4,50Hz confirms this point.Preferred said vibration damping material especially is covered with said micron or the first nano-structured structural detail under the situation that form fit connects.Said vibration damping material that is to say as long as said micron or the first nano-structured structural detail have than the little basal plane in said rigid internal zone in case of necessity just can cover said rigid internal zone and subregion said micron or the nano-structured first structural detail adjacency extraly.
In the scope of the another kind of embodiment of said member, said vibration damping material covers the zone of said flexibility extraly partly or completely.Can cover said micron or nano-structured first structural detail and cover said rigid internal zone in case of necessity such as said vibration damping material with the subregion of the said micron or the nano-structured first structural detail adjacency and the zone of said flexibility.
In addition, the subregion that in other words zone of said flexibility surrounded, the said vibration damping material subregion that can cover the perimeter of said rigidity and zone said flexibility adjacency.
In the scope of the another kind of embodiment of said member, the subregion that the zone with said flexibility of the perimeter of said vibration damping material zone and the said rigidity with the subregion said micron or the nano-structured first structural detail adjacency and said flexibility that be covered with said micron or nano-structured first structural detail and be covered with said rigid internal zone in case of necessity surrounds.
In the scope of the another kind of embodiment of said member, said member comprises the shaped structure on the perimeter that is configured in said rigidity in addition.Especially said shaped structure can so be configured on the perimeter of said rigidity, makes said shaped structure surround or around the subregion of the perimeter and zone said flexibility the adjacency of said rigidity in other words, the zone of said flexibility.
In the scope of the another kind of embodiment of said member, said drip molding is configured to frame structure.Preferred said frame structure so is configured on the perimeter of said rigidity at this, makes said frame structure limit said damping material and especially fences up, gives its packet boundary and/or to its frame that frames up with it.The surface of the perimeter of the said rigidity dorsad of especially said frame structure can be higher than the surface in the said dorsad rigid internal zone of said micron or nano-structured structural detail about the plane of the perimeter of said rigidity.Can have about the plane of the perimeter of said rigidity such as said frame structure be in>=100 μ m are to≤5000 μ m especially>=300 μ m to≤2000 μ m and such as the height of>=600 μ m in the scope of≤1200 μ m.
In the scope of the another kind of embodiment of said method, said shaped structure is configured to stream and ends structure (Flie stoppstruktur)." stream ends structure " especially can be meant a kind of structure within the scope of the invention, and this structure has defined the elongation of said vibration damping material through capillary effect.Ending structure such as said stream can be breach, groove, gap, slit or projection.Said stream end structure especially can have about the plane of the perimeter of said rigidity be in>=10 μ m are to≤200 μ m especially>=20 μ m to≤80 μ m and such as the degree of depth or the height of>=40 μ m in the scope of≤60 μ m.Depth-width ratio can be in>=2 with≤100 scope in especially can be in>=10 with≤80 scope in and such as be in>=20 with≤60 scope in.
In addition, said can have at least one micron or the second nano-structured structural detail by member of the present invention.The said micron second perhaps nano-structured structural detail is such as on the perimeter that can be arranged in said micron or the first nano-structured structural detail, said rigid internal zone or said rigidity.As long as said micron or the second nano-structured structural detail are arranged on the perimeter of said rigidity, the so said micron second perhaps nano-structured structural detail is preferably to vibrating insensitive micron or nano-structured structural detail.
Especially said shaped structure can comprise that at least one is especially to vibrating insensitive micron or nano-structured second structural detail and/or at least one printed conductor.Can constitute by a plurality of (root) micron or nano-structured second structural detail and/or printed conductor such as said shaped structure.
In addition, the said micron or nano-structured first structural detail and said vibration damping material (and zone, said rigid internal zone, perimeter and/or the said in case of necessity micron or the second nano-structured structural detail of said rigidity in case of necessity in case of necessity of said flexibility) in case of necessity can be covered.
At this, said housing can be the housing of precompressed casting, the case cover of precompressed casting or the lid of precompressed casting.Can have a housing such as said member, this housing surrounds said micron or the first nano-structured structural detail, said vibration damping material and surrounds the zone of said flexibility in case of necessity and surround said micron or the second nano-structured structural detail in case of necessity.Said housing can be to be fixed on said on-chip lid or to be fixed on said on-chip cover with the mode that can unclamp with the mode that can unclamp.
Preferred said housing is the cover layer that is made up of encapsulate substances.
In the scope of another kind of embodiment, the cover layer that the said micron or nano-structured first structural detail and said vibration damping material are made up of encapsulate substances covers.
Preferred said encapsulate substances covers the vibration damping material, said vibration damping material then be covered with said micron or nano-structured first structural detail and be covered with said rigid internal zone in case of necessity with the subregion of the said micron or the nano-structured first structural detail adjacency and the zone of said flexibility.Especially said encapsulate substances covers the vibration damping material, the subregion that the zone with said flexibility of the perimeter of said vibration damping material zone and the said rigidity with the subregion said micron or the nano-structured first structural detail adjacency and said flexibility that then be covered with said micron or nano-structured first structural detail and be covered with said rigid internal zone in case of necessity surrounds.
Said encapsulate substances can comprise at least a composition of from the material group that is made up of epoxy resin, polyacrylate, polyformaldehyde and/or silicone, selecting.In addition, said encapsulate substances can comprise filler.Can advantageously regulate the material behavior of said encapsulate substances in this way.Preferred employed encapsulate substances has small conductive capability, lower thermal conductivity factor, higher homogenieity, lower refractive index and/or in hardening process, has small shrinkage factor.
Said substrate is such as being printed circuit board (PCB).Especially said substrate can have multiple-printed circuit board (PCB) hollow plate.Can comprise a kind of material such as said substrate, this material is selected from the material group that constitutes by copper, epoxides, epoxides-glass tissue, copper-tungsten alloy or these materials.The rigid internal zone of especially said substrate and/or the perimeter of rigidity can comprise a kind of in these materials or several.Especially said rigid internal zone can be in another especially higher plane under the parallel mobile situation about the perimeter of said rigidity.The effectiveness in vibration suppression of the level that can advantageously obtain thus to be improved.
In addition, the perimeter of said rigid internal zone and/or said rigidity can have ledge, and this ledge surpasses the part in the zone of said flexibility.Can the surface of the side direction of said member be optimized in this way.
The zone of said flexibility can have the function of pure machinery at this.Zone such as said flexibility can be used as spring element, is used to capture the vibration of generation.Except the function of machinery, the zone of said flexibility can have electric function extraly.Zone such as said flexibility can comprise one or many printed conductors.
At the another kind of embodiment of said member, the zone of said flexibility comprises at least one printed conductor.Especially said printed conductor can make said rigid internal zone carry out electric the contact with the perimeter of said rigidity.Can be configured to corrugated such as said printed conductor.
The zone of said flexibility especially can be by the material of flexibility such as being made up of the plastics of the flexibility plastics such as thermoplastic flexibility.Such as the plastics of said flexibility can be based on polyimides such as have-O-,=CO ,-S-, SO 2-,-(CH) 2-,-C (CF 3) 2-or the plastics of few candy siloxanes-pad (Oligosiloxane-Spacern).
As replacement scheme or additional project; The zone of said flexibility can be configured in through one or more space in the substrate between the perimeter of said rigid internal zone and said rigidity; Said space so joins in the said substrate, makes said rigid internal zone keep being connected through one or more substrate section that does not interspace with the perimeter of said rigidity.Said space and/or the said substrate section that does not interspace especially can be configured to corrugated at this.In order to prevent that said micron or nano-structured structural detail from receiving ambient influnence, advantageously verified, also fill or hide said space with the especially flexible plastics of flexible material such as the plastics of thermoplastic flexibility in this case.The plastics of said flexibility be based on polyimides such as have-O-,=CO ,-S-, SO 2-,-(CH) 2-,-C (CF 3) 2-or the plastics of few candy siloxanes-pad (Oligosiloxane-Spacern).
As replacement scheme or additional project, said rigid internal zone is in order to compensate system vibration and can be equipped with a kind of blank extraly.Said rigid internal zone can with said micron or the nano-structured opposed side of structural detail on have a kind of blank.Can realize through metal body such as said blank.
Said rigid internal zone is used to admit and/or the support of fixing said micron or nano-structured first structural detail such as having, and can said micron or the first nano-structured structural detail be arranged in the said support at this.Such as said support can be the recess in the said rigid internal zone.
As replacement scheme or additional project; Said micron or the first nano-structured structural detail can have electric contact-making surface, this electric contact-making surface by means of the adhesive of conduction or Flip Chip (Flip-Chip Technik) and said support perhaps with said rigid internal zone on contact-making surface carried out electric the contact.
Said micron or the first nano-structured structural detail can connect (lead-in wire contact) through the lead-in wire bonding and carry out electric contact.The lead-in wire bonding connects such as constituting through miniature solder technology.Can set up through going between with electric contact the between the said substrate such as said micron or the first nano-structured structural detail, said lead-in wire is such as welding together with said micron or the contact-making surface of nano-structured first structural detail and the contact-making surface (pad) of said substrate.
The perimeter of said rigidity can with the opposed side of said vibration damping material on have the contact.Through this contact can with other printed circuit board (PCB) between set up soldering and be connected.Said soldering connects to be carried out such as having faying face (soldering point) and solder flux and/or soldered ball (L tball).Said soldering connect especially such as can as (English: " Land Grid Array ") when using LGA have faying face (soldering point) or as when the use BGA (English: " Ball Grid Array ") have soldered ball.Connect the spacing that especially can regulate between the regional and adjacent printed circuit board (PCB) of said rigid internal through said soldering.Therefore, such as structural detail, can correspondingly adjust said soldering and connect for high vibration.Such as said rigid internal zone and spacing between the adjacent printed circuit board (PCB) under the situation of using the LGA housing, can be in>=10 μ m to≤200 μ m especially>=40 μ m to the scope of≤100 μ m in and under the situation of use BGA housing, can be in>=10 μ m arrive≤400 μ m especially>=80 μ m arrive in the scope of≤300 μ m.
Said micron or the nano-structured especially said micron of first and/or second structural detail or nano-structured first structural detail are such as being the semiconductor structure element.
In the scope of the another kind of embodiment of said member; Said micron or the first and/or second nano-structured structural detail, the especially said micron or nano-structured first structural detail can be from by selecting peculiar integrated circuit (ASICS), sensor element and these systems, circuit of micron or nanometer micro mechanical system (NEMS, MEMS), application scheme and the group that combination of elements constituted.Can be from by pressure sensor such as said micron or the nano-structured especially said micron of first and/or second structural detail or nano-structured first structural detail; Acceleration transducer; Temperature sensor; The rotational speed rate sensor; Mass flow sensor; Magnetic sensor; Gas sensor; Hall sensor; Humidity sensor; APS sensor (English: " Active Pixel Sensor "); Ccd sensor (English: " Charge Coupled Device Sensor "); CIS sensor (English: " Contact Image Sensor "); Diac sensor (English: " Diode for alternating current "); DPS sensor (English: " Digital Pixel Sensor "); Electron multiplier; Logic array; GTO IGCT (English: " Gate Turn Off Thyristor "); Semiconductor relay; Semiconductor memory; Microprocessor; The neuromorphic microwafer; Photoelectrical coupler; PSD sensor (English: " Position Sensitive Device "); Solar cell; The operational amplifier of current feedback coupling; IGCT; The photoelectricity IGCT; The IGCT adjuster; The IGCT tetrode; The IGCT tower; TOF sensor (English: " Time of Flight Sensor "); Select in the components and parts group that direct access storage constitutes.Advantageously, will be applied to the structural detail of vibration sensing on the said rigid internal zone.To vibrate on the perimeter that insensitive structural detail also can be applied to said rigidity and in case of necessity can be extraly with the shaped structure of the moulding that acts on the vibration damping material.A kind of exemplary embodiments possibly be the acceleration transducer of vibration damping and the magnetic sensor of non-vibration damping.
About said further feature and advantage, clear and definite with reference to combining the said explanation of doing by method of the present invention at this by member of the present invention.
Description of drawings
Said other advantage and favourable design by theme of the present invention explained through accompanying drawing and in following explanation, obtained explaining.Should be noted that at this accompanying drawing only has described characteristic and do not imagine with certain form and limit the present invention.Accompanying drawing illustrates as follows:
Fig. 1 a-c is the schematic cross section that is used to explain the vibration damping situation by a kind of embodiment of member of the present invention;
Fig. 2 a-d is used to explain the schematic perspective view by a kind of flexible program of method of the present invention;
Fig. 3 is the schematic vertical view by the another kind of embodiment of member of the present invention;
Fig. 4 a, 4b are the schematic cross sections that is used to explain said another kind of flexible program by method of the present invention;
Fig. 5 a, 5b are the schematic cross sections that is used to explain said another kind of flexible program by method of the present invention;
Fig. 6 a-6d is the schematic cross section that is used to explain said another kind of flexible program by method of the present invention;
Fig. 7 is the schematic cross section that is used to explain said another kind of flexible program by member of the present invention; And
Fig. 8 is the schematic vertical view by the another kind of embodiment of member of the present invention.
The specific embodiment
Fig. 1 a shows a kind of embodiment by member of the present invention to 1c, and this member has substrate, and said substrate then has rigid internal zone 1a, flexible regional 1b, the perimeter 1c and the contact 11 of rigidity.Fig. 1 a shows that to 1c said rigid internal zone 1a is surrounded by the regional 1b of said flexibility and the regional 1b of said flexibility is surrounded by the perimeter 1c of said rigidity again.Said micron or the first nano-structured structural detail 2 are arranged in said rigid internal zone 1a and upward and through bonding connection 10 and said rigid internal zone 1a have carried out electric the contact.Said member comprises vibration damping material 3, the subregion that the regional 1b with said flexibility of the wherein said vibration damping material 3 perimeter 1c with the regional 1b subregion of said micron or nano-structured first structural detail, 2 adjacency, said flexibility and said rigidity that be covered with said micron or nano-structured first structural detail 2, said rigid internal zone 1a surrounds.In Fig. 1 a, said member is in the vibrationless state.Fig. 1 b and 1c then show the skew that in the process of vibrating along the z direction of said rigid internal zone 1a, produces, and wherein implement towards another printed circuit board 14 and leave the motion of this printed circuit board (PCB) 14 again.
Fig. 2 a shows to 2d and saidly is used to make a kind of flexible program by the method for member of the present invention by of the present invention.Fig. 2 a illustrates; At first provide have at least one rigid internal zone 1a, the substrate of the perimeter 1c of regional 1b that at least one is flexible and at least one rigidity, wherein said rigid internal zone 1a is surrounded by the regional 1b of said flexibility and the regional 1b of said flexibility is surrounded by the perimeter 1c of said rigidity.In addition, Fig. 2 a illustrates, and is applying on the 1a of said rigid internal zone on the micron or nano-structured first structural detail 2.Fig. 2 b shows, the said micron or nano-structured first structural detail 2 connect 10 through bonding and carried out electric the contact with the perimeter 1c of said rigidity.Fig. 2 c shows the vibration damping material 3 that is applied on the said micron or nano-structured first structural detail 2.Said vibration damping material 3 not only is covered with said structural detail 2, bonding at this and connects 10 and flexible regional 1b, and partly is covered with the perimeter 1c of said rigidity.Fig. 2 d shows the encapsulate substances 6 that is applied on the said vibration damping material 3, and said member is covered by said encapsulate substances 6.
Fig. 3 shows the vertical view of said another kind of embodiment by member of the present invention.This can be seen that said rigid internal zone 1a, the regional 1b of said flexibility and the perimeter 1c of said rigidity, wherein said rigid internal zone 1a is surrounded by the regional 1b of said flexibility and the regional 1b of said flexibility is surrounded by the perimeter 1c of said rigidity.Said micron or the first nano-structured structural detail 2 are arranged in said rigid internal zone 1a and upward and by means of bonding connection 10 and said rigid internal zone 1a have carried out electric the contact.Fig. 3 illustrates, and the regional 1b of said flexibility comprises corrugated printed conductor 7, and said printed conductor 7 makes said rigid internal zone 1a carry out electric the contact with the perimeter 1c of said rigidity.In Fig. 3, can find out the contact 11 below the perimeter 1c that is arranged in said rigidity.
In Fig. 4 a and 4b, can find out said another kind of flexible program by method of the present invention.Fig. 4 a and 4b illustrate, and when applying said vibration damping material 3c, can use template 4, and this template 4 has defined the shape of said vibration damping material 3.Before applying said vibration damping material 3, said template 4 is applied on the perimeter 1c of said rigidity.By means of scraper plate 13 said vibration damping material 3 is applied on said micron or the nano-structured structural detail 2.Can find out in addition, the perimeter 1c of said rigidity with the opposed side of a side with said micron or nano-structured structural detail 2 and vibration damping material 3 on be equipped with contact 11.Through this contact can with other printed circuit board (PCB) between set up soldering and be connected.The method step of removing after the template (not shown) has been shown in Fig. 4 b.
Fig. 5 a and 5b illustrate, and said vibration damping material 3 also can be coated on the said micron or nano-structured first structural detail 2 by means of dispense needles 15.The shape of said vibration damping material 3 can through with the regional 1b of said flexibility around stream end structure 17a and define.Process after finishing to apply operation has been shown in Fig. 5 b.Said vibration damping material 3 has the surface of protrusion in this embodiment.
Fig. 6 a and 6b show said another kind of flexible program by method of the present invention.Fig. 6 a illustrates, and will be configured in by the frame structure 17b that encapsulate substances 6 constitutes on the perimeter 1c of said rigidity by means of mould 16.Fig. 6 b shows the micron or the first nano-structured structural detail 2 that are applied on the said rigid internal zone 1a and is connected 10 with bonding, and said structural detail 2 has carried out electric the contact through said bonding connection 10 with said rigid internal zone 1a.In addition; Fig. 6 b illustrates, and the surface of the perimeter 1c of the said rigidity dorsad of said frame structure 17b is higher than the surface of the said dorsad rigid internal zone 1a of said micron or nano-structured structural detail 2 about the plane of the perimeter 1c of said rigidity.
Fig. 6 c shows the step after this process finishes on said vibration damping material 3 being coated to the said micron or nano-structured first structural detail 2.Said vibration damping material 3 not only is covered with said structural detail 2, bonding and connects 10 and flexible regional 1b but also partly be covered with the perimeter 1c of said rigidity.Said frame structure 1b is limiting coated vibration damping material 3.
Fig. 6 d shows encapsulate substances 6 or cladding system are being applied to the step after this process end on the vibration damping material 3 such as lid.
Fig. 7 shows said another kind of flexible program by member of the present invention.Fig. 7 shows said member; This member has substrate; Said substrate then has rigid internal zone 1a, the regional 1b of flexibility and the perimeter 1c of rigidity, and wherein said rigid internal zone 1a is surrounded by the regional 1b of said flexibility and the regional 1b of said flexibility is surrounded by the perimeter 1c of said rigidity.During said rigid internal zone 1a was in than the high plane of the perimeter 1c of said rigidity under parallel mobile situation, the regional 1b of wherein said flexibility coupled together said two regional 1a, 1c and is in the position of bending.Said micron or the first nano-structured structural detail 2 are arranged in said rigid internal zone 1a and upward and with said rigid internal zone 1a have carried out electric the contact.Said member comprises vibration damping material 3, the subregion that the regional 1b with flexibility of the wherein said vibration damping material 3 perimeter 1c with subregions said micron or nano-structured first structural detail, 2 adjacency, flexible regional 1b and said rigidity that be covered with said micron or nano-structured first structural detail 2, said rigid internal zone 1a surrounds.
Fig. 8 shows the schematic vertical view by the another kind of embodiment of member of the present invention.Can find out two rigid internal zone 1a, said interior zone 1a is surrounded by (common) flexible regional 1b, and the regional 1b of wherein said flexibility is surrounded by the perimeter 1c of rigidity again.The zone of said flexibility this be configured to the numeral 8 (8 fonts) the similar shape of shape.

Claims (15)

1. be used to make the method for the member with micron or nano-structured structural detail (2), this method may further comprise the steps:
-provide have at least one rigid internal zone (1a), the substrate of the perimeter (1c) of zone (1b) that at least one is flexible and at least one rigidity, wherein said rigid internal regional (1a) is surrounded by the zone of said flexibility (1b) and the zone (1b) of said flexibility is surrounded by the perimeter of said rigidity (1c);
-at least one micron or nano-structured first structural detail (2) are applied on the said rigid internal zone (1a);
-make said micron or nano-structured first structural detail (2) and said rigid internal regional (1a) and/or carry out electric the contact with the perimeter (1c) of said rigidity, and
-vibration damping material (3) is applied on perhaps nano-structured first structural detail (2) of said micron.
2. by the described method of claim 1, it is characterized in that said vibration damping material (3) is the combination gel especially of gel, foam, pellet, elastomer or these materials.
3. by claim 1 or 2 described methods, it is characterized in that said vibration damping material (3) partly or completely is covered with the zone (1b) of said flexibility extraly.
4. by each described method in the claim 1 to 3; It is characterized in that; Said vibration damping material (3) so is applied on said micron or nano-structured first structural detail (2), makes said vibration damping material (3) be covered with said micron or nano-structured first structural detail (2) and subregion that the zone with said flexibility (1b) of the perimeter (1c) of the zone (1b) of that be covered with said rigid internal zone (1a) in case of necessity and subregion said micron or nano-structured first structural detail (2) adjacency and said flexibility and said rigidity surrounds.
5. by each described method in the claim 1 to 4, it is characterized in that, when applying said vibration damping material (3), use the drip molding (4) of the shape of confirming vibration damping material (3), wherein said drip molding (4)
-be on the perimeter (1c) that is configured in said rigidity shaped structure (17a, 17b) especially frame structure (17b) or stream end structure (17a), perhaps
-be the template (4) that especially can heat, this template (4) is applying that perimeter (1c) that said vibration damping material (3) is applied to said rigidity is before gone up and is being removed again afterwards applying said vibration damping material (3).
6. by each described method in the claim 1 to 5, it is characterized in that said in addition method comprises that encapsulate substances (6) is applied said vibration damping material (3) goes up this method step.
7. by each described method in the claim 1 to 6; It is characterized in that; Provide have a plurality of rigid internal zones (1a), the substrate of the perimeter (1c) of flexible zone (1b) and rigidity; One of them rigid internal zone (1a) is correspondingly surrounded by the perimeter of a rigidity (1c) again by the zone (1b) that the zone of a flexibility (1b) surrounds and this is flexible; Wherein correspondingly at least one micron or nano-structured first structural detail (2) are applied on the said rigid internal zone (1a), wherein make said micron or nano-structured first structural detail (2) respectively with a rigid internal zone (1a) and/or carry out electric the contact with the perimeter (1c) of a rigidity; Wherein on perhaps nano-structured first structural detail (2) of said micron, apply vibration damping material (3), wherein in case of necessity encapsulate substances (6) is applied on the said vibration damping material (3); And said substrate is cut apart.
8. member, especially dynamo-electric member comprises
-substrate; This substrate has at least one rigid internal zone (1a), zone (1b) that at least one is flexible and the perimeter (1c) of at least one rigidity; Wherein said rigid internal zone (1a) is surrounded by the zone of said flexibility (1b) and the zone (1b) of said flexibility is surrounded by the perimeter of said rigidity (1c)
-at least one micron or nano-structured first structural detail (2); Wherein said micron or nano-structured first structural detail (2) be arranged in that said rigid internal zone (1a) is gone up and with electric contact the in perimeter (1c) of said rigid internal zone (1a) and/or said rigidity, and
-vibration damping material (3), wherein this vibration damping material (3) is covered with said micron or nano-structured first structural detail (2).
9. by the described member of claim 8, it is characterized in that said vibration damping material (3) is the combination gel especially of gel, foam, pellet, elastomer or these materials.
10. by claim 8 or 9 described members, it is characterized in that said vibration damping material (3) partly or completely is covered with the zone (1b) of said flexibility extraly.
11. by each described member in the claim 8 to 10; It is characterized in that the subregion that the zone with said flexibility (1b) of the perimeter (1c) of said vibration damping material (3) zone (1b) and the said rigidity with subregion said micron or nano-structured first structural detail (2) adjacency and said flexibility that be covered with said micron or nano-structured first structural detail (2) and be covered with said rigid internal zone (1a) in case of necessity surrounds.
12., it is characterized in that said micron or nano-structured first structural detail (2) are covered by the cover layer that is made up of encapsulate substances (6) with said vibration damping material (3) by each described member in the claim 8 to 11.
13. by each described member in the claim 8 to 12; It is characterized in that; Said in addition member comprises that especially frame structure (17b) or stream end structure (17a) for shaped structure (17a, 17b) on the perimeter (1c) that is configured in said rigidity; Said shaped structure (17a, 17b) so is configured on the perimeter (1c) of said rigidity, makes this shaped structure (17a, 17b) surround the subregion with zone said flexibility (1b) adjacency (1c), the perimeter of zone (1b) or said rigidity of said flexibility.
14. by each described member in the claim 8 to 13; It is characterized in that; The zone of said flexibility (1b) comprises at least one especially corrugated printed conductor (7), and this printed conductor (7) makes said rigid internal zone (1a) carry out electric the contact with the perimeter (1c) of said rigidity.
15. by each described member in the claim 8 to 14; It is characterized in that said micron or the nano-structured especially said micron of first (2) and/or second (5) structural detail or nano-structured first structural detail (2) are from by selecting peculiar integrated circuit, sensor element and these systems, circuit of system, the application scheme of micron or nano-electromechanical and the group that combination of elements constituted.
CN2011101863067A 2010-07-06 2011-07-05 Be used to make the method for the member of vibration damping Pending CN102311092A (en)

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Application publication date: 20120111