CN102308395B - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN102308395B
CN102308395B CN200980156321.8A CN200980156321A CN102308395B CN 102308395 B CN102308395 B CN 102308395B CN 200980156321 A CN200980156321 A CN 200980156321A CN 102308395 B CN102308395 B CN 102308395B
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China
Prior art keywords
semiconductor light
light emitting
insulating layer
wiring
package
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CN200980156321.8A
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Chinese (zh)
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CN102308395A (zh
Inventor
乃一拓也
冈田勇一
三木孝仁
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Nichia Corp
Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8582Means for heat extraction or cooling characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8583Means for heat extraction or cooling not being in contact with the bodies

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  • Led Device Packages (AREA)
CN200980156321.8A 2009-02-10 2009-10-14 半导体发光装置 Active CN102308395B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009028687A JP4780203B2 (ja) 2009-02-10 2009-02-10 半導体発光装置
JP2009-028687 2009-02-10
PCT/JP2009/067766 WO2010092707A1 (ja) 2009-02-10 2009-10-14 半導体発光装置

Publications (2)

Publication Number Publication Date
CN102308395A CN102308395A (zh) 2012-01-04
CN102308395B true CN102308395B (zh) 2014-04-09

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CN200980156321.8A Active CN102308395B (zh) 2009-02-10 2009-10-14 半导体发光装置

Country Status (8)

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US (1) US8759867B2 (enrdf_load_stackoverflow)
EP (1) EP2398072B1 (enrdf_load_stackoverflow)
JP (1) JP4780203B2 (enrdf_load_stackoverflow)
CN (1) CN102308395B (enrdf_load_stackoverflow)
CA (1) CA2751818C (enrdf_load_stackoverflow)
RU (1) RU2473152C1 (enrdf_load_stackoverflow)
TW (1) TWI440229B (enrdf_load_stackoverflow)
WO (1) WO2010092707A1 (enrdf_load_stackoverflow)

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CN104813492B (zh) * 2013-04-30 2016-05-04 创光科学株式会社 紫外线发光装置
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
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TWI513053B (zh) * 2013-10-01 2015-12-11 Prolight Opto Technology Corp 發光二極體封裝結構
TWI517446B (zh) * 2013-10-01 2016-01-11 葳天科技股份有限公司 發光二極體發光增益結構
JP6435705B2 (ja) * 2013-12-27 2018-12-12 日亜化学工業株式会社 集合基板、発光装置及び発光素子の検査方法
US11480305B2 (en) 2014-09-25 2022-10-25 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
US10560989B2 (en) 2014-09-28 2020-02-11 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
CN205961494U (zh) 2014-09-28 2017-02-15 嘉兴山蒲照明电器有限公司 Led直管灯
JP6547548B2 (ja) * 2014-10-31 2019-07-24 日亜化学工業株式会社 発光装置及び配光可変ヘッドランプシステム
JP6492587B2 (ja) * 2014-11-29 2019-04-03 日亜化学工業株式会社 発光装置
US12264789B2 (en) 2014-12-05 2025-04-01 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US10514134B2 (en) 2014-12-05 2019-12-24 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US9897265B2 (en) 2015-03-10 2018-02-20 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp having LED light strip
US11519565B2 (en) 2015-03-10 2022-12-06 Jiaxing Super Lighting Electric Appliance Co., Ltd LED lamp and its power source module
US11028973B2 (en) 2015-03-10 2021-06-08 Jiaxing Super Lighting Electric Appliance Co., Ltd. Led tube lamp
TWI567928B (zh) * 2015-04-29 2017-01-21 光寶光電(常州)有限公司 發光二極體封裝結構
US10412829B2 (en) * 2015-08-03 2019-09-10 Soko Kagaku Co., Ltd. Nitride semiconductor light-emitting element base and manufacturing method thereof
JP6327232B2 (ja) * 2015-10-30 2018-05-23 日亜化学工業株式会社 発光装置及び発光モジュールの製造方法
US11035526B2 (en) 2015-12-09 2021-06-15 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
US10559722B2 (en) 2016-04-26 2020-02-11 Citizen Electronics Co., Ltd. Light-emitting device
US10283688B2 (en) * 2016-08-22 2019-05-07 Nichia Corporation Light emitting device
US10074785B2 (en) * 2016-11-18 2018-09-11 Nichia Corporation Light-emitting device
JP6583247B2 (ja) 2016-12-21 2019-10-02 日亜化学工業株式会社 発光装置
JP1594174S (enrdf_load_stackoverflow) * 2017-07-25 2018-01-09
JP6677232B2 (ja) * 2017-09-29 2020-04-08 日亜化学工業株式会社 発光装置の製造方法
JP7239804B2 (ja) * 2018-08-31 2023-03-15 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
JP7206475B2 (ja) 2018-08-31 2023-01-18 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

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Also Published As

Publication number Publication date
EP2398072B1 (en) 2019-01-16
US20110291154A1 (en) 2011-12-01
JP4780203B2 (ja) 2011-09-28
CA2751818C (en) 2016-02-16
RU2473152C1 (ru) 2013-01-20
TWI440229B (zh) 2014-06-01
CN102308395A (zh) 2012-01-04
WO2010092707A1 (ja) 2010-08-19
CA2751818A1 (en) 2010-08-19
EP2398072A4 (en) 2014-10-29
EP2398072A1 (en) 2011-12-21
US8759867B2 (en) 2014-06-24
JP2010186814A (ja) 2010-08-26
TW201031031A (en) 2010-08-16

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