CN102263069A - 电路模块 - Google Patents

电路模块 Download PDF

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CN102263069A
CN102263069A CN2011100944207A CN201110094420A CN102263069A CN 102263069 A CN102263069 A CN 102263069A CN 2011100944207 A CN2011100944207 A CN 2011100944207A CN 201110094420 A CN201110094420 A CN 201110094420A CN 102263069 A CN102263069 A CN 102263069A
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components
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substrate
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CN102263069B (zh
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高井清文
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Murata Manufacturing Co Ltd
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Abstract

本发明提供一种能在绝缘树脂层填充后，对安装元器件与电路基板之间是否产生气泡进行检查，从而能可靠地防止有气泡的不合格品出厂的电路模块。芯片元件(31)经由外部电极(35)，安装于安装电极(29)。此时，芯片元件的剖面(41)配置成朝向电路模块(20)的、形成有安装电极(29)的端部一侧的侧面。另外，在芯片元件(31)的基体(33)的底面与电路基板(21)的表面之间，构成有可从外部进行观察的间隙(34)。

Description

电路模块
技术领域
本发明涉及一种包括表面装载有安装元器件的电路基板、以及覆盖该安装元器件的绝缘层的电路模块，特别涉及能对向安装元器件与电路基板之间填充的绝缘树脂层的填充性进行确认的电路模块。
背景技术
作为现有的电路模块的结构，例如，已知有专利文献1中所揭示的电路模块。图6表示该电路模块的剖视图。在图6中，电路模块10由内部含有由过孔和面内布线电极所构成的电极图案的电路基板12、装载于电路基板12的一个主面上的安装元器件11、13、15、17、以及形成于所述主面上以对这些安装元器件进行覆盖的绝缘树脂层19构成。
安装元器件11、13、15、17利用焊接结合或热压接等方法装载于电路基板12的一个主面上，与电路基板12内部的电极图案相连接。例如，安装元器件11、15、17经由连接导体14装载于电路基板12上。此时，在安装元器件11、15、17的底面与电路基板12的一个主面之间，在不存在连接导体14的部分上，留出有相当于连接导体14的高度大小的间隙。
形成绝缘树脂层19，以对包括上述间隙在内的整个安装元器件11、13、15、17进行覆盖。绝缘树脂层19具有加固电子元器件与电路基板之间的机械连接并防止因来自外部的冲击而导致安装元器件损坏的作用。
专利文献1：日本专利特开2006-203652
然而，在上述电路模块10中，为了降低模块的高度，多数情况下将连接导体14设计得较低。因而，安装元器件与电路基板之间的间隙高度也会变得非常低(几十微米左右)。
因此，当在电路基板12上形成绝缘树脂层19时，有时存在未充分填充至间隙内部而随机残留有气泡的情况。若像这样残留有气泡，则当一边利用回流等施加温度，一边将电路模块焊接结合于印刷布线基板等上时，会产生如下问题：引起气泡热膨胀，从而使绝缘树脂层或安装元器件产生裂纹。
另外，若该气泡中残留有水分，或水分逐渐通过绝缘树脂层19而积聚在气泡内，则还存在如下问题：安装元器件的外部电极发生腐蚀。
当然，还存在因气泡的存在而导致安装元器件11、15、17与电路基板12之间的机械连接力降低的缺点。
发明内容
本发明是鉴于上述问题点而完成的，其目的在于，提供一种能在绝缘树脂层填充后对安装元器件与电路基板之间是否存在气泡进行检查、从而能可靠地防止有气泡的不合格品出厂的电路模块。
本发明所涉及的电路模块包括内部包含电极图案的基板、安装于所述基板的一个主面上的安装元器件、以及形成为使得对所述安装元器件进行覆盖的绝缘树脂层，在所述电路模块中，在所述基板的一个主面的端部形成有安装电极，并且包括对电子元器件进行切断而形成的芯片元件，所述电子元器件包括利用浸渍法形成于两端面的、成为折回电极的外部电极，所述芯片元件经由所述外部电极安装于所述安装电极，使得所述芯片元件的剖面朝向所述电路模块的形成有所述安装电极的端部一侧的侧面。
在这种情况下，芯片元件在电路模块的端面上被切断，并且能将芯片元件与电路基板之间的间隙提高相当于折回电极的厚度的大小。因此，能从电路模块的外侧对间隙中的绝缘树脂层是否存在气泡进行检查。
另外，本发明所涉及的电路模块优选包括：与接地连接的安装电极；芯片元件，该芯片元件是通过对具有与外部电极导通的内部电极的电子元器件进行切断以使内部电极的至少一部分露出而形成的；以及屏蔽导电层，该屏蔽导电层形成为使得在所述芯片元件的剖面处与所述内部电极所露出的一部分导通，并对绝缘树脂层进行覆盖。
在这种情况下，由于利用与接地连接的屏蔽导电层对基板上的安装元器件进行覆盖，因此，能阻止因来自外部的电磁场和静电而使安装元器件受到影响。
另外，本发明所涉及的电路模块优选包括两个以上的安装电极及安装于该安装电极的芯片元件。
在这种情况下，由于电路模块上安装有多个芯片元件，因此，能更可靠地对是否存在气泡进行检查。
根据本发明，能在包括表面装载有安装元器件的电路基板、以及对这些安装元器件进行覆盖的绝缘树脂层的电路模块中，可靠地对绝缘树脂层是否残留有气泡进行检测。由此，能提高出厂的电路模块的可靠性。
附图说明
图1是本发明的实施方式1所涉及的电路模块的剖视图。
图2是本发明的实施方式1中所使用的电子元器件的剖视图。
图3是本发明的实施方式2所涉及的电路模块的剖视图。
图4是本发明的实施方式2中所使用的电子元器件的剖视图。
图5是对本发明的实施方式2所涉及的电路模块的制造方法进行说明的工序说明图。
图6是现有的高频模块的剖视图。
具体实施方式
下面，参照附图，对本发明的实施方式进行详细说明。
(实施方式1)
图1表示本发明的实施方式1所涉及的电路模块的剖视图。作为一个例子，电路模块20包括呈10.0mm×10.0mm×1.2mm的长方体形状的电路基板21、作为装载于电路基板21的表面的半导体元件的表面安装型的安装元器件23、25、以及芯片元件31。该芯片元件31的详细结构将在后文中阐述。
此外，根据电路模块的功能，除半导体元件以外，还可以使用电容器、电阻、SAW滤波器等作为安装元器件23、25。
作为电路基板21，可以使用主要由陶瓷材料所形成的陶瓷多层基板、以及主要由树脂材料所形成的树脂多层基板等。多层基板采用将形成有面内布线外，在芯片元件31的基体33的底面与电路基板21的表面之间，构成有可从外部进行观察的间隙34。
根据本实施方式的电路模块20，由于芯片元件31的剖面41与绝缘树脂层39的侧面相接近地进行配置，因此，能从绝缘树脂层39的外部对间隙34进行确认。而且，由于芯片元件31具有折回部35a，因此，能将间隙34的高度构成为比间隙24要高相当于折回部35a的厚度的大小，从而能使确认间隙34处是否产生气泡变得容易。
由于采用了如上所述的结构，因此，能在形成绝缘树脂层39之后，可靠地对电路模块20是否存在气泡进行检测。
此外，在本实施例的方式中，在电路模块基板上只安装有一个芯片元件31，但也可以在电路基板上安装多个芯片元件31。而且，通过同时在电路基板上的不同端部上安装芯片元件31，从而能更可靠地对是否存在气泡进行检测。
(实施方式2)
图3表示本发明的实施方式2所涉及的电路模块的剖视图。电路模块40中，在绝缘树脂层39的表面形成有屏蔽导电层43。屏蔽导电层43经由由芯片元件31a、过孔、以及面内布线电极所构成的电极图案47，与外部接地电极28相连接。由于其他的结构与本发明的实施方式1相同，因此省略说明。
图4(A)中示出了电子元器件30a的剖视图。电子元器件30a在基体33的内部形成有内部电极45，这一点不同于实施方式1所示的电子元器件30。切断该电子元器件30a，从而形成芯片元件31a。
内部电极45a、45c、45e与外部电极35相连接，内部电极45b、45d与外部电极36相连接。电子元器件30a的内部电极45a～45e彼此部分重叠，与所谓的层叠型电容器构造相同。
沿着与基体33的端面平行的方向(图4(A)中的箭头方向)切断电子元器件30a使其只具有一个外部电极(例如外部电极35)，以形成芯片元件31a。
与实施方式1相同，在从集成基板切出电路基板21的同时，对电子元器件30a进行切断。
图4(B)中示出了从正面对芯片元件31a的剖面41进行观察的图。将内部电极45与基体33一起切断，从而使内部电极45a～45e露出至剖面41的表面。
安装于安装电极29的上方的芯片元件31a的剖面41从绝缘树脂层39露出。
屏蔽导电层43形成于电路基板21的上方，使得对绝缘树脂层39的表面进行覆盖，并与芯片元件31a的剖面41相接。因此，屏蔽导电层43与芯片元件31a的内部电极45a～45e电连接。
对于屏蔽导电层43，例如使用含有导电性组分的导电性树脂。导电性树脂所包含的导电性组分(填料)例如为Ag、Cu、Ni等，包含导电性组分的合成树脂(粘合剂)例如为环氧树脂、酚醛树脂、聚氨酯树脂、硅树脂、聚酯树脂、丙烯酸树脂、聚酰亚胺树脂等。
另一方面，在电路基板21的底面，形成有外部接地电极28。接地电极28在电路基板内部，经由由过孔和面内布线电极所构成的电极图案47，与连接芯片元件31a的安装电极29电连接。因而，屏蔽导电层43通过由内部电极45a、45c、45e、外部电极35、安装电极29、以及电极图案47所构成的路径，与外部接地电极28电连接。
根据本实施方式的电路模块40，在电路基板21的表面形成有与外部接地电极28相连接的屏蔽导电层43，使得对绝缘树脂层39进行覆盖。利用这种结构，除了本发明的实施方式1中所述的效果以外，由于电路基板上的安装元器件完全被屏蔽导电层43所覆盖，因此，还能实现防止来自外部的电磁波噪声对电路模块造成影响的屏蔽效果。
此外，对于本实施例中的电子元器件30a，使用了层叠型电容器，但用于实现本实施例的屏蔽效果的电子元器件30a只要具有露出至剖面41并与外部电极相连接的内部电极即可，也可以使用层叠型电感器、层叠型片状电阻等来代替层叠型电容器。
接着，参照图5，对实施方式2所涉及的电路模块40的制造方法进行说明。此外，省略对图5中与图3相对应的部分的详细说明。
图5是用于对本发明的电路模块40的制造方法进行说明的剖视图。图5(a)表示在集成基板22的表面安装有安装元器件23、25和电子元器件30a的状态，图5(b)表示在集成基板22的表面形成有绝缘树脂层39使得对安装元器件23、25和电子元器件30a进行覆盖的状态，图5(c)表示在形成绝缘树脂层39之后，形成切口部32的状态，图5(d)表示形成屏蔽导电层43的状态，图5(e)表示集成基板22被完全分割的状态。
以陶瓷多层基板作为电路基板21为例，进行说明。通过对每一所需片材堆叠预定片数的设有规定图案的过孔或面内布线电极的陶瓷生片并进行烧成，从而能获得由表面和底面具有接合焊盘(未图示)和安装电极29的陶瓷多层基板构成的集成基板22。
接着，图5(a)是表示在集成基板22的表面安装有安装元器件23、25和电子元器件30a的状态的剖视图。
在利用丝网印刷等对集成基板22的表面的接合焊盘提供焊料之后，装载安装元器件23、25和电子元器件30a，然后，将其投入回流炉以使焊料熔融、固化，从而将安装元器件23、25和电子元器件30a安装于陶瓷多层基板。
接着，图5(b)是表示在集成基板22的表面形成有绝缘树脂层39使得对安装元器件23、25和电子元器件30a进行覆盖的状态的剖视图。绝缘树脂层利用传递模塑法、灌注法、真空印刷法等形成。
接着，图5(c)是表示在形成绝缘树脂层39之后形成切口部32的状态的剖视图。在作为电路模块40而进行切割的边界部分，利用刀片等形成沟状的切口部32，直至预定的深度为止。形成该切口部32，从而使间隙34露出至绝缘树脂层39的侧面。这里，通过对间隙34进行确认，能确认绝缘树脂层39内是否存在气泡。
此外，只要切口部的深度是使间隙34露出的大小，则切口部也可以止于绝缘树脂层的中途，也可以形成为直至到达集成基板22的中途的深度为止。
接着，图5(d)是表示形成屏蔽导电层43的状态的剖视图。利用点胶机、真空印刷装置、旋涂机等，包括切口部32在内，涂布屏蔽导电层43。此时，屏蔽导电层43与芯片元件31a的内部电极45相连接。另外，如图5(d)所示，通过涂布屏蔽导电层43以充分填充切口部32，从而能提高屏蔽性。
最后，图5(e)是表示集成基板22被完全分割的状态的剖视图。在形成屏蔽导电层43之后，利用刀片等进一步切割切口部32，从而将集成基板22分割成各个电路模块40。
此外，在制作实施方式1所示的不具有屏蔽导电层的电路模块20时，在电极的基板进行堆叠的结构，各层间的面内布线电极与安装元器件23、25通过过孔相连接。
安装元器件23、25利用焊接结合，与形成于电路基板21的表面的接合焊盘(未图示)相连接。此时，在安装元器件23、25的底面与电路基板21的表面之间构成间隙24，其高度相当于焊料的高度大小。
另外，在电路基板21的表面上形成有绝缘树脂层39，使得对安装元器件23、25、以及芯片元件31进行覆盖。此时，绝缘树脂层39也填充至间隙24中。利用绝缘树脂层39，能对安装元器件23、25和芯片元件31与电路基板21的连接进行加固，并能保护安装元器件23、25和芯片元件31免受外部环境的影响。
作为绝缘树脂层39，优选使用环氧树脂等热固化树脂，为了对强度、介电常数、温度特性、以及粘性等进行控制，也可以使用其中含有陶瓷等填料组分的材料。
在电路基板21的底面上形成有外部连接电极27，该外部连接电极27经由电路基板21内部的电极图案(未图示)与所述接合焊盘相连接。
在电路基板21的表面的一个端部形成有安装电极29，芯片元件31利用焊接接合与安装电极29相连接。
接下来，对芯片元件31进行详细说明。
图2表示电子元器件30的剖视图。电子元器件30由基体33和外部电极35、36构成。切断该电子元器件30，从而形成芯片元件31。利用在将基体33的端部浸渍于流动性的导电性材料之后、提起基体的浸渍法，形成外部电极35、36。通过利用浸渍法来形成，从而外部电极35、36成为具有从基体33的端面延伸至基体的两个侧面以及上表面和下表面的折回部35a、36a的折回电极。
沿着与基体33的端面平行的方向(图2中的箭头方向)切断电子元器件30使其只具有一个外部电极(例如外部电极35)，以形成芯片元件31。在从集成基板切出电路基板21的同时，对电路元器件30进行切断。
芯片元件31经由外部电极35，安装于安装电极29。此时，芯片元件的剖面41配置成朝向电路模块20的、形成有安装电极29的端部一侧的侧面。另图5(c)的时刻，形成切口部32至集成基板22的底面为止，由此，将集成基板22分割成各个电路模块20。
标号说明
20、40  电路模块
12、21  电路基板
22      集成基板
28      外部接地电极
30、30a 电子元器件
35、36  外部电极
35a、36a折回电极
45      内部电极
23、25  安装元器件
31、31a 芯片元件
24、34  间隙
19、39  绝缘树脂层
43      屏蔽导电层

Claims (4)

1.一种电路模块，包括基板、安装于所述基板的一个主面上的安装元器件、以及形成为使得对所述安装元器件进行覆盖的绝缘层，其特征在于，
在所述基板的一个主面的端部形成有安装电极，并且
包括对电子元器件进行切断而形成的芯片元件，所述电子元器件包括形成于两端面的、成为折回电极的外部电极，
所述芯片元件经由所述外部电极安装于所述安装电极，使得所述芯片元件的剖面朝向所述电路模块的形成有所述安装电极的端部一侧的侧面。
2.如权利要求1所述的电路模块，其特征在于，包括：
与接地连接的所述安装电极；
芯片元件，该芯片元件是通过对具有与所述外部电极导通的内部电极的电子元器件进行切断以使所述内部电极的至少一部分露出而形成的；以及
屏蔽导电层，该屏蔽导电层形成为使得在所述剖面处与所述内部电极所露出的一部分导通，并对所述绝缘层进行覆盖。
3.如权利要求1或2所述的电路模块，其特征在于，
包括两个以上的所述安装电极、以及表面安装于该安装电极的所述芯片元件。
4.一种电路模块的制造方法，其特征在于，包括：
准备集成基板的工序，所述集成基板形成有多个在一个主面上安装有安装元器件的基板；
横跨所述基板的边界部分，将电子元器件安装于所述集成基板的一个主面上的工序，所述电子元器件包括成为折回电极的外部电极、以及与所述外部电极导通的内部电极；
覆盖所述安装元器件和所述电子元器件，在所述集成基板的所述主面上形成绝缘层的工序；
对所述电子元器件进行切断以使所述内部电极露出，从而形成切口部的工序，所述切口部从所述绝缘层的顶面起，直到所述电子元器件的底面与所述集成基板的一个主面之间的绝缘层、或所述集成基板的内部为止；以及
覆盖所述切口部和所述绝缘层的顶面，形成与所述内部电极导通的屏蔽导电层的工序。
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