CN102257437A - 预对准装置以及预对准方法 - Google Patents
预对准装置以及预对准方法 Download PDFInfo
- Publication number
- CN102257437A CN102257437A CN2010800023893A CN201080002389A CN102257437A CN 102257437 A CN102257437 A CN 102257437A CN 2010800023893 A CN2010800023893 A CN 2010800023893A CN 201080002389 A CN201080002389 A CN 201080002389A CN 102257437 A CN102257437 A CN 102257437A
- Authority
- CN
- China
- Prior art keywords
- substrate
- prealignment
- foreign matter
- preservation portion
- conveyance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Toxicology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009267917 | 2009-11-25 | ||
JP2009-267917 | 2009-11-25 | ||
PCT/JP2010/070933 WO2011065380A1 (ja) | 2009-11-25 | 2010-11-24 | プリアライメント装置及びプリアライメント方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102257437A true CN102257437A (zh) | 2011-11-23 |
CN102257437B CN102257437B (zh) | 2014-05-28 |
Family
ID=44066485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080002389.3A Active CN102257437B (zh) | 2009-11-25 | 2010-11-24 | 预对准装置以及预对准方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JPWO2011065380A1 (zh) |
KR (1) | KR101408521B1 (zh) |
CN (1) | CN102257437B (zh) |
TW (1) | TWI428707B (zh) |
WO (1) | WO2011065380A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105549239A (zh) * | 2016-03-03 | 2016-05-04 | 武汉华星光电技术有限公司 | 精密测长机的遮蔽装置 |
CN106249446A (zh) * | 2016-07-20 | 2016-12-21 | 武汉华星光电技术有限公司 | 测试平台及具有所述测试平台的测长机 |
CN108231644A (zh) * | 2016-12-09 | 2018-06-29 | 亚威科股份有限公司 | 掩膜对准装置用基板升降装置 |
WO2019047244A1 (zh) * | 2017-09-11 | 2019-03-14 | 深圳市柔宇科技有限公司 | 机械手臂、曝光机前单元和温度控制方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102914951B (zh) * | 2011-08-04 | 2014-11-12 | 上海微电子装备有限公司 | 用于光刻设备的预对准装置 |
NL2009533A (en) * | 2011-10-27 | 2013-05-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
JP6735155B2 (ja) * | 2016-05-31 | 2020-08-05 | 株式会社オーク製作所 | 露光装置 |
JP7296740B2 (ja) * | 2019-02-04 | 2023-06-23 | 東京エレクトロン株式会社 | 基板処理装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126739A (ja) * | 1997-10-23 | 1999-05-11 | Nec Corp | 荷電粒子線露光装置 |
JP2005311113A (ja) * | 2004-04-22 | 2005-11-04 | Nikon Corp | 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法 |
JP2007040682A (ja) * | 2005-07-29 | 2007-02-15 | Katsuyuki Kihira | 立体型換気扇フィルター |
CN101344570A (zh) * | 2007-07-10 | 2009-01-14 | 东京毅力科创株式会社 | 检查方法和记录有检查方法的程序记录介质 |
WO2009040241A2 (en) * | 2007-09-26 | 2009-04-02 | International Business Machines Corporation | Method and apparatus for measurement and control of photomask to substrate alignment |
JP2009198794A (ja) * | 2008-02-21 | 2009-09-03 | Nsk Ltd | 近接露光装置及び異物検出方法並びに基板の製造方法 |
US20090263750A1 (en) * | 2008-04-17 | 2009-10-22 | Canon Kabushiki Kaisha | Foreign particle inspection apparatus, exposure apparatus, and method of manufacturing device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3668294B2 (ja) * | 1995-08-22 | 2005-07-06 | オリンパス株式会社 | 表面欠陥検査装置 |
JPH11337504A (ja) * | 1998-05-26 | 1999-12-10 | Central Glass Co Ltd | ガラス板の欠陥識別検査方法および装置 |
JP4002429B2 (ja) * | 2001-12-18 | 2007-10-31 | 株式会社日立ハイテクノロジーズ | 異物検査機能を備えた露光装置及びその装置における異物検査方法 |
JP3816426B2 (ja) * | 2002-09-09 | 2006-08-30 | 株式会社ルネサステクノロジ | プロセス処理装置 |
JP2004309266A (ja) * | 2003-04-04 | 2004-11-04 | Horiba Ltd | 異物検査装置および異物検査方法 |
JP2005032906A (ja) * | 2003-07-10 | 2005-02-03 | Nikon Corp | ウェハローダ及び露光装置 |
JP4314091B2 (ja) * | 2003-10-03 | 2009-08-12 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
JP4020261B2 (ja) * | 2003-11-05 | 2007-12-12 | 株式会社日立ハイテクノロジーズ | 露光方法、露光装置、及び基板製造方法 |
JP4626976B2 (ja) * | 2005-01-14 | 2011-02-09 | 株式会社日立ハイテクノロジーズ | 基板検査装置及び基板検査方法 |
JP2007010502A (ja) * | 2005-06-30 | 2007-01-18 | Sunx Ltd | 異物検出装置 |
JP4748353B2 (ja) * | 2005-08-04 | 2011-08-17 | 大日本印刷株式会社 | 異物検査装置 |
JP2007071763A (ja) * | 2005-09-08 | 2007-03-22 | Opto One Kk | 検査用照明装置 |
JP5128065B2 (ja) * | 2005-12-06 | 2013-01-23 | 株式会社ニコン | 情報処理装置、デバイス製造処理システム、デバイス製造処理方法、プログラム |
JP5090725B2 (ja) * | 2006-12-20 | 2012-12-05 | 株式会社日立ハイテクノロジーズ | 異物検査装置 |
JP2009049060A (ja) * | 2007-08-14 | 2009-03-05 | Nikon Corp | 基板処理システム、基板処理方法、露光装置、露光方法及び電子部品の製造方法並びにデバイス製造方法 |
-
2010
- 2010-11-24 WO PCT/JP2010/070933 patent/WO2011065380A1/ja active Application Filing
- 2010-11-24 KR KR1020127013455A patent/KR101408521B1/ko active IP Right Grant
- 2010-11-24 CN CN201080002389.3A patent/CN102257437B/zh active Active
- 2010-11-24 JP JP2011543271A patent/JPWO2011065380A1/ja active Pending
- 2010-11-25 TW TW099140851A patent/TWI428707B/zh active
-
2015
- 2015-05-27 JP JP2015107219A patent/JP2015172774A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126739A (ja) * | 1997-10-23 | 1999-05-11 | Nec Corp | 荷電粒子線露光装置 |
JP2005311113A (ja) * | 2004-04-22 | 2005-11-04 | Nikon Corp | 位置合わせ装置と位置合わせ方法、搬送システムと搬送方法、及び露光システムと露光方法並びにデバイス製造方法 |
JP2007040682A (ja) * | 2005-07-29 | 2007-02-15 | Katsuyuki Kihira | 立体型換気扇フィルター |
CN101344570A (zh) * | 2007-07-10 | 2009-01-14 | 东京毅力科创株式会社 | 检查方法和记录有检查方法的程序记录介质 |
WO2009040241A2 (en) * | 2007-09-26 | 2009-04-02 | International Business Machines Corporation | Method and apparatus for measurement and control of photomask to substrate alignment |
JP2009198794A (ja) * | 2008-02-21 | 2009-09-03 | Nsk Ltd | 近接露光装置及び異物検出方法並びに基板の製造方法 |
US20090263750A1 (en) * | 2008-04-17 | 2009-10-22 | Canon Kabushiki Kaisha | Foreign particle inspection apparatus, exposure apparatus, and method of manufacturing device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105549239A (zh) * | 2016-03-03 | 2016-05-04 | 武汉华星光电技术有限公司 | 精密测长机的遮蔽装置 |
CN105549239B (zh) * | 2016-03-03 | 2019-07-16 | 武汉华星光电技术有限公司 | 精密测长机的遮蔽装置 |
CN106249446A (zh) * | 2016-07-20 | 2016-12-21 | 武汉华星光电技术有限公司 | 测试平台及具有所述测试平台的测长机 |
CN108231644A (zh) * | 2016-12-09 | 2018-06-29 | 亚威科股份有限公司 | 掩膜对准装置用基板升降装置 |
CN108231644B (zh) * | 2016-12-09 | 2021-11-19 | 亚威科股份有限公司 | 掩膜对准装置用基板升降装置 |
WO2019047244A1 (zh) * | 2017-09-11 | 2019-03-14 | 深圳市柔宇科技有限公司 | 机械手臂、曝光机前单元和温度控制方法 |
CN109789568A (zh) * | 2017-09-11 | 2019-05-21 | 深圳市柔宇科技有限公司 | 机械手臂、曝光机前单元和温度控制方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201126281A (en) | 2011-08-01 |
KR101408521B1 (ko) | 2014-06-17 |
JPWO2011065380A1 (ja) | 2013-04-18 |
KR20120088757A (ko) | 2012-08-08 |
WO2011065380A1 (ja) | 2011-06-03 |
CN102257437B (zh) | 2014-05-28 |
JP2015172774A (ja) | 2015-10-01 |
TWI428707B (zh) | 2014-03-01 |
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Owner name: NSK TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: NSK LTD. Effective date: 20120411 |
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Effective date of registration: 20120411 Address after: Tokyo, Japan Applicant after: NSK Technology Co.,Ltd. Address before: Tokyo, Japan Applicant before: NSK Ltd. |
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Address after: Kanagawa, Japan Patentee after: VN Systems Ltd. Address before: Tokyo, Japan Patentee before: NSK Technology Co.,Ltd. |
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Effective date of registration: 20160106 Address after: Kanagawa, Japan Patentee after: V TECHNOLOGY Co.,Ltd. Address before: Kanagawa, Japan Patentee before: VN Systems Ltd. |