CN102231313A - 利用金属并联的多层堆叠电感 - Google Patents
利用金属并联的多层堆叠电感 Download PDFInfo
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- CN102231313A CN102231313A CN2009102019092A CN200910201909A CN102231313A CN 102231313 A CN102231313 A CN 102231313A CN 2009102019092 A CN2009102019092 A CN 2009102019092A CN 200910201909 A CN200910201909 A CN 200910201909A CN 102231313 A CN102231313 A CN 102231313A
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- 239000002184 metal Substances 0.000 title claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 92
- 150000002739 metals Chemical class 0.000 title abstract 3
- 239000010410 layer Substances 0.000 claims description 62
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 4
- 239000000306 component Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
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Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN200910201909.2A CN102231313B (zh) | 2009-12-08 | 2009-12-08 | 利用金属并联的多层堆叠电感 |
US12/963,462 US8289118B2 (en) | 2009-12-08 | 2010-12-08 | Stacked inductor |
Applications Claiming Priority (1)
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CN200910201909.2A CN102231313B (zh) | 2009-12-08 | 2009-12-08 | 利用金属并联的多层堆叠电感 |
Publications (2)
Publication Number | Publication Date |
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CN102231313A true CN102231313A (zh) | 2011-11-02 |
CN102231313B CN102231313B (zh) | 2014-04-16 |
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CN200910201909.2A Active CN102231313B (zh) | 2009-12-08 | 2009-12-08 | 利用金属并联的多层堆叠电感 |
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US (1) | US8289118B2 (zh) |
CN (1) | CN102231313B (zh) |
Cited By (18)
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CN102446896A (zh) * | 2011-11-08 | 2012-05-09 | 上海华力微电子有限公司 | 一种盘旋式金属间电容结构及其布局 |
CN102569032A (zh) * | 2012-01-16 | 2012-07-11 | 中国科学院上海微系统与信息技术研究所 | 多层金属化薄膜叠加制作电感元件的方法 |
CN103474415A (zh) * | 2012-06-06 | 2013-12-25 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
DE102012018013A1 (de) | 2012-09-12 | 2014-03-13 | X-Fab Semiconductor Foundries Ag | Spiralförmige, integrierbare Spulen mit zentrischen Anschlüssen in planarer grabenisolierter Siliziumhalbleitertechnologie |
CN104715903A (zh) * | 2013-12-17 | 2015-06-17 | 三菱电机株式会社 | 电感器、mmic |
CN105493208A (zh) * | 2013-08-30 | 2016-04-13 | 高通股份有限公司 | 具有变化厚度的电感器 |
CN106208408A (zh) * | 2016-09-13 | 2016-12-07 | 苏州纳格光电科技有限公司 | 无线充电接收线圈及其制备方法 |
CN106856142A (zh) * | 2015-12-09 | 2017-06-16 | 中芯国际集成电路制造(上海)有限公司 | 电感结构及其制作方法 |
US9906318B2 (en) | 2014-04-18 | 2018-02-27 | Qualcomm Incorporated | Frequency multiplexer |
US10002700B2 (en) | 2013-02-27 | 2018-06-19 | Qualcomm Incorporated | Vertical-coupling transformer with an air-gap structure |
US10116285B2 (en) | 2013-03-14 | 2018-10-30 | Qualcomm Incorporated | Integration of a replica circuit and a transformer above a dielectric substrate |
CN109215979A (zh) * | 2018-10-17 | 2019-01-15 | 安徽安努奇科技有限公司 | 一种贴片式电感及其制作方法 |
CN109524216A (zh) * | 2019-01-10 | 2019-03-26 | 广西芯百特微电子有限公司 | 一种分布式绕线电感器件及装置 |
CN110137676A (zh) * | 2013-03-08 | 2019-08-16 | 纽卡润特有限公司 | 用于高效无线通信的多层引线结构 |
CN111512404A (zh) * | 2017-12-29 | 2020-08-07 | 朗姆研究公司 | 高功率射频螺旋线圈滤波器 |
CN111755415A (zh) * | 2019-03-26 | 2020-10-09 | 格芯公司 | 嵌入t线圈内的峰化电感器 |
CN113012909A (zh) * | 2021-03-01 | 2021-06-22 | 安徽安努奇科技有限公司 | 一种电感器 |
US11335999B2 (en) | 2009-03-09 | 2022-05-17 | Nucurrent, Inc. | Device having a multi-layer-multi-turn antenna with frequency |
Families Citing this family (18)
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US9673268B2 (en) | 2011-12-29 | 2017-06-06 | Intel Corporation | Integrated inductor for integrated circuit devices |
WO2013101249A1 (en) * | 2011-12-31 | 2013-07-04 | Intel Corporation | Fully integrated voltage regulators for multi-stack integrated circuit architectures |
US9431473B2 (en) | 2012-11-21 | 2016-08-30 | Qualcomm Incorporated | Hybrid transformer structure on semiconductor devices |
US9324490B2 (en) | 2013-05-28 | 2016-04-26 | Tdk Corporation | Apparatus and methods for vector inductors |
US9570222B2 (en) | 2013-05-28 | 2017-02-14 | Tdk Corporation | Vector inductor having multiple mutually coupled metalization layers providing high quality factor |
US9218903B2 (en) | 2013-09-26 | 2015-12-22 | International Business Machines Corporation | Reconfigurable multi-stack inductor |
US20160133375A1 (en) * | 2014-11-06 | 2016-05-12 | Morfis Semiconductor, Inc. | Coupling on-die inductors for radio-frequency applications |
US9735752B2 (en) | 2014-12-03 | 2017-08-15 | Tdk Corporation | Apparatus and methods for tunable filters |
DE102015203796A1 (de) * | 2015-03-03 | 2016-09-08 | Siemens Aktiengesellschaft | Verwendung und Anordnung von Pencake-Spulen zur drahtlosen Energieübertragung an Elektrofahrzeuge |
US11024454B2 (en) * | 2015-10-16 | 2021-06-01 | Qualcomm Incorporated | High performance inductors |
US10163558B2 (en) * | 2016-01-21 | 2018-12-25 | Globalfoundries Inc. | Vertically stacked inductors and transformers |
US10199157B2 (en) * | 2016-09-30 | 2019-02-05 | Intel IP Corporation | Stacked metal inductor |
US20180323765A1 (en) * | 2017-05-03 | 2018-11-08 | Qualcomm Incorporated | Compact scalable on-chip inductor-capacitor (lc) resonator using conformally distributed capacitors |
TWI632661B (zh) * | 2017-09-20 | 2018-08-11 | 瑞昱半導體股份有限公司 | 積體電感裝置 |
JP2019172074A (ja) * | 2018-03-28 | 2019-10-10 | マツダ株式会社 | 車両のシート取付構造 |
WO2020077928A1 (zh) | 2018-10-17 | 2020-04-23 | 安徽安努奇科技有限公司 | 贴片式电感及其制作方法 |
CN111653546A (zh) * | 2020-06-28 | 2020-09-11 | 华虹半导体(无锡)有限公司 | 电感器件及其制作方法 |
US11837884B2 (en) | 2020-12-17 | 2023-12-05 | Tennessee Technological University | Layered double-D coil for wireless power transfer systems |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3680627B2 (ja) * | 1999-04-27 | 2005-08-10 | 富士電機機器制御株式会社 | ノイズフィルタ |
DE19944741C2 (de) * | 1999-09-17 | 2001-09-13 | Siemens Ag | Monolitisch integrierter Transformator |
CN1153272C (zh) * | 2001-03-23 | 2004-06-09 | 华邦电子股份有限公司 | 具有高q值电感组件的半导体技术制造方法及其结构 |
ATE452412T1 (de) * | 2001-08-09 | 2010-01-15 | Nxp Bv | Planares induktives bauelement und flachtransformator |
US6924725B2 (en) * | 2002-03-21 | 2005-08-02 | Infineon Technologies Ag | Coil on a semiconductor substrate and method for its production |
US6759937B2 (en) * | 2002-06-03 | 2004-07-06 | Broadcom, Corp. | On-chip differential multi-layer inductor |
KR100637078B1 (ko) * | 2005-02-15 | 2006-10-23 | 삼성전자주식회사 | 절단형 병렬 적층 인덕터 |
GB0523969D0 (en) * | 2005-11-25 | 2006-01-04 | Zarlink Semiconductor Ltd | Inductivwe component |
US7656264B2 (en) * | 2006-10-19 | 2010-02-02 | United Microelectronics Corp. | High coupling factor transformer and manufacturing method thereof |
KR100862489B1 (ko) * | 2007-06-11 | 2008-10-08 | 삼성전기주식회사 | 스파이럴 인덕터 |
-
2009
- 2009-12-08 CN CN200910201909.2A patent/CN102231313B/zh active Active
-
2010
- 2010-12-08 US US12/963,462 patent/US8289118B2/en active Active
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11916400B2 (en) | 2009-03-09 | 2024-02-27 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
US11336003B2 (en) | 2009-03-09 | 2022-05-17 | Nucurrent, Inc. | Multi-layer, multi-turn inductor structure for wireless transfer of power |
US11335999B2 (en) | 2009-03-09 | 2022-05-17 | Nucurrent, Inc. | Device having a multi-layer-multi-turn antenna with frequency |
US11476566B2 (en) | 2009-03-09 | 2022-10-18 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
CN102446896A (zh) * | 2011-11-08 | 2012-05-09 | 上海华力微电子有限公司 | 一种盘旋式金属间电容结构及其布局 |
CN102569032A (zh) * | 2012-01-16 | 2012-07-11 | 中国科学院上海微系统与信息技术研究所 | 多层金属化薄膜叠加制作电感元件的方法 |
CN102569032B (zh) * | 2012-01-16 | 2014-05-28 | 中国科学院上海微系统与信息技术研究所 | 多层金属化薄膜叠加制作电感元件的方法 |
CN103474415A (zh) * | 2012-06-06 | 2013-12-25 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
CN103474415B (zh) * | 2012-06-06 | 2016-08-31 | 中芯国际集成电路制造(上海)有限公司 | 电感及其形成方法 |
DE102012018013A1 (de) | 2012-09-12 | 2014-03-13 | X-Fab Semiconductor Foundries Ag | Spiralförmige, integrierbare Spulen mit zentrischen Anschlüssen in planarer grabenisolierter Siliziumhalbleitertechnologie |
US10002700B2 (en) | 2013-02-27 | 2018-06-19 | Qualcomm Incorporated | Vertical-coupling transformer with an air-gap structure |
CN110137676A (zh) * | 2013-03-08 | 2019-08-16 | 纽卡润特有限公司 | 用于高效无线通信的多层引线结构 |
CN110137676B (zh) * | 2013-03-08 | 2023-12-26 | 纽卡润特有限公司 | 用于高效无线通信的多层引线结构 |
US10116285B2 (en) | 2013-03-14 | 2018-10-30 | Qualcomm Incorporated | Integration of a replica circuit and a transformer above a dielectric substrate |
CN105493208B (zh) * | 2013-08-30 | 2020-06-30 | 高通股份有限公司 | 具有变化厚度的电感器 |
US10354795B2 (en) | 2013-08-30 | 2019-07-16 | Qualcomm Incorporated | Varying thickness inductor |
CN105493208A (zh) * | 2013-08-30 | 2016-04-13 | 高通股份有限公司 | 具有变化厚度的电感器 |
CN104715903A (zh) * | 2013-12-17 | 2015-06-17 | 三菱电机株式会社 | 电感器、mmic |
US9906318B2 (en) | 2014-04-18 | 2018-02-27 | Qualcomm Incorporated | Frequency multiplexer |
CN106856142B (zh) * | 2015-12-09 | 2018-10-16 | 中芯国际集成电路制造(上海)有限公司 | 电感结构及其制作方法 |
CN106856142A (zh) * | 2015-12-09 | 2017-06-16 | 中芯国际集成电路制造(上海)有限公司 | 电感结构及其制作方法 |
CN106208408A (zh) * | 2016-09-13 | 2016-12-07 | 苏州纳格光电科技有限公司 | 无线充电接收线圈及其制备方法 |
CN111512404B (zh) * | 2017-12-29 | 2022-07-19 | 朗姆研究公司 | 高功率射频螺旋线圈滤波器 |
CN111512404A (zh) * | 2017-12-29 | 2020-08-07 | 朗姆研究公司 | 高功率射频螺旋线圈滤波器 |
CN109215979A (zh) * | 2018-10-17 | 2019-01-15 | 安徽安努奇科技有限公司 | 一种贴片式电感及其制作方法 |
CN109524216A (zh) * | 2019-01-10 | 2019-03-26 | 广西芯百特微电子有限公司 | 一种分布式绕线电感器件及装置 |
CN111755415A (zh) * | 2019-03-26 | 2020-10-09 | 格芯公司 | 嵌入t线圈内的峰化电感器 |
CN113012909A (zh) * | 2021-03-01 | 2021-06-22 | 安徽安努奇科技有限公司 | 一种电感器 |
Also Published As
Publication number | Publication date |
---|---|
CN102231313B (zh) | 2014-04-16 |
US8289118B2 (en) | 2012-10-16 |
US20110133879A1 (en) | 2011-06-09 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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