CN102224199A - 用于环氧树脂的固化剂 - Google Patents
用于环氧树脂的固化剂 Download PDFInfo
- Publication number
- CN102224199A CN102224199A CN2009801465643A CN200980146564A CN102224199A CN 102224199 A CN102224199 A CN 102224199A CN 2009801465643 A CN2009801465643 A CN 2009801465643A CN 200980146564 A CN200980146564 A CN 200980146564A CN 102224199 A CN102224199 A CN 102224199A
- Authority
- CN
- China
- Prior art keywords
- group
- alkyl
- independently selected
- epoxy
- alkylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 0 CCCC(C)(*c1ccccc1)c1ccccc1 Chemical compound CCCC(C)(*c1ccccc1)c1ccccc1 0.000 description 2
- AJOQOSTZMPSOOQ-UHFFFAOYSA-N CCCC(C)(C)N=C Chemical compound CCCC(C)(C)N=C AJOQOSTZMPSOOQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11632808P | 2008-11-20 | 2008-11-20 | |
US61/116,328 | 2008-11-20 | ||
PCT/US2009/064929 WO2010059683A2 (en) | 2008-11-20 | 2009-11-18 | Curing agents for epoxy resins |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102224199A true CN102224199A (zh) | 2011-10-19 |
CN102224199B CN102224199B (zh) | 2013-07-03 |
Family
ID=42198779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801465643A Expired - Fee Related CN102224199B (zh) | 2008-11-20 | 2009-11-18 | 用于环氧树脂的固化剂 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8278396B2 (zh) |
EP (1) | EP2358813B1 (zh) |
JP (1) | JP5685545B2 (zh) |
KR (1) | KR101761423B1 (zh) |
CN (1) | CN102224199B (zh) |
TW (1) | TWI488881B (zh) |
WO (1) | WO2010059683A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111032723A (zh) * | 2017-08-30 | 2020-04-17 | 沙特阿拉伯石油公司 | 基于氟化聚酰亚胺的环氧材料 |
CN111630086A (zh) * | 2017-10-31 | 2020-09-04 | 博里利斯股份公司 | 一种含环氧基和交联剂的可交联乙烯聚合物组合物 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101374365B1 (ko) * | 2010-12-27 | 2014-03-17 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
JP5936340B2 (ja) * | 2011-12-13 | 2016-06-22 | 日本合成化学工業株式会社 | エポキシ樹脂用硬化剤 |
JP6710972B2 (ja) * | 2014-11-17 | 2020-06-17 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグ、樹脂硬化物および繊維強化複合材料 |
JP2017082052A (ja) * | 2015-10-26 | 2017-05-18 | 住友ベークライト株式会社 | エポキシ樹脂組成物、及びこれを用いた半導体装置 |
JP6489274B1 (ja) * | 2018-08-10 | 2019-03-27 | 千住金属工業株式会社 | フラックス組成物、はんだペースト、はんだ接合部及びはんだ接合方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10265549A (ja) * | 1997-03-27 | 1998-10-06 | Toray Ind Inc | エポキシ樹脂組成物および半導体装置 |
CN1742031A (zh) * | 2003-01-23 | 2006-03-01 | 分解性能产品有限责任公司 | 环氧树脂组合物,其制备方法和由其制备的制品 |
JP2006137822A (ja) * | 2004-11-11 | 2006-06-01 | Idemitsu Kosan Co Ltd | エポキシ樹脂用硬化剤 |
CN1958719A (zh) * | 2006-11-30 | 2007-05-09 | 复旦大学 | 席夫碱型液晶环氧树脂及其制备方法和应用 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3395105A (en) * | 1964-10-06 | 1968-07-30 | Mc Donnell Douglas Corp | Epoxy systems containing encapsulated pressure fracturable curing agents |
US3598765A (en) * | 1967-05-04 | 1971-08-10 | Gen Tire And Rubber Co The | Process for polymerizing cyclic oxides with a catalyst consisting of an organozinc compound and another material |
DE2152237A1 (de) * | 1971-04-08 | 1972-10-19 | Veba Chemie Ag | Verfahren zur Herstellung von Polyaddukten |
CA1082229A (en) * | 1975-03-17 | 1980-07-22 | Robert A. Gardiner | Polyaminophenol epoxy resin curing agent |
CH621539A5 (zh) * | 1976-12-14 | 1981-02-13 | Ciba Geigy Ag | |
JPS5991117A (ja) * | 1982-10-12 | 1984-05-25 | チバ−ガイギ−・アクチエンゲゼルシヤフト | 熱硬化性エポキシ樹脂組成物 |
CN87101669A (zh) * | 1987-02-27 | 1988-09-07 | 项新 | 环氧树脂增韧性固化剂 |
JP2803055B2 (ja) * | 1989-12-04 | 1998-09-24 | 東芝ケミカル株式会社 | 成形用耐熱性樹脂組成物 |
JPH03271250A (ja) * | 1990-03-22 | 1991-12-03 | Teijin Ltd | 新規ヒドロキシカルボン酸誘導体及びその製法 |
US5591811A (en) * | 1995-09-12 | 1997-01-07 | Ciba-Geigy Corporation | 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins |
JP3630487B2 (ja) * | 1995-12-19 | 2005-03-16 | 旭化成ケミカルズ株式会社 | 水性樹脂分散体組成物 |
JP2000038439A (ja) * | 1998-07-23 | 2000-02-08 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
JP3727591B2 (ja) * | 2000-05-16 | 2005-12-14 | サンスター技研株式会社 | 熱硬化性組成物 |
JP2007056152A (ja) * | 2005-08-25 | 2007-03-08 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物及びその硬化物 |
JP2009084360A (ja) * | 2007-09-28 | 2009-04-23 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物及び半導体装置 |
-
2009
- 2009-11-18 EP EP09828141.3A patent/EP2358813B1/en not_active Not-in-force
- 2009-11-18 CN CN2009801465643A patent/CN102224199B/zh not_active Expired - Fee Related
- 2009-11-18 JP JP2011537571A patent/JP5685545B2/ja not_active Expired - Fee Related
- 2009-11-18 KR KR1020117013605A patent/KR101761423B1/ko active IP Right Grant
- 2009-11-18 WO PCT/US2009/064929 patent/WO2010059683A2/en active Application Filing
- 2009-11-20 TW TW098139534A patent/TWI488881B/zh not_active IP Right Cessation
-
2011
- 2011-05-13 US US13/106,924 patent/US8278396B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10265549A (ja) * | 1997-03-27 | 1998-10-06 | Toray Ind Inc | エポキシ樹脂組成物および半導体装置 |
CN1742031A (zh) * | 2003-01-23 | 2006-03-01 | 分解性能产品有限责任公司 | 环氧树脂组合物,其制备方法和由其制备的制品 |
JP2006137822A (ja) * | 2004-11-11 | 2006-06-01 | Idemitsu Kosan Co Ltd | エポキシ樹脂用硬化剤 |
CN1958719A (zh) * | 2006-11-30 | 2007-05-09 | 复旦大学 | 席夫碱型液晶环氧树脂及其制备方法和应用 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111032723A (zh) * | 2017-08-30 | 2020-04-17 | 沙特阿拉伯石油公司 | 基于氟化聚酰亚胺的环氧材料 |
CN111630086A (zh) * | 2017-10-31 | 2020-09-04 | 博里利斯股份公司 | 一种含环氧基和交联剂的可交联乙烯聚合物组合物 |
Also Published As
Publication number | Publication date |
---|---|
WO2010059683A2 (en) | 2010-05-27 |
CN102224199B (zh) | 2013-07-03 |
EP2358813A2 (en) | 2011-08-24 |
KR101761423B1 (ko) | 2017-07-25 |
US20110213096A1 (en) | 2011-09-01 |
KR20110097835A (ko) | 2011-08-31 |
JP5685545B2 (ja) | 2015-03-18 |
WO2010059683A3 (en) | 2010-08-19 |
EP2358813B1 (en) | 2018-08-22 |
TW201030045A (en) | 2010-08-16 |
TWI488881B (zh) | 2015-06-21 |
US8278396B2 (en) | 2012-10-02 |
JP2012509391A (ja) | 2012-04-19 |
EP2358813A4 (en) | 2014-04-30 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HENKEL CORP. Free format text: FORMER OWNER: HENKEL US IP LLC Effective date: 20141120 Owner name: HENKEL US IP LLC Free format text: FORMER OWNER: HENKEL CORP. Effective date: 20141120 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141120 Address after: Dusseldorf Patentee after: HENKEL IP & HOLDING GmbH Address before: American Connecticut Patentee before: Henkel American Intellectual Property LLC Effective date of registration: 20141120 Address after: American Connecticut Patentee after: Henkel American Intellectual Property LLC Address before: American Connecticut Patentee before: Henkel Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20201118 |
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CF01 | Termination of patent right due to non-payment of annual fee |