CN102149761B - 低温固化的组合物 - Google Patents
低温固化的组合物 Download PDFInfo
- Publication number
- CN102149761B CN102149761B CN200980135081.3A CN200980135081A CN102149761B CN 102149761 B CN102149761 B CN 102149761B CN 200980135081 A CN200980135081 A CN 200980135081A CN 102149761 B CN102149761 B CN 102149761B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F122/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F122/36—Amides or imides
- C08F122/40—Imides, e.g. cyclic imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
- C08K5/3417—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8730608P | 2008-08-08 | 2008-08-08 | |
US61/087,306 | 2008-08-08 | ||
PCT/US2009/004568 WO2010016946A2 (en) | 2008-08-08 | 2009-08-10 | Low temperature curing compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102149761A CN102149761A (zh) | 2011-08-10 |
CN102149761B true CN102149761B (zh) | 2016-10-12 |
Family
ID=41664132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980135081.3A Active CN102149761B (zh) | 2008-08-08 | 2009-08-10 | 低温固化的组合物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110133330A1 (zh) |
JP (1) | JP5685533B2 (zh) |
KR (3) | KR20160113747A (zh) |
CN (1) | CN102149761B (zh) |
WO (1) | WO2010016946A2 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI454490B (zh) | 2011-12-30 | 2014-10-01 | Ind Tech Res Inst | 共聚物及其形成方法 |
US9018326B2 (en) | 2012-04-06 | 2015-04-28 | Ips Corporation | Adhesive composition for bonding low surface energy polyolefin substrates |
CN104995248B (zh) * | 2012-11-02 | 2017-12-08 | 株式会社普利司通 | 包含金属羧酸盐的橡胶组合物和其制备方法 |
TWI651387B (zh) * | 2013-09-30 | 2019-02-21 | 漢高智慧財產控股公司 | 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物 |
CN105900535B (zh) * | 2014-01-07 | 2019-06-07 | 三菱瓦斯化学株式会社 | 印刷线路板用绝缘层以及印刷线路板 |
CN106029803A (zh) * | 2014-02-24 | 2016-10-12 | 汉高知识产权控股有限责任公司 | 导热性预涂底部填充配制物及其用途 |
EP3207091B1 (en) | 2014-10-15 | 2019-09-18 | Bridgestone Corporation | Improved rubber compositions and uses thereof |
US10138351B2 (en) | 2014-10-15 | 2018-11-27 | Bridgestone Corporation | Rubber compositions and uses thereof |
KR102579981B1 (ko) | 2015-07-06 | 2023-09-18 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판 |
KR102502314B1 (ko) * | 2015-07-06 | 2023-02-21 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판 |
EP3362530A4 (en) * | 2015-10-15 | 2019-06-05 | Henkel IP & Holding GmbH | USE OF NICKEL AND ALLOYS CONTAINING NICKEL AS CONDUCTIVE LOADS IN ADHESIVE FORMULATIONS |
TWI826625B (zh) * | 2018-12-28 | 2023-12-21 | 美商帝克萊股份有限公司 | 耐高溫傳導性熱固型樹脂組合物 |
KR102601703B1 (ko) * | 2023-06-28 | 2023-11-13 | 최무근 | 목재보호용 도료 조성물 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1321715A (zh) * | 2000-04-14 | 2001-11-14 | 国家淀粉及化学投资控股公司 | 用于微电子器件的模片固定粘合剂 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3775364A (en) * | 1971-11-11 | 1973-11-27 | R Duggins | Process for curing methyl methacrylate in the presence of peroxy catalysts |
US4268597A (en) * | 1976-04-13 | 1981-05-19 | Philip A. Hunt Chemical Corp. | Method, apparatus and compositions for liquid development of electrostatic images |
US4269961A (en) * | 1977-10-25 | 1981-05-26 | Trw, Inc | Low temperature curable compliant bismaleimide compositions |
CH647249A5 (de) * | 1981-12-23 | 1985-01-15 | Ciba Geigy Ag | Lagerstabile, waermehaertbare, einen polymerisationskatalysator enthaltende mischungen auf polyimidbasis. |
US5296562A (en) * | 1987-05-08 | 1994-03-22 | Aristech Chemical Corporation | Incorporation of functional groups in polymers |
US4916210A (en) * | 1988-10-20 | 1990-04-10 | Shell Oil Company | Resin from alpha, alpha', alpha"-tris(4-cyanatophenyl)-1,3,5-triisopropylbenzene |
JPH082938B2 (ja) * | 1989-09-11 | 1996-01-17 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
KR100204629B1 (ko) * | 1991-04-04 | 1999-06-15 | 카나가와 치히로 | 열 경화성 수지 조성물 |
EP0570277B1 (en) * | 1992-05-13 | 1995-12-13 | Sartomer Company, Inc. | Method for adhering an elastomeric composition to a polar surface |
JPH06100633A (ja) * | 1992-09-18 | 1994-04-12 | Maruzen Petrochem Co Ltd | 熱硬化性樹脂組成物 |
US6034194A (en) * | 1994-09-02 | 2000-03-07 | Quantum Materials/Dexter Corporation | Bismaleimide-divinyl adhesive compositions and uses therefor |
US5789757A (en) * | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
US6194504B1 (en) * | 1997-04-28 | 2001-02-27 | Sartomer Technologies, Inc. | Process for compounding metal salts in elastomers |
US6265530B1 (en) * | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
US6461766B1 (en) * | 1998-08-27 | 2002-10-08 | Ovonic Battery Company, Inc. | Hydrogen storage powder and process for preparing the same |
US6187865B1 (en) * | 1998-12-16 | 2001-02-13 | Ludlow Composites Corporation | Rubber compositions and laminates thereof |
US6211320B1 (en) * | 1999-07-28 | 2001-04-03 | Dexter Corporation | Low viscosity acrylate monomers formulations containing same and uses therefor |
US6806309B2 (en) * | 2002-02-28 | 2004-10-19 | Henkel Corporation | Adhesive compositions containing organic spacers and methods for use thereof |
AU2003276729A1 (en) * | 2002-06-17 | 2003-12-31 | Henkel Corporation | Interlayer dielectric and pre-applied die attach adhesive materials |
DE102004044534B4 (de) * | 2004-07-01 | 2006-05-11 | Daimlerchrysler Ag | Verfahren zur Aushärtung von Lacken |
-
2009
- 2009-08-10 WO PCT/US2009/004568 patent/WO2010016946A2/en active Application Filing
- 2009-08-10 JP JP2011522072A patent/JP5685533B2/ja active Active
- 2009-08-10 KR KR1020167026170A patent/KR20160113747A/ko not_active Application Discontinuation
- 2009-08-10 CN CN200980135081.3A patent/CN102149761B/zh active Active
- 2009-08-10 KR KR1020187006005A patent/KR101990258B1/ko active IP Right Grant
- 2009-08-10 KR KR1020117005314A patent/KR20110045040A/ko not_active Application Discontinuation
-
2011
- 2011-02-15 US US13/027,747 patent/US20110133330A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1321715A (zh) * | 2000-04-14 | 2001-11-14 | 国家淀粉及化学投资控股公司 | 用于微电子器件的模片固定粘合剂 |
Also Published As
Publication number | Publication date |
---|---|
KR101990258B1 (ko) | 2019-06-17 |
KR20160113747A (ko) | 2016-09-30 |
JP5685533B2 (ja) | 2015-03-18 |
WO2010016946A3 (en) | 2010-05-14 |
CN102149761A (zh) | 2011-08-10 |
WO2010016946A2 (en) | 2010-02-11 |
JP2011530618A (ja) | 2011-12-22 |
KR20110045040A (ko) | 2011-05-03 |
KR20180026569A (ko) | 2018-03-12 |
US20110133330A1 (en) | 2011-06-09 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HENKEL CORP. Free format text: FORMER OWNER: HENKEL US IP LLC Effective date: 20141119 Owner name: HENKEL US IP LLC Free format text: FORMER OWNER: HENKEL CORP. Effective date: 20141119 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20141119 Address after: Dusseldorf Applicant after: HENKEL IP & HOLDING GmbH Address before: American Connecticut Applicant before: Henkel American Intellectual Property LLC Effective date of registration: 20141119 Address after: American Connecticut Applicant after: Henkel American Intellectual Property LLC Address before: American Connecticut Applicant before: Henkel Corp. |
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C14 | Grant of patent or utility model | ||
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Effective date of registration: 20220802 Address after: Dusseldorf Patentee after: HENKEL AG & Co.KGaA Address before: Dusseldorf Patentee before: HENKEL IP & HOLDING GmbH |