JPWO2017078157A1 - 接着剤組成物及び構造体 - Google Patents
接着剤組成物及び構造体 Download PDFInfo
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- JPWO2017078157A1 JPWO2017078157A1 JP2017549134A JP2017549134A JPWO2017078157A1 JP WO2017078157 A1 JPWO2017078157 A1 JP WO2017078157A1 JP 2017549134 A JP2017549134 A JP 2017549134A JP 2017549134 A JP2017549134 A JP 2017549134A JP WO2017078157 A1 JPWO2017078157 A1 JP WO2017078157A1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Abstract
Description
式(I)で表される構造を有するシラン化合物Aの有機基Xとしては、エチレン性不飽和結合含有基(エチレン性不飽和結合を含む基)、窒素原子含有基(窒素原子を含む基)、硫黄原子含有基(硫黄原子を含む基)、エポキシ基等が挙げられる。エチレン性不飽和結合含有基としては、(メタ)アクリロイル基、ビニル基、スチリル基等が挙げられる。窒素原子含有基としては、アミノ基、モノ置換アミノ基、ジ置換アミノ基、イソシアナート基、イミダゾール基、ウレイド基、マレイミド基等が挙げられる。モノ置換アミノ基としては、アルキルアミノ基(メチルアミノ基等)、ベンジルアミノ基、フェニルアミノ基、シクロアルキルアミノ基(シクロヘキシルアミノ基等)などが挙げられる。ジ置換アミノ基としては、非環状ジ置換アミノ基、環状ジ置換アミノ基等が挙げられる。非環状ジ置換アミノ基としては、ジアルキルアミノ基(ジメチルアミノ基等)などが挙げられる。環状ジ置換アミノ基としては、モルホリノ基、ピペラジノ基等が挙げられる。硫黄原子含有基としては、メルカプト基等が挙げられる。エポキシ基は、グリシジル基、グリシドキシ基等のエポキシ基含有基(エポキシ基を含む基)において含まれていてもよい。(メタ)アクリロイル基は、(メタ)アクリロイルオキシ基において含まれていてもよい。
(a)成分としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ナフタレン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールFノボラック型エポキシ樹脂、脂環式エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、脂肪族鎖状エポキシ樹脂等が挙げられる。(a)成分は、ハロゲン化されていてもよく、水素添加されていてもよい。(a)成分は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
(b)成分としては、エポキシ樹脂を硬化させることができるものであれば特に限定されない。(b)成分としては、熱又は光によりアニオン種を発生することができる硬化剤(アニオン重合性の触媒型硬化剤等)、熱又は光によりカチオン種を発生することができる硬化剤(カチオン重合性の触媒型硬化剤等)、重付加型の硬化剤などが挙げられる。(b)成分は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。(b)成分は、速硬化性に優れ、且つ、化学当量的な考慮が不要である観点から、熱又は光によりアニオン種又はカチオン種を発生することができる硬化剤が好ましく、アニオン重合性又はカチオン重合性の触媒型硬化剤がより好ましい。
(c)成分は、ラジカル重合可能な官能基を有する化合物である。(c)成分としては、(メタ)アクリレート化合物、マレイミド化合物、シトラコンイミド樹脂、ナジイミド樹脂等が挙げられる。「(メタ)アクリレート化合物」とは、(メタ)アクリロイル基を有する化合物を意味する。(c)成分は、モノマー又はオリゴマーの状態で用いてもよく、モノマーとオリゴマーとを併用することもできる。(c)成分は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
(d)成分としては、(d1)熱により遊離ラジカルを発生する硬化剤(以下、場合により「(d1)成分」という)、又は、(d2)光により遊離ラジカルを発生する硬化剤(以下、場合により「(d2)成分」という)を用いることができる。(d1)成分は、熱により分解して遊離ラジカルを発生する硬化剤である。(d1)成分としては、過酸化物(有機過酸化物等)、アゾ系化合物等が挙げられる。(d1)成分は、高反応性及びポットライフの向上の観点から、半減期10時間の温度が40℃以上、且つ、半減期1分の温度が180℃以下の有機過酸化物が好ましく、半減期10時間の温度が60℃以上、且つ、半減期1分の温度が170℃以下の有機過酸化物がより好ましい。
本実施形態の接着剤組成物は、必要に応じて、フィルム形成材を含有してもよい。フィルム形成材は、液状の接着剤組成物をフィルム状に固形化した場合に、通常の状態(常温常圧)でのフィルムの取扱い性を向上させ、裂け難い、割れ難い、べたつき難い等の特性をフィルムに付与することができる。フィルム形成材としては、フェノキシ樹脂、ポリビニルホルマール、ポリスチレン、ポリビニルブチラール、ポリエステル、ポリアミド、キシレン樹脂、ポリウレタン等が挙げられる。これらの中でも、接着性、相溶性、耐熱性及び機械的強度に優れる観点から、フェノキシ樹脂が好ましい。フィルム形成材は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本実施形態の接着剤組成物は、導電粒子を更に含有していてもよい。導電粒子の構成材料としては、金(Au)、銀(Ag)、ニッケル(Ni)、銅(Cu)、はんだ等の金属、カーボンなどが挙げられる。また、非導電性の樹脂、ガラス、セラミック、プラスチック等を核とし、この核に前記金属(金属粒子等)又はカーボンを被覆した被覆導電粒子でもよい。被覆導電粒子又は熱溶融金属粒子は、加熱加圧により変形性を有するため、接続時に回路電極の高さばらつきを解消し、接続時に電極との接触面積が増加することから信頼性が向上するため好ましい。
本実施形態の接着剤組成物は、必要に応じて、ハイドロキノン、メチルエーテルハイドロキノン類等の重合禁止剤を適宜含有してもよい。
本実施形態の構造体は、本実施形態の接着剤組成物又はその硬化物を備える。本実施形態の構造体は、例えば、回路接続構造体等の半導体装置である。本実施形態の構造体の一態様として、回路接続構造体は、第一の回路電極を有する第一の回路部材と、第二の回路電極を有する第二の回路部材と、第一の回路部材及び第二の回路部材の間に配置された回路接続部材と、を備える。第一の回路部材は、例えば、第一の基板と、当該第一の基板上に配置された第一の回路電極と、を有する。第二の回路部材は、例えば、第二の基板と、当該第二の基板上に配置された第二の回路電極と、を有する。第一の回路電極及び第二の回路電極は、相対向すると共に電気的に接続されている。回路接続部材は、本実施形態の接着剤組成物又はその硬化物を含んでいる。本実施形態に係る構造体は、本実施形態に係る接着剤組成物又はその硬化物を備えていればよく、前記回路接続構造体の回路部材に代えて、回路電極を有していない部材(基板等)を用いてもよい。
[実施例1]
ビスフェノールA型エポキシ樹脂と、分子内にフルオレン環構造を有するフェノール化合物(4,4’−(9−フルオレニリデン)−ジフェノール)とからフェノキシ樹脂を合成した。このフェノキシ樹脂をトルエン/酢酸エチル=50/50(質量比)の混合溶剤に溶解して、固形分40質量%の溶液を調製した。次に、ゴム成分としてアクリルゴム(ブチルアクリレート40質量部−エチルアクリレート30質量部−アクリロニトリル30質量部−グリシジルメタクリレート3質量部の共重合体、重量平均分子量80万)を用意し、このアクリルゴムをトルエン/酢酸エチル=50/50(質量比)の混合溶剤に溶解して、固形分15質量%の溶液を調製した。また、マイクロカプセル型潜在性硬化剤(マイクロカプセル化されたアミン系硬化剤)と、ビスフェノールF型エポキシ樹脂と、ナフタレン型エポキシ樹脂とを、質量比34:49:17で含有する液状の硬化剤含有エポキシ樹脂(エポキシ当量:202)を用意した。また、シラン化合物として、8−グリシドキシオクチルトリメトキシシラン(製品名:KBM4803、信越化学工業株式会社製)を用意した。
シラン化合物として、8−グリシドキシオクチルトリメトキシシランに代えて3−グリシドキシプロピルトリメトキシシラン(製品名:KBM403、信越化学工業株式会社製)を使用したこと以外は、実施例1と同様にして、フィルム状の接着剤組成物を作製した。
フェノキシ樹脂(製品名:PKHC、ユニオンカーバイド株式会社製、重量平均分子量45000)50gをトルエン/酢酸エチル=50/50(質量比)の混合溶剤に溶解して、固形分40質量%のフェノキシ樹脂溶液を調製した。ラジカル重合性化合物として、イソシアヌル酸EO変性ジアクリレート(製品名:M−215、東亜合成株式会社製)、2−(メタ)アクリロイロキシエチルホスフェート(製品名:P−2M、共栄社化学株式会社製)、及び、ウレタンアクリレート(製品名:U−2PPA、新中村化学工業株式会社製)を用いた。シラン化合物として、7−オクテニルトリメトキシシラン(製品名:KBM1083、信越化学工業株式会社製)を用意した。ラジカル発生剤としてベンゾイルパーオキサイド(製品名:ナイパーBMT−K40、日油株式会社製)を用意した。
シラン化合物として、7−オクテニルトリメトキシシランに代えてビニルトリメトキシシラン(製品名:KBM103、信越化学工業株式会社製)を使用したこと以外は、実施例2と同様にして、フィルム状の接着剤組成物を作製した。
シラン化合物として、7−オクテニルトリメトキシシランに代えて8−メタクリロキシオクチルトリメトキシシラン(製品名:KBM5803、信越化学工業株式会社製)を使用したこと以外は、実施例2と同様にして、フィルム状の接着剤組成物を作製した。
シラン化合物として、7−オクテニルトリメトキシシランに代えて3−メタクリロキシプロピルトリメトキシシラン(製品名:KBM503、信越化学工業株式会社製)を使用したこと以外は、実施例2と同様にして、フィルム状の接着剤組成物を作製した。
第1の回路部材として、ライン幅75μm、ピッチ150μm、厚み18μmの銅回路を500本有するフレキシブル回路板(FPC)を用意した。第2の回路部材として、0.5μmの窒化シリコン(SiNx)の薄層を形成したガラス(厚み0.7mm)ガラスを用意した。第1の回路部材及び第2の回路部材の間に実施例1〜3又は比較例1〜3のフィルム状の接着剤組成物を介在させた状態で、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用いて170℃、3MPaで20秒間の加熱加圧を行って幅2mmにわたり接続し、回路接続構造体(接続体)を作製した。
Claims (8)
- 前記有機基Xが、(メタ)アクリロイル基、ビニル基、エポキシ基、窒素原子含有基及び硫黄原子含有基からなる群より選ばれる少なくとも1種を含む、請求項1に記載の接着剤組成物。
- エポキシ樹脂と、潜在性硬化剤と、を更に含有する、請求項1又は2に記載の接着剤組成物。
- ラジカル重合性化合物と、熱又は光によりラジカルを発生する硬化剤と、を更に含有する、請求項1〜3のいずれか一項に記載の接着剤組成物。
- 導電粒子を更に含有する、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 回路接続用である、請求項1〜5のいずれか一項に記載の接着剤組成物。
- 請求項1〜6のいずれか一項に記載の接着剤組成物又はその硬化物を備える、構造体。
- 第一の回路電極を有する第一の回路部材と、
第二の回路電極を有する第二の回路部材と、
前記第一の回路部材及び前記第二の回路部材の間に配置された回路接続部材と、を備え、
前記第一の回路電極及び前記第二の回路電極が電気的に接続されており、
前記回路接続部材が、請求項1〜6のいずれか一項に記載の接着剤組成物又はその硬化物を含む、構造体。
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