CN102049368A - 涂覆设备和其涂覆方法以及利用该设备形成有机层的方法 - Google Patents
涂覆设备和其涂覆方法以及利用该设备形成有机层的方法 Download PDFInfo
- Publication number
- CN102049368A CN102049368A CN2010105042731A CN201010504273A CN102049368A CN 102049368 A CN102049368 A CN 102049368A CN 2010105042731 A CN2010105042731 A CN 2010105042731A CN 201010504273 A CN201010504273 A CN 201010504273A CN 102049368 A CN102049368 A CN 102049368A
- Authority
- CN
- China
- Prior art keywords
- coating
- target
- heating source
- applies
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 152
- 239000011248 coating agent Substances 0.000 title claims abstract description 148
- 239000012044 organic layer Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 25
- 239000000463 material Substances 0.000 claims abstract description 87
- 238000010438 heat treatment Methods 0.000 claims abstract description 63
- 239000010410 layer Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 33
- 239000011368 organic material Substances 0.000 claims description 31
- 238000001035 drying Methods 0.000 claims description 14
- 238000010422 painting Methods 0.000 claims description 11
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000027756 respiratory electron transport chain Effects 0.000 claims description 4
- 230000004807 localization Effects 0.000 claims description 2
- 239000002904 solvent Substances 0.000 description 6
- -1 for example Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0102879 | 2009-10-28 | ||
KR1020090102879A KR101182226B1 (ko) | 2009-10-28 | 2009-10-28 | 도포 장치, 이의 도포 방법 및 이를 이용한 유기막 형성 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102049368A true CN102049368A (zh) | 2011-05-11 |
Family
ID=43898667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105042731A Pending CN102049368A (zh) | 2009-10-28 | 2010-10-11 | 涂覆设备和其涂覆方法以及利用该设备形成有机层的方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20110097499A1 (zh) |
JP (1) | JP2011092924A (zh) |
KR (1) | KR101182226B1 (zh) |
CN (1) | CN102049368A (zh) |
TW (1) | TWI577454B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017197927A1 (zh) * | 2016-05-16 | 2017-11-23 | 京东方科技集团股份有限公司 | 液态光固化胶涂覆装置和方法 |
CN117414984A (zh) * | 2023-12-18 | 2024-01-19 | 四川华体照明科技股份有限公司 | 一种led荧光胶涂覆装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5864141B2 (ja) * | 2011-06-16 | 2016-02-17 | 株式会社日立製作所 | 薄膜形成装置および薄膜形成方法 |
KR101876191B1 (ko) * | 2012-02-10 | 2018-07-09 | 주식회사 케이씨텍 | 기판 처리 방법 및 그 장치 |
CN103100516B (zh) * | 2012-12-28 | 2014-10-29 | 中国科学技术大学 | 一种透射式激光微推进薄膜靶带的制备方法和其制作用设备 |
JP6452318B2 (ja) * | 2014-05-20 | 2019-01-16 | 中外炉工業株式会社 | 基板の塗布装置及び基板の塗布方法 |
EP3341136A4 (en) * | 2015-08-26 | 2019-07-24 | 3M Innovative Properties Company | METHOD AND APPARATUS FOR FORMING ARTICLES HAVING NON-UNIFORMLY PATTERNED COATINGS |
CN106733468B (zh) * | 2017-01-11 | 2018-11-23 | 新沂市瓦窑工业园区有限公司 | 一种电子元器件的点胶干燥装置 |
CN107088500B (zh) * | 2017-04-27 | 2019-07-19 | 佛山电器照明股份有限公司 | 一种灯管点胶固化系统 |
CN110465432B (zh) * | 2019-09-12 | 2021-03-23 | 浙江工业大学 | 矿井液压支柱防腐喷涂的自动定位技术 |
CN115056401B (zh) * | 2022-06-08 | 2023-02-03 | 佛山巨马新材料有限公司 | 一种电子胶的制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040263600A1 (en) * | 2003-06-25 | 2004-12-30 | Konica Minolta Medical & Graphic, Inc. | Ink jet recording apparatus |
US20060099759A1 (en) * | 2003-05-16 | 2006-05-11 | Seiko Epson Corporation | Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate |
US20080110395A1 (en) * | 2002-12-03 | 2008-05-15 | Kritchman Eliahu M | Apparatus for printing of three-dimensional objects |
CN101389482A (zh) * | 2006-02-28 | 2009-03-18 | 马斯特满股份有限公司 | 喷墨打印机 |
CN101558480A (zh) * | 2006-11-30 | 2009-10-14 | 东京毅力科创株式会社 | 半导体器件制造装置和半导体器件制造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3655173A (en) * | 1970-07-13 | 1972-04-11 | Argus Eng Co | Conveyor for fusing and heating systems |
US6151794A (en) * | 1999-06-02 | 2000-11-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for heat treating an object |
KR20010038006A (ko) | 1999-10-21 | 2001-05-15 | 박종섭 | 반도체 제조용 회전도포장치 |
JP2003159786A (ja) * | 2001-11-28 | 2003-06-03 | Seiko Epson Corp | 吐出方法およびその装置、電気光学装置、その製造方法およびその製造装置、カラーフィルタ、その製造方法およびその製造装置、ならびに基材を有するデバイス、その製造方法およびその製造装置 |
CN100542686C (zh) * | 2003-03-07 | 2009-09-23 | 日东电工株式会社 | 涂布膜的干燥方法和光学薄膜 |
JP2005013986A (ja) * | 2003-05-30 | 2005-01-20 | Seiko Epson Corp | デバイスとその製造方法、アクティブマトリクス基板の製造方法及び電気光学装置並びに電子機器 |
US20060093751A1 (en) * | 2004-11-04 | 2006-05-04 | Applied Materials, Inc. | System and methods for inkjet printing for flat panel displays |
KR20060064207A (ko) | 2004-12-08 | 2006-06-13 | 삼성전자주식회사 | 베이크 장치 |
JP4636495B2 (ja) | 2004-12-10 | 2011-02-23 | 大日本スクリーン製造株式会社 | 有機el表示装置を製造するための塗布装置 |
JPWO2006064792A1 (ja) | 2004-12-14 | 2008-06-12 | 株式会社アルバック | 塗布装置、有機材料薄膜の形成方法、有機elパネル製造装置 |
AU2005202167B2 (en) * | 2005-05-19 | 2010-12-16 | Canon Kabushiki Kaisha | Method of forming structures using drop-on-demand printing |
KR20060135160A (ko) | 2005-06-24 | 2006-12-29 | 아텍 엔지니어링 주식회사 | 건조장치 |
KR200394547Y1 (ko) | 2005-06-24 | 2005-09-02 | 아텍 엔지니어링 주식회사 | 건조장치 |
EP1995068A4 (en) * | 2006-02-28 | 2010-03-31 | Mastermind Co Ltd | INKJET |
KR100969332B1 (ko) | 2009-09-07 | 2010-07-09 | 주식회사 디씨엔 | 멀티 코터 |
-
2009
- 2009-10-28 KR KR1020090102879A patent/KR101182226B1/ko active IP Right Grant
-
2010
- 2010-02-24 US US12/659,060 patent/US20110097499A1/en not_active Abandoned
- 2010-09-08 TW TW099130284A patent/TWI577454B/zh active
- 2010-09-13 JP JP2010204278A patent/JP2011092924A/ja active Pending
- 2010-10-11 CN CN2010105042731A patent/CN102049368A/zh active Pending
-
2013
- 2013-08-07 US US13/961,111 patent/US9406885B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080110395A1 (en) * | 2002-12-03 | 2008-05-15 | Kritchman Eliahu M | Apparatus for printing of three-dimensional objects |
US20060099759A1 (en) * | 2003-05-16 | 2006-05-11 | Seiko Epson Corporation | Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate |
US20040263600A1 (en) * | 2003-06-25 | 2004-12-30 | Konica Minolta Medical & Graphic, Inc. | Ink jet recording apparatus |
CN101389482A (zh) * | 2006-02-28 | 2009-03-18 | 马斯特满股份有限公司 | 喷墨打印机 |
CN101558480A (zh) * | 2006-11-30 | 2009-10-14 | 东京毅力科创株式会社 | 半导体器件制造装置和半导体器件制造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017197927A1 (zh) * | 2016-05-16 | 2017-11-23 | 京东方科技集团股份有限公司 | 液态光固化胶涂覆装置和方法 |
US11198147B2 (en) | 2016-05-16 | 2021-12-14 | Boe Technology Group Co., Ltd. | Liquid photocurable adhesive coating device and method |
CN117414984A (zh) * | 2023-12-18 | 2024-01-19 | 四川华体照明科技股份有限公司 | 一种led荧光胶涂覆装置 |
CN117414984B (zh) * | 2023-12-18 | 2024-02-23 | 四川华体照明科技股份有限公司 | 一种led荧光胶涂覆装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110097499A1 (en) | 2011-04-28 |
US9406885B2 (en) | 2016-08-02 |
KR20110046057A (ko) | 2011-05-04 |
TW201114500A (en) | 2011-05-01 |
TWI577454B (zh) | 2017-04-11 |
KR101182226B1 (ko) | 2012-09-12 |
US20130323879A1 (en) | 2013-12-05 |
JP2011092924A (ja) | 2011-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102049368A (zh) | 涂覆设备和其涂覆方法以及利用该设备形成有机层的方法 | |
KR101254335B1 (ko) | 금속판 벨트 증발원을 이용한 선형 유기소자 양산장비 | |
JP5930579B2 (ja) | 基板加工装置 | |
CN1986224B (zh) | 显示装置的制造装置及显示装置的制造方法 | |
US6900875B2 (en) | Method of manufacturing liquid crystal display and drying apparatus | |
JP4705624B2 (ja) | 基板エッチング装置及びこれを利用した液晶表示素子製造ライン | |
EP3604607B1 (en) | Substrate side-deposition apparatus | |
CN110172683A (zh) | 加热机构、等离子体腔室及在基片上成膜的方法 | |
KR101958397B1 (ko) | 유기막 증착 장치와, 방법 및 유기막 장치 | |
KR20130074307A (ko) | 척킹 및 디척킹 장치부를 갖는 유기발광소자 양산 시스템 | |
WO2016186386A1 (ko) | 유기막 증착 장치와, 방법 및 유기막 장치 | |
CN102224449A (zh) | 取向膜材料的滴下方法和滴下装置 | |
KR20010029883A (ko) | 기판처리방법 및 기판처리장치 | |
KR102260366B1 (ko) | 박막 증착 인라인 시스템 | |
WO2015027622A1 (zh) | 液晶显示器、液晶显示器用基板及其制作方法和制作装置 | |
JP2004111073A (ja) | 薄膜形成装置 | |
JP2010222103A (ja) | 搬送装置 | |
JPH05309301A (ja) | 硬基板塗布・プリベ−ク装置 | |
JP2006150206A (ja) | 機能性膜形成装置及び機能性膜形成方法 | |
CN107589572A (zh) | 用于彩膜烘烤机的承载台、彩膜烘烤机 | |
CN205999477U (zh) | 有机膜蒸镀装置及有机膜装置 | |
KR100831279B1 (ko) | 액정표시장치의 배향막 형성장치 및 방법 | |
KR20180025737A (ko) | 유기 발광 소자의 제조 시스템과, 제조 방법과, 유기막 장치 및 도너 기판 세트 | |
US20130104417A1 (en) | Drying device for glass substrate with alignment liquid sprayed thereon and conveying apparatus with the same | |
KR20070078887A (ko) | 배향막 예비건조 장치 및 이를 포함하는 배향막 형성시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121105 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121105 Address after: South Korea Gyeonggi Do Yongin Applicant after: Samsung Display Co., Ltd. Address before: South Korea Gyeonggi Do Yongin Applicant before: Samsung Mobile Display Co., Ltd. |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110511 |