TW201114500A - Coating apparatus, coating method thereof, and method of forming organic layer using the same - Google Patents

Coating apparatus, coating method thereof, and method of forming organic layer using the same Download PDF

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TW201114500A
TW201114500A TW099130284A TW99130284A TW201114500A TW 201114500 A TW201114500 A TW 201114500A TW 099130284 A TW099130284 A TW 099130284A TW 99130284 A TW99130284 A TW 99130284A TW 201114500 A TW201114500 A TW 201114500A
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coating
target
layer
heating source
stage
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TW099130284A
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Chinese (zh)
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TWI577454B (en
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Jin-Han Park
Myeng-Woo Nam
Eui-Shin Shin
Sung-Gon Kim
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Samsung Mobile Display Co Ltd
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Publication of TWI577454B publication Critical patent/TWI577454B/en

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/26Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A coating apparatus includes a stage supporting a coating target, ca coating part on the stage, the coating part being configured to apply a coating material onto the coating target, and a heating source opposite to and spaced apart from the stage, the heating source being configured to supply heat to the coating target after application of the coating material onto the coating target.

Description

201114500 六、發明說明: 【發明所屬之技術領域】 範例貫施例是有關於一種塗層設備、一種其之塗層方 法以及使用其形成有機層之方法,而能夠提供具有大致均 勻厚度的薄層。 【先前技術】 隨者資訊通訊產業快速發展,顯示裝置的應用項目亦 兴乏i夕近來則需要能夠滿足低耗電、輕重量、薄型化 、及回解析度的顯示裝置,即如平型面板顯示裝置。 舉例來說’像是液晶顯示(咖)裝置及有機發光二極體 (OLED)顯不裝置的平型面板顯示裝置可含有經構成於相對 IS板之間的發射範圍和薄獏電晶體(TFT)。而為保護該 圍不受外部濕度、氧氣等等的影響,可將一嵌封材 ==發射範圍的週邊處藉以黏著該等兩片基板,並 袭封s亥發射範圍。 該平型面板顯示裝置可具備 積各種薄屙,Pn , i T可此 射範圍…Τ :广層、無機層及金屬層,俾構成該發 顯示裝置可含有Υ主動矩陣有機發光二極體(AM〇LED) 體芦: 種結構,其中沉積有-緩衝層、-半導 體層、-電閘絕緣層、一閘極、牛導 一保護層、—極 B絕緣層、源極/汲極、 八 °層、一像素定義層、一下方雷栢一七 3有機層的有機發射層、一上方電極等等。此/、一匕 發射層可在該下+ + 电枉等4此外,該有機 J隹違下方電極與該有機層 及-電洞傳送層,並且可進…:間3有一電洞注入層 ^ 上方電極與該有機層 3 201114500 之間a有—電子注入層及一電子傳送層。 δ玄平型面板顯示裝置内的各種薄層可為藉由在該等所 /儿積4層之間’即如該有機層、該層間絕緣層、該電洞注 入層等等’施用一液體塗層材料所構成。該液體塗層材料 可予以乾燥化俾確製一薄層。 【發明内容】 本發明實施例係針對於一種塗層設備、其之塗層方法 及使用其形成有機層之方法,該等可大致克服由於相關技 藝之限制和缺點所導致的一或更多問題。 此 貫施例之一特點在於提供一種能夠構成具有 大致均勻厚度之薄層的塗層設備。 因此,一實施例之另一特點在於提供一種利用能夠構 成/、有大致均勾厚度之薄層的塗層設備之塗層方法。 因此,一實施例之又另一特點在於提供一種利用能夠 構成具有大致均勻厚度之薄層的塗層設備構成一有機層之 方法。 前述及其他的特性與優點之至少一者可藉由提供一種 塗層設備所實現,其中含有一階台,其上設置有一塗層目 私,一塗層部件,此者係經設置於該階台上,並且將一塗 層材料施用於該塗層目標上;以及一加熱來源,此者係相 對於並·且分隔於該㉟台’ i且在將該塗層㈣施用於該塗 層目標上之後對該塗層目標供應熱能。 該加熱來源可重疊於整個塗層目標,該加熱來源係經 建構以將熱能同時地且均勻地供應予整個塗層目標。該加 4 201114500 熱來源可為—紅外線加熱器或-自素燈。該加熱來源可為 :素燈’並且該加熱來源進一步含有一反射平板。該加 ’、、、A原可朝向該階台垂直地移動。該加熱來源可完全地 離於該階台。該塗層部件可包含—位於該階台上的可移動 支按框架,以及—位於該可移動支樓框架上的射出部件, 該射出部件可在與該支樓框架之移動方向相垂直的方向上 移動並經建構以射出該㈣材料。該支標框架可含有多 個第支撐框架’該等係以—預定距離彼此相對地分隔並 ::有預疋阿度,以及-第二支撐框架,此者的兩端皆經 設置在該等第一支撐框架上並與該等第一支撐框架相交 又。該第二支樓框架可位於該等第一支樓框架上,同時經 建構以朝向該階台垂直地移動。該射出部件可包含一可移 動塗層頭’此者係經建構以按該第二支撐框架的縱向方向 移動’以& $嘴’此者位於該可移動塗層頭内並經建構 以射出該塗層材料。該塗層設備可進-步含有一腔室,啵 階台位於該腔室的下方部份處而該加熱來源則位於該腔室 的上方部份處。 前述及其他的特性與優點之至少一者亦可藉由提供一 種塗層方法所實現,其中包含將一塗層目標定位於該塗層 設備内的-階台上;利用一塗層部件將該塗層材料施用於 〆塗層目‘上’以及當完全地施用該塗層材料後利用一 位於該塗層設備内的加熱來源對該塗廣材料供應熱能以乾 燥化該塗層材料。 將熱能供應予#淨·溫g —P + ^ ^卞该塗層目軚可包含將均勻熱能同時地供 201114500 應予整個塗層目標。祐 M „ ,, 施用一塗層材料可包含施用一有 』有機薄層電晶體材料及,或 二 料。將熱能供應予該塗層 ^匕電電池材 的溫度乾燥化該塗層材料=包,約.C至約2°。。。 含利用Λ I I ”、'此•供應予该塗層目標可包 3利用一紅外線加熱器或一齒素燈。 種槿述:其他的特性與優點之至少一者亦可藉由提供-種構成-有機層的方法所實現,其中包含利用一塗 =一有機材料施用經設置在一塗層設傷裡一階台上的基板 上勒以及於施用該有機材料之後,在該塗層設備裡利用— 口禮^原將熱能供應予該有機材料並且乾燥化該有機材料 以構成一有機層。 施用該有機材料可包含施用一材料藉以構成一有機發 極體的發射層、電洞注入層、電洞傳送層、電子注入 層及/或電子傳送層。將熱能供應予該有機材料可包含以約 至約200〇C的溫度乾燥化該有機材料。將熱能供應予 該有機材料可包含將均勻熱能同時地供應予整個基板以乾 燥化該有機材料。 【實施方式】 現將於後文中參照隨附圖式以更完整地說明多項範例 實施例;然該等可以不同方式所具體化,並且不應被證釋 =受限於本揭所陳述的實施例。相反地,該等實施例係經 提供藉以令本揭示成為通徹且完整’同時對熟諳本項技藝 之人士完整地傳遞本發明的範疇。 在該等圖式中,薄層與範圍的維度或將為便於清晰說 6 201114500 明之目的而有所誇炫。亦應瞭解當將—薄層或構件稱為位 於另一薄層或基板「之上」時,該者可為直接地位於該其 他薄層或基板之上’亦或者可出現有中介薄層。此外,亦 將瞭解當將-薄層稱為位於兩個薄層「之間」時,該等兩 個薄層之間可僅有此一薄層,或是亦可出現有一或更多中 介薄層。全篇中類似參考編號是指相仿構件。 後文中將參照於圖i及2以進一步詳細說明範例實施 例圖1說明根據一示範性實施例之塗層設備的外觀視圖, 並且圖2說明圖1之塗層設備的截面視圖。 現參照圖卜-根據—示範性實施例的塗層設備i可包 a P白口 20 ’其上設置有一塗層目標1〇 ; 一塗層部件 係,置於該階台20上,並且將一塗層材料射出至該塗層 目‘ 10 ’ Μ及一加熱來源4〇 ’此者係相對地設置於該階台 — 層目標10可藉由一載送機制(未予圖示)的操作以 2位於。亥20上並自此移除。該塗層目標可為即如 用於顯示裝置的基板或是半導體的晶圓。此外,可進一步 部件(未予圖,示)設置於該階台⑼上,故而能夠敌 二;目上標1〇。並且可將一载送機制(未予圖示歸 …20上’而於該機制上該塗層目標1〇係經嵌封。 如進標1〇可經定位於該階台2〇上以供處理,即 ::灯塗層處理。待予塗層於該塗層目標1〇上的塗層材料 可為以液體狀態’即如其中一材 狀能,以刹谂田 、 ’、…·生溶解於一溶液内之 利施用於該塗層目標上俾構成-薄膜。例如, 201114500 該塗層材料可為— M ^ ^ 有拽材料。而若該塗層材料為用於士 機裝置的有機材料,則該塗層 有 然可包含有機發射材料、有機TFT材料料, 等等β 太陽m電池材料 、該塗:部件30係經可移動地設置於該階 以將某一置值的塗層材料施用 曰 部件30可包含土滑目私10上。該塗層 支撐框架3 1及一射出部件33。 架31係經可移動地設置於該階台20’亦即兮支^/匡 可在該階台20於*一 万即錢撐框架31 # 、 方向(X軸方向)上移動。該射出邛201114500 VI. Description of the Invention: [Technical Field of the Invention] An example embodiment relates to a coating apparatus, a coating method therefor, and a method of forming an organic layer using the same, which can provide a thin layer having a substantially uniform thickness . [Prior Art] With the rapid development of the information and communication industry, the application of display devices is also prosperous. Recently, there is a need for display devices that can meet low power consumption, light weight, thinness, and resolution, such as flat panels. Display device. For example, a flat panel display device such as a liquid crystal display (coffee) device and an organic light emitting diode (OLED) display device may have an emission range and a thin germanium transistor (TFT) formed between the opposing IS plates. ). In order to protect the surrounding from external humidity, oxygen, etc., the periphery of an embedding material == the emission range can be adhered to the two substrates, and the emission range of the shai can be sealed. The flat panel display device can be provided with various thin enamels, and Pn, i T can be used in the range of Τ: wide layer, inorganic layer and metal layer, and the 显示 constituting the display device can include a Υ active matrix organic light emitting diode ( AM〇LED) Body reed: a structure in which a buffer layer, a semiconductor layer, an electric gate insulating layer, a gate, a bovine conductive layer, a B-insulating layer, a source/drain, and an eight-degree layer are deposited. A layer, a pixel defining layer, an organic emissive layer of a lower Reebok-7 organic layer, an upper electrode, and the like. The /, one emission layer can be in the lower + + power, etc. In addition, the organic J is in violation of the lower electrode and the organic layer and the - hole transport layer, and can be ... The upper electrode and the organic layer 3 201114500 have an electron injection layer and an electron transport layer. The various thin layers in the delta flat panel display device may be applied by a liquid between the four layers of the device, ie, the organic layer, the interlayer insulating layer, the hole injection layer, and the like. Made up of coating materials. The liquid coating material can be dried to form a thin layer. SUMMARY OF THE INVENTION Embodiments of the present invention are directed to a coating apparatus, a coating method therefor, and a method of forming an organic layer therewith, which may substantially overcome one or more problems due to limitations and disadvantages of the related art. . One of the features of this embodiment is to provide a coating apparatus capable of forming a thin layer having a substantially uniform thickness. Accordingly, another feature of an embodiment is to provide a coating method utilizing a coating apparatus capable of forming a thin layer having a substantially uniform thickness. Accordingly, still another feature of an embodiment is to provide a method of forming an organic layer using a coating apparatus capable of forming a thin layer having a substantially uniform thickness. At least one of the foregoing and other features and advantages can be achieved by providing a coating apparatus comprising a first stage having a coating thereon and a coating member disposed thereon. And applying a coating material to the coating target; and a heating source, which is opposite to and separated from the 35 'i and applying the coating (4) to the coating target The coating target is then supplied with thermal energy. The source of heat may overlap the entire coating target, which is constructed to supply thermal energy to the entire coating target simultaneously and uniformly. The addition of 4 201114500 heat source can be - infrared heater or - self-priming lamp. The heating source can be a prime lamp' and the heating source further comprises a reflective plate. The addition ', , A can move vertically toward the stage. This source of heat can be completely separated from the stage. The coating member can include a movable support frame on the step, and an injection member on the movable branch frame, the injection member being movable in a direction perpendicular to a direction in which the frame is moved Move up and construct to shoot the (4) material. The support frame may include a plurality of first support frames 'these are separated by a predetermined distance relative to each other and: a pre-arc and a second support frame, both ends of which are disposed at the same The first support frame and the first support frame intersect again. The second floor frame can be located on the first floor frame while being configured to move vertically toward the stage. The ejection member may comprise a movable coating head 'this is constructed to move in the longitudinal direction of the second support frame 'to & $mouth' which is located within the movable coating head and constructed to project The coating material. The coating apparatus may further comprise a chamber, the step platform being located at a lower portion of the chamber and the heating source being located at an upper portion of the chamber. At least one of the foregoing and other features and advantages can be achieved by providing a coating method comprising positioning a coating target on a step in the coating apparatus; The coating material is applied to the enamel coating and when the coating material is completely applied, the coating material is supplied with thermal energy to dry the coating material using a heating source located within the coating apparatus. Supplying thermal energy to #净·温格 - P + ^ ^ 卞 The coating target may include uniform thermal energy for 201114500 to be applied to the entire coating target.佑 M „ , , applying a coating material may comprise applying an organic thin layer of a crystalline material and/or a second material. The heat is supplied to the coating, and the temperature of the battery is dried. , about .C to about 2 °... Containing Λ II ′′, 'This•Supply to the coating target can be used 3 to use an infrared heater or a dentate lamp. A description of the above: at least one of the other characteristics and advantages can also be achieved by providing a method of constituting the organic layer, which comprises applying a coating with an organic material to provide a first step in a coating. After the substrate is applied to the substrate and after the application of the organic material, thermal energy is supplied to the organic material in the coating device and the organic material is dried to form an organic layer. Application of the organic material may comprise applying a material to form an emissive layer of an organic emitter, a hole injecting layer, a hole transporting layer, an electron injecting layer, and/or an electron transporting layer. Supplying thermal energy to the organic material can comprise drying the organic material at a temperature of from about 200 °C. Supplying thermal energy to the organic material can include simultaneously supplying uniform thermal energy to the entire substrate to dry the organic material. [Embodiment] A plurality of exemplary embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which FIG. example. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In these figures, the dimensions of the thin layer and the range may be exaggerated for the purpose of clarity. It will also be understood that when a thin layer or member is referred to as being "on" another layer or substrate, it may be directly over the other thin layer or substrate, or an intervening thin layer may be present. In addition, it will also be understood that when the thin layer is referred to as being "between" two thin layers, there may be only one thin layer between the two thin layers, or one or more intermediate thin layers may also be present. Floor. Like reference numerals throughout the text refer to similar components. The following will be described in further detail with reference to Figures i and 2. Figure 1 illustrates an exterior view of a coating apparatus in accordance with an exemplary embodiment, and Figure 2 illustrates a cross-sectional view of the coating apparatus of Figure 1. Referring now to Figure 4 - a coating apparatus i according to an exemplary embodiment may include a white port 20' having a coating target disposed thereon; a coating member system disposed on the stage 20 and A coating material is ejected to the coating target '10' and a heating source 4'' is relatively disposed on the stage - the layer target 10 can be operated by a carrier mechanism (not shown) Located at 2. Hai 20 and removed from here. The coating target can be a substrate such as a substrate for a display device or a semiconductor. Further, a further component (not shown) is provided on the stage (9), so that it can be enemies; And a carrier mechanism (not shown in Fig. 20) is used, and the coating target 1 is sealed on the mechanism. If the index 1 is located, the target can be positioned on the stage 2 Treatment, namely:: lamp coating treatment. The coating material to be coated on the target of the coating may be in a liquid state, that is, as one of the materials can be used to brake the field, ', ... The solution dissolved in a solution is applied to the target of the coating to form a film. For example, 201114500, the coating material may be - M ^ ^ tantalum material, and if the coating material is organic for the machine device a material, the coating may optionally comprise an organic emissive material, an organic TFT material, etc., a beta solar cell material, the coating: the component 30 is movably disposed in the step to provide a certain value of the coating The material application crucible member 30 may comprise a soil sliding cover 10. The coating supports the frame 31 and an injection member 33. The frame 31 is movably disposed on the step 20', that is, the support member/匡 can be The stage 20 moves in the direction of the *10, the money support frame 31 #, the direction (X-axis direction).

件33可經設置於該 出口P 架3〗在-盘咳第太〜 並且可沿著該支撐框 ” 方向(X軸方向)相垂直的第二方向 方向)上移動,藉以將該 ° 第一方向(X軸方向)可為處理/向2 1〇。該 30移動的方向或是兮塗層 二 向可為該塗層部件 J次疋。亥塗層目標丨〇移動的方向。 *該支樓框架31可包含多個第一支撐框架31a,該等係 工間分隔並且彼此相對同時具有一高度;以及一第二支撐 框架3lb’此者的兩端皆經設置在該等第一支揮框架 並與該等第一支搶插靼1 牙才木31a相交又。該等第一支撐框架3 la 可在該階台20上移動,祐日兮泠μ 0 # 勒並且a玄塗層目標10可於該等第一 支樓框架3U之間設置在該階台2〇上,第二支樓框架3ib 係經固定地設置在料第一支#框架…的頂±處。因此, 當該等第-支撐框架31a在該階台2〇上移動時,該第二支 樓框架训可被該等第一支樓框架3la帶拉至該階台川的 上方。例如’該第二支細31b可為設置在距該塗層目 8 201114500 牦10的—預定距離處,並且可在一垂直方向(z軸方向)上 向°亥σ 20移動。在另一範例裡,該等第一支撐框架3 1 a 及该第二支撐框架31b可為連同彼此整合地構成。 °亥射出部件33可含有複數個塗層頭33a,該等係以該 第支撐框架3 lb的縱向方向(γ軸方向)上可移動地設置; 、及複數個喷冑33b ’該等係經個別地設置於該等塗層頭 …内’並且射出某—量值的塗層材料。該等喷嘴33b可為 任何適用於塗層處理的噴嘴,即如喷墨頭、散佈喷嘴、模 頭剪鋒片等等。該射出部件33可經連接至一材料供應設 備(未予圖不)’藉以將_塗層材料供應至該等塗層頭33a並 、丄由肩等喷嘴33b射出該塗層材料。然應注意本揭實施 二並:焚限於此,即如該射出部件33可含有具備複數個噴 _的單塗層頭或是具備單-個喷嘴的單-塗層頭。 和忒加熱來源40可為相對於該階台2〇所設置,並且可 1刀隔於D玄階台20 ’使得該塗層部件3〇不會對將該塗層 材料施用於6亥塗層目標1〇上的處理程序造成影響。在藉由 〆土層#件3G將該塗層材料施用於該塗層目標l Q的整個 之後孩加熱來源40可將熱能施加於該塗層目標i〇 :利乾燥化所塗層材料並移除該溶劑。注意到該塗層材料 二7‘ 層且經乾燥化於該塗層目標1 〇上然不致被移動。 可5周整由該加熱來源4 0戶斤提供的熱能俾擁有一預定溫 度而使得該塗層材料不會㈣,且即使是在當該塗層目標 ▲移動時亦然。換言之,可根據該塗層材料的種類來調整 /力‘、,、來源40的溫度。例如若可在約至約2⑼。c溫 201114500 度處移除該塗層材料内所使用以構成有機發射層的溶劍, 則該加熱來源40可以約1〇〇〇c至約2〇〇Cc的溫度供應熱能。 該加熱來源40可運作以供應熱能,並且可含有任何適 當設備’即如紅外線加熱器、齒素燈等#。例如,當該加 熱來源4〇為-紅外線加熱器或•素燈時,可調整該二熱來 源40的加熱速率,使得能夠在相當微短的時間内加熱該资 層材料。 例如田°亥加熱來源40為一鹵素燈時,該加熱來源4〇 可s有一反射平板,此者係以一與光線朝向該塗層目標^ 〇 移動之方向相反的方向所設置,#以獲致光學均勻度。當 。又置有6亥反射平板時,可藉由反射以與該塗層目標^ 〇之方 向相反所發射的光線而朝向於該塗層目標ι〇,藉以有效地 供應熱能》 可設置-或更多的加熱來源4〇。為將熱能均勻地且同 時地供應予該塗層目標1〇的整個範圍,而其上係經施用以 該塗層材料’該加熱來源4G可為對應於該塗層目標ι〇的 整個叙圍。例如,gp 士關1 α - J 即如圖1所不,可設置一單一加熱來源 40而重疊於整個塗層目標1〇。在另一範例裡,可排置複數 個加熱來源以重疊於整個塗層目標丨0。 例如,该加熱來源40可含有一具備與該塗層目標10 f致相同形狀的平型平板。而該加熱來源40的至少其一局 部’即如該平型平板,可為大致平行於該塗層目標ι〇所定 :如在xy平面上,並且可與該塗層目標10相重疊, 凡王地重疊。例外之處為該可移動塗層部件3 3,而即 10 201114500 如整個塗層目標1 〇 的一底部表面,亦gp 將來自於該加熱來;原 該塗層目標10。故% 可為受曝於該加熱來源40之平型平板 面朝該塗層目標10的表面,因此能夠 4〇的熱能大致同時地且均勻地施加於 該塗層目標1 〇上的塗層材料可均勻地 乾燥化成大致均勻的薄層。 相反地,當以π a , 不均勾的方式’即如循序地,將熱能供 應給°亥塗層材料時’由熱能供應的溫度可能出現變化,故 而改變該塗層材料的特徵。因此,可能會難以構成具有均 句品質的塗層材料薄層。㈣,當加熱來源並未分離於該 階台時’該階台可能受到熱能的不良影響,並且支撐該塗 層材料之基板@不@部份間,即如前端及後端部份,之溫 度差可月b會出ί見’從而該塗層液體的移動可能會導致塗層 瑕疵。此外,由於傳統技藝無法將該基板加熱至1〇〇。匚或 更高以提升該階台的精準度,因此可能難以加熱該塗層液 體而不造成液流。 該加熱來源40係以—垂直方向(ζ軸方向u朝向㈣ 台20可移動地設置。故而能夠防止或是顯著降低該加熱來 源4〇對於該塗層部件30移動所造成的干擾。由於該加熱 來源40可垂直方向移動,因此無須在分隔於該塗層目標 及該塗層部件之固定距離處設置—非可移動的加熱來源, 藉以避免拉長在較遠距離處加熱該塗層目標所需要的時間 並同時提高設備精準度。 換言之,當該塗層部件3〇執行塗層處理時,該加熱來 源40可顯著地分隔於該塗層目才票1 〇。當完成該塗層處理 201114500 後’该加熱來源40可在Z軸方向上朝向該階台20下降俾 將熱能供應予該塗層目標1 0以進行乾燥化處理。接著,當 該乾燥化處理完成後’該加熱來源可沿Z軸方向上升以分 隔於該階台20。 於其上該塗層目標1 0係經嵌封的階台2 〇、該塗層部件 30和該加熱來源40可經設置在一腔室5〇内。該階台2〇可 為設置在該腔室50的一較低部份處,並且該加熱來源4〇 可為設置在該腔室5〇的一較高部份處。 本實施例雖說明該塗層部件30係-相對於該階台2〇 的可移動構件以將該塗層材料施用於該塗層目標1〇上,然 並未排除其他的實施例。例如,該塗層部件3〇可相對於該 階台20而為固定,而該塗層目標1〇可移動以將該塗層: 料施用於移動性的塗層.目標’丨〇上。, 一根據一示範性實施例的塗層設備可含有該塗層目桿 10’此者位於該階台20上;該塗層部件30可在該處理方 向(X轴方向)上移動,藉以將該塗層材料施用於該塗層目桿 10上;以及該加熱來源40 ’此者將熱能供應至該塗層目標 10上的塗層材料’而當該塗層處理完成時,可供以乾燥化 即如經液化的塗層材料。此一加熱設備可提供大致均勾, 即如具有大致均勻厚度及/或特徵,的薄層塗層。 相對地’在傳統方法裡,去 a 材料的塗層及乾料處理時,備裡進行塗層 以化處理時,亦即利用-機械臂在一塗層 5又備與一分別的乾燥化 材粗士R間彺返傳送-經塗層的塗層 材科,由該,層材料所構成的薄層可能會產生變形,即如 12 201114500 具有非均勻的厚度。亦即,由於所塗 的狀態下被載送進入該乾燥化 :此:β未乾燥 臂之臂部的基板,即如塗層目標備因=到該機械 〈’皿度可能會改Μ计、皮 該基板可能因在載送過程中所產生的外部力 其且/或因該基板旋轉所產生的向心力可能嚴重地 衫日“亥基板上的薄層厚度’從而難以構成出高品質的薄 層。因此’精由根據本範例實施例之塗層設備構成_薄層The piece 33 may be disposed on the outlet P frame 3 to move over the second direction of the support frame "direction (X-axis direction), thereby first The direction (X-axis direction) can be the treatment/direction 2 1 〇. The direction of the 30 movement or the bismuth coating can be the coating component J times. The direction of the target of the coating is 丨〇. The floor frame 31 may include a plurality of first support frames 31a, which are separated and have a height opposite to each other; and a second support frame 31b' is provided at both ends of the first support frame The frame intersects with the first smashing scorpion 31a. The first supporting frame 3 la can be moved on the stage 20, and the 兮泠 兮泠 μ 0 # 勒 and a 玄 coating target 10 may be disposed on the stage 2〇 between the first floor frames 3U, and the second floor frame 3ib is fixedly disposed at the top of the first frame #.... When the first-support frame 31a moves on the stage 2, the second branch frame can be pulled by the first branch frame 3la Above the platform, for example, 'the second thin portion 31b may be disposed at a predetermined distance from the coating target 8 201114500 牦 10, and may be in a vertical direction (z-axis direction) to ° Hz 20 In another example, the first support frame 3 1 a and the second support frame 31 b may be integrally formed together with each other. The angle-emitting member 33 may include a plurality of coating heads 33a, which are a longitudinal direction (γ-axis direction) of the first support frame 3 lb is movably disposed; and a plurality of squirts 33b 'these are individually disposed in the coating heads... and emit a certain amount The coating material 33. The nozzles 33b can be any nozzle suitable for coating treatment, such as an inkjet head, a dispensing nozzle, a die cutting blade, etc. The injection component 33 can be connected to a material supply device ( It is not shown) 'The coating material is supplied to the coating heads 33a and the nozzles 33b are ejected from the nozzles 33b. However, it should be noted that the second embodiment of the present invention: the burning is limited to this, that is, The injection member 33 may include a single coating head having a plurality of sprays or may be provided a single-coated head of a nozzle. The 忒 heating source 40 can be disposed relative to the stage 2〇, and can be separated from the D-stage 20' such that the coated part 3〇 will not The coating material is applied to the treatment process of the 6-coat target 1〇. After the coating material is applied to the coating target l Q by the alumina layer #3, the child heating source 40 can be used. Applying thermal energy to the coating target: drying the coated material and removing the solvent. Note that the coating material is two 7' layers and is dried on the coated target 1 〇 without being moved The thermal energy supplied by the heating source of 40 kilograms may have a predetermined temperature for 5 weeks so that the coating material does not (4), and even when the coating target ▲ is moved. In other words, the temperature of the /force ',,, source 40 can be adjusted according to the type of the coating material. For example, if it is about 2 (9). The heat source 40 can supply thermal energy at a temperature of about 1 〇〇〇c to about 2 〇〇Cc by removing the sifting sword used in the coating material to form the organic emission layer at a temperature of 201114500 degrees. The heating source 40 is operable to supply thermal energy and may contain any suitable device' such as an infrared heater, a guillotine lamp, etc. For example, when the heating source 4 is an -infrared heater or a lamp, the heating rate of the two sources of heat 40 can be adjusted to enable heating of the layer material in a relatively short period of time. For example, when the source 40 is a halogen lamp, the heating source may have a reflective plate, which is set in a direction opposite to the direction in which the light moves toward the target of the coating. Optical uniformity. when . When a 6-Hai reflective plate is placed, it can be directed toward the coating target by reflecting light emitted in a direction opposite to the direction of the coating target, thereby effectively supplying heat energy. The heating source is 4〇. In order to uniformly and simultaneously supply thermal energy to the entire range of the coating target 1 ,, the coating material is applied thereto. The heating source 4G may be the entire range corresponding to the coating target 〇 . For example, gp 士关1 α - J, as shown in Figure 1, can be provided with a single heating source 40 overlapping the entire coating target. In another example, a plurality of heating sources can be arranged to overlap the entire coating target 丨0. For example, the heating source 40 can comprise a flat plate having the same shape as the coating target 10f. And at least a portion of the heating source 40, ie, the flat plate, may be substantially parallel to the target of the coating: as in the xy plane, and may overlap with the coating target 10, Overlap. The exception is the movable coating component 33, i.e., 10 201114500, such as a bottom surface of the entire coating target 1 ,, also gp will be derived from the heating; the coating target 10 is originally. Therefore, the flat plate exposed to the heating source 40 faces the surface of the coating target 10, so that the thermal energy of 4 〇 can be applied to the coating material of the coating target substantially simultaneously and uniformly. It can be uniformly dried into a substantially uniform thin layer. Conversely, when the thermal energy is supplied to the coating material in a manner of π a , unevenly, that is, sequentially, the temperature supplied by the thermal energy may change, thereby changing the characteristics of the coating material. Therefore, it may be difficult to form a thin layer of coating material having a uniform sentence quality. (4) When the heating source is not separated from the stage, the stage may be adversely affected by thermal energy, and the substrate supporting the coating material is not between the parts, such as the front end and the rear end. The difference can be seen in the month b. Thus the movement of the coating liquid may cause the coating to collapse. In addition, the substrate cannot be heated to 1 由于 due to conventional techniques.匚 or higher to increase the accuracy of the stage, so it may be difficult to heat the coating liquid without causing liquid flow. The heating source 40 is movably disposed in a vertical direction (the z-axis direction u toward the (four) stage 20. Therefore, it is possible to prevent or significantly reduce the interference caused by the heating source 4 to the movement of the coating member 30. The source 40 can be moved in a vertical direction so that there is no need to provide a non-movable heating source at a fixed distance from the coating target and the coated component to avoid elongating the need to heat the coating target at a greater distance. Time and at the same time improve the accuracy of the device. In other words, when the coating component 3 is subjected to a coating treatment, the heating source 40 can be significantly separated from the coating target. When the coating treatment 201114500 is completed 'The heating source 40 can be lowered toward the stage 20 in the Z-axis direction, and heat energy is supplied to the coating target 10 for drying treatment. Then, when the drying process is completed, the heating source can be along Z. The axial direction rises to be separated from the stage 20. On which the coating target 10 is a sealed step 2, the coating member 30 and the heating source 40 can be disposed in a chamber 5 This The stage 2 can be disposed at a lower portion of the chamber 50, and the heating source 4 can be disposed at a higher portion of the chamber 5〇. This embodiment illustrates the coating. The component 30 is a movable member relative to the step 2 to apply the coating material to the coating target, although other embodiments are not excluded. For example, the coating member 3 can be relatively The substrate 20 is fixed, and the coating target is movable to apply the coating: to the mobile coating. The target '丨〇., a coating according to an exemplary embodiment. The apparatus may include the coating rod 10' on which the step 20 is placed; the coating member 30 is movable in the processing direction (X-axis direction) by which the coating material is applied to the coating rod 10; and the heating source 40' which supplies thermal energy to the coating material on the coating target 10' and when the coating treatment is completed, it is available for drying, ie, liquefied coating material. A heating device can provide a substantially uniform hook, i.e., a thin layer coating having a substantially uniform thickness and/or features. In the traditional method, when the coating and dry material treatment of the material is applied, the coating is applied to the processing, that is, the mechanical arm is used in a coating 5 and a separate drying material. Between the R and the R-transports - the coated coating material, the thin layer of the layer material may be deformed, ie, 12 201114500 has a non-uniform thickness. That is, due to the applied state The carrier is carried into the desiccation: this: the substrate of the arm of the beta undried arm, ie, the target of the coating target = the mechanical degree of the machine may be changed, the substrate may be carried by the substrate The external force generated during the process and/or the centripetal force generated by the rotation of the substrate may seriously cause the thin layer thickness on the substrate to be difficult to form a high quality thin layer. Therefore, the composition of the coating device according to the present exemplary embodiment is thin.

可避免薄層厚度上的變異情況,即如在將塗層材料塗層I 基板後將該基板載送至—㈣化設備之傳統方法的過程中 所產生者。 換言之,可藉由在其中該液化塗層材料不會流動之溫 度處,即如約100〇c至約200〇c且因而能夠移除一部份的 溶劑,於與該塗層處理相同的設備處執行加熱處理,亦即 乾燥化該液化塗層材料,來避免根據範例實施例之塗層材 料4層的變形。根據範例實施例的加熱溫度可較傳統個別 的乾燥化設備之溫度,即如約25〇〇c或以上,為低,藉以 在该等所含材料内之元素間產生反應以獲得一些特徵,藉 此即如相較於傳統分別塗層/乾燥化設備而言避免或顯著地 降低對於該塗層材料之成份所造成的高熱效應。應注意到 由於施用於傳統乾燥化設備的高溫可能不會施用於傳統塗 層設備’因此可將傳統塗層設備内的塗層目標載送至該乾 燥化设備以通過即如額外的乾燥化程序。 即如圖3所示,在根據範例實施例的塗層設備1裡, 可將一有機材料施用於該塗層目標1 〇上以構成一 OLED 11 13 201114500 的有機層12 »該OLED 11可含有一第一電極層13、該有機 層12和一第二電極層14 ’該等可為循序地沉積於該塗層目 標10’亦即一基板10,上。 該基板10可為任何適用於該0LED i i的基板,即如任 何擁有足以支撐該〇LED π之強度的適合基板。該基板1〇 可視其用途而定由軟性材料或硬性材料所構成。例如該 基板10可包含玻璃、石英、聚丙烯、聚對苯二甲酸乙二醇 8曰聚碳酸酯、聚甲基丙烯酸酯、聚曱基丙烯酸甲酯、聚 丙烯酸甲酯、聚酯等等之一或更多者。 當自該有機層1 2之發射層所發射的光線會穿過該基板 10時,該基板10可為由透明材料所構成。然而,當自該有 機層1 2之發射層所發射的光線是通過相反於該基板1 〇的 一側時’該基板1 〇則不受限於透明材料。 。亥有機層1 2可為以照含有一發射層的單層結構,或者 是以具有兩個或以上之薄層而其中包含該發射層的結構, 所構成。在該有機層⑴里,除該發射層以外,亦可構成一 即如電洞注入層或電子注入層的電荷注入層,或者是一即 如電洞傳送層或電子傳送層的電荷傳送層。 、,注意到該有機層12的發射層可為由有機材料所構成, 並且可由前文中參照圖1A2所討論的塗層設備…構成。 然亦可藉由相同方法以構成其他薄層,即如有機層。 可藉由該材料供應設備將一液化有機材料,其中用以 部件3發射層的材料係經溶解於—溶劑裡,供應至該射出 201114500 例如,該有機層12可含有任何適當的發光有機材料, 並且可包含即如色劑發射材料、金屬複合物發射材料、聚 合物發射材料等等。此外1添入即如摻質介質等等的添 加劑’精以改善發射效率性與發射波長的變隸,同時該 溶劑可為即如甲苯、三氯甲&、二氣甲院、四氫咳味、: 氧陸園等等。 當該基板1G被設置在該階台2()上時,該塗層部件% 可化《亥處理方向(X軸方向)移動,以射出經過該喷嘴3外由 該塗層頭33a内所供應某一量值的有機材料,藉此將該有機 材料施用於該基板1G上1著,#施用該有機材料後,該 加熱來源40可將熱能供應予其上經施用以該有機材料的基 板1 0,並且可乾燥化該液化有機材料以構成該有機層1 2。 在此,由該加熱來源40所提高之溫度的範圍可根據該 有機材料的溶劑種類而定從約1〇〇〇c至約2〇〇〇c。因此在 根據範例實施例之塗層設備1内所乾燥化的有機材料可為 足夠地固化,並且可擁有大致均勻的厚度。 由則揭說明可顯知由於塗層材料是在一塗層設備内所 乾燥化,因此能夠防止薄層厚度的變形,即如因傳統上將 一基板自一塗層設備載送至一乾燥化設備所導致的材料液 流。此外,由於基板並未接觸到該加熱來源,因此能夠避 免在加熱過程中出現基板的熱性變形。此外,由於階台内 並未设置加熱來源,所以能夠避免階台的變形,同時不會 對遠s史備的精準度造成不良效應。同時,由於可以約i 〇〇〇c 或以上的溫度對塗層材料進行加熱,故而能夠將足夠熱能 15 201114500 供應予塗層材料。Variations in the thickness of the thin layer can be avoided, i.e., as produced during the conventional method of carrying the substrate onto the substrate after the coating material is coated onto the I substrate. In other words, the same equipment as the coating can be treated by the temperature at which the liquefied coating material does not flow, i.e., about 100 〇c to about 200 〇c, and thus a portion of the solvent can be removed. The heat treatment, that is, drying the liquefied coating material, is performed to avoid deformation of the coating material 4 layer according to the exemplary embodiment. The heating temperature according to the exemplary embodiment may be lower than the temperature of a conventional individual drying apparatus, that is, such as about 25 〇〇c or more, whereby a reaction occurs between elements in the materials contained therein to obtain some characteristics. This is to avoid or significantly reduce the high thermal effects on the composition of the coating material as compared to conventional separate coating/drying equipment. It should be noted that due to the high temperatures applied to conventional drying equipment, it may not be applied to conventional coating equipment 'so the coating target within the conventional coating equipment can be carried to the drying equipment to pass, for example, additional drying program. That is, as shown in FIG. 3, in the coating apparatus 1 according to the exemplary embodiment, an organic material may be applied to the coating target 1 以 to constitute an organic layer 12 of an OLED 11 13 201114500 » The OLED 11 may contain A first electrode layer 13, the organic layer 12 and a second electrode layer 14' may be sequentially deposited on the coating target 10', that is, a substrate 10. The substrate 10 can be any substrate suitable for the OLED, i.e., any suitable substrate having sufficient strength to support the 〇LED π. The substrate 1〇 may be composed of a soft material or a hard material depending on the application. For example, the substrate 10 may comprise glass, quartz, polypropylene, polyethylene terephthalate 8 曰 polycarbonate, polymethacrylate, polymethyl methacrylate, polymethyl acrylate, polyester, etc. One or more. When light emitted from the emissive layer of the organic layer 12 passes through the substrate 10, the substrate 10 may be composed of a transparent material. However, when the light emitted from the emission layer of the organic layer 12 passes through the side opposite to the substrate 1 ’, the substrate 1 不受 is not limited to the transparent material. . The organic layer 12 may be formed by a single layer structure containing an emission layer, or a structure having two or more thin layers including the emission layer. In the organic layer (1), in addition to the emission layer, a charge injection layer such as a hole injection layer or an electron injection layer, or a charge transport layer such as a hole transport layer or an electron transport layer may be formed. It is noted that the emissive layer of the organic layer 12 may be composed of an organic material and may be composed of the coating apparatus... discussed above with reference to FIG. 1A2. However, other thin layers, such as organic layers, can be formed by the same method. The liquefied organic material may be liquefied by the material supply device, wherein the material for the luminescent layer of the component 3 is dissolved in a solvent and supplied to the injection 201114500. For example, the organic layer 12 may contain any suitable luminescent organic material. And may include, for example, a toner emitting material, a metal composite emitting material, a polymer emitting material, and the like. In addition, an additive such as a dopant medium or the like is added to improve the emission efficiency and the emission wavelength, and the solvent may be, for example, toluene, trichloromethane, amp; Taste, Oxygen Park, etc. When the substrate 1G is disposed on the stage 2 (), the coating member % can be moved in the "processing direction of the sea (X-axis direction) so as to be emitted from the inside of the coating head 33a through the nozzle 3 a certain amount of organic material, whereby the organic material is applied to the substrate 1G, after the application of the organic material, the heating source 40 can supply thermal energy to the substrate 1 on which the organic material is applied. 0, and the liquefied organic material may be dried to constitute the organic layer 12. Here, the temperature increased by the heating source 40 may range from about 1 〇〇〇c to about 2 〇〇〇c depending on the solvent type of the organic material. Therefore, the organic material dried in the coating apparatus 1 according to the exemplary embodiment can be sufficiently cured and can have a substantially uniform thickness. It can be seen from the description that since the coating material is dried in a coating apparatus, deformation of the thickness of the thin layer can be prevented, that is, as a substrate is conventionally carried from a coating apparatus to a drying. The flow of material caused by the equipment. Further, since the substrate is not in contact with the heating source, it is possible to avoid thermal deformation of the substrate during heating. In addition, since the heating source is not provided in the stage, the deformation of the stage can be avoided, and the accuracy of the accuracy can not be adversely affected. At the same time, since the coating material can be heated at a temperature of about 〇〇〇c or above, sufficient heat energy 15 201114500 can be supplied to the coating material.

行形式上與細節上的各種變化, 她例並且運用特定詞彙, 所使用且詮釋而非用於限 人士將能瞭解確能著手進 而不致悖離如後載申請專 利範圍中所陳述的本發明精神和範嘴。 【圖式簡單說明】 藉由詳細描述示範性實施例並參照於隨附圖式,熟諳 本項技藝之人士將更能夠顯知前述及其他的特性與優點, 其中: 圖1說明根據一示範性實施例之塗層設備的外觀視圖; 圖2說明圖1之塗層設備的截面視圖; 圖3說明一 OLED顯示裝置的截面視圖,其中含有利 用根據一示範性實施例之塗層設備所構成的有機層。 【主要元件符號說明】 I 塗層設備 10 塗層目標Various changes in form and detail, she uses and uses specific vocabulary, and the use and interpretation, rather than the person employed, will be able to understand that it is indeed possible to proceed without further circumventing the spirit of the invention as set forth in the appended patent application. And Fan mouth. BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and other features and advantages will be more apparent to those skilled in the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 2 is a cross-sectional view of the coating apparatus of FIG. 1; FIG. 3 illustrates a cross-sectional view of an OLED display device including a coating apparatus according to an exemplary embodiment. Organic layer. [Main component symbol description] I Coating equipment 10 Coating target

II OLED 12 有機層 13 第一電極層 14 第二電極層 20 階台 30 塗層部件 31 支撐框架 16 201114500 31a 第一支撐框架 31b 第二支撐框架 33 射出部件 33a 塗層頭 33b 喷嘴 40 加熱來源 50 腔室II OLED 12 Organic layer 13 First electrode layer 14 Second electrode layer 20 Stage 30 Coating member 31 Support frame 16 201114500 31a First support frame 31b Second support frame 33 Injection member 33a Coating head 33b Nozzle 40 Heating source 50 Chamber

Claims (1)

201114500 七、申請專利範圍: 1. 一種塗層設備,其包含: 一階台,此者支撐一塗層目標; 一塗層部件’此者係位於該階台上,該塗層部件係經 建構以將一塗層材料施用於該塗層目標上;以及 一加熱來源,此者係相對於並且分隔於該階台,該加 熱來源係經建構以將該塗層材料施用於該塗層目標上之後 對該塗層目標供應熱能。 2. 如申請專利範圍第1項所述之塗層設備,其中該加熱 來源重疊於整個塗層目標,該加熱來源係經建構以將熱能 同時地且均勻地供應予整個塗層目標。 3·如申請專利範圍第丨項所述之塗層設備,其中該加熱 來源為一紅外線加熱器或一齒素燈。 4. 如申請專利範圍第3項所述之塗層設備,其中該加熱 來源為一函素燈,並且該加熱來源進一步含有—反射平板。 5. 如申請專利範圍第1項所述之塗層設備,其中該加熱 來源可朝向該階台垂直地移動。 6. 如申請專利範圍第丨項所述之塗層設備,其中該加埶 來源完全地分離於該階台。 ”、、 7 .如申請專利範圍第丨項所述之塗層設備,直中 部件包含: 八^ i層 —可移動支撐框架,此者位於該階台上;以及 ^ 一射出部件,此者位於該可移動支撐框架上,該射出 部件可在一與該支撐框架之移動方向相垂直的方向上移 18 201114500 動,並經建構以射出該塗層材料。 8. 如申請專利範圍第7項所述之塗層設備,其中該可移 動支撐框架含有: 多個第一支撐框架,該等係以一預定距離彼此相對地 分隔並具有一預定高度;以及 一第二支撐框架,此者的兩端皆經設置在該等第一支 撐框架上並與該等第—支撐框架相交又。 9. 如申請專利範圍第8項所述之塗層設備,其中該第二 支樓框架可朝向該階台垂直地移動並遠離該階台。 1 〇 ·如申請專利範圍第8項所述之塗層設備,其中該射 出部件包含: —可移動塗層頭’此者係經建構以以該第二支撐框架 的縱向方向移動;以及 —喷嘴’此者位於該可移動塗層頭内並經建構以射出 該塗層材料。 U •如申請專利範圍第1項所述之塗層設備,其進一步 包’ 匕3 腔室’該階台位於該腔室的下方部份處而該加熱來 源則位於該腔室的上方部份處。 12·—種塗層方法,其包含: 將一塗層目標定位於該塗層設備内的一階台上; 利用一塗層部件將一塗層材料施用於該塗層目標上; 以及 ’ 在將該塗層材料施用於該塗層目標上之後,利用一加 ‘“、來源以對該塗層材料供應熱能,該加熱來源係相對於且 19 201114500 分隔於該塗層設備内的階台。 13. 如申請專利範圍第12項所述之塗層方法,其中將熱 能供應予該塗層目標包含將均勻熱能同時地供應予整個塗 層目標。 &amp; 14. 如申請專利範圍第12項所述之塗層方法,其中施用 一塗層材料包含施用一有機發射材料、一有 材料及/或-太陽能電電池材料。 電阳體 15. 如申請專利範圍第12項所述之塗層方法,其中將熱 能供應予該塗層目標包含以肖⑽。c至約酬。c的溫度乾 燥化該塗層材料。 ° 16. 如申請專利範圍第12項所述之塗層方法,其中將埶 能供應予該塗層目標包含利用 '红外線加熱器或一幽素 I7· 一種構成一有機層的方法,其包含: 利用-塗層部件將一有機材料施用於一基板上,此 板係位於—塗層設備裡的一階台上;以及 於施用該有機材料之後,刺 χ ^ ^ ^ ^利用一加熱來源將熱能供 予6亥有機材料並且乾燥彳卜兮古拖u 备化°玄有機材料以構成一有機層, 加熱來源係相對於且分隔於j 刀丨to於8玄塗層设備内的階台。 1 8 ·如申請專利範圍第 ^ ^ ^ 第17項所述之方法,其中施用該 機材料匕έ施用一材料择以错士、 a ^ . 猎以構成一有機發光二極體的發: 層、電洞〉主入層、雷、、因/自 '專送層、電子注入層及/或電子傳. 層0 19.如申請專利範圍 靶圍第17項所述之方法,其中將熱能, 20 201114500 應予該有機材料包含以約1 〇〇°C至約200°C的溫度乾燥化 該有機材料。 20.如申請專利範圍第17項所述之方法,其中將熱能供 應予該有機材料包含將均勻熱能同時地供應予整個基板以 乾燥化該有機材料。 八、圊式: (如次頁) 21201114500 VII. Patent application scope: 1. A coating device comprising: a first stage platform supporting a coating target; a coating member 'this is located on the stage, the coating part is constructed Applying a coating material to the coating target; and a source of heat relative to and separated from the stage, the heating source being configured to apply the coating material to the coating target The coating target is then supplied with thermal energy. 2. The coating apparatus of claim 1, wherein the heating source overlaps the entire coating target, the heating source being constructed to supply thermal energy to the entire coating target simultaneously and uniformly. 3. The coating apparatus of claim 2, wherein the heating source is an infrared heater or a guillotine lamp. 4. The coating apparatus of claim 3, wherein the heating source is a light element, and the heating source further comprises a reflective plate. 5. The coating apparatus of claim 1, wherein the heating source is vertically movable toward the stage. 6. The coating apparatus of claim 2, wherein the twisting source is completely separated from the stage. </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Located on the movable support frame, the injection member can be moved 18 201114500 in a direction perpendicular to the moving direction of the support frame, and constructed to project the coating material. 8. Patent Application No. 7 The coating apparatus, wherein the movable support frame comprises: a plurality of first support frames spaced apart from each other by a predetermined distance and having a predetermined height; and a second support frame, two of the two The end of the first support frame is disposed on the first support frame and intersects with the first support frame. 9. The coating device of claim 8, wherein the second branch frame can face the step The apparatus is vertically moved and moved away from the stage. The coating apparatus of claim 8, wherein the injection part comprises: - a movable coating head - the second is constructed to be the second support The longitudinal direction of the frame is moved; and the nozzle is located in the movable coating head and is constructed to project the coating material. U. The coating device according to claim 1, further comprising匕3 chamber 'The stage is located at a lower portion of the chamber and the heating source is located at an upper portion of the chamber. 12. A coating method comprising: positioning a coating target a first stage in the coating apparatus; applying a coating material to the coating target using a coating component; and 'using a coating after applying the coating material to the coating target ", source to supply thermal energy to the coating material, which is separated from the step in the coating apparatus relative to 19 201114500. 13. The coating method of claim 12, wherein supplying thermal energy to the coating target comprises simultaneously supplying uniform thermal energy to the entire coating target. 14. The coating method of claim 12, wherein applying a coating material comprises applying an organic emissive material, a material and/or a solar cell material. The method of coating according to claim 12, wherein the supply of thermal energy to the coating target comprises a diatom (10). c to the reward. The temperature of c dries the coating material. The coating method of claim 12, wherein the coating of the coating to the coating target comprises using an 'infrared heater or a phollix I7· a method of constituting an organic layer, comprising: Applying an organic material to a substrate by means of a coated component, the plate being located on a first stage in the coating apparatus; and after applying the organic material, the hedgehog ^ ^ ^ ^ using a heating source to heat The organic material is supplied to 6 kel and dried, and the organic material is formed to form an organic layer. The heating source is relative to and separated from the step in the j-coating device. 1 8 The method of claim 17, wherein the application of the material, the application of a material to the wrong, a ^. hunting to form an organic light-emitting diode: layer , hole> main entry layer, thunder, cause/self-delivery layer, electron injection layer and/or electron transfer. Layer 0 19. The method described in claim 17 of the patent scope, wherein heat energy, 20 201114500 The organic material should be dried to dry the organic material at a temperature of from about 1 ° C to about 200 ° C. 20. The method of claim 17, wherein the supplying thermal energy to the organic material comprises simultaneously supplying uniform thermal energy to the entire substrate to desalt the organic material. Eight, 圊 type: (such as the next page) 21
TW099130284A 2009-10-28 2010-09-08 Coating apparatus, coating method thereof, and method of forming organic layer using the same TWI577454B (en)

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US20110097499A1 (en) 2011-04-28
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KR101182226B1 (en) 2012-09-12
CN102049368A (en) 2011-05-11
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