1226289 (1) 玖、發明說明 【發明所屬之技術領域】 本發明關係於用以排放一液體材料之排放方法。更明 確地說，本發明關係於一種液體材料用排放方法；一種用 於液體材料之排放設備；及依此方法製造之電子裝置，這 加強了由排放液體材料所完成之薄膜厚度的均勻性，更防 止由在基材構成元件之靜電荷所造成之缺陷，該材料容易 帶靜電，或者，有關在基材上形成容易帶靜電之構成元件 【先前技術】 傳統上，因爲被裝有一排放頭以排放液體材料的排放 設備，所以，一裝設有一噴墨頭之噴墨印表機係爲已知的 〇 典型地，裝在噴墨印表機上之噴墨頭包含一空腔，其 儲存液體材料，及一噴嘴，其係開放至該空腔，及一排放 裝置，其經由該噴嘴排放被儲存於空腔中之液體材料。另 外，一儲存有液體材料之液體材料槽係被連接至該排放頭 ，及一液體材料被由此液體材料槽所提供至排放頭。 另外，近來，不但商用噴墨印表機，噴墨頭同時也可 以作爲工業用排放設備，即，一設備其完成各種設備之構 成元件。例如，排放頭用以形成液晶設備用之彩色濾光片 等，作爲在有機EL元件設備中之光發射層及正電洞注入 層，另外，對於各種裝置之金屬配線、微透鏡等等。 -4 - (2) 1226289 於此，當噴墨頭用以製造例如液晶設備之彩色濾光片 時，因爲基材由玻璃作成，所以基材帶電荷’當噴在一區 域上之彩色濾光片帶電時，可能發生所謂”飛行路徑曲率’‘ ，藉此所排放之液體滴液衝擊一與想要位置不同之位置。 因此，一彩色濾光片製造方法’仍藉由降低飛行路徑 曲率，而避免液體微滴之衝擊點之變化（例如，參考曰本 專利申請第1 1-281810號）。 於此彩色濾光片製造方法中，在基材上之電荷藉由在 排放彩色濾光片材料（墨水）前，吹拂離子氣體於基材上 而被中性化，因爲其目的只有避免基材本身之帶電。這是 因爲基材由例如玻璃之材料製成，所以其容易帶電荷。 然而，於製造彩色濾光片以外之各種裝置時，藉由帶 電基材外之元件，例如，一形成在基材上之裝置的構成元 件’可能會有一問題發生，即該元件將爲靜電荷所摧毀或 破壞’或者，噴墨頭（排放頭）將爲元件之電荷所損壞或 摧毀。 並未有任何先前技術被用來防止電荷被累積於基材外 之元件上。 再者’一般而言，在噴墨頭（排放頭）中，當例如作 爲一裝置構成元件之彩色膜之各種膜被形成時，爲固態元 件之膜材料被溶解或分散於溶液中。這是爲了增加膜材料 之流動性並使得其能提共給噴嘴，並予以經由噴嘴加以排 放。 因此’藉由排放包含溶液之液體材料或分散媒體於一 (3) 1226289 基材上，在塗覆呈薄膜方式後’將之傳送至一乾燥製程’ 及進行乾燥製程，其用熱風爐、熱板、紅外線輻射爐等， 以蒸發溶劑及分散媒體並將之形成爲膜形態構成元件。 然而，於液體材料所作成之膜中，溶劑及分散媒體之 蒸發可能立即發生在塗覆於基材之後，及初步蒸發只發生 在傳送至一乾燥設備之前。在大氣環境下之初步蒸發中’ 接近膜表面，由薄膜所蒸發之溶劑（分散媒體）之濃度氣 係高於中心部份並在週邊爲相對地低。 然後，蒸發緩慢進行於中心部份，另一方面，蒸發在 其旁邊部份進行相對地快，這造成溶劑（分散媒體）由中 心部份側循環至在其旁之部份。當循環發生時，固體內容 (膜材料）的一部份由中心部份移動至週邊，結果，在中 心部份旁之部份的膜厚度較中心部份爲厚。 因此，可以想到，在乾燥製程後，所得之整個膜之膜 厚均勻性損失，因此，在構成元件中之分散功能發生，造 成了可靠度之降低。 另外，如同彩色濾光片及有機E L，藉由排放墨水至 一基材上之若干薄膜進入被分成每一像素之一格中，若乾 燥期很短，則該格的中心部份變成下凹，而若乾燥期相當 地長，則格的中心部份凸出。因此，當觀看整個基材時， 凸出形格被集中在中心部份，而下凹形格被集中在週邊， 這造成於面板上之亮度的變化。 【發明內容】 -6 - (4) 1226289 本發明係針對上述加以完成，其目的爲提供一液體材 料之排放方法及一用於液體材料之排放設備，其加強了由 排放液體材料所完成之膜厚度之均勻性，其防止了被形成 或將要形成於-〜基材上之易帶電構成元素之靜電荷所造成 之問題，但並不限定於基材本身，也提供了 一電子裝置， 其係使用液體材料之排放方法及液體材料之排放設備加以 完成。 爲了 71：成此目的’本發明之液體材料排放方法係爲一 用於液體材料之排放方法，其能將一液體材料由液體材料 之排放設備，排放至一基材，該排放設備具有一排放頭， 其放出液體材料；至少在排放液體材料至基材後，一離子 風被朝向在基材上之液體材料。 依據一用於液體材料之排放方法，因爲在排放液體材 料於基材上後，離子風係朝向在基材上之液體材料，所以 蒸發化學品將立即由上述基材藉由離子風而去除，並發散 由液體材料所蒸發之媒體。因此，於中心部份及旁邊部份 間之分散媒體或溶液蒸氣之梯度將不會產生，這可以防止 由濃度差所造成之膜厚度上之變化的產生。因此，以這可 以避免由膜厚度均勻性損失所造之構成元件之功能的變化 ，並可以防止可靠度之損失。再者，這也可以防止面板亮 之非均勻性。 另外，藉由提供一離子風至基材上，在基材上之靜電 荷可以被中和化，在構成元件被帶電或排放頭爲基材上之 靜電荷所損壞之問題可以被防止。 -7- (5) 1226289 另外，依據液體材料之排放方法，該基材包含一容易 帶電之構成元件，其較佳爲在排放液體材料前’一離子風 被朝向基材。 於此時，也可能可靠地中和化在基材上之電荷’也可 能在排放液體材料前，中和化在容易帶電構成元件上之電 荷。因此，容易帶電構成元件可以防止損壞或破壞。該排 放頭也可以防止爲構成元件之帶電所損壞或破壞。 再者，依據液體材料之排放方法，容易帶電構成元件 可以爲一活性元素。 於容易帶電構成元件爲主動元件，具有例如TFT (薄 膜電晶體）等時，藉由將離子風朝向它，則由於靜電力所 造成之損壞或破壞可以被防止。因此，可以完成於使用此 基材所完成之產品生產力之改良及可靠度之之改良。 另外，依據液體材料之排放方法，當液體材料由容易 帶電構成元件作成時，較佳地，在排放液體材料之前，將 離子風朝向基材。 於此時，有可能可靠地中和化在基材上之電荷，也可 能防止靜電累積在該正被排放之容易帶電液體材料上。因 此，由容易帶電液體材料所作成之構成元件上所累積之靜 電可以被避免。再者，由排放構成元件等所損壞或破壞之 排放頭的問題可以被避免。 再者，依據一液體材料之排放方法，該由容易帶電材 料作成之液體材料可以爲金屬配線材料。 於此時，液體材料例如由金屬膠質材料等之配線材米斗 (6) 1226289 所作成，藉由將一離子風朝向它，可以防止其帶電荷，因 此’ 一'金屬配線可以形成’其中可避免帶電。因此，有可 能改良一產品之生產力，該產品係使用此基材加以完成並 改良其可靠度。 於用於本發明之液體材料的排放方法中，當排放一液 體材料至一具有容易帶電元件之基材上時，在排放液體材 料之前，至少一離子風係被朝向該基材。 依據此用於液體材料之排放方法，因爲至少在排放液 體材料前，離子風被朝向具有容易帶電構成元件之基材， 所以有可能可靠地中和化基材上之容易帶電構成元件之靜 電荷。因此，該爲靜電荷所容易可帶電元件之破壞或損壞 可以避免。再者，也可防止排放頭由於構成元件之靜電荷 而損壞或破壞之問題。 另外，依據液體材料之排放方法，容易帶電構成元件 可以爲一主動兀件。 當容易排放構成元件係爲主動元件，例如具有TFT ( 薄膜電晶體）等，藉由將離子風導入其中，靜電損壞及破 壞可以被避免。因此，有可能改良用此基材之產品的生產 力，並改良可靠度。 用於本發明液體材料之排放設備包含一基材固持部， 其固持具有容易帶電構成元件之基材；一排放頭，其將液 體材料排放至該基材；及一離子化風產生裝置，其產生離 子化風給基材。 依據液體材料之此排放設備，至少在排放液體材料之 -9- (7) 1226289 前，藉由自離子化風產生裝置產生離子化風，並將該離子 化風朝向具有容易帶電元件之基材，有可能可靠地中和化 基材本身之靜電荷，及有可能中和化容易帶電構成元件之 靜電荷。因此，容易帶電元件之損壞及破壞可以被避免。 排放頭被由於構成元件之帶電所損壞或破壞之問題可以被 避免。 本發明另一液體材料的排放設備包含一基材固持件， 其固持一基材；一排放頭，其排放一容易帶電材料之液體 材料至基材上；及一離子化風產生設備，其產生一離子化 風並將該離子化風朝向基材。 依據此液體材料之排放設備，藉由自離子化風產生裝 置產生離子化風，並在排放由容易帶電材料作成之液體材 料排放至基材前，將離子化風朝向基材，有可能中和在基 材本身上之靜電荷，更可能防止容易帶電之液體材料的帶 電。因此，由容易帶電液體材料所形成之構成元件之帶電 被避免。同時，由構成元件之帶電所造成之排放頭之損傷 或破壞的問題也可以被防止。 本發明之另一液體材料排放設備包含一基材固持件， 其固持一基材；一排放頭，其將液體材料排放至該基材； 一離子化風產生裝置，其產生離子化風並將離子化風朝向 基材；及一排氣裝置，其沿著離子風產生裝置所吹出離子 風之方向提供。 依據此用於液體材料之排放設備，在排放液體材料至 基材之後，藉由提供離子化風至基材上之液體材料，及藉 -10- (8) 1226289 由使用排氣裝置，以排出溶劑蒸氣或分散爲離子化風所引 入之媒體蒸氣，溶劑蒸氣或來自液體材料之媒體蒸氣可以 立即由基材上去除。因此，於溶劑蒸氣中之濃度梯度或者 媒體蒸氣分散於中心部份及週邊將不會產生，這可以防止 由於濃度差所造成之膜厚度之變化的產生。因此，由於膜 厚度均勻度損失，所造成之構成元件之功能差異可以避免 ，及可靠度之損失可以避免。再者，這也可以防止面板亮 度之非均勻性。 另外，藉由提供離子化風至基材上，有可能中和基材 本身之靜電荷，及予以爲基材上之靜電荷所形成之構成元 件之靜電荷可以被避免。因此，也可以避免排放頭被損傷 及破壞之問題。 本發明之電子裝置係爲使用液體材料排放方法或排放 設備所形成之構成元件的一部份。 因爲該電子裝置係使用一基材加以形成，而爲高度可 靠並想要的’該基材避免由於所形成膜厚度之非均勻性所 造成之構成元件功能上之變化，或者，基材可以防止可靠 度之損失。該裝置可以高度可靠並想要的，因爲對該容易 帶電構成元件之損傷或破壞可以避免。該裝置也高度可靠 並想要的’因爲其係使用具有構成元件之基材所形成，該 元件係由容易帶電材料所形成，因而避免其靜電荷。 【實施方式】 本發明將說明如下。 -11 - (9) 1226289 第1圖顯示用於本發明之液體材料之排放設備之實施 例（以下稱排放設備）。於第1圖中，參考編號3 0表示 一排放頭。該排放設備3 0具有一基座3 1、一基材傳送裝 置3 2、一頭傳送裝置3 3、一排放頭3 4、一液體材料槽3 5 、一離子產生裝置38、一排氣裝置40等，及該排放頭34 朝向基材S並塗覆液體材料於其上呈一薄膜。再者，於本 實施例之排放設備3 4中，一構成元件，其係用於基材s 之可容易帶電或者用於液體材料容易帶電之材料。 基座31被提供有一基材傳送裝置32及頭傳送裝置 3 3於其上。 基材傳送裝置3 2作動爲本發明之基材固持裝置，即 ，一基材支持件，係用以固持住基材S。基材傳送裝置3 2 同時也有一導軌3 6。於此結構中，基材傳送裝置3 2例如 ，以一線性馬達傳送一滑動件3 7沿著導軌3 6。滑動作3 7 具有馬達，爲0軸（未示出）。例如，馬達爲一直接驅動 馬達，及轉子（未示出）被固定至桌台3 9。於此結構中 ，當電力提供給馬達時，轉子及桌台3 9沿著Θ方向旋轉 ，並指示（旋轉指向）桌台3 9。 桌台3 9係用以固定位置並將之固持。即，桌台3 9具 有已知吸引及固時裝置（未示出），藉由驅動它，進行基 材S之吸引及固持至桌台39上。 基材S係精確地放置並固定於定位，以在桌台3 9之 一預定位置，藉由位置固定銷，然後，被固定於其上。在 桌台3 9上，一細塵粒區（未不出）被提供一來自排放頭 -12- (10) 1226289 3 4之墨水之細微粒。於本實施例中，此細塵粒係被沿著 X軸方向形成，並被提供在桌台3 9之背面。 頭傳送裝置3 3具有一對托架3 3 a及3 3 a，其係立於 基座3 1之背面側，一移動路3 3 b，其被提供在這些托架 3 3 a及3 3 a之上。頭傳送裝置3 3被沿著X軸方向放置， 即沿著與基材傳送裝置32之Y軸方向呈垂直之方向。移 動路3 3 b藉由令一固持板3 3 c建立於托架3 3 a及3 3 a間加 以形成，及一對導軌3 3 d及3 3 d提供在固持板3 3 c上。再 者’一滑動件42，其固持住排放頭34，使得其沿著導軌 3 3d及33d之方向移動。滑動件42藉由驅動一線性馬達 等（未示出）而行進於導軌3 3 d及3 3 d上，以此，滑動件 42被構建以使得排放頭34沿著X軸方向移動。 作爲振盪位置固定裝置之馬達43、44、45及46係連 接至排放頭3 4。當馬達4 3作動時，排放頭3 4沿著Z軸 向上或向下移動，因此，一位置固定可以執行於Z軸上。 再者，Z軸爲一方向（上及下方向），其與X軸及Y軸 呈垂直。另外，當馬達44作動時，排放頭3 4沿著第1圖 中之/3方向振盪，因此，可以執行一位置固定。當馬達 4 5作動時，排放頭3 4沿著r軸方向振盪，因此，執行一 位置固定。當馬達4 6作動時，排放頭3 4沿著α方向振盪 ’因此’可以執彳了 一'位置固定。 在滑動作42上，排放頭34可以藉由直接沿著Ζ軸方 向移動’而固定位置，同時，藉由沿著α、0及Τ方向行 進而固定位置。因此，排放頭3 4之墨排放面相對在桌台 -13- (11) 1226289 3 9上之基材S之位置及經度可以精確地控制。 如第2 A圖所不’排放頭3 4具有一噴嘴板1 2及一振 動板1 3 ’迨些例如爲不鐘鋼材料作成，並將之組合，同 時，安插有一分隔件（貯板）1 4於其間。在噴嘴板12及 振動板1 3之間，藉由分隔件14而形成多數空腔丨5及貯 器1 6，這些空腔1 5及貯器1 6係經由路徑1 7加以連接。 每一空腔1 5及貯器1 6之內部被塡充以一液體材料， 及其間之路徑1 7作動爲一供給路徑，其由貯器1 6供給液 體材料至空腔1 5。另外，多數用以排放來自空腔1 5之液 體材料的孔形噴嘴1 8被形成爲一狀態，其中，它們被垂 直及水平對準。另一方面，在振動板1 3處，形成有一孔 1 9開放至貯器1 6之內側，及一液體材料槽3 5經由管24 連接至孔19(參考第1圖）。 另外’在振動板1 3之與面對空腔1 5相反之面上，一 壓電兀件20係連接成如第2B圖所示。壓電元件20係被 包夾於一對電極2 1及2 1之間，並在施加一電源時，被構 建使得其軟式彎曲並突出向外。該壓電元件2 〇作動爲本 發明之排放裝置。 於此結構中，連接至壓電元件20之振動板1 3彎曲向 外側’作爲同時具有壓電元件20之單元，藉此，在空腔 1 5內之容量增加。然後，空腔1 5及貯器1 6內部彼此開 通’所以’貯器1 6之內部被塡充以液體材料，及液體材 料等於在空腔1 5中所增加之體積，經由路徑1 7流入貯器 1 6中。 -14- (12) 1226289 若供給至壓電元件20之電力停止於此狀態下，則壓 電元件20及振動板1 3之形狀回到其原始形狀。因此，因 爲空腔15中之體積回到原始體積，所以在空腔15內之液 體材料的壓力增加，然後，液體材料的液體微滴22由噴 嘴1 8噴出。 再者’作爲排放頭之排放裝置，該方法也可以採用使 用壓電元件20以外之電機轉換方法。例如，一使用電熱 轉換體作爲能量產生兀件之方法、例如電力放大控制方法 之連續方法、及壓力振盪方法、靜吸引法、以及以照射例 如雷射之電磁波加熱之方法，及以熱工排放液體材料之方 法均可以採用。 如第1圖所示，液體材料槽3 5係放在接近排放頭3 4 ’並儲存由排放它所形成之構成元件之液體材料。一加熱 益（未不出）係裝在液體材料槽3 5之內或外。此加熱器 係用以加熱被儲存之液體材料，該液體材料具有高黏度特 性等，藉由加熱降低黏度，然後，使液體材料容易由液體 材料槽3 5流入排放頭3 4。 離子產生裝置38係用以產生一離子風，並由例如一 游離器或一離子吹風機構成。於此，離子風爲一游離氣體 流，其係藉由在放電支架邊緣之電暈放電所產生之離子， 吹以空氣或N2加以完成。本發明之離子產生裝置38可以 藉由提供很多放電支架，加以提供足夠量之離子。另外， 至於吹在由電暈放電所產生之離子之空氣源或N2源，例 如由壓縮機之壓縮空氣之已知來源、塡於氣缺內之空氣或 -15- (13) 1226289 N2均可以採用。於本發明中，如下所述，由提供離子風 之結果’進行了初步乾燥。因此，可接受離子風作爲一高 於室溫之熱風’其係藉由由空氣源或N 2來之流動路徑上 提供一加熱器加以進行。 另外，離子產生裝置38被放置在基座31上之基材S 的一側，即沿著在桌台3 9上之基材S之X軸側，如同第 1圖所示。吹風出口埠38a係放置面向基材S之表面，使 得所產生之離子風可以吹在整個基材S上，特別是在基材 S之表面上。至於離子產生裝置38，有可能將之附著至一 傳送它之傳送裝置上，並相對於基材S藉由傳送裝置的動 作，而傳送離子產生裝置38沿著基材S之縱長方向（Y 軸方向）或沿著寬度方向（X軸方向），使得足夠及均勻 之離子風可以被吹於基材S表面上。 來自離子產生裝置38之離子風吹拂（流率）的數量 並沒有特殊設限，而是相對應於基材S之大小等，而儘可 能設定爲所需。即，流率在整個基材S表面上，係如上所 述被設定接近均勻。流率被設定爲一數量（流率），以配 合離子風足以去除由溶液所產生蒸氣，或者，分散媒體於 液體材料排放中。 另外，來自離子產生裝置38之離子風並不只作用以 乾燥，同時，實際上也作用以放電，即離子風作用以排放 在基材S上之靜電荷等。一使用離子風之排放方法係較佳 的，因爲其並未接觸基材S，並將不會刮傷或帶灰塵給基 材S。因此，雖然提供（吹拂）離子風至基材s在將一液 -16- (14) 1226289 體材料排放前或排放後隨即進行，但較佳係在此二時間進 行。再者，只要在排放頭3 4或於由之排放液體微滴沒有 問題，則較佳於排放液體材料之同時，進行吹風。 排氣裝置40爲已知排氣結構，例如，排氣導管等， 於本例子中，其有排氣導管40a，及一吸氣泵40c連接至 排氣導管40a。排氣導管40a係被放置，使得其排氣入口 4 0b面向離子風由離子產生裝置38吹來之方向。即，排 氣導管40a係放置於離子產生裝置38經由基材S之吹風 出口埠38a之相對側，及排氣入口 40b係放置以使得其面 向離子產生裝置3 8之吹風出口埠3 8 a。在此情形下，當 離子產生裝置38被作動及離子風如下述被由吹風出口埠 3 8a吹出，則排氣裝置40吸引溶劑（分散媒體）蒸氣與 離子風，並將之藉由作動吸氣泵40c而將之排出。 再者，有關在排氣裝置40之吸氣泵40c之吸引力， 其係足以由離子產生裝置3 8立即吸引離子風，及一溶劑 (分散媒體）與離子風並將之排出，但較佳不利用強的吸 引力，以避免在基材S上造成液體材料流。 再者，本發明之液體材料的排放方法例將基於有此結 構之排放設備3 0的動作加以說明。於本發明中，將使用 被提供有容易帶電材料之基材S，同時，也將使用一容易 帶電材料作爲該液體材料。 首先，在基材傳送裝置32上之基材S被放置在一本 發明之基材固持件之位置，然後，被固持及固定在基材傳 送裝置32上。 -17- (15) 1226289 當基材S藉由如此作加以設定時，離子風爲離子產生 裝置3 8所產生，在由排放頭3 4排放液體材料前’所產生 之離子風被吹至整個基材S。將離子產生裝置38被附著 至傳送裝置時，當適當地移動離子產生裝置38時’離子 風之由吹風出口埠3 8 a吹拂，使得離子風被提供於整個基 材S表面上，特別是均勻地在表面上。 然後，在基材本身上之靜電荷可以被放電，再者，在 形成於基材S上之容易帶電構成元件之靜電荷，例如，由 TFT (薄膜電晶體）所構作之主動元件等，及在已經形成 之金屬配線上之靜電荷也可以放電。若使用離子風，未執 行放電，則基材S的電位將爲約5kV至30kV，同時，藉 由執行處理以提供離子風，基材S的電位可以等於或低於 lkV。 再者，在吹拂離子風時，排氣裝置40之吸氣泵40c 可以被作動也可以不作動。 再者，藉由將排放頭3 4傳送至排放用適當位置，或 ，藉由自排放頭3 4排放，於使用基材傳送裝置傳送基材 S的同時，一例如由金屬膠質材料之液體材料作成之金屬 配線材料係被形成在基材S的想要位置上之膜中。再者， 於液體材料之排放程序中，只要液體材料之排放沒有問題 ，較佳地，持續由離子產生裝置38吹出一離子風。然而 ’對排放液體材料之干擾應藉由停止排氣裝置4〇之吸引 泵40c之動作加以避免。 當排放如此之一液體材料時，因爲已經如前述執行在 -18- (16) 1226289 基材S上之靜電荷的放電，所以來自排放頭3 4之容易帶 電材料的帶靜電可以被避免，再者，由在基材S上之靜電 荷所造成之排放頭之損傷及破壞等可以被避免。另外，當 於液體排放動作中，連續吹送來自離子產生裝置3 8之離 子風時，於排放動作中之基材S的帶靜電可以被避免，同 時，排放在基材S上之液體材料的帶靜電也可以被避免。 以此方式，當一預定量之液體材料被施加至每一預定 位置，以形成一想要薄膜時，完成排放。然後，離子產生 裝置3 8之作動及離子風吹向在基材S上之液體材料在完 成排放後立即執行。於此同時，用於排氣裝置40之吸引 泵4 0 c被作動。當液體材料之排放工作時，離子風由離子 產生裝置38所吹出時，離子風被持續吹出，排氣裝置40 之吸引泵40c被新作動。 然後，一來自被排放與塗覆在基材S上之液體材料的 溶劑（分散媒體）蒸氣將立即爲來自基材S上之位置的離 子風所去除，蒸氣被由排氣埠40c所排出。因此，在基材 S中心部份與週邊間所產生之溶劑（分散媒體）之蒸氣的 濃度差消失，這避免在濃度差所造成之膜中的不規則性。 另外’藉由將離子風吹向基材s’在基材S上之靜電 荷將被釋放，其中，在放電之前，例如離子風將不被提供 在基材S上，以及，基材S本身被帶電。 藉由以此方式吹拂一離子風，包含在基材S上之液體 材料中之溶劑（分散媒體）將被蒸發並以蒸氣去除，然後 ，其被初步乾燥。 -19- (17) 1226289 此後’進行此類型之初步乾燥一預定時間，例如，當 由膜（液體材料）每單位時間所產生之蒸氣變低時，而可 以不影響膜厚度下，基材S被傳送至乾燥處理。再者，一 在膜中之構成元素係藉由進行一乾燥處理加以形成，使用 〜熱氣爐或熱板、一紅外線輻射爐、一真空乾燥爐等加以 進行，並蒸發殘留在膜中之溶劑或分散媒體。 於使用此類型之排放設備3 0之液體材料的排放方法 中，因爲如上述在排放液體材料於基材S上後，一離子 風隨即被吹向在基材S上之液體材料，所以，在基材S之 中心部份與週邊間之溶劑（分散媒體）蒸氣的濃度梯度消 失，因此，由濃度梯度所造成之膜厚度的不均勻可以防止 。因此，由膜厚度不均勻損失及可靠度損失所造成之構成 元件之功能上之變化可以被防止。 另外，藉由提供一離子風至基材S上，在基材S本身 上之靜電荷可以被釋放，然後’在予以形成之構成元件上 之爲基材s上之靜電荷所帶電的問題，或者，排放頭3 4 被損傷或破壞的問題等可以被防止。 另外，因爲在排放一液體材料前，一離子風被吹向基 材S，所以在基材S本身上之靜電荷可以被釋放，再者， 在容易帶電構成元件上之靜電荷也可以被釋放，該元件被 例如形成在基材S上’爲例如由TFT (薄膜電晶體）作成 之主動元件。因此，可以避免主動元件等被靜電荷損傷或 破壞，再者，也可以避免排放頭3 4被電荷所損傷或破壞 -20- (18) 1226289 另外，當一液體材料被排放時，因爲在基材S上之靜 電荷已經被釋放，所以，在已放電液體材料上之帶靜電荷 可以被防止。再者，因爲在排放一液體材料後，隨即提供 離子風在液體材料（膜）上，所以，由容易帶電材料所形 成之構成元件上的帶電，例如金屬配線可以被防止。再者 ，由構成元件（金屬搭接）等之放電所造成之排放頭3 4 破壞的問題也可以防止。 因此，依據使用排放設備3 0之液體材料的排放法， 由膜厚度均勻性損失所造成之構成元件功能變化可以避免 ，以及，可靠度之損失可以避免。再者，其可以藉由加強 使用基材S所形成之產品的生產力來增加可靠度，該產生 品係排放一液體材料加以完成者。 再者，本發明並不限定於上述實施例，也可以在一不 脫離本發明之精神的範圍內加以作各種修改。例如，於本 發明中之排放設備3 0，也可以整個被收納在一室內，或 者，至少基材S、排放頭3 4及離子產生裝置3 8也可以收 納於該室中，排氣裝置4 0之排氣入口 4 0 b也可以提供在 室中。 另外’於本實施例中，例如TFT之主動元件係被顯 示作爲容易帶電構成材料，以及，一例如金屬膠質材料作 爲一金屬配線材料也被顯示爲一容易帶電材料作成之材料 。然而，本發明並不限定於此，各種其他者也可以作爲容 易帶電構成材料’或者作爲容易帶電材料作成之液體材料 。例如，有關容易帶電構成材料，有可能應用至上述金屬 -21 - (19) 1226289 配線、各種記憶體元件、一有機EL元件、一有機TFT元 件等。至於容易帶電材料作成之液體材料，也可能使用由 導電細微粒作成之液體材料，其可以被分散，及一例如導 電彩色濾光片材料之導電樹脂材料等。 再者，一第一應用例中，將說明一有機EL設備之製 造例。 第3圖顯示一有機E L設備之側剖面圖，其構成元件 之一部份由排放設備所製造。首先，將說明有機E L設備 之示意架構圖。 如弟3圖所不’有機EL設備301係爲一有機EL兀 件302，其連接有一軟式基板（未示出）及驅動ic (未示 出）之配線，有機EL元件3 02具有一基材3 1 1、一電路 元件部3 2 1、一像素電極3 3 1、一排部3 4 1、一發光元件 3 5 1、一陰極3 6 1 (相對電極）、及一密封基材3 7 1。電路 元件部3 2 1係由例如T F T等之主動元件所形成在基材3 1 1 上，並被構成以使得多數像素3 3 1被安排於電路元件部 321上。在像素電極3 3 3 1之間，形成有呈矩陣狀之排部 341，及發光元件351係形成在凹陷形開口埠3 44中，其 係爲排部3 4 1所作成。發光元件3 5 1具有一元件，其發出 紅光，一元件其發出綠光，及一元件，其發出藍光。以此 結構，有機EL設備3 0 1可以實施全彩顯示。陰極3 6 1係 整個形成在排部3 4 1及發光元件3 5 1頂面上，密封基材 371係被層疊於陰極361上。 包含有機EL元件之有機EL設備301之製程具有一 -22- (20) 1226289 排部形成製程，其形成排部3 4 1、一電漿處理設備，其用 以適當地形成發光元件3 5 1、一發光元件形成製程，其形 成發光元件3 5 1、一相對電極形成製程，其形成陰極3 6 i 、及一密封製程，其將密封基材3 7 1疊於陰極3 6 1上並將 之密封。 發光元件形成製程係用以藉由在像素電極3 3 1上，形 成正電洞注入層3 5 2及發光層3 5 3加以形成發光元件3 5 1 。並具有一正洞注入層形成製程及一發光層形成製程。該 正洞注入層形成製程具有第一排放製程，其排放一液體材 料至該像素電極3 3 1，用以形成正電洞注入層3 5 2，及一 第一乾燥製程，其乾燥被排放之液體材料並形成正電洞注 入層352。另外’發光層形成製程具有一第二排放製程， 其排放用以形成發光層3 5 3之液體材料於正電洞注入層 3 52上，及，一第二乾燥製程，其乾燥被排放之液體材料 並形成發光層353。發光層353被如上述發出三色，即紅 、綠及藍。因此，第二乾燥製程具有三個程序，用以排放 三類型之材料。 於發光元件形成製程中，排放設備3 0係用以於在正 洞注入層形成製程中之第一排放處理，其也用於在發光層 形成製程中之第二排放程序。即，在第一排放製程中，一 離子風將由離子產生裝置3 8所提供，在液體材料被排放 之前後，再者，當液體材料被排放於第二排放程序之三個 程序中，一離子風將被提供在該排放之前後。 於製造有機EL設備3 0 1之時，在排放形成每一構成 -23- (21) 1226289 元件前，在基材3 1 1上之靜電荷及在像素電極3 3 1及電路 元件部321上之靜電荷將藉由提供來自離子產生裝置38 之離子風至基材3 i丨，而加以放電，即，對容易帶電構成 元件’例如電路元件部3 2 1及像素電極3 3 1之基材3 1 1執 行放電。另外，在正洞注入層形成製程及發光層形成製程 後，離子風將提供至在基材3 1 1上之液體材料。 藉此，靜電對排放頭3 4之損壞或破壞可以被防止， 再者’所生產之有機EL設備3 0 1之生產力可以加強，及 加強可靠度。 另外，至於予以形成之正電洞注入層352及發光層 3 5 3 ’因爲膜厚度可以均勻，所以有可能免除於功能上之 變動及加強可靠度。 再者，作爲本發明之第二應用，將說明一電漿顯示器 〇 第4圖顯示一電漿顯示器之分解及立體圖，其中構成 元件之一部份，即位址電極5 1 1及匯流排電極5 1 2 a係爲 排放設備所製造。第4圖中之參考符號500表示一電漿顯 示器。電漿顯示器係由一玻璃基材5 0 1及一玻璃基材5 0 2 構成’其係被放置彼此相對，及一放電顯示部5 1 0被形成 於其中。 放電顯示部510具有一群放電室516。在多數放電室 5 1 6內’三個放電室5 1 6係被放置，以使得一紅色放電室 516(R)、一綠色放電室516(G)、及一藍色放電室 5 1 6 ( B )完成一組並構成一像素。 -24- (22) 1226289 在基材（玻璃5 01 )之頂面，位址電極5 1 1係呈帶狀 形成在其間之預定間隙中，及介電層5 1 9係被形成，以覆 蓋位址電極511及基材501之頂面，再者，在介電層519 上，排5 1 5係被形成於位址電極5 1 1及5 1 1之間，使得其 沿著每一位址電極5 1 1延伸◦排5 1 5同時也在預定位址於 其延伸方向，分別以預定間隙（未示出）分割爲垂直方向 ，及矩形區係基本上爲鄰近位址電極5 1 1之寬度方向中之 左及右側之排及延伸垂直於位址電極5 1 1 (未示出）方向 之排所分割形成，以及，放電室5 1 6係被形成對應於這些 矩形區，及一像素由一群之三個矩形區所構成。一螢光材 料5 1 7係放置在由排5 1 5所分割之矩形區域內。螢光材料 5 1 7射出紅、綠及藍螢光之一，及紅色螢光材料5 1 7 ( R ) 係放置在紅色放電室 5 1 6 ( R )的底部，及綠色螢光材料 517(G)係放置在綠色放電室516(G)之底部，及藍色 螢光材料5 1 7 ( B )係放置在藍色放電室5 1 6 ( B )的底部 〇 在玻璃基板5 02側上，由多數ITO作成之顯示電極 5 12係被形成爲帶狀，其間具有一預定間隙，ITO被對準 使得其方向垂直於位址電極5 1 1。同時，由金屬所作成之 匯流排電極512a係被形成以補償高阻ITO。另外，一介 電層5 1 3將藉由塗覆它們加以形成，因此，例如M g Ο等 之保護膜5 1 4將被形成。 放電室516係藉由將6 5 0 1及玻璃基板5 02相互安裝 形成，以使得位址電極5 1 1及顯示電極5 1 2相對並彼此垂 -25- (23) 1226289 直，及藉由抽真空由基材5 Ο 1及排位址電極5 1 1與形成在 玻璃基板5 02側上之保護膜5 14所包圍之空間，及將之塡 充以惰性氣體。形成在玻璃基板5 02上之顯示電極5 1 2係 被形成，使得其兩者被放置對應於每一放電室5 1 6。 位址電極5 1 1及顯示電極5 1 2被連接至一交流電源（ 未示於圖中），及藉由提供電力至這些位址電極511及顯 示電極5 1 2，在放電顯示部 5 1 0之必要位置之螢光材料 5 1 7被激勵及發光，因而，實現一彩色顯示。 於例子，更明確地說，位址電極5 1 1及匯流排電極 5 1 2a係使用排放設備3 0加以形成。即，於形成位址電極 511及匯流排電極512a時，其具有圖案化的優點，一包 含金屬膠質材料（例如金膠質及銀膠質）或導電細微粒（ 例如金屬細微粒）之液體材料被排放，並且，其係藉由乾 燥及燒結加以形成。 於此例中，應用本發明，在基材5 0 1 (玻璃基板5 02 )上之靜電荷藉由事先將來自離子產生裝置38之離子風 吹向基材5 0 1或玻璃基板5 0 2加以放電。另外，藉由在排 放電極材料後，立即提供離子風，予以形成之電極的膜厚 度將爲均勻及予以形成之電極帶電將可以避免。 以此，予以形成之位址電極5 1 1及匯流排電極5 1 2 a 之均勻性可以加強，以及，有可能形成，而使得其功能不 會變化並具有高可靠度。 另外，有可能防止排放頭3 4之靜電破壞，再者，予 以生產之電漿顯示器之生產力可以加強，也加強可靠度。 -26- (24) 1226289 再者，於本發明第三應用中，將說明一電氣裝置的製 造例係被裝配有發光二極體及一有機T F T。 第5圖爲電子裝置的側剖面圖，其構成元件之一部份 係由排放設備所製造。一電子裝置70係藉由將有機 TFT71及有機LED72積集至同一基材73上成單石加以完 成。有機TFT包含一閘極電極74，形成在基材73上，一 介電質層75藉由覆蓋此形，成一源極電極76及汲極電極 77被形成在介電質層75上，及一有機半導體層78藉由 覆蓋它們加以形成。 有機LED 7 2包含形成在基材73上之陽極79、藉由覆 蓋陽極7 9所形成之正電洞傳送層8 0、形成在正電洞傳送 層80上之電子傳送層81，及一陰極82形成在此電子傳 送/發射層8 1上。陽極7 9係藉由延伸汲極電極7 7於基材 7 3上加以形成，及正電洞傳送層8 〇係藉由延伸7 8於陽 極79上加以形成。 在電子裝置70中，當例如用金屬等形成陽極79及陰 極82，排放設備3 0較佳用於此製造。即，當形成陽極79 及陰極82時，其係持別有利於圖案化，一包含金屬膠質 材料（例如金膠質及銀膠質）之液體材料或導電細微粒（ 例如金屬細微粒）係被排放，並藉由乾燥及燒結形成。 於此時，應用本發明，在基材7 3上之靜電荷及在有 機TFT71上之電荷係事先爲來自離子產生裝置38之離子 風吹向基材7 3所放電。另外，藉由於排放電極材料時， 更於排放後隨即提供離子風，予以形成之電極上之帶電可 -27- (25) 1226289 以被避免。 以此，有可能防止排放頭3 4之靜電損傷及破壞，再 者，予以生產之電漿顯示器之生產力可以加強，也加強可 靠度。 再者，本發明第四應用將說明製造用於液晶顯示裝置 等之彩色膜的製造例。 爲了使用排放設備3 0，在基材S上排放墨水以製造 彩色濾光片，首先，基材S被放置在桌台39上之預定位 置。至於基材S，具有適當之機械應力及高光學透光率之 透明基材可以採用。明確地說，一透明玻璃基材、一丙烯 酸玻璃、一塑膠玻璃、一塑膠膜、及這些之表面處理產品 等均可採用。 另外，於本例子中，爲增加生產力，多數彩色濾光片 區被形成在矩形基材S上，呈矩陣形式。彩色濾光片區隨 後用作爲適用於液晶顯示裝置，藉由切割基材S而用作爲 彩色濾光片。彩色濾光片區分別被排列形成紅（R )、綠 (G)及藍（B)墨水成預定圖案，以此，例子中，帶式 圖案爲傳統式。再者，除了帶式圖案外，其他形成圖案包 含馬賽克、三角形、及正方形圖案也可。 爲了形成彩色濾、光片區，首先，一'黑色矩陣52被針 對透明基材S —側加以形成如第6 A圖所示。此黑色矩陣 5 2係藉由例如旋塗法，而塗覆一預定厚度（例如約2微 米）之非透光樹脂（較佳爲黑色）加以形成。爲黑色矩陣 5 3所包圍之最小顯示元件，即濾色片件5 3具有X軸方向 -28- (26) 1226289 寬度約3 0微米及Y軸方向長度約1 00微米。 再者，如第6Β圖所示，墨水微滴（液體滴）54係由 排放頭3 4所排出並衝擊在濾光片元件5 3上。同時，在排 放墨水微滴（液體微滴）5 4之前’基材S上之靜電荷及 在黑色矩陣52上之靜電荷係藉由提供來自離子產生裝置 3 8之離子風加以放電。另外，一離子風係於排放墨水微 滴（液體微滴）5 4時，由排放裝置所提供。來自離子產 生裝置38之離子風的吹拂係在排放墨水微滴（液體微滴 )5 4之前後加以進行。 帶電墨水微滴5 4之數量係爲一考量加熱步驟中，墨 水體積縮減之適當量。 一旦，墨水微滴5 4被以此方式，塡入所有基材S上 之濾光片元件5 3，基材S被使用一加熱器而熱處理至一 預定溫度（例如約70 °C )。由於此熱處理，墨水溶劑蒸 發及墨水體積減少。當積體減少很多時，墨水排放步驟及 加熱步驟被重覆進行，直到取得作爲彩色濾、光片之適當墨 水膜厚度爲止。此處理之結果，於墨水中之溶劑蒸發，使 得只有包含於墨水中之固體成份以膜的形式殘留，因而造 成如第6 C圖所示之彩色濾光片5 5。當重覆墨水排放處理 及加熱處理時，特別是於墨水排放處理時，在該處理前後 ，離子風被由離子產生裝置38所提供。 再者’爲了平坦化基材S及保護彩色濾光片5 5，一 保護膜5 6係形成在基材S上，以覆蓋彩色濾光片5 5及黑 色矩陣52，如第6D圖所示。雖然旋塗，但捲動塗覆或輕 -29- (27) 1226289 塗等也可以用以形成此保護膜5 6，如第1圖所示之排放 設備3 0也可以如同彩色濾光片5 5之方式使用。當使用排 放設備3 0時，較佳在排放保護膜5 6之形成材料前後，提 供一來自離子產生裝置38之離子風。 再者’如第6 E圖所示，一透明導電膜5 7藉由濺鍍或 真空沉積法等，形成在保護膜5 6之整個表面上。隨後， 透明導電膜5 7被作出圖案及像素電極5 8被作出對應於濾 光片元件53之圖案。 於使用排放設備3 0以製造彩色濾光片時，在排放彩 色濾光片材料（墨水微滴5 4 )時，及在排放後，隨即在 基材S上之靜電荷係藉由來自離子產生裝置之離子風 所放電’及予以形成之彩色濾光片之帶電荷被提供離子風 所防止。 以此方式，有可能防止排放頭3 4之靜電損傷及破壞 ’再者’予以生產之光學裝置（液晶顯示器）之生產力可 以加強，也加強可靠度。 再者，本發明第五應用中，將參考附圖說明導電膜電 路圖案（金屬電路圖案）之形成方法。第7圖爲形成本發 明之形·成圖案之方法的流程圖。 於第7圖中，本發明之圖案形式成方法具有一使用預 定溶劑等之淸洗基材程序，其上將分佈液體材料之液體微 滴（步驟S 1 )，一親水性加強處理，構成了基材之表面 處理程序之一部份（步驟S2 )，一親水控制處理程序， 其構成表面處理之一部份，其控制基材表面的親水性（步 -30- (28) 1226289 驟S 3 ) ’ 一材料分佈程序，用以在被處理之基材表面， 藉由使用一液體微滴排放法，分佈一液體材料而在基材上 繪出（形成）一膜圖案，該液體材料包含導電膜電路形成 材料（步驟S4 )，一中間乾燥處理，用以去除分佈在基 材上之液體材料中之溶劑構成的至少一部份（步驟s 5 ) ’及一烘烤處理’用以繪有預定圖案之基材（步驟s 7 ) 。在中間乾燥處理後，可以判斷預定圖案繪出完成否（步 驟S 6 )，然後，若圖案繪成，則烘烤程序將被執行，否 則，若圖案繪出未完成，則材料分佈程序將進行。 再者’將說明基於液晶微滴排放法之材料分佈處理（ 步驟S 4 )，用排放設備3 0 (步驟s 4 )。 本例子之材料分佈程序爲用以以線性形成多數線性膜 圖案（電路圖案）處理，藉由將含有來自排放設備之液體 微滴排放頭3 4之導電電路形成材料的液體材料分佈至基 材S上。液體材料爲液體類型材料，其導電細微粒，例如 金屬等係被分散於分佈媒體中。於以下說明中，將說明三 個第一、第二及第三膜圖案（線性圖案）W1、W 2及W 3 〇 第8、9及1 0圖係用以解釋之分佈液體微滴至基材s 上之例子。於這些圖中，一包含多數呈矩陣單元區域之像 素的位元映圖及液體微滴將被分佈於基材s上。於此，一 像素被作成正方形。形成第一、第二及第三膜圖案W1、 W2及W3之第一、第二及第三圖案形成區^、^及R3 係被設定爲使得其相對於多數像素中之預定像素。多數圖 -31 - (29) 1226289 案形成區R1、R2及R3係沿著X軸方向，設定爲線性。 於第8至10圖中，圖案形成區Rl、R2及R3係被標示爲 陰影區。 另外，將由液體微滴排放設備之排放頭3 4上之多數 噴嘴的第一排放噴嘴3 4 A之液體材料的微滴分佈在基材S 上之第一圖案形成區R1。同樣地，將由液體微滴排放設 備之排放頭3 4上之多數噴嘴的第二及第三排放噴嘴3 4B 及3 4C之液體材料的微滴分佈在基材S上之第二及第三 圖案形成區R2及R3。 即，排放噴嘴（排放部）34A、34B及34C係提供， 以使得其對應於一第一、第二及第三圖案形成區R 1、R2 及R3。排放頭3 4分佈多數微滴，以在多數圖案形成區 Rl、R2及R3之每一多數像素位置上。 再者，每一第一、第二及第三圖案形成區R1、R2及 R3被設定，以使得被形成在這些第一、第二及第三圖案 形成區Rl、R2及R3上之第一、第二及第三膜圖案W1、 W2及W3被由第一側部圖案Wa形成，該圖案Wa係在線 寬方向之一側（-X側），再者，第二側部圖案Wb係在另 一側（+X側）形成，在第一及第二側部圖案Wa及Wb形 成後，在線寬方向之中心位置之中心圖案w c被形成。 於本例子中，每一膜圖案（線性圖案）W1至W 3，即 每一具有相同線寬L之圖案形成區R1至R3，及線寬L 被設定爲等於三像素之寬度。每一圖案間之間隔件係被設 定爲相同寬度S，及寬度S也被設定等於三個像素之寬度 -32- (30) 1226289 。於排放噴嘴s34A至s34C間之間隙的噴嘴間距也被設定 等於六像素之寬度。 於以下說明中，包含排放噴嘴3 4 A、3 4 B及3 4 C之排 放頭3 4將沿著Y軸在基材s上排放液體微滴。於第6至 1 0圖之說明中，符號” 1 ”表示液體微滴已經在第一掃描中 ，分佈液體微滴，及符號”2”，”3”，…，”η”表示於第二、 第三、…、及第η掃描所分佈之液體微滴。1226289 (1) 玖, Description of the invention [Technical field to which the invention belongs] The present invention relates to a discharge method for discharging a liquid material. More specifically, The invention relates to a discharge method for liquid materials; A discharge device for liquid materials; And electronic devices manufactured in this way, This enhances the uniformity of the thickness of the film made from the discharged liquid material, To prevent defects caused by the electrostatic charge of the components constituting the substrate, This material is prone to static electricity, or, Regarding the formation of electrostatically susceptible components on a substrate [Prior art] Traditionally, Because the discharge equipment is equipped with a discharge head to discharge liquid materials, and so, An inkjet printer equipped with an inkjet head is known. Typically, The inkjet head mounted on the inkjet printer contains a cavity, It stores liquid materials, And a nozzle, It is open to the cavity, And a discharge device, It discharges the liquid material stored in the cavity through the nozzle. In addition, A liquid material tank storing liquid material is connected to the discharge head, And a liquid material is supplied to the discharge head by this liquid material tank. In addition, recently, Not only commercial inkjet printers, The inkjet head can also be used as industrial discharge equipment. which is, A device completes the constituent elements of various devices. E.g, The discharge head is used to form color filters for liquid crystal equipment, etc. As a light emitting layer and a positive hole injection layer in an organic EL element device, In addition, For metal wiring of various devices, Micro lenses and more. -4-(2) 1226289 Here, When an inkjet head is used to manufacture a color filter such as a liquid crystal device, Because the substrate is made of glass, So the substrate is charged ’When the color filter sprayed on an area is charged, The so-called "curvature of the flight path" may occur, As a result, the discharged liquid droplet impacts a position different from the desired position. therefore, A color filter manufacturing method ’still reduces the curvature of the flight path, While avoiding changes in the impact point of liquid droplets (for example, (Refer to Japanese Patent Application No. 1 1-281810). In this color filter manufacturing method, The charge on the substrate is obtained before the color filter material (ink) is discharged. Neutralized by blowing ion gas on the substrate, Because the only purpose is to avoid the substrate itself. This is because the substrate is made of a material such as glass, So it is easy to be charged. however, When manufacturing various devices other than color filters, With components outside the charged substrate, E.g, A component of a device formed on a substrate may have a problem, That the element will be destroyed or destroyed by electrostatic charges ’or, The inkjet head (discharge head) will be damaged or destroyed by the charge of the component. No prior technique has been used to prevent charges from being accumulated on components outside the substrate. Furthermore, generally speaking, In the inkjet head (discharge head), When various films such as a color film of a device constituting element are formed, Membrane materials that are solid components are dissolved or dispersed in a solution. This is to increase the fluidity of the membrane material and enable it to be fed to the nozzle. It is discharged through the nozzle. So ‘by discharging a liquid material or dispersion medium containing a solution onto a (3) 1226289 substrate, After being applied as a thin film, ‘transport it to a drying process’ and perform the drying process, It uses a hot blast stove, Hot plate, Infrared radiation furnace, etc. The solvent and the dispersion medium are evaporated and formed into a film-shaped constituent element. however, In the film made of liquid material, Evaporation of solvents and dispersion media may occur immediately after coating on the substrate, And the initial evaporation only takes place before being transferred to a drying device. In the initial evaporation in the atmospheric environment, it ’s close to the film surface, The concentration gas of the solvent (dispersion medium) evaporated from the film is higher than the center portion and relatively lower in the periphery. then, Evaporation proceeds slowly in the center, on the other hand, Evaporation takes place relatively quickly on its side, This causes the solvent (dispersion medium) to circulate from the center portion to the portion next to it. When the cycle happens, Part of the solid content (membrane material) moves from the center to the periphery, result, The thickness of the film near the center portion is thicker than the center portion. therefore, As you can imagine, After the drying process, The thickness uniformity of the obtained whole film is lost, therefore, The dispersive function in the constituent elements occurs, This results in a reduction in reliability. In addition, Like color filters and organic EL, By discharging ink onto a number of thin films on a substrate, the cells are divided into a cell divided into each pixel, Some dry periods are very short, Then the central part of the cell becomes concave, And if the drying period is quite long, The central part of the grid is protruding. therefore, When looking at the entire substrate, The protruding grid is concentrated in the center, And the recessed grid is concentrated on the periphery, This causes a change in brightness on the panel. [Summary of the Invention] -6-(4) 1226289 The present invention is completed in view of the above, Its purpose is to provide a discharge method for liquid materials and a discharge device for liquid materials, It enhances the uniformity of the film thickness made by the discharge of liquid material, It prevents the problems caused by the electrostatic charges of easily-chargeable constituent elements that are formed or are to be formed on the- But not limited to the substrate itself, An electronic device is also provided, This is done using liquid material discharge methods and liquid material discharge equipment. For 71: To this end ’the liquid material discharge method of the present invention is a discharge method for liquid materials, It can discharge a liquid material from a liquid material discharge device, Discharge to a substrate, The discharge device has a discharge head, It emits liquid material; At least after discharging the liquid material to the substrate, An ionic wind is directed at the liquid material on the substrate. According to a discharge method for liquid materials, Because after discharging the liquid material on the substrate, The ionic wind is directed towards the liquid material on the substrate, So the evaporation chemicals will be immediately removed from the above substrate by ion wind, And divergent media evaporated by liquid materials. therefore, The gradient of the dispersion medium or solution vapor between the center part and the side part will not be generated. This prevents the variation in film thickness from being caused by the difference in concentration. therefore, This can avoid the change in the function of the constituent elements caused by the loss of film thickness uniformity, And can prevent the loss of reliability. Furthermore, This also prevents unevenness in panel brightness. In addition, By providing an ionic wind to the substrate, The electrostatic charge on the substrate can be neutralized, The problem that the constituent elements are damaged by the electrostatic charge on the substrate or the discharge head is prevented can be prevented. -7- (5) 1226289 In addition, According to the discharge method of liquid materials, The substrate contains a constituent element that is easily charged, It is preferred that an ionic wind is directed towards the substrate before the liquid material is discharged. At this time, It is also possible to reliably neutralize the charge on the substrate ’, or before discharging the liquid material, Neutralize the charge on the components that are easily charged. therefore, The easily charged constituent elements can prevent damage or destruction. The discharge head can also be prevented from being damaged or destroyed by the electrification of the constituent elements. Furthermore, According to the discharge method of liquid materials, The easily-chargeable constituent element may be an active element. The component that is easy to be charged is an active component, When there is, for example, a TFT (Thin Film Transistor) By directing the ion wind towards it, Damage or destruction due to electrostatic forces can be prevented. therefore, It can be used to improve the productivity and reliability of the products completed by using this substrate. In addition, According to the discharge method of liquid materials, When the liquid material is made of a component that is easily charged, Preferably, Before discharging liquid material, Direct the ion wind towards the substrate. At this time, It is possible to reliably neutralize the charge on the substrate, It is also possible to prevent static electricity from accumulating on the easily charged liquid material being discharged. Therefore, Accumulated static electricity on constituent elements made of easily charged liquid materials can be avoided. Furthermore, The problem of the discharge head which is damaged or destroyed by the discharge constituent elements and the like can be avoided. Furthermore, According to a method of discharging a liquid material, The liquid material made of an easily charged material may be a metal wiring material. At this time, Liquid materials such as wiring materials such as metal glue (6) 1226289, By directing an ion wind towards it, Can prevent it from being charged, Therefore, 'a' metal wirings can be formed ', in which electrification can be avoided. therefore, May improve the productivity of a product, This product was completed using this substrate and improved its reliability. In the discharge method of the liquid material used in the present invention, When a liquid material is discharged onto a substrate with an easily charged element, Before discharging liquid material, At least one ionic wind system is directed toward the substrate. According to this discharge method for liquid materials, Because at least before the liquid material is discharged, The ionic wind is directed towards a substrate having constituent elements that are easily charged, Therefore, it is possible to reliably neutralize the electrostatic charges of the easily charged constituent elements on the substrate. therefore, The destruction or damage of the chargeable components which are easily caused by electrostatic charges can be avoided. Furthermore, It is also possible to prevent the discharge head from being damaged or destroyed due to the electrostatic charge of the constituent elements. In addition, According to the discharge method of liquid materials, The easily-charged constituent element may be an active element. When the component that is easy to discharge is an active component, For example, TFT (thin film transistor), etc. By introducing ionic wind into it, Electrostatic damage and breakage can be avoided. therefore, It is possible to improve the productivity of products using this substrate, And improve reliability. The discharge device for a liquid material of the present invention includes a substrate holding portion, It holds a substrate with constituent elements that are easily charged; A discharge head, It discharges liquid material to the substrate; And an ionized wind generating device, It generates ionized wind to the substrate. According to this discharge equipment for liquid materials, At least until -9- (7) 1226289 for the discharge of liquid materials, By generating ionized wind from a self-ionizing wind generating device, And directing the ionized wind toward a substrate having an easily charged element, It is possible to reliably neutralize the electrostatic charge of the substrate itself, And it is possible to neutralize the electrostatic charges of the components that are easily charged. therefore, Damage and destruction of easily charged components can be avoided. The problem that the discharge head is damaged or destroyed by the electrification of the constituent elements can be avoided. Another liquid material discharging device of the present invention includes a substrate holder, It holds a substrate; A discharge head, It discharges a liquid material that is easily charged onto the substrate; And an ionized wind generating device, It generates an ionized wind and directs the ionized wind toward the substrate. Discharge equipment based on this liquid material, The ionized wind is generated by the self-ionized wind generating device, And before discharging the liquid material made of easily charged materials to the substrate, Direct ionized wind towards the substrate, It is possible to neutralize the electrostatic charge on the substrate itself, It is more likely to prevent the charging of liquid materials that are easily charged. therefore, Charging of constituent elements formed of a liquid material which is easily charged is avoided. Simultaneously, The problem of damage or destruction of the discharge head caused by the charging of the constituent elements can also be prevented. Another liquid material discharge device of the present invention includes a substrate holder, It holds a substrate; A discharge head, It discharges liquid material to the substrate; An ionized wind generating device, It generates ionized wind and directs it toward the substrate; And an exhaust device, It is provided in the direction of the ion wind blown by the ion wind generating device. Based on this for the discharge equipment for liquid materials, After discharging the liquid material to the substrate, By providing ionized wind to the liquid material on the substrate, And by -10- (8) 1226289 by using exhaust To remove solvent vapor or disperse the media vapor introduced by ionized wind, Solvent vapors or media vapors from liquid materials can be immediately removed from the substrate. therefore, The concentration gradient in the solvent vapor or the dispersion of the media vapor in the central part and the periphery will not occur. This prevents variations in film thickness due to the difference in concentration. therefore, Due to the loss of film thickness uniformity, The functional differences of the constituent elements can be avoided, And the loss of reliability can be avoided. Furthermore, This also prevents unevenness in panel brightness. In addition, By providing ionized wind to the substrate, It is possible to neutralize the electrostatic charge of the substrate itself, And the electrostatic charge of the constituent elements formed by the electrostatic charge on the substrate can be avoided. therefore, The problem of damage and destruction of the discharge head can also be avoided. The electronic device of the present invention is a part of a constituent element formed by using a liquid material discharge method or discharge device. Because the electronic device is formed using a substrate, And the highly reliable and desired ‘the substrate avoids the functional change of the constituent elements due to the non-uniformity of the film thickness formed, or, The substrate prevents loss of reliability. The device can be highly reliable and desired, This is because damage or destruction to the easily charged constituent elements can be avoided. This device is also highly reliable and desirable ’because it ’s formed using a substrate The element is formed of a material that is easily charged, Thus avoiding its electrostatic charge. [Embodiment] The present invention will be explained as follows. -11-(9) 1226289 Fig. 1 shows an embodiment of a discharge device for a liquid material of the present invention (hereinafter referred to as a discharge device). In Figure 1, The reference number 30 represents a discharge head. The discharge device 30 has a base 3 1, One substrate transfer device 3 2. One head conveyor 3 3, One discharge head 3 4, A liquid material tank 3 5 、 An ion generating device 38, An exhaust device 40, etc. And the discharge head 34 faces the substrate S and is coated with a liquid material to form a thin film thereon. Furthermore, In the emission device 34 of this embodiment, A constituent element, It is a material that can be easily charged for the substrate s or a liquid material that can be easily charged. The base 31 is provided with a substrate transfer device 32 and a head transfer device 3 3 thereon. The substrate conveying device 32 operates as the substrate holding device of the present invention, which is , A substrate support, It is used to hold the substrate S. The substrate transfer device 3 2 also has a guide rail 36. In this structure, Substrate transfer device 3 2 For example, A linear motor is used to transport a slider 3 7 along the guide rail 36. Sliding action 3 7 with motor, 0 axis (not shown). E.g, The motor is a direct drive motor, And the rotor (not shown) is fixed to the table 39. In this structure, When power is supplied to the motor, The rotor and table 3 9 rotate in the direction of Θ, And indicate (rotate to point) the table 3 9. The table 39 is used to fix the position and hold it. which is, The table 39 has a known suction and fixed-time device (not shown), By driving it, The substrate S is attracted and held on the table 39. The substrate S is precisely placed and fixed in position, Taking a predetermined position at one of the tables 3 to 9, With the position fixing pin, then, Fixed on it. On the table 39, A fine dust area (not shown) is provided with fine particles of ink from the discharge head -12- (10) 1226289 3 4. In this embodiment, The fine dust particles are formed along the X-axis direction, It is provided on the back of the table 39. The head conveyor 3 3 has a pair of brackets 3 3 a and 3 3 a, It stands on the back side of the base 31, A moving path 3 3 b, It is provided on these brackets 3 3 a and 3 3 a. The head conveyor 3 3 is placed along the X-axis direction, That is, it is perpendicular to the Y-axis direction of the substrate transfer device 32. The moving path 3 3 b is formed by establishing a holding plate 3 3 c between the brackets 3 3 a and 3 3 a, And a pair of guide rails 3 3 d and 3 3 d are provided on the holding plate 3 3 c. Moreover 'a slider 42, It holds the discharge head 34, Make it move in the directions of the guide rails 3 3d and 33d. The slider 42 travels on the guide rails 3 3 d and 3 3 d by driving a linear motor or the like (not shown), With this, The slider 42 is constructed so that the discharge head 34 moves in the X-axis direction. Motors 43 as oscillation position fixing devices 44 、 45 and 46 are connected to the discharge head 34. When the motor 4 3 is activated, The discharge head 3 4 moves up or down along the Z axis, therefore, A fixed position can be performed on the Z axis. Furthermore, The Z axis is one direction (up and down directions), It is perpendicular to the X and Y axes. In addition, When the motor 44 is activated, The discharge head 3 4 oscillates along the / 3 direction in Figure 1. therefore, A position fix can be performed. When the motor 4 5 is activated, The discharge head 3 4 oscillates along the r-axis direction, therefore, Perform a position fix. When the motor 4 6 is activated, The discharge head 3 4 oscillates in the α direction. Therefore, the position can be fixed. In slip motion 42, The discharge head 34 can be fixed in position by moving directly in the Z-axis direction ’ Simultaneously, By following α, The 0 and T directions move in a fixed position. therefore, The position and longitude of the ink discharge surface of the discharge head 3 4 relative to the substrate S on the table -13- (11) 1226289 3 9 can be accurately controlled. As shown in FIG. 2A, the discharge head 3 4 has a nozzle plate 12 and a vibration plate 1 3 ′, which are made of stainless steel, for example. And combine them, Simultaneously, A partition (storage plate) 14 is inserted between them. Between the nozzle plate 12 and the vibration plate 1 3, The plurality of cavities 5 and the reservoirs 16 are formed by the partition member 14, These cavities 15 and 16 are connected via a path 17. The interior of each cavity 15 and the receptacle 16 is filled with a liquid material, And the path 17 between them acts as a supply path, It supplies the liquid material from the reservoir 16 to the cavity 15. In addition, Most of the hole-shaped nozzles 18 for discharging liquid material from the cavity 15 are formed into a state, among them, They are aligned vertically and horizontally. on the other hand, At the vibration plate 1 3, A hole 19 is formed to open to the inside of the receptacle 16, And a liquid material tank 35 is connected to the hole 19 via the pipe 24 (refer to FIG. 1). In addition, on the side of the vibration plate 13 opposite to the surface facing the cavity 15, A piezoelectric element 20 is connected as shown in FIG. 2B. The piezoelectric element 20 is sandwiched between a pair of electrodes 21 and 21, And when a power source is applied, Constructed so that it flexes flexibly and projects outward. The piezoelectric element 20 operates as the discharge device of the present invention. In this structure, The vibration plate 1 3 connected to the piezoelectric element 20 is bent outward 'as a unit having the piezoelectric element 20 at the same time, With this, The volume in the cavity 15 increases. then, The interior of the cavity 15 and the container 16 are opened to each other ’, so the interior of the container 16 is filled with a liquid material, And the liquid material is equal to the volume added in the cavity 15 It flows into the reservoir 16 via the path 17. -14- (12) 1226289 If the power supplied to the piezoelectric element 20 stops in this state, Then, the shapes of the piezoelectric element 20 and the vibration plate 13 return to their original shapes. therefore, Because the volume in cavity 15 returns to the original volume, So the pressure of the liquid material in the cavity 15 increases, then, The liquid droplets 22 of the liquid material are ejected from the nozzles 18. Furthermore, as the discharge device of the discharge head, This method may also employ a motor conversion method other than the piezoelectric element 20. E.g, A method of using an electrothermal converter as an energy generating element, Such as continuous methods of power amplification control methods, And pressure oscillation method, Static attraction method, And heating by irradiation with electromagnetic waves such as lasers, Both methods of thermally discharging liquid materials can be used. As shown in Figure 1, The liquid material tank 35 is placed close to the discharge head 3 4 'and stores the liquid material of the constituent elements formed by discharging it. A heating element (not shown) is installed inside or outside the liquid material tank 35. This heater is used to heat the stored liquid material, This liquid material has high viscosity characteristics, etc. Reduced viscosity by heating, then, The liquid material is easily flowed from the liquid material tank 3 5 into the discharge head 3 4. The ion generating device 38 is used to generate an ion wind. It is composed of, for example, an ionizer or an ion blower. herein, The ion wind is a flow of free gas, It is produced by corona discharge at the edge of the discharge holder, Blow with air or N2 to complete. The ion generating device 38 of the present invention can provide a large number of discharge supports, Provide a sufficient amount of ions. In addition, As for the air or N2 source blowing on the ions generated by the corona discharge, E.g. from a known source of compressed air from the compressor, Either air trapped in a lack of air or -15- (13) 1226289 N2 can be used. In the present invention, As described below, Preliminary drying was performed from the result of supplying ion wind. therefore, Acceptable ion wind as a hot air above room temperature is performed by providing a heater on the flow path from an air source or N 2. In addition, The ion generating device 38 is placed on one side of the substrate S on the base 31, That is, along the X-axis side of the substrate S on the table 39, As shown in Figure 1. The blower outlet port 38a is placed on the surface facing the substrate S, So that the generated ion wind can blow on the entire substrate S, Especially on the surface of the substrate S. As for the ion generating device 38, It is possible to attach it to a transmitting device that transmits it, And with respect to the substrate S by the operation of the conveying device, The transmission ion generating device 38 is along the longitudinal direction (Y-axis direction) or the width direction (X-axis direction) of the substrate S, So that a sufficient and uniform ionic wind can be blown on the surface of the substrate S. The number of ion wind blowing (flow rate) from the ion generating device 38 is not particularly limited. It corresponds to the size of the substrate S, etc. Set as much as possible. which is, The flow rate is over the entire surface of the substrate S, It is set to be nearly uniform as described above. The flow rate is set to a quantity (flow rate), The combination of ion wind is sufficient to remove the vapor generated by the solution, or, Disperse the media in the discharge of liquid materials. In addition, The ion wind from the ion generating device 38 does not only act to dry, Simultaneously, Actually acts on discharge, That is, the ionic wind acts to discharge the electrostatic charge and the like on the substrate S. A discharge method using ion wind is preferred, Because it does not touch the substrate S, It will not scratch or dust the substrate S. therefore, Although supplying (blowing) ion wind to the substrate s is performed before or after discharging a liquid -16- (14) 1226289 bulk material, However, it is preferred to do so at these two times. Furthermore, As long as there is no problem with discharging liquid droplets at or from the discharge head 34, It ’s better than discharging liquid materials, Blow. The exhaust device 40 has a known exhaust structure, E.g, Exhaust ducts, etc. In this example, It has an exhaust duct 40a, And a suction pump 40c is connected to the exhaust duct 40a. The exhaust duct 40a is placed, The exhaust gas inlet 40b is directed to the direction in which the ion wind is blown from the ion generating device 38. which is, The exhaust duct 40a is placed on the opposite side of the air outlet port 38a of the ion generating device 38 through the substrate S, And the exhaust inlet 40b is placed so that it faces the blower outlet port 38a of the ion generating device 38. In this case, When the ion generating device 38 is activated and the ion wind is blown out from the blower outlet port 38a as described below, The exhaust device 40 attracts solvent (dispersed media) vapor and ion wind. Then, it is discharged by operating the suction pump 40c. Furthermore, Regarding the attraction of the suction pump 40c in the exhaust device 40, It is enough to immediately attract ion wind by the ion generating device 38, And a solvent (dispersion medium) and ion wind and discharge it, But it is better not to use strong attraction, To avoid causing liquid material flow on the substrate S. Furthermore, An example of a method for discharging a liquid material of the present invention will be described based on the operation of the discharge device 30 having this structure. In the present invention, Will use substrate S which is provided with an easily charged material, Simultaneously, An easily charged material will also be used as the liquid material. First of all, The substrate S on the substrate transfer device 32 is placed at a position of a substrate holder of the present invention, then, It is held and fixed on the substrate transfer device 32. -17- (15) 1226289 When the substrate S is set in this way, The ion wind is generated by the ion generating device 38. The ion wind generated before the liquid material is discharged by the discharge head 34 is blown to the entire substrate S. When the ion generating device 38 is attached to the transfer device, When the ion generating device 38 is moved appropriately, the 'ion wind is blown by the blower outlet port 3 8 a, So that ionic wind is provided on the entire surface of the substrate S, Especially evenly on the surface. then, The electrostatic charge on the substrate itself can be discharged, Furthermore, The electrostatic charge of the easily charged constituent elements formed on the substrate S, E.g, Active elements made of TFT (thin film transistor), etc. The electrostatic charge on the formed metal wiring can also be discharged. If using ion wind, Discharge is not performed, The potential of the substrate S will be about 5kV to 30kV, Simultaneously, By performing processing to provide ionic wind, The potential of the substrate S may be equal to or lower than lkV. Furthermore, When blowing ion wind, The suction pump 40c of the exhaust device 40 may or may not be activated. Furthermore, By transmitting the discharge head 34 to the appropriate position for discharge, Or With self-emission head 3 4 discharge, While using the substrate transfer device to transfer the substrate S, A metal wiring material made of a liquid material such as a metal colloid material is formed in a film at a desired position of the base material S. Furthermore, In the discharge procedure for liquid materials, As long as there is no problem with the discharge of liquid materials, Preferably, An ion wind is continuously blown from the ion generating device 38. However, the interference with the discharged liquid material should be avoided by stopping the operation of the suction pump 40c of the exhaust device 40. When discharging such a liquid material, Because the discharge of the electrostatic charge on the substrate S has been performed as described above, Therefore, static electricity from easily charged materials from the discharge head 34 can be avoided, Furthermore, Damage and destruction of the discharge head caused by electrostatic charges on the substrate S can be avoided. In addition, When the liquid is discharged, When blowing ion wind from the ion generating device 38 continuously, The static electricity of the substrate S during the discharging operation can be avoided, Simultaneously, The static electricity of the liquid material discharged on the substrate S can also be avoided. In this way, When a predetermined amount of liquid material is applied to each predetermined position, To form a desired film, Complete discharge. then, The operation of the ion generating device 38 and the blowing of the ion wind to the liquid material on the substrate S are performed immediately after the discharge is completed. at the same time, The suction pump 40c for the exhaust device 40 is activated. When the discharge of liquid materials works, When the ion wind is blown out by the ion generating device 38, The ion wind is continuously blown out, The suction pump 40c of the exhaust device 40 is newly activated. then, A solvent (dispersion medium) vapor from the liquid material discharged and coated on the substrate S will be immediately removed by the ion wind from the position on the substrate S, The vapor is discharged from the exhaust port 40c. therefore, The difference in the concentration of the vapor of the solvent (dispersion medium) generated between the center portion of the substrate S and the periphery disappears, This avoids irregularities in the film caused by the difference in concentration. In addition, the electrostatic charge on the substrate S will be released by blowing ion wind to the substrate s. among them, Before discharging, For example, ionic wind will not be provided on the substrate S, as well as, The substrate S itself is charged. By blowing an ion wind in this way, The solvent (dispersion medium) contained in the liquid material on the substrate S will be evaporated and removed by vapor, Then It was preliminarily dried. -19- (17) 1226289 Thereafter, ’the preliminary drying of this type is performed for a predetermined time, E.g, When the vapor produced by the membrane (liquid material) per unit time becomes low, Without affecting the film thickness, The substrate S is transferred to a drying process. Furthermore, -The constituent elements in the film are formed by performing a drying process, Use ~ hot gas stove or hot plate, An infrared radiation furnace, A vacuum drying furnace, etc. And the solvent or dispersion medium remaining in the film is evaporated. In the discharge method of liquid materials using this type of discharge equipment 30, Because as described above, after the liquid material is discharged onto the substrate S, An ion wind is then blown to the liquid material on the substrate S, and so, The concentration gradient of the solvent (dispersion medium) vapor between the central part of the substrate S and the periphery disappears, therefore, Unevenness in film thickness caused by concentration gradients can be prevented. therefore, Changes in the function of constituent elements caused by loss of film thickness unevenness and loss of reliability can be prevented. In addition, By providing an ion wind to the substrate S, The electrostatic charge on the substrate S itself can be released, Then, on the constituent element to be formed, the problem is that the electrostatic charge on the substrate s is charged, or, Problems such as damage or destruction of the discharge head 3 4 can be prevented. In addition, Because before discharging a liquid material, An ion wind is blown towards the substrate S, So the electrostatic charge on the substrate S itself can be released, Furthermore, The electrostatic charge on the components that are easy to be charged can also be released, This element is formed on the substrate S, for example, and is an active element made of, for example, a TFT (thin film transistor). therefore, It can prevent the active components and the like from being damaged or destroyed by electrostatic charges. Furthermore, It can also prevent the discharge head 34 from being damaged or destroyed by the electric charge. -20- (18) 1226289 In addition, When a liquid material is discharged, Because the electrostatic charge on the substrate S has been released, and so, Static charges on the discharged liquid material can be prevented. Furthermore, Because after discharging a liquid material, Ion wind is provided on the liquid material (film), and so, Electrification of constituent elements formed of materials that are easily electrified, For example, metal wiring can be prevented. Furthermore, The problem of damage to the discharge head 3 4 caused by the discharge of constituent elements (metal laps) or the like can also be prevented. therefore, According to the discharge method of liquid materials using discharge equipment 30, Functional changes in constituent elements caused by loss of film thickness uniformity can be avoided, as well as, The loss of reliability can be avoided. Furthermore, It can increase reliability by enhancing the productivity of products formed using substrate S, The production line discharges a liquid material to complete it. Furthermore, The present invention is not limited to the above embodiments, Various modifications can be made without departing from the spirit of the invention. E.g, Emission equipment 30 in the present invention, It can also be stored in the whole room, Or At least substrate S, The discharge head 34 and the ion generating device 38 can also be housed in the chamber, An exhaust inlet 40b of the exhaust device 40 may also be provided in the chamber. In addition, in this embodiment, For example, the active element of TFT is shown as a constituent material which is easily charged, as well as, For example, a metal colloid material as a metal wiring material is also shown as a material made of an easily charged material. however, The invention is not limited to this, Various other materials can also be used as the easily-chargeable constituent material 'or as a liquid material easily-charged material. E.g, Concerning the easily charged constituent materials, May be applied to the above metals -21-(19) 1226289 Wiring, Various memory elements, An organic EL element, An organic TFT element and the like. As for liquid materials that are easily charged, It is also possible to use liquid materials made of conductive fine particles, It can be scattered, And a conductive resin material such as a conductive color filter material. Furthermore, In a first application example, A manufacturing example of an organic EL device will be described. Figure 3 shows a side sectional view of an organic EL device, Part of its components are made by the discharge equipment. First of all, A schematic architecture diagram of an organic EL device will be explained. As shown in Figure 3, the organic EL device 301 is an organic EL element 302. It is connected with a flexible substrate (not shown) and the wiring of the driver IC (not shown), The organic EL element 3 02 has a substrate 3 1 1. One circuit element part 3 2 1. One pixel electrode 3 3 1. One row part 3 4 1. A light-emitting element 3 5 1. A cathode 3 6 1 (opposite electrode), And a sealing substrate 3 7 1. The circuit element portion 3 2 1 is formed on the substrate 3 1 1 by an active element such as T F T, It is configured such that a plurality of pixels 3 3 1 are arranged on the circuit element portion 321. Between the pixel electrodes 3 3 3 1 Formed in a matrix-like row 341, And the light-emitting element 351 are formed in the recessed opening 344, It is made by row section 3 4 1. The light-emitting element 3 5 1 has an element, It glows red, One element emits green light, And a component, It emits blue light. With this structure, The organic EL device 301 can implement full-color display. The cathode 3 6 1 is entirely formed on the top surface of the row portion 3 4 1 and the light emitting element 3 5 1. The sealing substrate 371 is laminated on the cathode 361. The process of the organic EL device 301 including the organic EL element has a -22- (20) 1226289 bank formation process, It forms a row part 3 4 1. A plasma processing equipment, It is used to appropriately form the light emitting element 3 5 1. A light-emitting element forming process, It forms a light emitting element 3 5 1. A counter electrode forming process, Which forms the cathode 3 6 i, And a sealing process, It stacks a sealing substrate 3 7 1 on the cathode 3 61 and seals it. The light-emitting element forming process is performed on the pixel electrode 3 3 1. A positive hole injection layer 3 5 2 and a light emitting layer 3 5 3 are formed to form a light emitting element 3 5 1. A positive hole injection layer forming process and a light emitting layer forming process are provided. The positive hole injection layer forming process has a first discharge process, It discharges a liquid material to the pixel electrode 3 3 1, Used to form a positive hole injection layer 3 5 2 And a first drying process, It dries the discharged liquid material and forms a positive hole injection layer 352. In addition, the light emitting layer forming process has a second emission process, It discharges the liquid material used to form the light emitting layer 3 5 3 on the positive hole injection layer 3 52, and, A second drying process, It dries the discharged liquid material and forms a light emitting layer 353. The light emitting layer 353 is emitted in three colors as described above, I.e. red, Green and blue. therefore, The second drying process has three programs, Used to discharge three types of materials. In the process of forming the light-emitting element, The discharge device 30 is used for the first discharge treatment in the process of forming the injection hole in the main hole. It is also used for the second discharge procedure in the light-emitting layer forming process. which is, In the first emission process, An ion wind will be provided by the ion generating device 38. Before and after the liquid material is discharged, Furthermore, When liquid material is discharged in three of the second discharge procedures, An ion wind will be provided before and after this discharge. When manufacturing the organic EL device 3 01, Before the emissions form each component -23- (21) 1226289, The electrostatic charge on the substrate 3 1 1 and the electrostatic charge on the pixel electrode 3 3 1 and the circuit element portion 321 will be supplied to the substrate 3 i 丨 by the ion wind from the ion generating device 38, And discharge it, which is, The base member 3 1 1 which is a component which is liable to be charged such as the circuit element portion 3 2 1 and the pixel electrode 3 3 1 is discharged. In addition, After the positive hole injection layer forming process and the light emitting layer forming process, Ionic wind will be provided to the liquid material on the substrate 3 1 1. With this, Damage or destruction of the discharge head 34 by static electricity can be prevented, Furthermore, the productivity of the organic EL device 3 0 1 produced can be enhanced, And enhance reliability. In addition, As for the positive hole injection layer 352 and the light emitting layer 3 5 3 ′ to be formed, since the film thickness can be uniform, Therefore, it is possible to avoid functional changes and enhance reliability. Furthermore, As a second application of the present invention, A plasma display will be explained. Figure 4 shows an exploded and perspective view of a plasma display. Which forms part of the element, That is, the address electrode 5 1 1 and the bus electrode 5 1 2 a are manufactured by a discharge device. Reference numeral 500 in Fig. 4 indicates a plasma display. Plasma displays are composed of a glass substrate 5 0 1 and a glass substrate 5 0 2 ′, which are placed facing each other, And a discharge display portion 5 10 is formed therein. The discharge display section 510 includes a group of discharge cells 516. Within most discharge cells 5 1 6 ’, three discharge cells 5 1 6 are placed, So that a red discharge cell 516 (R), One green discharge chamber 516 (G), And a blue discharge cell 5 1 6 (B) completes a group and forms a pixel. -24- (22) 1226289 On the top surface of the substrate (glass 5 01), The address electrodes 5 1 1 are formed in a band shape in a predetermined gap therebetween. And a dielectric layer 5 1 9 is formed, To cover the top surface of the address electrode 511 and the substrate 501, Furthermore, On the dielectric layer 519, The row 5 1 5 is formed between the address electrodes 5 1 1 and 5 1 1 Make it extend along each address electrode 5 1 1 ◦ Row 5 1 5 is also at the predetermined address in its extension direction, It is divided into vertical directions by a predetermined gap (not shown), The rectangular region is basically formed by dividing the left and right rows in the width direction adjacent to the address electrode 5 1 1 and the row extending perpendicular to the direction of the address electrode 5 1 1 (not shown). as well as, The discharge cells 5 1 6 are formed corresponding to these rectangular regions, And a pixel is composed of a group of three rectangular regions. A fluorescent material 5 1 7 is placed in a rectangular area divided by a row 5 1 5. Fluorescent material 5 1 7 emits red, One of green and blue fluorescence, And red fluorescent material 5 1 7 (R) are placed on the bottom of the red discharge cell 5 1 6 (R), And green fluorescent material 517 (G) are placed at the bottom of the green discharge cell 516 (G), And blue fluorescent material 5 1 7 (B) is placed on the bottom of the blue discharge cell 5 1 6 (B) 〇 On the glass substrate 50 02 side, The display electrodes 5 and 12 made of most of ITO are formed into a band shape. With a predetermined gap in between, The ITO is aligned so that its direction is perpendicular to the address electrode 5 1 1. Simultaneously, A bus electrode 512a made of metal is formed to compensate for high resistance ITO. In addition, A dielectric layer 5 1 3 will be formed by coating them, therefore, A protective film 5 1 4 such as M g 0 will be formed. The discharge chamber 516 is formed by mounting 6 501 and a glass substrate 502 on each other. So that the address electrode 5 1 1 and the display electrode 5 1 2 face each other and are perpendicular to each other -25- (23) 1226289 straight, And a space surrounded by the substrate 5 Ο 1 and the address electrode 5 1 1 and the protective film 5 14 formed on the glass substrate 50 02 side by vacuuming, Fill it with inert gas. The display electrodes 5 1 2 formed on the glass substrate 502 are formed. So that both of them are placed corresponding to each discharge cell 5 1 6. The address electrode 5 1 1 and the display electrode 5 1 2 are connected to an AC power source (not shown), And by supplying power to the address electrodes 511 and the display electrodes 5 1 2, The fluorescent material 5 1 7 at the necessary position of the discharge display portion 5 1 0 is excited and emits light, thus, Achieve a color display. Based on the example, More specifically, The address electrode 5 1 1 and the bus electrode 5 1 2a are formed using a discharge device 30. which is, When the address electrode 511 and the bus electrode 512a are formed, It has the advantage of patterning, A liquid material containing colloidal materials (such as gold colloids and silver colloids) or conductive fine particles (such as metal fine particles) is discharged and, It is formed by drying and sintering. In this example, Applying the present invention, The electrostatic charge on the substrate 5 0 1 (glass substrate 5 02) is discharged by blowing the ionic wind from the ion generating device 38 to the substrate 5 0 1 or the glass substrate 5 02 in advance. In addition, By discharging the electrode material, Provide ion wind immediately, The film thickness of the electrode to be formed will be uniform and the charging of the electrode to be formed will be avoided. With this, The uniformity of the formed address electrodes 5 1 1 and the bus electrodes 5 1 2 a can be enhanced, as well as, May form, This makes its function unchanged and highly reliable. In addition, It is possible to prevent the electrostatic destruction of the discharge head 34, Furthermore, The productivity of the produced plasma display can be enhanced, It also enhances reliability. -26- (24) 1226289 Furthermore, In a third application of the present invention, A manufacturing example of an electric device will be described which is equipped with a light emitting diode and an organic T F T. Figure 5 is a side sectional view of the electronic device, Some of its components are manufactured by the discharge equipment. An electronic device 70 is completed by integrating the organic TFT 71 and the organic LED 72 on the same substrate 73 into a single stone. The organic TFT includes a gate electrode 74, Formed on the substrate 73, A dielectric layer 75 covers this shape, A source electrode 76 and a drain electrode 77 are formed on the dielectric layer 75. And an organic semiconductor layer 78 is formed by covering them. The organic LED 7 2 includes an anode 79 formed on a substrate 73, The positive hole transport layer 8 0 formed by covering the anode 7 9, An electron transport layer 81 formed on the positive hole transport layer 80, And a cathode 82 is formed on this electron transporting / emitting layer 81. The anode 7 9 is formed on the substrate 7 3 by extending the drain electrode 7 7. The positive hole transport layer 80 is formed on the anode 79 by extending 78. In the electronic device 70, When the anode 79 and the cathode 82 are formed of, for example, a metal or the like, Emission equipment 30 is preferably used for this manufacture. which is, When the anode 79 and the cathode 82 are formed, Its system is good for patterning, A liquid material or fine conductive particles (eg fine metal particles) containing colloidal materials (such as gold colloids and silver colloids) are discharged, And formed by drying and sintering. At this time, Applying the present invention, The electrostatic charge on the substrate 7 3 and the charge on the organic TFT 71 are discharged in advance by the ion wind from the ion generating device 38 being blown toward the substrate 7 3. In addition, When discharging electrode materials, Ion wind is provided immediately after discharge, The electrification of the formed electrodes can be avoided by -27- (25) 1226289. With this, It is possible to prevent electrostatic damage and destruction of the discharge head 34. Furthermore, The productivity of the plasma display to be produced can be enhanced, Reliability is also strengthened. Furthermore, The fourth application of the present invention will explain a manufacturing example of manufacturing a color film for a liquid crystal display device and the like. In order to use the emission equipment 30, Discharging ink on the substrate S to make a color filter, First of all, The substrate S is placed at a predetermined position on the table 39. As for the substrate S, Transparent substrates with appropriate mechanical stress and high optical transmittance can be used. To be clear, A transparent glass substrate, An acrylic glass, A plastic glass, A plastic film, And these surface treatment products can be used. In addition, In this example, To increase productivity, Most color filter regions are formed on a rectangular substrate S, In matrix form. The color filter area is then used as a liquid crystal display device, The substrate S is used as a color filter by cutting. The color filter regions are arranged to form red (R), The green (G) and blue (B) inks are in a predetermined pattern. With this, In the example, The belt pattern is traditional. Furthermore, In addition to the band pattern, Other forming patterns include mosaics, triangle, And square patterns are also available. In order to form a color filter, Light zone, First of all, A black matrix 52 is formed on the transparent substrate S-side as shown in Fig. 6A. The black matrix 5 2 is formed by, for example, a spin coating method. A non-light-transmitting resin (preferably black) having a predetermined thickness (e.g., about 2 m) is applied and formed. Is the smallest display element surrounded by the black matrix 5 3, That is, the color filter element 5 3 has an X-axis direction of -28- (26) 1226289 with a width of about 30 microns and a Y-axis length of about 100 microns. Furthermore, As shown in Figure 6B, Ink droplets (liquid droplets) 54 are discharged by the discharge head 34 and impinge on the filter element 53. Simultaneously, Before the ink droplets (liquid droplets) 5 4 are discharged, the electrostatic charge on the substrate S and the electrostatic charge on the black matrix 52 are discharged by supplying ion wind from the ion generating device 38. In addition, One ion wind is at the time of discharging ink droplets (liquid droplets) 5 4 Provided by the discharge device. The blowing of the ionic wind from the ion generating device 38 is performed before and after the ink droplets (liquid droplets) 54 are discharged. The number of charged ink droplets 5 4 is a consideration in the heating step, An appropriate amount of ink volume reduction. once, Ink droplets 5 4 are used in this way, Filter elements 5 3 inserted into all substrates S, The substrate S is heat-treated to a predetermined temperature (for example, about 70 ° C) using a heater. Due to this heat treatment, Ink solvent evaporation and ink volume reduction. When the buildup is reduced a lot, The ink discharge step and heating step are repeated. Until obtained as a color filter, The appropriate ink film thickness of the light film. The result of this processing, The solvent in the ink evaporates, So that only the solid components contained in the ink remain in the form of a film, Thus, a color filter 55 as shown in Fig. 6C is produced. When the ink discharge treatment and heat treatment are repeated, Especially in ink discharge processing, Before and after the process, The ionic wind is provided by an ion generating device 38. Furthermore, in order to flatten the substrate S and protect the color filters 5 5, A protective film 5 6 is formed on the substrate S, To cover the color filters 5 5 and the black matrix 52, As shown in Figure 6D. Although spin-coated, But rolling coating or light -29- (27) 1226289 coating can also be used to form this protective film 5 6 ， The discharge device 30 shown in Fig. 1 can also be used in the same manner as the color filter 55. When using an exhaust device 30, Preferably, before and after the material forming the protective film 56 is discharged, An ion wind from an ion generating device 38 is provided. Furthermore, as shown in Figure 6E, A transparent conductive film 57 is formed by sputtering or vacuum deposition. It is formed on the entire surface of the protective film 56. Then, The transparent conductive film 57 is patterned and the pixel electrode 58 is patterned corresponding to the filter element 53. When using emission equipment 30 to manufacture color filters, When discharging color filter materials (ink droplets 5 4), And after discharge, The electrostatic charge on the substrate S is then discharged by the ion wind from the ion generating device 'and the charged charge of the formed color filter is prevented by the ion wind. In this way, It is possible to prevent electrostatic damage and destruction of the discharge head 34. Furthermore, the productivity of the optical device (liquid crystal display) produced by ‘Further’ may be enhanced. It also enhances reliability. Furthermore, In a fifth application of the present invention, A method for forming a conductive film circuit pattern (metal circuit pattern) will be described with reference to the drawings. Fig. 7 is a flowchart of a method for forming a shape and pattern in the present invention. In Figure 7, The pattern forming method of the present invention has a cleaning substrate procedure using a predetermined solvent, etc. Liquid droplets on which the liquid material is to be distributed (step S1), A hydrophilic strengthening treatment, Forms a part of the surface treatment procedure of the substrate (step S2), A hydrophilic control process, It forms part of the surface treatment, It controls the hydrophilicity of the substrate surface (step -30- (28) 1226289 step S 3) ’a material distribution program, Used on the surface of the substrate being treated, By using a liquid droplet discharge method, Distribute a liquid material and draw (form) a film pattern on the substrate, The liquid material includes a conductive film circuit forming material (step S4), An intermediate drying process, It is used to remove at least a part of the solvent formed in the liquid material distributed on the substrate (step s5) 'and a baking process' for drawing a substrate with a predetermined pattern (step s7). After the intermediate drying process, It can be judged whether the predetermined pattern has been drawn (step S 6). then, If the pattern is drawn, The baking process will be performed, Otherwise, If the pattern is not drawn, The material distribution procedure will then proceed. Furthermore, the material distribution process based on the liquid crystal droplet discharge method (step S 4) will be explained. Use the discharge device 30 (step s 4). The material distribution program in this example is used to form most linear film patterns (circuit patterns) in a linear process. The liquid material containing the conductive circuit forming material of the liquid droplet discharge head 34 from the discharge device is distributed onto the substrate S. Liquid materials are liquid type materials, Its conductive fine particles, For example, metals are dispersed in the distribution medium. In the following description, Three first, Second and third film patterns (linear patterns) W1, W 2 and W 3 〇 Article 8, The figures 9 and 10 are examples for explaining the distribution of liquid droplets onto the substrate s. In these figures, A bitmap containing most of the pixels in a matrix cell area and liquid droplets will be distributed on the substrate s. herein, One pixel is made into a square. Form first, Second and third film patterns W1, W2 and W3 first, The second and third pattern forming regions ^, ^ And R3 are set so that they are relative to a predetermined pixel among a plurality of pixels. Majority figure -31-(29) 1226289 Case formation area R1, R2 and R3 are along the X-axis direction, Set to linear. In Figures 8 to 10, Pattern forming area R1, R2 and R3 are marked as shaded areas. In addition, The droplets of the liquid material of the first discharge nozzle 3 4 A from the majority of the nozzles on the discharge head 34 of the liquid droplet discharge device are distributed in the first pattern forming region R1 on the substrate S. Similarly, The droplets of the liquid material of the second and third discharge nozzles 3 4B and 3 4C of the majority of the nozzles on the discharge head 34 of the liquid droplet discharge device are distributed in the second and third pattern forming regions R2 on the substrate S And R3. which is, Discharge nozzle (discharge section) 34A, 34B and 34C are provided, So that it corresponds to a first, The second and third pattern forming regions R 1, R2 and R3. The discharge head 3 4 distributes most droplets, To form regions R1, R2 and R3 are at each of the majority pixel positions. Furthermore, Every first, Second and third pattern forming regions R1, R2 and R3 are set, So as to be formed in these first, The second and third pattern forming regions R1, First on R2 and R3, Second and third film patterns W1, W2 and W3 are formed by the first side pattern Wa, The pattern Wa is on one side (-X side) of the line width direction, Furthermore, The second side pattern Wb is formed on the other side (+ X side), After the first and second side patterns Wa and Wb are formed, A center pattern w c at the center position in the line width direction is formed. In this example, Each film pattern (linear pattern) W1 to W 3, That is, each of the pattern forming regions R1 to R3 having the same line width L, And the line width L is set equal to a width of three pixels. The spacers between each pattern are set to the same width S, And the width S is also set equal to the width of three pixels -32- (30) 1226289. The nozzle pitch between the discharge nozzles s34A to s34C is also set equal to a width of six pixels. In the following description, Contains discharge nozzles 3 4 A, The discharge heads 3 4 B and 3 4 C will discharge liquid droplets on the substrate s along the Y axis. In the description of Figures 6 to 10, The symbol "1" indicates that the liquid droplet is already in the first scan, Distribution of liquid droplets, And the symbol "2", "3", …, "Η" means in the second, third, ..., And the droplets of liquid distributed on the n-th scan.
如第8Α圖所示，於第一掃描中，形成用於每一第一 、第二及第三圖案形成區R 1、R2、及R3之第一側部圖案 Wa，液體微滴被分佈於來自第一、第二及第三排放噴嘴 34A、34B及3 4C的相同時間，諸噴嘴具有等於該第一側 部圖案形成區所形成之區域的空間。來自每一排放噴嘴 34 A、34B及3 4C所排放之液體微滴，一離子風將爲離子 產生裝置3 8所提供。於此，分佈在基材S上之液體微滴 將潮濕並藉由衝擊至基材S上，而噴在基材S上。即，如 第8A圖中之圖圈所示，衝擊於基材S上之微滴將濕潤並 噴出，使得它們具有直徑C，該直徑係大於一像素的尺寸 。可以設定分佈在基材S上之每一液體微滴將不會彼此重 疊，因爲每一液體微滴係沿著Y軸方向，以其間具有一 預定間隙之方式加以分佈。藉此，一液體材料被防止過量 沿著Y軸方向，被分佈於基材S上，同時，防止了凸出 之產生。 於第8A圖中，雖然每一液體微滴被分佈以使得當它 們分佈於基材S上時，不會彼此重疊，每一微滴也可以被 -33- (31) 1226289 分佈使得它們略微彼此重疊。再者，雖然於此例子中，每 一液體微滴被以等於一像素之間隙加以分佈，但可知予以 分佈之每一微滴具有一等於二或更多數量之間隙。於此例 子中，在基材S上之每一液體微滴間之間隙可以藉由增加 排放頭3 4掃描操作及分佈（排放操作）至基材S上的操 作次數加以補償。 因爲基材S表面事先在步驟S 2及步驟3中作處理， 以具有預定疏水性，所以，可以防止分佈過量噴灑之液體 微滴，在基材S上。因此，圖案形狀也可以控制於良好狀 況，再者，增加膜厚度也可以容易地執行。 第8B圖爲示意圖，其中液體微滴係由排放頭34於第 二掃描時分佈至基材S上。於第8B圖中，符號”2”表示分 佈於第二掃描中之液體微滴。於第二掃描中，液體微滴被 與每一排放噴嘴34 A、34B及3 4C同時間分佈，使得其補 償分佈在第一掃描中之液體微滴” 1 ”間之間隙。第一側部 圖案Wa藉由在第一及第二掃描操作，而彼此連接液體微 滴及分佈操作時，被形成在每一個第一、第二及第三圖案 形成區Rl、R2及R3。於此，液體微滴”2”也是濕潤並藉 由衝擊於基材S上，而噴出，然後，事先分佈在基材8上 液體微滴” 2 ”之一部份及液體微滴” 1 ”之一部份彼此重疊。 明確地說，液體微滴”2”之一部份重疊於液體微滴”1”上。 以此第二掃描中，當液體微滴由每一排放噴嘴3 4 A、3 4 B 及3 4C所排放時，一來自離子產生裝置38之離子風在排 放前後吹拂。 -34- (32) 1226289 在排放液體微滴於基材S上，以形成第一側部件圖案 w a後，立即乾燥處理（步驟s 5 )可以執行，若有必要則 移動分佈之媒體。中間乾燥處理可以爲一選用處理，其使 用一般熱處理外之燈回火，使用一熱板、一電爐、一熱風 機等。 再者，排放頭3 4及基材S係沿著+χ軸方向相對移動 一剛好等於兩像素大小之一距離。隨後，排放噴嘴3 4 A、 3 4 B及3 4 C所排放也移動。然後，排放頭3 4將執行第三 掃描。以此，如第9A圖所示，用以形成第二側部圖案 Wb之液體微滴”3”將由每一排放噴嘴34A、34B及34C所 排放，於被排放至基材S的同時，沿著X軸方向靠著第 一側部圖案W a具有一間隙，該圖案W b構成每一膜圖案 Wl、W2及W3之一部份。液體微滴”3”將以一像素之間隙 ，沿著Y軸方向分佈。於第三掃描中，當液體微滴由每 一排放噴嘴34A、34B及34C所分佈時，離子風被由離子 產生裝置3 8吹出，在排放之前後。 第9B圖爲第四掃描中，由排放頭3 4所分配之液體微 滴至基材S的示意圖。於第9 B圖中，符號” 4 ”表示於第四 掃描中之液體微滴分佈。於第四掃描中，液體微滴係被於 來自每一排放噴嘴34A、34B及34C所分佈，使得它們補 償於第三掃描中之液體微滴” 3 ”間之間隙。第二側部圖案 Wb係被形成於每一第一、第二及第三圖案形成區Rl、R2 及R3，藉由在第三及第四掃瞄操作及排放操作中，連接 彼此之液體微滴。事先分佈在基材S上之液體微滴”3”之 -35- (33) 1226289 一部份及液體微滴”4”的一部份係彼此重疊。明確地說’ 液體微滴”4”的一部份重疊於液體微滴”3”上。於此第四掃 描中，當排放之前後，液體微滴由每一排放噴嘴3 4 A、 3 4B及3 4C所排放時’離子風係由離子產生裝置38吹拂 〇 在排放液體微滴至基材S上’以形成第二側部圖案 Wb後，一中間乾燥處理若有必要可以加以執行，以去除 分佈媒體。 再者，排放頭3 4進行步階式移動向-X軸方向，以一 等於兩像素之尺寸之距離，隨後，排放噴嘴34A、34B 及34C也進行步階式移動向-X軸方向一等於兩像素尺寸 之距離。然後，排放頭3 4將進行第五掃描。以此，如第 10A圖所示，用以形成構成每一膜圖案Wl、W2及W3之 部件的中間圖案W c之液體微滴” 5 ”將同時排放至基材S 上。液體微滴” 5 ”以一像素之間隙，沿著γ軸方向分佈。 液體微滴”5”及液體微滴”丨”及，，3”的一部份係事先彼此重 疊分散在基材S上彼此重疊。明確地說，液體微滴，，5”之 一部份重疊液體微滴” 1，，及，，3，，。於第五掃描時，當來自每 一排放噴嘴34 A、34B及3 4C所排放之液體微滴被排放時 ，一離子風在排放前或後，由離子產生裝置38吹出。 第10B圖爲一示意圖，其中液體微滴被由排放頭34 分佈至基材S上。於第丨〇 b圖中，符號，，6，，表示分佈於第 /、掃描中之液體微滴。於第六掃描中，液體微滴同時由每 一排放噴嘴34A、34B及34C所排放，使得它們補償分佈 (34) 1226289 於第五掃描中之液體微滴”5”間之間隙。藉由在第五及第 六掃描操作及分佈操作中’彼此連接液體微滴，中間圖 案 Wc係形成在每一'第一*、弟一及弟二圖案形成區R1、 R2及R3。事先分佈在基材S上之液體微滴”6”的一部份 與液體微滴，’ 5 ”之一部份彼此重疊。再者，事先分佈在基 材S上之液體微滴” 6 ”的一部份與液體微滴” 2 ”及” 4 ”彼此 重疊。於第六掃描中，當液體微滴由每一排放噴嘴3 4 A、 3 4 B及3 4 C所排放時，於該排放之前後，一離子風被由離 子產生裝置3 8吹出。 藉由執行如上，膜圖案Wl、W2及W3將形成在每一 圖案形成區R1、R2及R3。 如上所述，當藉由依序分佈多數液體微滴之相同形狀 ，以形成膜圖案Wl、W2及W3時’用於分佈液體微滴朝 向每一圖案形成區Rl、R2及R3之分佈命令係被設定爲 彼此相同。因此，當每一液體微滴”1”至”6”被分佈，使得 其一部份重疊，則每一膜圖案W 1、W2及W3之外部形狀 可以爲相同，因爲在每一膜圖案Wl、W2及W3間之重疊 形狀相同。因此，在每一膜圖案W1、W2及W3間之外表 不規則顏色可以被防止。 液體微滴之分佈（在液體微滴間之重疊形狀）可以相 同，因爲液體微滴之分佈順序對於每一膜圖案w 1、W2及 W 3係相同。因此，防止了一不規則頻色的產生。 每一膜厚度分佈可以幾乎相同，因爲在液體微滴間之 重疊狀態，對於每一膜圖案Wl、W2及W3被設定爲相同 -37- (35) 1226289 。因此’當i吴圖条爲重覆圖案，其被沿著基材的面方向重 覆時’特別是當膜圖案爲多數對應於顯示裝置之像素的圖 案，則每一像素將具有相同膜厚度分佈。因此，相同功能 可以沿著基材的面方向實現。 另外，每一膜圖案Wl、W2及W3之線寬可以接近均 勻，因爲用以形成中心圖案Wc之液體微滴”5”及”6”被分 佈，使得其塡入於第一側部圖案W a與第二側部圖案W b 間之間隙，在形成第一側部圖案W a及第二側部圖案Wb 之後。即，當在基材S上形成中心圖案W c之後，用以形 成側部圖案W a、W b之液體微滴” 1 ”” 2，，、，，3 ”及，，4，，時， 因爲會有液體微滴被拖向形成在基材S上之中心的現象， 所以，每一膜圖案W 1、W2及W3之線寬控制困難的問題 。另一方面，在本實施例中，每一膜圖案W1、W2及W3 之線寬控制可以精確地執行，因爲用以形成中心圖案 Wc 之液體微滴”5”及”6”被分佈，以使得它們在形成側部圖案 Wa及側部圖案Wb之後，將塡入側部圖案Wa及側部圖案 Wb間之間隙。 此側部圖案Wa及側部圖案Wb可以在形成中心圖案 W c後加以形成。此時，在每一圖案中之不規則顏色之生 產可以藉由施加每一膜圖案W1至W3，以相同液體微滴 分佈順序加以禁止。 於此導電膜電路圖案（金屬電路圖案）之形成方法中 ，在基材S上之靜電荷可以藉由事先吹以來自離子產生裝 置3 8之離子風至基材S上加以放電’也同時’予以形成 -38- (36) 1226289 之導電膜電路圖案之帶電也可以藉由當包含導電膜電路形 成材料之液體材料被排放時及隨即在排放液體材料後，吹 拂一離子風加以防止。 以此，可以防止排放頭3 4之靜電破壞，再者，予以 製造之裝置的生產力被加強，同時，也加強可靠度。 再者，作爲本發明之第六應用，將說明一光學部件用 之表面處理。 於本例子中，一離子風被提供在光學部件上，當一處 理液體材料係塗覆在表面上，以完成光學效能及功能的加 強。 光學部件之例子可以爲已處理物件，各種光學透鏡包 含玻璃用透鏡、發光控制用透鏡、太陽眼鏡用透鏡、相機 用透鏡、望遠鏡用透鏡、放大鏡用透鏡、投影機用透鏡、 拾取透鏡、微透鏡等等。同時，也可以例如是一光學鏡、 一濾光片、稜鏡、用於半導體曝光之步進機的光學部件、 行動裝置之有機蓋玻璃。 至於此一光學部件之表面處理，明確地說，可以例如 硬處理、抗反射處理等。至於，用於此表面處理之處理材 料，可以例如光學部件之原料部份、光學部份之未處理部 份、光學部件之表面硬化原料的一部份、光學部件之表面 原料、光學部件之塗底原料之一部份、光學部件之塗底原 料、光學部件之抗反射膜原料的一部份、光學部件之一抗 反射膜原料。 處理液體材料之原料組成係依據硬化方法加以選擇。 -39- (37) 1226289 例如’當使用紫外線光、電子束、微波等，以硬化一光學 部件之原料、一表面硬化膜原料、一塗底原料、及一抗反 射膜原料時，因爲硬化反應可以在不必加入反應啓始液體 、一觸媒、一溶劑、水以進行水解反應，所以，也可以使 用匕們以外之光學邰件原料之一部份、表面硬化膜原料之 一邰份、塗底原料之一部份、及抗反射膜原料之一部份。 另一方面，當硬化用於光學部件之原材料、一表面硬 化膜原料、一塗底原料、及一抗反射膜原料時，因爲硬化 處理將不會沒有反應啓始液、一觸媒、一溶劑、用於處理 水解反應之水，所以有必要使用包含它們、表面硬化膜原 料、塗底原料及抗反射膜原料之光學部件原料。也可能藉 由在處理液材料包含染料及/或染劑而有顏色。 以塗覆液體材料作此表面處理，該基材傳送裝置3 2 作爲排放設備3 0可以被構成爲使得桌台3 9可以藉由使用 馬達，沿著0方向，針對Θ軸旋轉光學部件（未示於圖中 )加以指示（旋轉指示）。 於本例子中，在處理材料內，硬塗覆液體（硬塗覆組 成）係被塗覆於一光學部件之曲面上，該部件將爲一基材 。如第1 1 A圖所示，藉由，於固持部件i〗2所固時光學 部件1 2 0的同時，相對地移動光學部件1 2 0與排放頭3 4 ，並藉由重覆地施加液體微滴至光學部件1 20之曲面 12 0a上，塗覆液體係爲來自裝設在排放頭34上之多數噴 嘴之處理液體’而將一塗覆膜將藉由排放硬塗覆液體作爲 液體微滴，而形成在曲面1 2 〇 a上。 -40- (38) 1226289 於本例子中，塗覆在光學部件120之曲面120a上之 多數處理液體仍在曲面1 2 0 a上保持其原樣，因爲處理液 體被塗覆於液體微滴方式，所以使用效率很高。於本例子 中，光學部件120係被放置以使得曲形之曲面120a朝上 ，及硬塗覆液體係由放在光學設備120上之排放頭34所 朝下排放。另外，當液體微滴由排放頭3 4排放時，來自 離子產生裝置38之離子風將在排放液體微滴之前後，提 供給光學部件120。 於本例子中，當塗覆處理液體時，光學部件1 20之曲 面120a被分成多數區域，及處理液體的塗覆量針對每一 區域加以控制。明確地說，如第1 1 B圖所示，爲塗覆物件 之光學部份120之曲面120a係被分爲多數具有同心圓形 之區域，其頂點爲中心（於此，三區域 MO、Ml及I42 )，及於多數區域140、141、142中，設定處理液之塗覆 量（每區域之處理量），在內側區係大於在外側區。即， 如第1 1 B圖所示之例子中，至最外側區1 4 0之塗覆量爲最 低，塗覆量朝向內側作步階增加，以區域1 40及區域1 42 之順序增加。 於本例子中，塗覆在曲面120a上之處理液體材料的 一部份係由藉由朝向外側之重力作用，而由曲面1 20a之 內側之中心部份旁移動向外側，因爲爲塗覆物件之光學部 件120之曲面120a被放置以使得曲面120a將爲一凸出形 ，沿著垂直方向朝上。因爲由於處理液體材料的一部份由 曲面1 20a之內側移動向外側，以及，因爲內側區域之塗 -41 - (39) 1226289 覆量係大於外側區域者，所以’在曲面1 2 0 a內之每單位 面積處理液體材料量變均勻，及塗覆膜變平坦。因此，在 本例子之塗覆方法中，藉由在曲面120a之上部區域及下 部區域間之重力的作用，膜厚度之差可以被禁止。 再者，第12A及12B圖顯示塗覆處理液體材料之例 子，其中在光學部件120之表面內之具有凹面形狀之曲面 1 2 0 b係沿著垂直方向朝上放置。 如第12A圖所示之例子中，光學部件120被放置， 使得具有凹陷形之曲面朝上，及爲處理液體材料之硬塗覆 液體係由放置在光學部件1 2 0上之排放頭3 4所朝下排放 。當由排放頭3 4排放液體微滴時，一來自離子產生裝置 3 8之離子風在排放液體微滴前後被提供給光學部件1 2 0。 另外，當如第1 2B圖所示之塗覆時，爲塗覆物件之光 學部件120之曲面120b係被分割成多數區域（於此，三 區域145、146及147 )，其有同心圓形，及最低點作爲 中心，及，在多數區域1 4 5、1 4 6及1 4 7內，在外側區之 處理液體材料塗覆量係大於在內側區域者。即，在最內側 區1 4 5之塗覆量爲最低，及塗覆量朝向外側作步階增加， 以例如區域1 46及區域1 47之順序增加。 於本例子中，由於重力作用，因爲塗覆物件之光學部 件120之曲面120b係被放置使得曲面120b爲沿著垂直方 向朝上之凹面形，所以塗覆在曲面120b上之處理液體材 料的一部份由最外側移動向曲面1 20b之中心部份，即內 側。另外，因爲處理液體材料之一部份在曲面1 20b上由 -42- (40) 1226289 外側移動向內側，以及’因爲在外側區域之塗覆量係大於 內側區域者，所以，在曲面1 2 〇 b內之每單位面積之處理 液體材料量變得均勻’以及塗覆膜將平坦。因此，於本例 子之塗覆方法中，如同第11圖之例子，由於曲面120b之 上部區域及下部區域間之重力作用，在膜厚度之差可以被 禁止。 於第1 1及1 2圖所示之例子中，雖然曲面被分成三個 區域，但並不限定於三個區域，其可以接受分成兩或四或 更多區域。當將曲面分成多數同心區域時，不必要適當地 對準每一區域之中心。再者，區分方法並不限定於同心方 式，任意方法均可以採用。 曲面之區分可以對應於曲面之形狀加以設定。例如， 當曲面之曲率半徑很小及處理液體材料容易流動於曲面時 ，較佳將曲面分成更小區域。當光學部件具有多數曲面， 包含凸出面及凹陷面時，較佳地將曲面分成對應於曲面形 狀之更小區域。 用於每一區分區域之塗覆量係被決定，使得基於處理 液體材料特徵，例如想要之膜厚度、曲面之曲率半徑及放 置角度、蒸發率等，也基於乾燥條件，在乾燥後之膜厚變 成均勻。對於每一區域之塗覆量可以藉由改變來自液體材 料排放頭之每液體微滴體積、改變於液體微滴間之間隙、 及塗覆次數加以控制。 於此光學部件之表面處理中，在光學部件上之靜電荷 係藉由事先吹拂來自離子產生裝置38之離子風向爲基材 -43- (41) 1226289 之光學部件1 2 0，而被放電。另外，予以形成之光學部件 之帶電荷也藉由在表面處理液體排放時，在排放處理液體 後，隨即提供離子風，而加以防止。 藉此，對排放頭3 4之靜電損傷或破壞可以防止，再 者，所產生之光學設備之生產力可以加強，也加強了可靠 度。 再者，對於本發明可採用之裝置及電子裝置，並不限 定於這些裝置，有可能製造各種裝置，例如一電子遷移裝 置、一有機EL顯示裝置、一電子放電元件（包含FED及 SED )、一電子光學裝置，例如液晶顯示裝置，各種之半 導體裝置等。 再者，將說明藉由排放設備所形成之構成元件之一部 份的電子裝置例。 第1 3圖爲此一作爲電子裝置之行動電話例立體圖。 於第13圖中，參考號1000表示一行動電話主體，而參考 號1001表示一顯示部，其使用有機EL設備301加以完 成。 該電子裝置（行動電話）具有良好生產力，特別是在 顯示器部份，並具有高可靠度，因爲其具有由有機EL裝 置作成之顯示部。 【圖式簡單說明】 第1圖爲本發明之排放設備之構成示意圖。 第2A及2B圖爲一排放頭之構成示意圖。 -44- (42) 1226289 第3圖爲有機EL設備之側剖面圖。 第4圖爲一電漿顯示器之分解立體圖。 第5圖爲一電子裝置之側剖面圖。 第6 A至6 F圖顯示形成一彩色濾光片之方法。 第7圖爲形成圖案之方法流程圖。 第8A及8B圖爲形成圖案之方法例示意圖。 第9A及9B圖爲形成圖案之方法例示意圖。 第10A及10B圖爲形成圖案之方法例示意圖。 第1 1 A及1 1 B圖顯示一光學部件之表面處理。 第12A及12B圖顯示電子裝置例之立體圖。 第13圖爲電子裝置例之立體圖。 主要元件對照表 1 2 :噴嘴板 1 3 :振動板 1 4 :分離件 1 5 :空腔 1 6 :儲存器 1 7 :路徑 1 8 :孔形噴嘴 19 :孔 20 :壓電元件 21 :電極 22 :液體微滴 -45- (43) (43)1226289 24 :管 3 〇 :排放設備 31 :基座 3 2 :基材傳送裝置 3 3 :頭傳送裝置 3 3 a :托架 3 3 b :進行路 3 3 c :固持板 3 3 d :導軌 34 :排放頭 3 5 :液體材料槽 3 6 :導軌 3 7 :滑動件 38 :離子生產裝置 39 :桌台 40 :排氣裝置 40a :排氣管 4 0 b :排氣入口 4 0 c :吸引泵 4 2 :滑動件 4 3 :馬達 44 :馬達 4 5 :馬達 4 6 :馬達 -46- (44) 1226289 5 2 :黑色矩陣 5 3 :濾波元件 5 4 :墨水微滴 5 5 :彩色濾光片 5 6 :保護膜 5 7 :透明導電膜 5 8 :像素電極 70 :電子裝置As shown in FIG. 8A, in the first scan, first side patterns Wa for each of the first, second, and third pattern forming regions R1, R2, and R3 are formed, and liquid droplets are distributed on At the same time from the first, second, and third discharge nozzles 34A, 34B, and 34C, the nozzles have a space equal to the area formed by the first side pattern forming area. From the liquid droplets discharged from each of the discharge nozzles 34 A, 34B, and 34C, an ion wind will be provided by the ion generating device 38. Here, the liquid droplets distributed on the substrate S will be wet and sprayed on the substrate S by being impacted on the substrate S. That is, as shown by the circle in Fig. 8A, the droplets impinging on the substrate S are wetted and ejected so that they have a diameter C, which is larger than the size of one pixel. It can be set that each liquid droplet distributed on the substrate S will not overlap each other, because each liquid droplet is distributed along the Y-axis direction with a predetermined gap therebetween. Thereby, a liquid material is prevented from being excessively distributed along the Y-axis direction on the substrate S, and at the same time, the occurrence of protrusions is prevented. In Fig. 8A, although each liquid droplet is distributed so that they do not overlap each other when they are distributed on the substrate S, each droplet can also be distributed by -33- (31) 1226289 so that they are slightly on each other. overlapping. Furthermore, although in this example, each liquid droplet is distributed with a gap equal to one pixel, it is known that each droplet to be distributed has a gap equal to two or more. In this example, the gap between each liquid droplet on the substrate S can be compensated by increasing the number of operations of the discharge head 34 scanning operation and distribution (discharge operation) to the substrate S. Since the surface of the substrate S is treated in advance in steps S2 and 3 to have a predetermined hydrophobicity, it is possible to prevent distribution of excessively sprayed liquid droplets on the substrate S. Therefore, the shape of the pattern can also be controlled in a good condition, and further, increasing the film thickness can be easily performed. Fig. 8B is a schematic diagram in which liquid droplets are distributed on the substrate S by the discharge head 34 during the second scan. In Fig. 8B, the symbol "2" indicates liquid droplets distributed in the second scan. In the second scan, the liquid droplets are distributed at the same time as each of the discharge nozzles 34 A, 34B and 34C, so that they compensate for the gap between the liquid droplets "1" distributed in the first scan. The first side pattern Wa is formed in each of the first, second, and third pattern forming regions R1, R2, and R3 when the liquid droplets and the distribution operation are connected to each other by the first and second scanning operations. Here, the liquid droplets "2" are also wet and ejected by impacting on the substrate S, and then, a portion of the liquid droplets "2" and the liquid droplets "1" are distributed on the substrate 8 in advance. Some parts overlap each other. Specifically, a part of the liquid droplet "2" is superimposed on the liquid droplet "1". In this second scan, when the liquid droplets are discharged from each of the discharge nozzles 3 4 A, 3 4 B, and 3 4C, an ion wind from the ion generating device 38 blows before and after the discharge. -34- (32) 1226289 After the discharged liquid droplets are formed on the substrate S to form the first side member pattern w a, a drying process (step s 5) can be performed immediately, and if necessary, the distributed medium is moved. The intermediate drying treatment may be an optional treatment, which is tempered using lamps other than general heat treatment, using a hot plate, an electric furnace, a hot air fan, and the like. Furthermore, the discharge head 34 and the substrate S are relatively moved along the + χ-axis direction by a distance equal to exactly one pixel. Subsequently, the discharges from the discharge nozzles 3 4 A, 3 4 B, and 3 4 C also move. Then, the discharge head 34 will perform a third scan. Thus, as shown in FIG. 9A, the liquid droplets “3” used to form the second side pattern Wb will be discharged by each of the discharge nozzles 34A, 34B, and 34C, and while being discharged to the substrate S, along the There is a gap against the first side pattern Wa in the X-axis direction, and the pattern Wb constitutes a part of each of the film patterns W1, W2, and W3. The liquid droplets "3" will be distributed along the Y axis with a gap of one pixel. In the third scan, when the liquid droplets are distributed by each of the discharge nozzles 34A, 34B, and 34C, the ion wind is blown out by the ion generating device 38 before and after the discharge. Fig. 9B is a schematic diagram of the liquid droplets dispensed by the discharge head 34 to the substrate S in the fourth scan. In Figure 9B, the symbol "4" indicates the liquid droplet distribution in the fourth scan. In the fourth scan, liquid droplets are distributed from each of the discharge nozzles 34A, 34B, and 34C so that they compensate for the gap "3" between the liquid droplets in the third scan. The second side pattern Wb is formed in each of the first, second, and third pattern forming regions R1, R2, and R3, and is connected to each other in the third and fourth scanning operations and discharge operations. drop. A part of the liquid droplet "3" -35- (33) 1226289 and a part of the liquid droplet "4" previously distributed on the substrate S overlap each other. Specifically, a portion of the 'liquid droplet "4" overlaps the liquid droplet "3". In this fourth scan, when the liquid droplets are discharged by each of the discharge nozzles 3 4 A, 3 4B, and 3 4C before and after the discharge, the ionic wind is blown by the ion generating device 38 and the liquid droplets are discharged to the base. After the material S is formed to form the second side pattern Wb, an intermediate drying process may be performed if necessary to remove the distribution medium. Furthermore, the discharge head 34 is moved stepwise toward the -X axis direction by a distance equal to a size of two pixels, and then the discharge nozzles 34A, 34B, and 34C are also moved stepwise toward the -X axis direction. The distance between two pixel sizes. Then, the discharge head 34 will perform a fifth scan. Thus, as shown in FIG. 10A, the liquid droplets "5" for forming the intermediate pattern Wc constituting the members of each of the film patterns W1, W2, and W3 will be simultaneously discharged onto the substrate S. The liquid droplets "5" are distributed along the γ axis with a gap of one pixel. The liquid droplet "5" and the liquid droplet "丨" and, a part of 3 "are overlapped with each other and dispersed on the substrate S in advance. Specifically, the liquid droplet, a part of 5" Overlapping liquid droplets "1, and, 3, ... In the fifth scan, when the liquid droplets discharged from each of the discharge nozzles 34 A, 34B, and 3 4C are discharged, an ionic wind precedes the discharge. Or afterwards, it is blown out by the ion generating device 38. Fig. 10B is a schematic diagram in which liquid droplets are distributed on the substrate S from the discharge head 34. In the figure, the symbol, 6 ,, indicates that the The liquid droplets in the / scan. In the sixth scan, the liquid droplets are simultaneously discharged by each of the discharge nozzles 34A, 34B, and 34C, so that they compensate for the distribution (34) 1226289 of the liquid droplets in the fifth scan. A gap between "5". By connecting liquid droplets to each other in the fifth and sixth scanning operations and distribution operations, an intermediate pattern Wc is formed in each of the first, second and first pattern forming regions R1. , R2 and R3. Part of the liquid droplet "6" distributed in advance on the substrate S and the liquid micro Drop, a part of '5' overlaps each other. Furthermore, a part of the liquid droplets "6" and the liquid droplets "2" and "4" distributed on the substrate S in advance overlap each other. In the sixth scan, when liquid droplets are discharged from each of the discharge nozzles 3 4 A, 3 4 B, and 3 4 C, an ion wind is blown out by the ion generating device 38 before and after the discharge. By performing the above, the film patterns W1, W2, and W3 will be formed in each of the pattern forming regions R1, R2, and R3. As described above, when the film patterns W1, W2, and W3 are formed by sequentially distributing the same shape of most of the liquid droplets, the distribution command for distributing the liquid droplets toward each of the pattern forming regions R1, R2, and R3 is changed. Set to be the same as each other. Therefore, when each liquid droplet "1" to "6" is distributed such that a part of them overlaps, the outer shape of each film pattern W1, W2, and W3 can be the same, because in each film pattern Wl The overlapping shapes among W2, W2, and W3 are the same. Therefore, irregular colors outside each of the film patterns W1, W2, and W3 can be prevented. The distribution of the liquid droplets (overlapping shapes among the liquid droplets) may be the same, because the distribution order of the liquid droplets is the same for each of the film patterns w 1, W2, and W 3. Therefore, generation of an irregular frequency color is prevented. The thickness distribution of each film can be almost the same because the overlapping state between liquid droplets is set to the same for each film pattern W1, W2, and W3 -37- (35) 1226289. Therefore, 'when the iWu bar is a repeated pattern, which is overlapped along the surface direction of the substrate', especially when the film pattern is a pattern that most of the pixels correspond to the display device, each pixel will have the same film thickness distributed. Therefore, the same function can be realized along the surface direction of the substrate. In addition, the line width of each film pattern W1, W2, and W3 can be close to uniform, because the liquid droplets "5" and "6" used to form the center pattern Wc are distributed so that they penetrate into the first side pattern W The gap between a and the second side pattern W b is after the first side pattern Wa and the second side pattern Wb are formed. That is, when the center pattern W c is formed on the substrate S, the liquid droplets “1” ”2 ,,,, 3”, and 4, 4 that are used to form the side patterns Wa, Wb, Since there is a phenomenon that the liquid droplets are dragged toward the center formed on the substrate S, it is difficult to control the line width of each film pattern W1, W2, and W3. On the other hand, in this embodiment, the line width control of each film pattern W1, W2, and W3 can be accurately performed because the liquid droplets "5" and "6" used to form the center pattern Wc are distributed to After forming the side pattern Wa and the side pattern Wb, they are inserted into the gap between the side pattern Wa and the side pattern Wb. The side pattern Wa and the side pattern Wb can be formed after the center pattern W c is formed. At this time, the production of irregular colors in each pattern can be prohibited by applying each film pattern W1 to W3 in the same liquid droplet distribution order. In the method for forming a conductive film circuit pattern (metal circuit pattern), the electrostatic charge on the substrate S can be discharged by blowing the ionic wind from the ion generating device 38 to the substrate S in advance, and also at the same time. The formation of the conductive film circuit pattern of -38- (36) 1226289 can also be prevented by blowing an ionic wind when the liquid material containing the conductive film circuit forming material is discharged and immediately after the liquid material is discharged. In this way, electrostatic damage to the discharge head 34 can be prevented, and furthermore, the productivity of the device to be manufactured is enhanced, and at the same time, the reliability is enhanced. Furthermore, as a sixth application of the present invention, a surface treatment for an optical component will be described. In this example, an ionic wind is provided on the optical component, and a processing liquid material is coated on the surface to complete the enhancement of optical efficiency and function. Examples of the optical component may be processed objects. Various optical lenses include glass lenses, light emission control lenses, sunglasses lenses, camera lenses, telescope lenses, magnifying lenses, projector lenses, pickup lenses, and micro lenses. and many more. At the same time, it can also be, for example, an optical mirror, a filter, an optical fiber, an optical component of a stepper for semiconductor exposure, or an organic cover glass of a mobile device. As for the surface treatment of this optical component, specifically, it may be, for example, a hard treatment, an anti-reflection treatment, or the like. As for the processing material used for this surface treatment, for example, the raw material portion of the optical component, the untreated portion of the optical portion, a portion of the surface-hardened raw material of the optical component, the surface raw material of the optical component, and the coating of the optical component A part of the base material, a base material of the optical component, a part of the anti-reflection film material of the optical component, and an anti-reflection film material of the optical component. The composition of raw materials for processing liquid materials is selected according to the hardening method. -39- (37) 1226289 For example, when using ultraviolet light, electron beam, microwave, etc. to harden a raw material for an optical component, a raw material for a surface hardening film, a raw material for a primer, and a raw material for an anti-reflection film, the It is not necessary to add a reaction initiating liquid, a catalyst, a solvent, and water to carry out the hydrolysis reaction. Therefore, it is also possible to use a part of the raw materials of the optical parts other than the knives, a part of the raw materials of the surface hardening film, and coating. Part of the base material and part of the anti-reflection film material. On the other hand, when hardening the raw materials for optical components, a raw material for surface hardening film, a raw material for coating, and a raw material for antireflection film, there will be no reaction starting liquid, a catalyst, a solvent because of the hardening treatment. 2. It is used to treat the water of hydrolysis reaction, so it is necessary to use the raw materials of optical components containing them, the raw materials of the surface hardening film, the raw materials of the primer and the raw materials of the anti-reflection film. It may also be colored by including dyes and / or dyes in the processing liquid material. This surface treatment is performed by applying a liquid material, and the substrate transfer device 3 2 as the discharge device 30 can be configured so that the table 39 can rotate the optical component (not shown) with respect to the Θ axis by using a motor in the 0 direction. (Shown in the figure). In this example, in the processing material, a hard coating liquid (hard coating composition) is applied on the curved surface of an optical component, which will be a substrate. As shown in FIG. 1A, by holding the optical component 1 2 0 while the holding component i 2 is fixed, the optical component 1 2 0 and the discharge head 3 4 are relatively moved, and repeatedly applied Liquid droplets on the curved surface 12 0a of the optical component 1 20, the coating liquid system is the processing liquid from most of the nozzles installed on the discharge head 34, and a coating film will be discharged as a liquid by hard coating liquid The droplets are formed on the curved surface 12a. -40- (38) 1226289 In this example, most of the processing liquid coated on the curved surface 120a of the optical component 120 remains on the curved surface 120a, because the processing liquid is applied to the liquid droplet method. So use efficiency is very high. In this example, the optical component 120 is placed so that the curved curved surface 120a faces upward, and the hard coating liquid system is discharged downward by the discharge head 34 placed on the optical device 120. In addition, when the liquid droplets are discharged from the discharge head 34, the ionic wind from the ion generating device 38 is supplied to the optical member 120 before and after the liquid droplets are discharged. In this example, when the treatment liquid is applied, the curved surface 120a of the optical member 120 is divided into a plurality of regions, and the application amount of the treatment liquid is controlled for each region. Specifically, as shown in FIG. 11B, the curved surface 120a of the optical part 120 of the coated object is divided into a plurality of regions having concentric circles with the apex as the center (here, the three regions MO, Ml And I42), and in most regions 140, 141, and 142, the coating amount of the processing liquid (the processing amount per region) is set to be greater in the inner region than in the outer region. That is, as in the example shown in FIG. 11B, the coating amount to the outermost region 140 is the lowest, and the coating amount increases stepwise toward the inside, increasing in the order of region 1 40 and region 1 42. In this example, a part of the processing liquid material coated on the curved surface 120a is moved to the outside by the center portion of the inside of the curved surface 120a by the action of gravity toward the outside because it is a coated object. The curved surface 120a of the optical component 120 is placed so that the curved surface 120a will have a convex shape and face upward in the vertical direction. Because a part of the processing liquid material moves from the inside of the curved surface 1 20a to the outside, and because the coating of the inner area is larger than that of the outer area,-'in the curved surface 1 2 0 a The amount of processing liquid material per unit area becomes uniform, and the coating film becomes flat. Therefore, in the coating method of this example, the difference in film thickness can be suppressed by the effect of gravity between the upper region and the lower region of the curved surface 120a. Further, Figs. 12A and 12B show an example of applying a coating liquid material, in which a curved surface 1 2 0 b having a concave shape in the surface of the optical member 120 is placed upward in the vertical direction. In the example shown in FIG. 12A, the optical component 120 is placed so that the curved surface having a concave shape faces upward, and the hard coating liquid system for processing liquid materials is formed by a discharge head 3 placed on the optical component 120. 4 stations are discharged downward. When the liquid droplets are discharged from the discharge head 34, an ionic wind from the ion generating device 38 is supplied to the optical component 120 before and after the liquid droplets are discharged. In addition, when coated as shown in FIG. 12B, the curved surface 120b of the optical component 120 that is the coated object is divided into a plurality of regions (here, three regions 145, 146, and 147), which have concentric circles. , And the lowest point is taken as the center, and in most regions 1 4 5, 1 4 6 and 1 4 7, the coating amount of the processing liquid material in the outer region is greater than that in the inner region. That is, the coating amount in the innermost region 1 4 5 is the lowest, and the coating amount increases stepwise toward the outside, for example, in the order of region 1 46 and region 1 47. In this example, because of the effect of gravity, the curved surface 120b of the coated optical component 120 is placed so that the curved surface 120b is a concave shape that faces upward in the vertical direction. Therefore, one of the processing liquid materials coated on the curved surface 120b The part moves from the outermost side to the central part of the curved surface 120b, that is, the inner side. In addition, because a part of the processing liquid material moves from the outside of -42- (40) 1226289 to the inside on the curved surface 1 20b, and 'because the coating amount in the outside area is greater than the inside area, so on the curved surface 1 2 The amount of the processing liquid material per unit area within OB becomes uniform 'and the coating film will be flat. Therefore, in the coating method of this example, as in the example of FIG. 11, due to the gravity action between the upper region and the lower region of the curved surface 120b, the difference in film thickness can be prohibited. In the examples shown in Figs. 11 and 12, although the curved surface is divided into three regions, it is not limited to three regions, and it can be divided into two or four or more regions. When dividing the surface into most concentric regions, it is not necessary to properly align the center of each region. Furthermore, the distinguishing method is not limited to the concentric method, and any method may be adopted. The division of the surface can be set corresponding to the shape of the surface. For example, when the curvature radius of the surface is small and the processing liquid material easily flows on the surface, it is better to divide the surface into smaller areas. When the optical component has most curved surfaces, including convex surfaces and concave surfaces, the curved surface is preferably divided into smaller areas corresponding to the shape of the curved surface. The coating amount used for each distinguished area is determined based on the characteristics of the liquid material being processed, such as the desired film thickness, the radius of curvature of the curved surface, the placement angle, the evaporation rate, etc., and also based on the drying conditions. The thickness becomes uniform. The coating amount for each area can be controlled by changing the volume of liquid droplets from the liquid material discharge head, changing the gap between the liquid droplets, and the number of coatings. In the surface treatment of this optical component, the electrostatic charge on the optical component is discharged by blowing in advance the direction of the ion wind from the ion generating device 38 as the optical component 1-2 0 of the substrate -43- (41) 1226289. In addition, the charge of the formed optical component is also prevented by supplying ionic wind immediately after the treatment liquid is discharged when the surface treatment liquid is discharged. Thereby, the electrostatic damage or destruction to the discharge head 34 can be prevented, and furthermore, the productivity of the optical equipment produced can be enhanced and the reliability can be enhanced. Furthermore, the devices and electronic devices that can be used in the present invention are not limited to these devices, and it is possible to manufacture various devices, such as an electron migration device, an organic EL display device, an electronic discharge element (including FED and SED), An electro-optical device, such as a liquid crystal display device, various semiconductor devices, and the like. In addition, an example of an electronic device which is a part of constituent elements formed by a discharge device will be described. FIG. 13 is a perspective view of an example of a mobile phone as an electronic device. In Fig. 13, reference numeral 1000 denotes a mobile phone main body, and reference numeral 1001 denotes a display section, which is completed using an organic EL device 301. This electronic device (mobile phone) has good productivity, especially in the display portion, and has high reliability because it has a display portion made of an organic EL device. [Brief description of the drawings] Figure 1 is a schematic diagram of the structure of the emission equipment of the present invention. Figures 2A and 2B are schematic diagrams of the structure of a discharge head. -44- (42) 1226289 Figure 3 is a side sectional view of an organic EL device. FIG. 4 is an exploded perspective view of a plasma display. FIG. 5 is a side sectional view of an electronic device. Figures 6A to 6F show the method of forming a color filter. FIG. 7 is a flowchart of a method for forming a pattern. 8A and 8B are schematic diagrams illustrating an example of a method for forming a pattern. Figures 9A and 9B are schematic illustrations of a method for forming a pattern. Figures 10A and 10B are schematic illustrations of a method for forming a pattern. Figures 1 1 A and 1 1 B show the surface treatment of an optical component. Figures 12A and 12B show perspective views of examples of electronic devices. Fig. 13 is a perspective view of an example of an electronic device. Main component comparison table 12: Nozzle plate 1 3: Vibration plate 1 4: Separator 1 5: Cavity 16: Reservoir 1 7: Path 1 8: Hole nozzle 19: Hole 20: Piezo element 21: Electrode 22: Liquid droplet-45- (43) (43) 1226289 24: Tube 3 〇: Discharge device 31: Base 3 2: Substrate conveying device 3 3: Head conveying device 3 3 a: Holder 3 3 b: 3 3 c: holding plate 3 3 d: guide 34: discharge head 3 5: liquid material tank 3 6: guide 3 7: slider 38: ion production device 39: table 40: exhaust device 40a: exhaust Tube 4 0 b: Exhaust inlet 4 0 c: Suction pump 4 2: Slider 4 3: Motor 44: Motor 4 5: Motor 4 6: Motor -46- (44) 1226289 5 2: Black matrix 5 3: Filter Element 5 4: Ink droplets 5 5: Color filter 5 6: Protective film 5 7: Transparent conductive film 5 8: Pixel electrode 70: Electronic device
71 ：有機TFT 72 ··有機 LED 7 3 :基材 7 4 :閘極電極 75 :介電層 7 6 :源極電極 77 :汲極電極 78 :半導體層 7 9 :陽極 8 0 :正電洞傳送層 81 :電子傳送/發射層 82 :陰極 1 1 2 :固持件 120 :光學件 120a：曲面 12 0b:曲面 (45) 122628971: Organic TFT 72 ·· Organic LED 7 3: Substrate 7 4: Gate electrode 75: Dielectric layer 7 6: Source electrode 77: Drain electrode 78: Semiconductor layer 7 9: Anode 8 0: Positive hole Transport layer 81: Electron transport / emission layer 82: Cathode 1 1 2: Holder 120: Optical 120a: Curved surface 12 0b: Curved surface (45) 1226289
14 0 ·區域 1 4 1 :區域 14 2 ·區域 1 4 5 :區域 146 ·區域 147.區域 3 0 1 :有機E L設備 3 02 :有機EL元件 3 1 1 :基材 3 2 1 :電路元件部 3 3 1 :像素電極 3 4 1 :排部 3 5 1 :發光元件 352:正電洞注入層 3 5 3 :發光層 3 6 1 :陰極 3 7 1 :密封基材 5 0 0 :電漿顯示 5 0 1 :玻璃基材 5 02 :玻璃基材 5 1 0 :放電顯示件 5 1 1 :位址電極 5 1 2 :顯示電極 5 1 2 a :匯流排電極 -48- (46) (46)1226289 5 1 3 :介電層 5 1 4 :保護膜 515 :排 5 1 6 :排放室 5 1 7 :螢光材料 5 1 9 :介電層14 0 · Area 1 4 1: Area 14 2 · Area 1 4 5: Area 146 · Area 147.Area 3 0 1: Organic EL Device 3 02: Organic EL Element 3 1 1: Substrate 3 2 1: Circuit Element Unit 3 3 1: Pixel electrode 3 4 1: Row section 3 5 1: Light emitting element 352: Positive hole injection layer 3 5 3: Light emitting layer 3 6 1: Cathode 3 7 1: Sealing substrate 5 0 0: Plasma display 5 0 1: glass substrate 5 02: glass substrate 5 1 0: discharge display 5 1 1: address electrode 5 1 2: display electrode 5 1 2 a: bus electrode -48- (46) (46) 1226289 5 1 3: Dielectric layer 5 1 4: Protective film 515: Row 5 1 6: Emission chamber 5 1 7: Fluorescent material 5 1 9: Dielectric layer
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