CN115056401B - Preparation method of electronic adhesive - Google Patents

Preparation method of electronic adhesive Download PDF

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Publication number
CN115056401B
CN115056401B CN202210647599.2A CN202210647599A CN115056401B CN 115056401 B CN115056401 B CN 115056401B CN 202210647599 A CN202210647599 A CN 202210647599A CN 115056401 B CN115056401 B CN 115056401B
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China
Prior art keywords
plate
coating
cavity
transmission
frame body
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Active
Application number
CN202210647599.2A
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Chinese (zh)
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CN115056401A (en
Inventor
王彬
罗伟
邓戈
陈海东
黎春湄
陈艳清
梁倩映
侯星平
戴海英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Juma New Material Co ltd
Foshan Juma New Material Co ltd
Original Assignee
Guangdong Juma New Material Co ltd
Foshan Juma New Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Guangdong Juma New Material Co ltd, Foshan Juma New Material Co ltd filed Critical Guangdong Juma New Material Co ltd
Priority to CN202210647599.2A priority Critical patent/CN115056401B/en
Publication of CN115056401A publication Critical patent/CN115056401A/en
Application granted granted Critical
Publication of CN115056401B publication Critical patent/CN115056401B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22Component parts, details or accessories; Auxiliary operations

Abstract

The invention discloses a preparation method of electronic glue, which comprises the following steps of pouring prepared glue materials into a cavity of a mould plate; conveying the die plate to the position below the coating machine along the conveying frame, aligning the positioning column with the positioning hole, controlling the coating machine to move downwards, inserting the positioning column into the positioning hole, and fixing the frame body on the conveying frame; according to the preparation method of the electronic glue, the coating method is adopted in the preparation process of the electronic glue, so that the electronic glue can be automatically coated, and the electronic glue is simultaneously subjected to heating and drying treatment when being conveyed after the coating and the coating are finished, so that the time consumed by drying the electronic glue during the coating is saved.

Description

Preparation method of electronic adhesive
Technical Field
The invention relates to the technical field of electronic glue, in particular to a preparation method of electronic glue.
Background
The electronic glue is a common consumable material in the process of fixing and mounting the electronic components;
chinese patent CN102964983B discloses a silicon hybrid composite coating electronic adhesive and a preparation method thereof, wherein ethyl orthosilicate, PDMS and methyltriethoxysilane are catalyzed by an acid catalyst added step by step to form sol A, and the sol A and chitosan are compounded to form a novel silicon hybrid composite coating electronic adhesive. The prepared coated electronic adhesive has good comprehensive performance, and a coating film formed by the coated electronic adhesive has super-strong hydrophobic property, good stain resistance and corrosion resistance, strong adhesion to a coated substrate, high refractive index, good mechanical property and good oxygen barrier property;
in the prior art, an electronic adhesive generally comprises an adhesive main material, a chemical stability modifier, a solvent and an electronic adhesive tape base film, wherein the adhesive main material is mixed and modified by the chemical stability modifier in the solvent and then coated on the electronic adhesive tape base film to obtain an electronic adhesive tape, and in the coating process, an adhesive material is placed on the base film, uniformly spread by coating equipment and then transferred to a drying box for forming.
Disclosure of Invention
The present invention is directed to solve the above problems of the background art, and to provide a method for preparing an electronic adhesive.
The purpose of the invention can be realized by the following technical scheme:
a preparation method of electronic glue comprises the following steps:
step 1: pouring the prepared adhesive material into a cavity of a mold plate;
step 2: conveying the die plate to the lower part of the coating machine along the conveying frame, aligning the positioning column with the positioning hole, controlling the coating machine to move downwards, inserting the positioning column into the positioning hole, and fixing the frame body on the conveying frame;
and step 3: coating the gluing material in the die cavity through the coating machine, simultaneously, hot water injects the heating cavity of framework into through the reference column, heats the stoving to the electron glue after the coating.
As a further scheme of the invention: the temperature of the injected hot water is 85-88 ℃.
As a further scheme of the invention: and controlling the time for transferring the coated electronic glue to the transfer mechanism to be 5-8min.
As a further scheme of the invention: the working method of the transfer mechanism comprises the following steps:
the die plate moves to a position between the first transmission plate and the second transmission plate, and the distance between the first transmission plate and the second transmission plate is adjusted; meanwhile, the first transmission plate and the second transmission plate can pull the guide rail on the die plate to move, so that the water outlet is opened, and hot water in the die plate can directly flow into the water tank from the water outlet.
As a further scheme of the invention: the hot water collected in the water tank continuously flows into the heating tank through the circulating pump to be heated, and then is injected into the die plate in the coating process to be dried.
As a further scheme of the invention: the water outlet connecting part of the guide rail and the frame body is provided with a rubber pad, and the guide rail makes the inner cavity of the mould plate form a sealed cavity under the action of the restoring force of the spring.
As a further scheme of the invention: the mould plates are transported by a belt.
As a further scheme of the invention: a sliding rail is arranged between the two transmission belts and is matched with the guide rail on the mould plate.
The invention has the beneficial effects that:
(1) According to the preparation method of the electronic glue, the coating method adopted in the preparation process of the electronic glue is designed, so that the electronic glue can be automatically coated, and the electronic glue is simultaneously subjected to heating and drying treatment when being conveyed after being coated and coated, so that the time consumed by drying the electronic glue during coating is saved; when the drying is finished, the hot water is automatically discharged in the conveying process and collected for recycling.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic structural view of an electronic adhesive manufacturing apparatus according to the present invention;
FIG. 3 is a schematic view of the construction of the coating mechanism of the present invention;
FIG. 4 is a schematic structural view of a die plate of the present invention;
FIG. 5 is a schematic view of the construction of the drainage member of the present invention;
fig. 6 is a schematic structural view of the pivoting mechanism of the present invention.
In the figure: 1. a support; 2. a transfer frame; 3. a transfer mechanism; 4. a coating roller; 5. a positioning column; 6. a mold plate; 7. a frame body; 8. a cavity; 9. a guide rail; 10. positioning holes; 11. a fixing rod; 12. a slide bar; 13. a fixed block; 14. a spring; 15. a water tank; 16. a fixing plate; 17. a screw rod; 18. a first limit shaft; 19. a sliding plate; 20. a first drive plate; 21. a transmission belt; 22. a slide rail; 23. a second drive plate; 24. a second limiting shaft.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-4, the present invention is an apparatus for preparing electronic glue, wherein the apparatus for preparing glue material is prepared by the existing process, which is not described herein again, and the apparatus comprises a support 1 and a transmission frame 2;
the two supports 1 are arranged side by side, a conveying frame 2 is arranged between the two supports 1, the conveying frame 2 is used for conveying the die plate 6, an installation frame is arranged at the top of each support 1, a coating machine is arranged on the installation frame and can horizontally move along the installation frame, and the output end of the coating machine is connected with a coating roller 4 and is used for uniformly coating the adhesive on the die plate 6;
the mould plate 6 comprises a frame body 7, a cavity 8, a guide rail 9 and a positioning hole 10; the frame body 7 is of a square hollow structure, a square cavity 8 is formed in the middle of the frame body 7, an electronic tape base film is arranged in the cavity 8, guide rails 9 are respectively arranged on two sides of the mold plate 6, and the guide rails 9 are matched with the conveying frame 2, so that the mold plate 6 is horizontally conveyed along the conveying frame 2 through the guide rails 9;
wherein, both sides of the frame body 7 are respectively provided with a positioning hole 10 matched with the positioning column 5, and the inner cavity of the frame body 7 is a heating cavity; the positioning columns 5 are arranged on two sides of the coating roller 4, move up and down along with the coating machine and are inserted into the positioning holes 10 of the frame body 7; the positioning column 5 is a metal pipe, the top end of the positioning column 5 is connected with a water pipe, hot water is conveyed into the positioning column 5 through the water pipe, and then the hot water is injected into the heating cavity of the frame body 7 from the positioning column 5 for heating and drying the coated electronic adhesive;
therefore, in the coating process of the electronic adhesive, firstly, the adhesive material is poured into the cavity 8 of the frame 7, then, the electronic adhesive is conveyed to the lower part of the coating machine along the conveying frame 2, the positioning column 5 is aligned with the positioning hole 10, then, the coating machine is controlled to move downwards, the positioning column 5 is inserted into the positioning hole 10, the frame 7 is fixed on the conveying frame 2, the coating roller 4 of the coating machine horizontally moves along the frame 7, the adhesive material in the cavity 8 is uniformly coated, in the coating process, hot water is conveyed into the positioning column 5 through the water pipe, then, the hot water is injected into the heating cavity of the frame 7 from the positioning column 5, and the coated electronic adhesive is heated and dried; wherein the temperature of the injected hot water is 85-88 ℃; after the electronic glue coating is finished, the coating machine resets, the next die plate 6 is coated, and meanwhile, the coated electronic glue continuously moves forwards along the conveying frame 2 and is conveyed to the transfer mechanism 3; wherein, the time for transferring the coated electronic glue to the transfer mechanism 3 is controlled to be 5-8min; the set time can be dried under the action of hot water at 85-88 ℃;
therefore, the coating method adopted in the preparation process of the electronic glue can realize automatic coating of the electronic glue, and the mold plate 6 is more stable when moving through the arrangement of the guide rail 9 during conveying, and the structural design of the mold plate 6 can ensure that the electronic glue is also subjected to heating and drying treatment when being conveyed after coating and coating are finished, so that the time consumed by drying the electronic glue during coating is saved; and the heating mode is matched with the positioning of the die plate 6, so that the time for coating the electronic adhesive is further saved;
example 2
Referring to fig. 5 and 6, the transfer mechanism 3 transfers the coated electronic glue to the next process, and the transfer mechanism 3 includes a water tank 15, a fixing plate 16, and a sliding plate 25; two fixed plates 16 are arranged side by side, a water tank 15 is arranged at the bottom of the fixed plate 16, and a horizontal moving mechanism is also arranged on the fixed plate 16 and comprises a screw rod 17, a first limit shaft 18, a sliding plate 19, a first transmission plate 20, a second transmission plate 23 and a second limit shaft 24; the screw rod 17 is rotatably installed on the fixed plate 16, the two sides of the screw rod 17 are respectively provided with a first limiting shaft 18, the screw rod 17 and the first limiting shaft 18 are respectively connected with the top of the sliding plate 19, the bottom of the sliding plate 19 is connected with a second limiting shaft 24, the sliding plate 19 is provided with a first transmission plate 20, the fixed plate 16 is provided with a second transmission plate 23, the first transmission plate 20 and the second transmission plate 23 are mutually matched, and the first transmission plate 20 and the second transmission plate 23 are respectively provided with a transmission member;
the sliding plate 19 is in threaded connection with the screw rod 17, and the sliding plate 19 is in sliding connection with the first limiting shaft 18; the screw rod 17 is connected with the output end of a driving motor, and the driving motor is arranged on the fixing plate 16;
the conveying members on the first and second transmission plates 20 and 23 and the conveying members on the conveying frame 2 are of the same structure, the conveying members comprise two transmission belts 21, two sliding rails 22 and two transmission belts 21, the two transmission belts 21 are respectively arranged on the corresponding first and second transmission plates 20 and 23, the sliding rail 22 is arranged between the two transmission belts 21, and the sliding rail 22 is matched with the guide rail 9 on the mold plate 6;
referring to fig. 4, a drainage member is further disposed in the mold plate 6, the drainage member includes a fixing rod 11, a sliding rod 12, a fixing block 13, and a spring 14, drainage openings are disposed on two sides of the frame 7, a guide rail 9 is mounted at the drainage opening, and a rubber pad is disposed at a connection between the guide rail 9 and the drainage opening of the frame 7, and the rubber pad can ensure sealing of an inner cavity of the frame 7, so that hot water does not leak from the inner cavity of the frame 7;
the guide rail 9 is connected with one end of a sliding rod 12, the other end of the sliding rod 12 extends into the inner cavity of the frame body 7, a fixed rod 11 is sleeved on the sliding rod 12 and is in sliding connection with the fixed rod 11, the fixed rod 11 is installed in the inner cavity of the frame body 7, a fixed block 13 is installed at the other end of the sliding rod 12, a spring 14 is sleeved on the sliding rod 12, and two ends of the spring 14 are respectively connected with the fixed block 13 and the fixed rod 11;
during operation, when the mold plate 6 moves to the transmission members on the first transmission plate 20 and the second transmission plate 23, the driving motor is started to operate to drive the screw rod 17 to rotate, so that the sliding plate 19 horizontally moves along the first limiting shaft 18 and the second limiting shaft 24, and the distance between the first transmission plate 20 and the second transmission plate 23 is increased; meanwhile, the first transmission plate 20 and the second transmission plate 23 pull the guide rail 9 on the mold plate 6 to move, so that the water outlet is opened, hot water in the mold plate 6 directly flows into the water tank 15 from the water outlet, the mold plate 6 is continuously conveyed upwards along the conveying member in the water discharging process to the next process, and when the conveying member is moved out, the guide rail 9 is reset under the restoring force of the spring 14, so that the inner cavity of the mold plate 6 forms a sealed cavity;
therefore, the arrangement of the guide rail 9 not only plays a role in stable transmission, but also plays a role in sealing the inner cavity of the mold plate 6, hot water collected in the water tank 15 continuously flows into the heating tank through the circulating pump to be heated, and then is injected into the mold plate 6 in the coating process to be dried, so that the water tank 15 can be designed to enable water resources to be recycled; the transfer mechanism 3 designed by the invention can automatically discharge hot water in the transportation process, and does not influence the time of the electronic glue in the preparation process.
Example 3
Referring to fig. 1, a method for preparing an electronic adhesive includes the following steps:
step 1: pouring the prepared adhesive material into a cavity 8 of a frame body 7, conveying the adhesive material to the lower part of a coating machine along a conveying frame 2, aligning a positioning column 5 with a positioning hole 10, controlling the coating machine to move downwards, inserting the positioning column 5 into the positioning hole 10, fixing the frame body 7 on the conveying frame 2, horizontally moving a coating roller 4 of the coating machine along the frame body 7, uniformly coating the adhesive material in the cavity 8, conveying hot water into the positioning column 5 through a water pipe in the coating process, injecting the hot water into a heating cavity of the frame body 7 from the positioning column 5, and heating and drying the coated electronic adhesive; wherein the temperature of the injected hot water is 85-88 ℃; after the electronic glue coating is finished, the coating machine resets, the next die plate 6 is coated, and meanwhile, the coated electronic glue continuously moves forwards along the conveying frame 2 and is conveyed to the transfer mechanism 3; wherein, the time for transferring the coated electronic glue to the transfer mechanism 3 is controlled to be 5-8min; the set time can be dried under the action of hot water at 85-88 ℃;
step 2: when the mold plate 6 is conveyed to the transfer mechanism 3, the driving motor is started to work to drive the screw rod 17 to rotate, so that the sliding plate 19 horizontally moves along the first limiting shaft 18 and the second limiting shaft 24, and the distance between the first transmission plate 20 and the second transmission plate 23 is increased; meanwhile, the first driving plate 20 and the second driving plate 23 will pull the guide rail 9 on the mold plate 6 to move, so that the water outlet is opened, the hot water in the mold plate 6 directly flows into the water tank 15 from the water outlet, the mold plate 6 will continue to be conveyed upwards along the conveying member in the process of water drainage, and when the conveying member is removed, the guide rail 9 is reset under the restoring force of the spring 14, so that the inner cavity of the mold plate 6 forms a sealed cavity.
According to the preparation method of the electronic glue, the coating method adopted in the preparation process of the electronic glue is designed, so that the electronic glue can be automatically coated, and heating and drying treatment can be simultaneously carried out when the electronic glue is conveyed after coating and coating are finished, so that the time consumed by drying the electronic glue during coating is saved; when the drying is finished, the hot water is automatically discharged in the conveying process and collected for recycling.
Although one embodiment of the present invention has been described in detail, the description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims (6)

1. The preparation method of the electronic glue is characterized by comprising the following steps of:
step 1: pouring the prepared adhesive material into a cavity (8) of a mould plate (6);
and 2, step: conveying a die plate (6) to the lower part of the coating machine along a conveying frame (2), aligning a positioning column (5) with a positioning hole (10), controlling the coating machine to move downwards, inserting the positioning column (5) into the positioning hole (10), and fixing a frame body (7) on the conveying frame (2);
and 3, step 3: coating the adhesive material in the cavity (8) by a coating machine, simultaneously injecting hot water into the heating cavity of the frame body (7) through the positioning column (5), and heating and drying the coated electronic adhesive;
controlling the time for transferring the coated electronic glue to the transfer mechanism (3) to be 5-8min;
the working method of the transfer mechanism (3) comprises the following steps:
the mould plate (6) moves between the first transmission plate (20) and the second transmission plate (23), and the distance between the first transmission plate (20) and the second transmission plate (23) is adjusted; simultaneously, the first transmission plate (20) and the second transmission plate (23) pull the guide rail (9) on the die plate (6) to move, so that the water outlet is opened, and hot water in the die plate (6) directly flows into the water tank (15) from the water outlet;
the die plate (6) comprises a frame body (7), a cavity (8), a guide rail (9) and a positioning hole (10); the frame body (7) is of a square hollow structure, a square cavity (8) is formed in the middle of the frame body (7), an electronic adhesive tape base film is arranged in the cavity (8), guide rails (9) are respectively arranged on two sides of the die plate (6), and the guide rails (9) are matched with the conveying frame (2) so that the die plate (6) can be horizontally conveyed along the conveying frame (2) through the guide rails (9);
positioning holes (10) matched with the positioning columns (5) are respectively formed in two sides of the frame body (7), and an inner cavity of the frame body (7) is a heating cavity; the positioning columns (5) are arranged on two sides of the coating roller (4), move up and down along with the coating machine and are inserted into the positioning holes (10) of the frame body (7);
the transfer mechanism (3) comprises a water tank (15), a fixed plate (16) and a sliding plate (25); the two fixed plates (16) are arranged side by side, the bottom of each fixed plate (16) is provided with a water tank (15), and the fixed plates (16) are also provided with horizontal moving mechanisms which comprise screw rods (17), first limiting shafts (18), sliding plates (19), first transmission plates (20), second transmission plates (23) and second limiting shafts (24); screw rod (17) rotate to be installed on fixed plate (16), be provided with first spacing axle (18) respectively in the both sides of screw rod (17), be connected with the top of sliding plate (19) on screw rod (17) and first spacing axle (18) respectively, the bottom and the spacing axle of second (24) of sliding plate (19) are connected, install first transmission board (20) on sliding plate (19), install second driving plate (23) on a fixed plate (16), first transmission board (20) and second driving plate (23) are mutually supported, and be provided with the conveying piece on first transmission board (20) and second driving plate (23) respectively.
2. The method of claim 1, wherein the temperature of the injected hot water is 85-88 ℃.
3. The method for preparing electronic glue according to claim 2, characterized in that the hot water collected in the water tank (15) will continue to flow into the heating tank by the circulating pump to be heated, and then injected into the mold plate (6) in the coating process to be dried.
4. The method for preparing electronic glue according to claim 3, characterized in that a rubber pad is arranged at the joint of the guide rail (9) and the drainage port of the frame body (7), and the guide rail (9) makes the inner cavity of the mold plate (6) form a sealed cavity under the action of the restoring force of the spring (14).
5. A method for preparing electronic glue according to claim 4, characterized in that the transportation of the mould plates (6) is carried out by means of a conveyor belt (21).
6. A method for preparing electronic glue according to claim 5, characterised in that between the two belts (21) there are slide rails (22), the slide rails (22) fitting the guide rails (9) on the mould plate (6).
CN202210647599.2A 2022-06-08 2022-06-08 Preparation method of electronic adhesive Active CN115056401B (en)

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CN115056401B true CN115056401B (en) 2023-02-03

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CN111565515A (en) * 2020-06-09 2020-08-21 江苏胜帆电子科技有限公司 Manufacturing method of LCP material high-frequency plate

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