KR101876191B1 - Substrate treating method and apparatus thereof - Google Patents

Abstract

The present invention relates to a substrate processing method and apparatus for processing substrates in a hermetically sealed chamber, comprising: a substrate mounting step of mounting a substrate to be processed on a substrate stage; A chemical liquid applying step of applying a chemical liquid to the substrate to be processed; A pressure regulating step of regulating the inside of the hermetically closed chamber to a pressure lower than atmospheric pressure; A substrate bonding step of moving the bonding substrate downward from the upper side of the substrate to be processed to bond the substrate with the chemical liquid to form a panel; A cleaning and drying step of cleaning and drying the chemical liquid flowing out of the substrate to be processed in the process of combining the substrate to be processed and the adhesion substrate; Even when the chemical liquid is applied to the substrate to be processed to a thickness larger than the gap between the substrate to be processed and the adhesion substrate, the chemical liquid that has leaked to the outside of the panel in the laminating process while maintaining the state in which the thickness of the chemical liquid is kept constant The present invention is directed to a substrate processing method and apparatus capable of realizing better image quality by applying various properties and distribution states of a chemical solution applied to a panel while maintaining efficiency of a process by immediately proceeding to a subsequent process to provide.

Description

[0001] SUBSTRATE TREATING METHOD AND APPARATUS THEREOF [0002]

The present invention relates to a substrate processing apparatus and a substrate processing method using the substrate processing apparatus. More particularly, the present invention relates to a substrate processing apparatus and a substrate processing method using the same, The present invention also relates to a substrate processing method and apparatus for cleaning a substrate to be cleaned even if a chemical liquid leaks and is contaminated during a process of manufacturing a display panel by attaching a substrate to be bonded to the substrate.

A process for manufacturing a flat panel display such as an LCD (Liquid Crystal Display Device), a PDP (Plasma Display Panel), an ELD (Electro Luminescent Display), and a VFD (Vacuum Fluorescent Display) A chemical liquid such as liquid crystal is applied on the surface of a substrate to be processed (or Thin Film Transistor) which is provided with a phosphor on a surface of a substrate to be processed (or Thin Film Transistor) .

In the course of moving the substrate to be treated to the coagulating apparatus after the chemical liquid is applied to the surface of the substrate to be treated, minute vibrations must be generated. This fine vibration causes flow of the chemical liquid which is not dried, Even if the chemical liquid is applied to the surface of the substrate to be processed in the coating apparatus with a uniform thickness, the chemical liquid spreads non-uniformly on the surface of the substrate to be processed.

Therefore, in a flat panel which is finally manufactured by being attached to a laminating board in a laminating apparatus, the chemical liquid is not uniformly distributed, resulting in a problem that the display image quality is deteriorated. Particularly, in recent years, as the size of the substrate to be processed becomes larger, when a small vibration is applied to the substrate to be processed, the vibration due to the vibration remains for a long time on the substrate to be processed, And has been pointed out as a problem in maintaining uniform display quality.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method for manufacturing a semiconductor device, which can bond a substrate to which a chemical solution has been applied, And to provide a substrate processing method capable of manufacturing a panel in a state in which a chemical liquid is uniformly applied to a substrate.

Another object of the present invention is to clean a bonded panel and a substrate stage cleanly and to carry out a subsequent process immediately after the chemical liquid is leaked and contaminated during the process of manufacturing a display panel by attaching the substrate to be treated and the adhesion substrate together.

In order to achieve the above object, the present invention provides a method of processing a substrate in a hermetically sealed chamber, comprising: a substrate mounting step of mounting a substrate to be processed on a substrate stage; A chemical liquid applying step of applying a chemical liquid to the substrate to be processed; A pressure regulating step of regulating the inside of the hermetically closed chamber to a pressure lower than atmospheric pressure; A substrate bonding step of moving the bonding substrate downward from the upper side of the substrate to be processed to bond the substrate with the chemical liquid to form a panel; A cleaning and drying step of cleaning and drying the chemical liquid flowing out of the substrate to be processed in the process of combining the substrate to be processed and the adhesion substrate; And a substrate processing method.

This is because, after the chemical liquid is applied to the surface of the substrate to be treated, the position of the substrate to be processed is held fixed until the adhesion substrate is adhered to the substrate to be processed, The distribution of the chemical liquid applied while the substrate to be processed is fluctuated is prevented from being uneven.

That is, according to the present invention, since the substrate to be processed, which is placed on the substrate stage, is configured to be coated with the chemical solution in a fixed position, and the chemical solution is dried and bonded to the adhesion substrate, It is possible to obtain an advantageous effect that an excellent image quality can be realized by maintaining the distributed state.

In addition, even if a part of the chemical solution applied to the substrate to be treated leaks out while the substrate to be processed and the adhesion substrate are adhered to each other, the substrate stage and the substrate to be processed are cleanly cleaned while being washed and dried, The efficiency of the process can be maintained while the application state of the chemical liquid is excellent.

The cleaning and drying step may be performed by relatively moving the cleaning / drying unit relative to the target substrate while spraying at least one of the cleaning liquid and the compressed air through an outlet having a length corresponding to the width of the substrate stage. Thereby, the target substrate contaminated by the leaked chemical liquid and the adhesion substrate can be cleaned in a short period of time by jetting the cleaning liquid and the compressed air after the laminating process of the substrate to be processed and the lap joint is performed.

Above all, the present invention comprises a compressed air spraying step of spraying compressed air on the upper surface of the substrate stage in an adjustment hole around the substrate to be processed; Is performed while the substrate bonding step is performed. By injecting the compressed air around the substrate to be processed in this way, contamination of the panel or the substrate stage due to leakage of the chemical liquid during the process of attaching the substrate to the substrate can be originally minimized. Thus, the time required for the washing and drying step can be shortened.

At this time, it is preferable that the control hole is formed in the form of a closed loop around the substrate to be processed. Since the pressurized air discharged by the control hole is constantly arranged around the entire periphery of the substrate to be processed, even if the chemical liquid applied to the substrate is leaked during the process of adhering the substrate to be processed and the adhesion substrate, It is possible to prevent contamination. In addition, when the intensity of the pressurized air discharged by the control hole is increased, it is possible to minimize the amount of the chemical liquid leaking from the substrate stage by being led out of the substrate stage during the laminating process.

The compressed air injection step may be performed while the target substrate and the adhesion substrate are bonded together, but the process may be continued until the target substrate is cleaned or dried by the cleaning and drying unit. As a result, the cleaning and drying efficiency of the substrate to be processed is improved, and the cleaning can be performed in a shorter time.

A fluid sucking step of sucking the fluid around the upper surface of the substrate stage in the adjustment hole around the substrate to be processed and sucking the drug solution flowing out of the substrate adhering step; And may be performed while the substrate bonding step is performed. Accordingly, the chemical liquid flowing out during the process of attaching the substrate to be treated and the adhesion substrate can be collected and processed by being sucked out without scattering. The fluid sucking step is preferably performed until the washing and drying step is completed.

The substrate mounting step includes mounting the substrate to be processed on the substrate stage in an edge-widened state, forming a receiving groove around the edge of the substrate to be processed, and discharging the fluid collected in the receiving groove through the discharging port It is effective.

On the other hand, the slit nozzle can apply one kind of chemical liquid to the surface of the substrate to be processed, but the slit nozzle can be formed by applying the first chemical liquid to the surface of the substrate to be processed and stacking the second chemical liquid in the first chemical liquid Or the like. At this time, the first chemical liquid is selected as a chemical liquid which controls the amount of light transmitted according to the intensity of the electric power applied to the electrodes arranged on each pixel of the substrate to be processed, and the second chemical liquid is selected according to the direction It is possible to produce a display panel of higher image quality by selecting the liquid medicine to improve the visual field uniformity. As described above, the thickness of the chemical liquid applied on the substrate to be processed is larger than the gap in the state where the substrate to be processed and the adhesion substrate are bonded together, so that the image quality of the display panel can be further improved.

According to another aspect of the present invention, there is provided an air conditioner comprising: an airtight chamber capable of adjusting an internal pressure; A substrate stage disposed in the hermetically sealed chamber, the hermetically sealed chamber having a control hole for receiving compressed air having an upward component arranged along an edge of the substrate to be processed; A slit nozzle provided in the hermetically sealed chamber, for applying a chemical liquid to a surface of the substrate to be processed by discharging the chemical liquid while moving relative to the substrate to be processed; A bonding unit mounted in the hermetically sealed chamber by moving the bonded substrate stack in the state of holding the bonded substrate stack toward the substrate to be processed and attaching the bonded substrate stack and the substrate to be processed; And the compressed air is injected from the control hole while the pressure of the hermetically closed chamber is adjusted to be lower than the atmospheric pressure while the adhesion of the substrate to be processed and the adhesion substrate is performed.

Further, according to another embodiment of the present invention, the control hole may be configured to suck the surrounding fluid instead of injecting the compressed air. That is, the present invention provides an airtight container comprising: an airtight chamber capable of adjusting an internal pressure; A substrate stage disposed in the hermetically closed chamber, the substrate stage having a control hole for receiving a substrate to be processed and arranged along an edge of the substrate to be sucked, A slit nozzle provided in the hermetically sealed chamber, for applying a chemical liquid to a surface of the substrate to be processed by discharging the chemical liquid while moving relative to the substrate to be processed; A bonding unit mounted in the hermetically sealed chamber by moving the bonded substrate stack in the state of holding the bonded substrate stack toward the substrate to be processed and attaching the bonded substrate stack and the substrate to be processed; And while the pressure of the hermetically closed chamber is adjusted to be lower than the atmospheric pressure while the adhesion of the substrate to be processed and the adhesion substrate is performed, the fluids are sucked in the control hole and sucked and discharged by the cementation And a substrate processing apparatus.

At this time, the target substrate and the substrate stage are cleaned and dried while spraying at least one of a cleaning liquid and compressed air through an outlet having a length corresponding to the width of the substrate stage, the substrate being relatively movable with respect to the substrate stage A cleaning and drying unit; In addition, it is possible to reliably clean the chemical liquid in a clean state in which the chemical liquid is not adhered to the surroundings in a state where the substrate to be treated and the adhesion substrate are adhered to each other.

The substrate stage is formed to have a width smaller than the width of the substrate to be mounted on the edge of the substrate to be processed, and a closed loop-shaped receiving groove is formed around the substrate stage. By discharging through the outlet, it is possible to effectively treat the chemical liquid flowing out during the cementation process.

INDUSTRIAL APPLICABILITY As described above, according to the present invention, after a chemical liquid is applied to the surface of a substrate to be processed, the position of the substrate to be processed is held in a fixed state until the adhesion substrate is bonded to the substrate, It is possible to obtain an advantageous effect that it is possible to prevent the distribution of the applied chemical liquid from fluctuating while the substrate to be processed swings while moving from the apparatus to the substrate laminating apparatus.

The present invention also relates to a method of manufacturing a display panel, which comprises adhering a panel to a substrate and / or a substrate stage by performing a cleaning / drying step on the substrate and / or a substrate stage, It is possible to obtain an advantageous effect that the subsequent process can be carried out immediately.

That is, even if the chemical liquid is applied to the substrate to be treated with a thickness larger than the gap between the substrate to be treated and the adhesion substrate, the present invention can prevent the chemical liquid leaking to the outside of the panel And the subsequent process is immediately performed. Thus, the quality and distribution state of the chemical solution applied to the panel can be more variously applied while maintaining the efficiency of the process, thereby realizing better image quality.

1 is a perspective view showing the configuration of a substrate processing apparatus according to an embodiment of the present invention;
Fig. 2 is a front view of Fig. 1
Figure 3 is a top view of the substrate stage of Figure 1;
FIG. 4 is a side view showing a configuration in which a chemical liquid is coated on the surface of a substrate to be processed with a slit nozzle using the apparatus of FIG. 1
5 is an enlarged view of a portion 'A'
6 is an enlarged view of the portion "A" of FIG. 4 showing a state in which the chemical liquid is applied
7 is a view showing a state in which a chemical liquid is erroneously applied
Figs. 8A to 8G are views sequentially showing the structure for processing a substrate to be processed by using the apparatus of Fig. 1
9 is a view showing a washing and drying process of another type of panel
10 is a view showing a configuration according to still another embodiment of the present invention

Hereinafter, a substrate processing apparatus 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention.

1 is a plan view of the substrate stage of Fig. 1, Fig. 4 is a cross-sectional view of the substrate processing apparatus of Fig. 1, and Fig. FIG. 5 is an enlarged view of a portion 'A' in FIG. 4, and FIG. 6 is a side view showing a state in which a chemical liquid is coated on the surface of the substrate A ' 7 is a view showing a state in which the chemical liquid is erroneously applied.

A substrate processing apparatus 100 according to an embodiment of the present invention includes a substrate stage 110 for mounting a substrate G1 to be processed, A chemical solution applying unit 120 for applying a chemical solution onto the surface of the target substrate G1 by discharging the chemical solution 55 and holding the adhesion substrate G2 by vertically moving 130d, A hermetically sealed chamber 140 for adjusting the internal pressure and accommodating the substrate stage 110, the chemical solution applying unit 120 and the cementing unit 130; And a cleaning and drying unit 150 for cleaning and drying the periphery contaminated with the leaked chemical liquid while the processing substrate G1 and the adhesion substrate G2 are bonded together.

 A plurality of suction holes (not shown) are formed on the surface of the substrate stage 110, and the suction pressure 110p acts on the substrate stage 110 by the suction pump 116, thereby firmly fixing the substrate G1. Although the figure shows the structure in which the target substrate G1 is fixed to the substrate stage 10 and the slit nozzle 100 moves, the target substrate G1 of the substrate stage 10 moves, The slit nozzle 121 of the application unit 120 may be fixed in position.

2 and 3, the target substrate G1 is mounted on the substrate stage 110 so that the edge of the target substrate G1 is in an excited state and a closed loop G1 is formed around the target substrate G1. Receiving grooves 119 are formed in a recessed shape. 3, the width 119d between the receiving grooves 119 is formed to be smaller than the width G1d of the target substrate G1.

A plurality of discharge ports 119a are formed in the receiving groove 119 in communication with the discharge pump 117 to discharge the chemical liquid collected in the receiving recess 119 to the outside. A control hole 112 for spraying the compressed air 112e from the bottom surface of the substrate G1 or for applying a suction pressure for sucking the surrounding fluid is formed on the bottom surface of the substrate G1. 3, a plurality of the control holes 112 are spaced apart from each other around the target substrate G1. However, according to another preferred embodiment of the present invention, And may be formed in a slit shape continuous in a closed loop shape around the substrate G1.

2, the chemical solution applying unit 120 includes a slit nozzle 121 for forming a slit-shaped discharge port having a length corresponding to the width of the target substrate G1 and applying a chemical solution, a slit nozzle 121 A pair of sliders 123 that move along the longitudinal direction of the substrate stage 110 while supporting both sides of the crosshead 122 to support the slit nozzle 121, And a guide rail 125 for guiding the pair of sliders 123 to move along the longitudinal direction of the substrate stage 110.

4 and 5, the slit nozzle 121 of the chemical solution applying unit 120 discharges the first chemical liquid 551 at the first discharge port 1211 located in front of the moving direction 121d, And the second chemical liquid 552 is discharged from the second discharge port 1212 located in the rear of the moving direction 121d so that the first chemical liquid 551 and the second chemical liquid 552 ) Are laminated and applied. The first chemical liquid 551 is supplied to the slit nozzle 121 in the direction indicated by the reference numeral 551i by the first supply pump 1211p and the second chemical liquid 552 is supplied to the slit nozzle 121 by the second supply pump 1212p And is supplied to the slit nozzle 121 in the direction indicated by 552i.

As described above, the slit nozzle 121 can apply only the first chemical solution 551, which displays the color of the pixel, to the surface of the substrate G1 by the power source applied to the substrate G1, It is effective to produce a display panel of higher image quality by applying the second chemical liquid 552 uniform on the first chemical liquid 551 to improve the uniformity of the visual field. At this time, it is advantageous to apply the second chemical solution 552 sufficiently thickly at a thickness (55d1) of 50 占 퐉 to 5000 占 퐉 to place the first chemical solution 551 and improve the visual field uniformity. Thus, the thickness of the chemical liquids 551, 552, 55 applied to the target substrate G1 is higher than the gap between the target substrate G1 and the adhesion substrate G2.

6, a target substrate G1 made of a display panel is formed with a step 83 around which a rectangular cell 80s constituting a pixel is bounded, and each cell 80s The color of the pixel is displayed by the first chemical liquid 551 applied to the substrate G1 in accordance with the power source applied to the electrode 81. [ Each stepped portion 83 is formed of a hydrophobic material to guide the first chemical liquid 551 to move to the bottom surface 82 on both sides thereof.

Therefore, the first chemical liquid 551 applied to the surface of the substrate G1 is guided into the rectangular cell 80s outside the step 83 of the hydrophobic property to fill the cell 80s. The first drug solution 551 filled in each cell 80s has a tendency of self-aggregation of the first drug solution 551 as shown in FIG. 6 due to its surface tension. Furthermore, since the substrate G1 mainly made of a glass material is often made hydrophobic on the bottom surface of each cell 80s, unless the amount of application of the first chemical solution 551 is excessive, 1 medicament liquid 551 does not contact the electrode 81, an error of a pixel defect may occur in the finally produced display panel.

Therefore, before the first chemical liquid 551 applied to each cell 80s of the substrate G1 shrinks due to its surface tension or the hydrophobic nature of the substrate G1, The second chemical liquid 552 discharged from the second discharge port 1212 toward the first discharge port 1211 in a tilted manner is directly covered with the first chemical liquid 551 applied thereon so that the first chemical liquid 551 An advantageous effect of effectively maintaining the state of contact with the electrode 81 can be obtained. This reduces the occurrence of pixel defects in all the pixels of the substrate G1, thereby significantly reducing the defect rate generated in the fabrication of the display panel.

The first chemical liquid 551 and the second chemical liquid 552 are discharged from the first discharge port 1211 and the second discharge port 1212 of the slit nozzle 121 made of one body, Layered chemical solution layer 551, 552, 55 can be applied to the surface of the substrate G1 even if the slit nozzle consisting of the slit nozzle is moved only once, The first discharge port 1211 and the second discharge port 1212 are arranged so as to be spaced apart from each other and the slit nozzle 121 is arranged on the upper side of the target substrate G1 Since the two layers of the chemical solution layer are simultaneously applied while moving once, foreign substances are inserted between the chemical solution layers, so that there is no fear that the coating quality will be deteriorated. Also, the localized migration of the chemical solution layer So that it is possible to coat a two-ply chemical layer with a more uniform thickness It is possible to obtain an advantageous advantage.

On the other hand, the first chemical solution 551 applied to the surface of the substrate G1 is guided into the rectangular cell 80s outside the step 83 of the hydrophobic property to fill the cell 80s region first . The first chemical solution 551 filled in each cell 80s has a tendency to self-aggregate by the surface tension of the first chemical solution 551 as shown in FIG. Furthermore, since the target substrate G1 mainly made of glass material is often made hydrophobic on the bottom surface of each cell 80s, when the amount of application of the first chemical solution 551 is applied in an appropriate amount, There is a cell in which the chemical solution 551 does not contact the electrode 81, so that a defective pixel defect may occur in the finally produced display panel.

Therefore, before the first chemical liquid 551 applied to each cell 80s of the substrate G1 shrinks in a spherical or oval shape due to its surface tension or the hydrophobic nature of the substrate G1, The second chemical liquid 552 discharged from the second discharge port 1212 toward the first discharge port 1211 in an inclined manner is applied in the direction indicated by the reference numeral 552f to the first chemical liquid 551 applied immediately before The first liquid medicine 551 is distributed in a spread state in the cell 80s constituting each pixel so as to be brought into contact with the electrode 81 and effectively maintain the contact state. This reduces the occurrence of pixel defects in all the pixels of the substrate G1, thereby significantly reducing the defect rate generated in the fabrication of the display panel.

The second discharge port 1212 of the slit nozzle 121 is located on the upper side farther from the target substrate G 1 than the first discharge port 1211. Namely, both side members 121a and 121b forming the first discharge port 1211 and both side members 121b and 121c forming the second discharge port 1212 are formed in a shape having a length denoted by y1 and y2, As shown in Fig. The second chemical liquid 552 discharged from the second discharge port 1212 flows through the first chemical liquid 551 which is applied while being not mixed with the first chemical liquid 551 discharged from the first discharge port 1211, The first chemical liquid 551 can be reliably pressed by the second chemical liquid 552 in each cell 80s of the substrate G1 to be in contact with the electrode 81. [

The cementing unit 130 is for manufacturing a display panel G by attaching and bonding a cementing substrate G2 to a substrate G1 on which a chemical solution 551, 552, 55 is applied, When the chemical liquid 55 is applied to the surface of the substrate G1 to be processed, the bonding unit 130 moves downward to form the target substrate G1 The display panel G is manufactured by aligning the gluing substrate G1 with the adhesion substrate G2 and then bonding the adhesion substrate G2 to the substrate G1.

At this time, a gap S for keeping a certain distance from the surface of the target substrate G1 is provided on the adhesion substrate G2 so that the chemical liquid 55 is supplied to the substrates G1 and G2 The chemical liquid remaining between the substrates G1 and G2 is higher than the height of the gap S so as to escape through the substrates G1 and G2 so that a predetermined amount of the chemical liquid remains between the substrates G1 and G2 to form a display panel .

1 and 2, the hermetically closed chamber 140 maintains the hermetically closed state with the ambient air until the target substrate G1 is mounted on the substrate stage 110 and adhered to the adhesion substrate G2 It plays a role. The hermetically sealed chamber 140 is provided with a substrate stage 110, a chemical solution applying unit 120, a cementing unit 130, and a cleaning and drying unit 150, A vacuum or a negative pressure atmosphere lower than the atmospheric pressure can be formed inside by a vacuum pump (not shown).

The height d of the chemical liquid 55 coated on the surface of the target substrate G1 is smaller than the height of the gap S between the target substrate G1 and the adhesion substrate G2, A part of the chemical liquid 55 flows out of the panel G to which the substrates G1 and G2 are adhered. The panel G and the substrate stage 110 are contaminated by the chemical liquid 552e leaking to the outside of the panel G so that the cleaning and drying unit 150 can prevent the substrate G1 and the adhesion- And then the cleaning liquid 88 and the dry compressed air (CDA) 89 are sequentially injected into the panel G and the substrate stage 110 while moving in the longitudinal direction 150d1 and 150d2 along the substrate stage 110 The cleaned solution is cleaned and dried so that the subsequent process can be carried out immediately.

On the other hand, a cleaning and drying process is carried out by carrying the panel G on which the target substrate G1 and the adhesion substrate G2 are adhered, separately from the cleaning and drying unit 150 which moves relative to the substrate stage 110 It is possible. For this, a panel G carried by a robot arm (not shown) or the like is accommodated and cleaned by a cleaning liquid 88 and compressed air 89 (FIG. 1) through a cleaning liquid supply nozzle 171 and a high- And an external cleaning and drying unit 170 for cleaning and drying the panel G may be provided.

In the drawing, reference numerals 171a denote supply pipes for supplying the cleaning liquid 88, and reference numerals 172a denote supply pipes for supplying compressed air 89.

A substrate processing method using the substrate processing apparatus 100 constructed as above will be described in detail.

Step 1: First, as shown in FIG. 8A, the substrate G1 is mounted on the substrate stage 110 so that the edge of the substrate G1 to be coated with the chemical solution 55 is lifted, And the negative pressure 116p is applied to the plurality of intake holes 111 of the main body 110 by the suction pump 116 to position and fix the substrate G1. After the chemical liquid 55 is applied to the surface of the target substrate G1, the adhesion unit 130 sucks and fixes the adhesion substrate G2 to be bonded to the target substrate G1.

Step 2: Then, as shown in Fig. 8B, while the slit nozzle 121 moves relative to the target substrate G1 by the reference numeral 121d, the first chemical liquid 551 Is applied to the surface of the substrate G1 and the second chemical solution 552 is applied from the second discharge port 1212 which follows. Thus, when the slit nozzle 121 is moved once, the first chemical solution 551 and the second chemical solution 552 are coated on the surface of the substrate G1 in a stacked state.

6, rectangular shaped cells 80s are distributed longitudinally and laterally with a partition 83 interposed therebetween, and the partition 83 has a high hydrophobic property The first chemical liquid 551 coated or formed with a thin material is moved to the bottom surface 82 of the cell 80s located on both sides of the partition wall 83 to form the first chemical liquid 551 around the partition wall 83 The chemical liquids 551 become disconnected from each other. The first chemical liquid 551 is covered by the second chemical liquid 552 discharged from the second discharge port 1212 following the first discharge port 1211 so that the first chemical liquid 551 is pressed and stably held in the cell 80s, As shown in Fig.

The first chemical liquid 551 may be selected as a chemical liquid such as oil or photoresist that controls the amount of light transmitted according to the intensity of the power applied to the electrode. The second chemical liquid 552 may have a uniform phase And can be selected as a coating liquid such as water capable of improving the uniformity of view regardless of the viewing direction. 6, the first drug solution 551 is applied with a thickness 55d1 of about 3 to 30 占 퐉 lower than the height of the step 83 and the second drug solution 552 is applied to the first drug solution 551 551) and a thickness (55 dl) of approximately 500 [mu] m to 5000 [mu] m to fix the position. Thus, the chemical liquid 55 is applied to the surface of the target substrate G1 with a thickness larger than the gap between the target substrate G1 and the adhesion substrate G2.

Step 3: The pressure in the hermetically closed chamber 140 is then adjusted to a vacuum or negative pressure state with a pressure lower than the atmospheric pressure. 8C, after the position of the adhesion substrate G2 adsorbed on the adhesion unit 130 is aligned with the substrate G1, the adhesion substrate G2 is placed on the substrate G1, And moves the cementing unit 130 downward (130z) so that the cementing unit 130 and the cementing unit 130 are cemented together.

Even if there is a gas remaining in the chemical solution 55 applied to the substrate G1 because the pressure in the hermetic chamber 140 is maintained at a vacuum or a negative pressure lower than the atmospheric pressure in this way, The target substrate G1 and the adhesion substrate G2 can be coupled with each other.

Step 4: The pressurizing pump 113 is operated to bring the static pressure 113p to the control hole 112, which is located around the target substrate G1, before the substrate G1 and the adhesion substrate G2 come into contact with each other. Thereby causing the compressed air 112e to be sprayed upward and outward from the control hole 112. [

Step 5: Then, as shown in FIG. 8D, when the bonded substrate G2 abuts on the substrate G1 to be pressed with a predetermined force, the suction pressure or current applied to the bonded unit 130 is controlled to cohere The adhesion unit 130 moves to the upper side 130z 'while leaving the adhesion substrate G2 on the substrate G1 while releasing the adsorption state of the substrate G2. To this end, the suction unit 130 may be equipped with a load cell. Thus, the adhesion substrate G2 and the target substrate G1 are bonded by a sealing material (not shown) with a space S having a height of approximately 15 to 40 mu m therebetween.

At the same time, the thickness of the chemical liquid 55 applied to the target substrate G1 is larger than the gap between the target substrate G1 and the adhesion substrate G2 when the target substrate G1 and the adhesion substrate G2 are bonded together. The second chemical liquid 552 which is higher than the height of the spacing material S at the moment of contact with the processing substrate G1 is formed on the outer side 552e of the panel G on which the substrates G1 and G2 are adhered, ). However, since the compressed air is supplied from the compression pump 115 in the direction indicated by reference numeral P31 and the compressed air 112e is injected with the component directed upward from the bottom surface of the target substrate G1, The amount of the chemical liquid 552e leaking outwardly stains the side surface of the target substrate G1 or the bottom surface of the substrate stage 110 is minimized.

At this time, the receiving groove 119 serves as a guide for the compressed air 112e injected from the adjusting hole 112. [ A suction pressure P71 is applied from the discharge pump 117 to the plurality of discharge ports 119a formed in the receiving recess 119 to immediately discharge the chemical liquid that has fallen into the receiving recess 119. [

According to another embodiment of the present invention, as shown in FIG. 10, a suction pump 115 'is provided in the control hole 112 so as to communicate with the suction pump 115', and a negative pressure P31 ' The suction pressure 112i may be applied to the control hole 112. In this case, a strong flow field directed to the bottom surface is formed around the target substrate G1, And the gluing board G2 are collected in the receiving recess 119 and discharged immediately through the discharge port 119a. At the same time, the chemical solution 552e is also discharged through the adjustment hole 112. [

As described above, the present invention can also act to minimize the amount of the chemical liquid 552e flowing out by applying the compressed air 112e upward on the substrate G1 to be processed and the substrate G1 or the substrate stage 110 And the suction pressure 112i is applied to the periphery of the substrate G1 to induce a downward flow field so that the chemical liquid 552e flowing out from the substrate G1 is collected in the receiving groove 119 and discharged to the discharge port 119a and the control hole 112. The control hole 112,

Step 6: The substrates G1 and G2 and the substrate stage 110 are coated on the substrates G1 and G2 in the process of being bonded to the adhesion substrate G2, The second chemical liquid 552e discharged to the outside of the second chemical solution 552e. The cleaning liquid is supplied from the cleaning liquid supply unit 152 to the cleaning liquid supply unit 152 while the cleaning liquid 88 is moved from the panel G to the substrate G by moving the cleaning and drying unit 150 in the direction of the reference numeral 150d1, And is sprayed onto the stage 110 to remove the chemical liquid.

The cleaning and drying unit 150 may be provided with a slit-shaped outlet port corresponding to the width of the substrate stage 110 so that the cleaning liquid 88 may be sprayed from the outlet port.

Then, the cleaning and drying unit 150 is supplied again from the drying high-pressure air supply unit 151 to the high-pressure dry air (CDA) cleaning liquid 151d while moving the substrate 150 in the direction of the reference numeral 150d2, The dry air 89 is sprayed onto the panel G and the substrate stage 110 to dry the parchment G and the substrate stage 110 in a wet state with the cleaning liquid.

Step 7: On the other hand, since the degree of contamination of the panel G and the substrate stage 110 by the control hole 112 of the substrate stage 110 is very small, only the substrate stage 110 is moved by the robot arm, The cleaning and drying may be performed in the external cleaning and drying unit 170 located outside the cleaning unit 140.

The method of processing a substrate according to an embodiment of the present invention configured as described above includes the steps of applying the chemical solution 55 to the surface of the target substrate G1 and then attaching the adhesion substrate G2 to the target substrate G1 The position of the substrate G1 to be processed is maintained in a fixed state until the substrate G1 is moved from the chemical liquid applicator to the substrate laminating apparatus. Thus, it is possible to obtain a favorable effect that a chemical liquid is uniformly distributed and a display panel of excellent image quality can be produced.

The first chemical liquid 551 is applied to the surface of the substrate G1 and the second chemical liquid 552 is applied to the first chemical liquid 551 to improve the uniformity of the visual field, The coating thickness of the chemical solution is greater than the gap between the substrate G1 and the adhesion substrate G2 in the process of applying the chemical solution 552e in a stacked form, When the process substrate G1 and the adhesion substrate G2 are attached to each other, the chemical liquid 552e leaking to the outside by the compressed air 112e ejected from the control hole 112 in the closed curve shape surrounding the substrate G1 By minimizing the degree of contamination of the panel P or the substrate stage 110 or by discharging the leaking chemical liquid 552e to the outside by applying a suction pressure to the control hole 112, The time required for washing and drying the contaminated portion of the cleaning cloth 110 is greatly reduced So that it is possible to produce a display panel of excellent image quality with high process efficiency by applying various properties and distribution states of the chemical liquid applied to the panel while maintaining the efficiency of the process, Can be obtained.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

DESCRIPTION OF REFERENCE NUMERALS
55: Solution 551: Solution 1
552: second chemical liquid 552e: second chemical liquid discharged
100, 100 ': substrate processing apparatus 110: substrate stage
112: Adjustable ball 112e: Compressed air
120: chemical solution applying unit 121: slit nozzle
130: Adhesive unit 140: Closed chamber
150: Cleaning and drying unit 170: External cleaning and drying unit
G1: substrate to be processed G2: adhesion substrate
G: Display panel

Claims (13)

There is provided a method of processing a target substrate for manufacturing a display device in which a plurality of cells partitioned by barrier ribs are formed corresponding to pixels and electrodes are arranged for each cell,
A substrate mounting step of mounting the substrate to be processed on an upper surface of the substrate stage so that a bottom edge of the substrate to be processed is spaced apart from a closed loop shaped receiving recess formed in an upper surface of the substrate stage;
After the first chemical liquid is applied to the surface of the substrate to be brought into contact with the electrode and then adhered to the upper surface of the substrate to be processed and the substrate to be processed before the first chemical liquid is formed on the surface of the substrate to be processed A chemical liquid applying step of applying a second chemical liquid to the upper portion of the first chemical liquid so as to cover the first chemical liquid at a coating height higher than a gap between the bonding substrates;
A pressure regulating step of regulating the inside of the hermetically closed chamber to a pressure lower than atmospheric pressure;
A substrate bonding step of moving the bonding substrate downward from the upper side of the substrate to be processed and bonding the second chemical liquid and the first chemical liquid to the substrate to form a panel;
And a suction hole formed in the receiving groove so as to communicate with the receiving groove and adapted to apply a suction pressure to the receiving groove, A fluid sucking step of sucking the second drug solution flowing out of the edge;
Wherein the substrate processing step comprises:
The method according to claim 1,
A cleaning and drying step of cleaning and drying the second chemical liquid flowing out of the substrate to be processed in the process of combining the substrate to be processed and the adhesion substrate;
Wherein the substrate processing step comprises:
3. The method of claim 2,
Wherein the cleaning and drying step is performed by relatively moving the cleaning and drying unit relative to the target substrate while spraying at least one of a cleaning liquid and compressed air through an outlet having a length corresponding to the width of the substrate stage Processing method.
3. The method of claim 2,
Wherein the fluid sucking step is performed until the washing and drying step is completed.
A substrate processing apparatus for processing a substrate to be processed for producing a display device in which a plurality of cells partitioned by barrier ribs are formed corresponding to pixels and electrodes are arranged for each cell,
An airtight chamber capable of adjusting the internal pressure;
A closed loop shaped receiving groove is formed so as to be disposed on an upper surface of the substrate to be processed, the bottom side of the processed substrate being spaced apart from the bottom surface of the processed substrate, and a discharge port communicating with the receiving groove, A substrate stage provided with a control hole for applying a suction pressure to the receiving groove, the substrate stage being provided in the sealing chamber;
A first discharge port for applying a first chemical liquid to the surface of the substrate to be brought into contact with the electrode; and a second discharge port for discharging the first chemical liquid from the surface of the substrate to be processed, And a second discharge port for applying a second chemical liquid to an upper portion of the first chemical liquid so as to cover the first chemical liquid at a coating height higher than a gap between gaps between the first and second chemical liquids.
A bonding unit mounted in the hermetically sealed chamber by moving the bonding substrate downward from the upper side of the substrate to be processed while gripping the bonding substrate and bonding the bonding substrate and the substrate to be processed;
Wherein a pressure of the hermetically closed chamber is adjusted to be lower than an atmospheric pressure while the adhesion between the substrate to be processed and the adhesion substrate is performed and the hermetically sealed chamber is allowed to flow out of the edge of the substrate to be processed And the second chemical liquid is sucked and discharged.
6. The method of claim 5,
A cleaning and drying unit which is provided so as to be movable relative to the substrate stage and which cleans and dries the substrate to be processed and the substrate stage while ejecting at least one of a cleaning liquid and compressed air through an outlet having a length corresponding to the width of the substrate stage, of;
Further comprising:
delete delete delete delete delete delete delete

Images