KR101586837B1 - An application apparatus for panels with adhesive material and application method of using the same apparatus. - Google Patents

Abstract

The present invention relates to a coating apparatus for applying an adhesive by bringing an adhesive portion of an object to be bonded into contact with an adhesive and a method of applying and applying the adhesive by using the apparatus, To change the properties of the surface to be hydrophilic, align the substrates, and apply the adhesive while discharging the adhesive using a bonding apparatus to bond the substrates. When the surface treatment is performed with the atmospheric plasma, it is possible to adjust the hydrophilic surface area by using the mask, thereby minimizing the area where the adhesive is applied. By modifying the surface, it is possible to suppress the air bubbles And to provide a coating method capable of eliminating defective factors.

Description

A coating apparatus for applying an adhesive to a substrate, and a method for adhering a substrate using the apparatus. {AN APPLICATION APPARATUS FOR PANELS WITH ADHESIVE MATERIAL AND APPLICATION METHOD OF USING THE SAME APPARATUS.

The present invention generally relates to a coating apparatus for treating a surface of an adhesive portion with an atmospheric pressure plasma so as to adhere a side surface portion of a substrate composed of two or more sheets and then applying and bonding an adhesive and a method of adhering the substrate using the apparatus . More particularly, the present invention relates to a new applicator capable of adjusting the shape and width of a hydrophilic surface portion modified by using an atmospheric pressure plasma generator and a mask, A method in which the coating is applied in the form of a spot-type coating or a method in which one part or the whole of the coating area is coated by a contact method. In addition, as the surface to be coated is modified, the surface activation energy is increased, so that bubbles generated during coating can be suppressed, and product defects can be prevented.

2. Description of the Related Art Flat panel display devices using self-emitting organic materials such as organic light emitting diodes (OLEDs), which have been recently emerging as display panels, have been extensively studied and are being used not only for TVs and monitors, but also for personal portable telephones such as mobile phones and PDAs This trend is being actively applied. Such an organic light emitting diode device is a display device capable of high-speed response and high brightness, and can be made thinner than a liquid crystal display (LCD) because a backlight is not required. In such an OLED display device, electrons injected from one electrode and holes injected from other electrodes combine with each other in an emissive layer located between the two electrodes to generate an exciton, and the exciton emits light while emitting energy.

Organic light emitting diodes are classified into active type and passive type according to the driving method. An active matrix OLED (AMOLED) has a TFT (Thin Film Transistor) device for controlling each pixel on a pixel-by-pixel basis, and a Passive Matrix OLED (passive matrix OLED) And a structure in which power is supplied to the intersecting pixels by applying a voltage. The active matrix type organic light emitting diode is advantageous in that it consumes less power than a passive matrix type and is suitable for a large area and has a high resolution.

Such organic light emitting diodes are mainly used in portable telephones. Recently, portable display devices have become popular, and portable devices having such active type organic light emitting diodes (AMOLED) as display means have been proposed. In the case of such small display devices, So as to have a weight and volume reduced.

1 is a perspective view illustrating a general active type organic light emitting diode. As shown in Fig. 1, an object to be bonded 1 such as an active type organic light emitting diode is composed of a glass substrate 2 on which a driving circuit is formed and a glass cover 3 for protecting a driving circuit formed on the glass substrate 2. Here, the glass cover 3 is applied to the glass substrate 2 by a sealant applied to the edge of the glass substrate 2.

On the other hand, even if the glass substrate 2 and the glass cover 3 are adhered to each other by a sealant, if an impact is applied to the object 1 to be bonded to the active matrix organic light emitting diode, A separate liquid adhesive is applied to the adhesive surface of the glass substrate 2 and the glass cover 3 adhered by the sealant.

The method of applying the liquid adhesive along the bonding surface of the glass substrate 2 and the glass cover 3 is disclosed in the prior art patent application No. 2010-0043367 (published on Apr. 29, 2010 : Method and Apparatus for Applying Liquid Adhesive of Active Organic Light Emitting Diode), Published Unexamined Patent Application No. 2002-0021862 (Published on Mar. 9, 2012, Name: Non-contact Adhesive Application Device and Application Method Using the Same) 2012-0051143 (published on May 22, 2012, entitled: Adhesive Application Device and Adhesive Application Method Using Same), Published Japanese Patent Application No. 2014-0010843 (Publication Date: Jan. 27, 2014, Coating apparatus).

However, in the above prior arts, since the adhesive is applied directly to the side surface of the object to be bonded of the active matrix organic light emitting diode using a point-like nozzle, there is a disadvantage that it can not be applied to an object to be bonded having a certain thickness or less. There is a problem that bubbles are generated in the post-adhered region, and defects often occur in the product.

In addition, the conventional prior arts have shown that the distribution of the adhesive is not uniform due to sticking to the adhesive portion of the active-type organic light-emitting diode (1) There is a problem that a contaminant removing means must be separately provided to prevent the surface of the substrate from being contaminated.

SUMMARY OF THE INVENTION An object of the present invention is to modify at least two portions of a glass substrate to be adhered with an atmospheric pressure plasma at the time of adhering a plurality of glass substrates, And to provide a new application method capable of narrowing the width thereof with ease. In addition to this, it is possible to adopt not only the coating method which was performed by the conventional point-of-discharge method but also the method of contact coating on one part of the coating area without moving the spray nozzle for spraying the coating liquid, As a result, the surface activation energy is increased, so that the bubbles generated when the adhesive is applied after the application of the adhesive are suppressed, so that the defective product can be minimized. In addition, in the case of a novel contact-type coating apparatus, it is not necessary to provide a contaminant removing means for preventing adhesion to the surface of the substrate, so that the coating apparatus can be further simplified You can.

The method for bonding a substrate according to an embodiment of the present invention for realizing the above object is a device for applying an adhesive to a plurality of substrates. The liquid adhesive (220) (200) connected to the container (100): a moving part (300) capable of moving the applying member horizontally and vertically; a sensing part (500) arranged in the moving part to sense the position of the object and the arrangement state of the applying member; An aligning device 400 for moving a plurality of substrates, and the application member 100 is a coating device for applying an adhesive, which is characterized by a plasma device 10 and a nozzle 20, to a substrate.

More specifically, the present invention relates to an application device for applying an adhesive to a substrate, characterized in that the container 200 further comprises a pressing portion 210 for continuously supplying a liquid adhesive.

More specifically, the present invention relates to a coating apparatus for applying an adhesive to a substrate characterized in that a supply port (140) is further provided in a flow line (141) connecting the container (200) and the nozzle (20).

Specifically, the plasma apparatus 10 and the nozzle 20 are characterized by a coating apparatus for applying an adhesive to a substrate characterized by being arranged to maintain a constant distance therebetween.

More specifically, the plasma apparatus 10 relates to a coating apparatus for applying an adhesive, which is characterized by being an atmospheric pressure plasma apparatus, to a substrate.

More specifically, the plasma electrode 10 relates to a coating apparatus for applying an adhesive to a substrate characterized by a torch shape or a dielectric barrier discharge pattern.

More specifically, the applicator relates to a coating apparatus for applying an adhesive to a substrate, characterized in that it further comprises a mask (30) capable of controlling the width to be surface-treated.

More specifically, the present invention relates to a coating apparatus for applying an adhesive having a thickness of 0.1 to 3 mm to the substrate.

Specifically, the mask 30 is characterized in that the substrate 30 is coated with an adhesive having a width of 10 to 30 占 퐉.

More specifically, the present invention relates to a coating apparatus for applying an adhesive to a substrate characterized in that the nozzle 20 for applying the adhesive is replaced by a blanket 22.

More specifically, the present invention relates to a coating apparatus for coating an adhesive on a substrate, characterized in that the nozzle (20) has an inner diameter of 30 to 50 mu m at the end of the nozzle with a dispenser nozzle.

More specifically, the dispenser nozzle is a dispenser for applying an adhesive to a substrate characterized by an outer diameter of the nozzle end of 80 to 100 mu m.

More specifically, the nozzle (20) relates to a coating device for applying an adhesive to a substrate characterized by the formation of the hydrophobic coating portion (21).

In addition, a method of adhering a substrate using the above-described application device includes the steps of: moving and aligning a substrate; Plasma processing the bonded portion of the substrate; And a step of applying an adhesive to the plasma-treated portion is applied to the substrate.

More specifically, it relates to a method of applying an adhesive to a substrate characterized by that the substrate is a display panel.

More specifically, the present invention is characterized by a method of applying an adhesive to a substrate characterized in that the adhesive portion is a side surface of a display panel.

More specifically, the present invention relates to a method of applying an adhesive to a substrate characterized by making contact with the adhesive.

More specifically, the adhesive application method is any one of a precision dispenser nozzle 20 method, a reverse offset printing method, a flexography printing method, a gravure printing method, a method using a Piezo-Electric Jet Valve, and an inkjet printing method And a method for applying an adhesive to a substrate.

More specifically, the contact type relates to a method of applying an adhesive to a substrate characterized by applying the adhesive to one side of the plasma-treated contact.

More specifically, the plasma treatment is characterized in that a substrate is coated with an adhesive for treating the surface using atmospheric pressure plasma.

More specifically, the present invention relates to a method of applying an adhesive to a substrate characterized in that the surface is modified hydrophilically by the plasma treatment.

More specifically, the method is characterized in that the substrate is coated with an adhesive characterized by the plasma treated width being 10 to 30 μm.

And is characterized by a substrate on which an adhesive is applied by the above bonding method.

In order to realize the above-mentioned problem, in the adhesive apparatus and the adhesive application method for applying the adhesive relating to the embodiment of the present invention to the substrate, a part of the constitution is added to the conventional point-of-application application apparatus, In addition, in the case of a new coating apparatus which is applied in a contact manner in a part to be coated, there is no need to provide a contamination removing means for preventing the spreading coating agents from adhering to the surface of the substrate, It is.

In the bonding method using the bonding apparatus according to the present invention, as the surface of the side surface of the substrate is modified by the atmospheric pressure plasma, the surface activation energy is increased, so that bubbles generated after the application are suppressed to suppress the product defects. Besides. When the surface modification of the atmospheric plasma is performed, the shape or width of the surface modified by the mask can be adjusted, so that the width of the adhesion can be adjusted. Accordingly, it is a new substrate bonding method which can easily adhere a substrate having a thickness smaller than the thickness of the glass substrate currently used in accordance with the trend of a thinner glass substrate.

FIG. 1 is a perspective view of a general active type organic light emitting diode.
2 schematically shows a coating apparatus for applying the adhesive of the present invention to a substrate.
FIG. 3 shows a coating concept using a plasma torch and a dispenser nozzle disposed inside the coating member of FIG. 2 of the present invention.
Fig. 4 (a) relates to an apparatus for applying an adhesive to a dispenser nozzle by a masking process using a mask, and Fig. 4 (b) relates to an apparatus for applying the adhesive using a reverse offset printing method using a blanket.
Figure 5 illustrates atmospheric plasma methods.
6 shows the sizes of the nozzles for discharging the adhesive solution and the size of the adhesive solution injected from the nozzles.
Fig. 7 shows a procedure for bonding substrates.
8 is a photograph of a section of the bonded portion.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a coating apparatus in which an adhesive is applied to a substrate in order to adhere a plurality of substrates made of two or more sheets of the present invention and a method of applying an adhesive using the apparatus are described in detail with reference to the accompanying drawings. In this specification, similar structures are denoted by the same reference numerals even though they are different from each other, and the description will be replaced with the first explanation.

2 is a schematic view of a coating apparatus for coating a substrate with an adhesive according to the present invention. The coating apparatus includes a coating member 100, a container 200 containing a liquid coating agent, A sensing unit 500, and a control unit 700. The control unit 700 includes a control unit 700, The applying member 100 can move the liquid adhesive through the pipe-shaped adhesive moving line 141 and eject the liquid adhesive through the nozzle 20. [ A supply port 140 for regulating the supply amount of the liquid adhesive 220 is formed between the liquid coating agent receiving container 200 of the moving line 141 and the nozzle 20 for ejecting the liquid coating agent. The receiving container 200 may include a pressing portion 210 which can pressurize the liquid adhesive 220 to send the liquid adhesive 220 used therein to the moving line 141 continuously. A plasma apparatus 10 is provided in front of the dispenser nozzle 20 for spraying the liquid coating agent 220 into the coating member 100 so that the surface of the coating liquid is coated on the side surface of the organic diode substrate 1 .

The moving unit 300 moves the liquid adhesive 220 in the x, y, and z directions from the upper side of the object 1, which is an organic light emitting diode, to which the liquid adhesive 220 is to be injected. z axis. The moving part 300 is coupled to the upper end of the applying member 100 by bolts or the like, and moves along with the applying member 100 in the x, y, and z directions on the upper side of the object. and is applied while moving along the z axis. The moving part 300 can move according to a set value according to the shape of the object to which the liquid adhesive is to be sprayed, and it has a joint part like a robot arm, so that the joint part can be moved while being deflected in any direction.

The alignment unit 400 may include a pickup 410 and a support 420. The pick-up unit 410 serves to fix the organic light emitting diode 1 to be coated with the adhesive, and may be a block extending in the longitudinal direction. It is possible to form a plurality of holes communicating the inside and the outside in the form of a block in which a hollow space is formed in the pickup 410. The pickup unit may be connected to a vacuum pump to suck and discharge air from the plurality of suction holes 411 formed in the pickup unit. Thus, the pick-up unit 410 may be of a type in which the organic light emitting diode 1 can be fixed by an object such as a sucked shape, a tongue, a groove formed according to the shape of the object, or the like. The support member 420 may be such that a plurality of pickup units 410 are arranged and fixed in parallel on a predetermined interval. The support may be in the form of a long bar having a horizontal shape, and a plurality of pick-up parts 410 may be fixedly formed on the upper surface thereof at regular intervals.

The sensing unit 500 measures the position of the organic light emitting diodes 1 as a plurality of objects. Specifically, the sensing unit may include a camera and a light source. For example, the sensing unit 500 is fixed to the moving part 300, passes through the upper side of the object, and measures the position of the object 1 to be bonded, which is the organic light emitting diode. The positional value measured by the sensing unit 500 may be adjusted by controlling the time interval when applying the liquid adhesive 220. The position and width of the object may be measured to accurately measure the position to be coated . The sensing unit 500 includes a position sensor or a motion sensor, so that the position of the object can be corrected, and the liquid application agent 220 can be applied to the object according to the object.

The control unit 700 receives the information of the object measured by the sensing unit 500 and moves the moving unit 300 to a position where the object to be bonded is located. In this control unit, when the moving part moves the applying member 100 located above the object 1 to be bonded, the plasma torch and the nozzle of the applying member are operated to simultaneously perform surface modification and coating. At this time, an opening / closing lever provided in the supply port is operated so that the liquid adhesive 220 can be applied, thereby adjusting the amount of the coating agent applied.

Next, a method of adhering an object 1 to be bonded, which is an organic light emitting diode, using a coating apparatus that applies an adhesive to a substrate based on FIGS. 3 to 5 will be described in detail. Fig. 3 is a schematic view showing the surface treatment of the side surface of the substrate with the atmospheric pressure plasma apparatus 10 disposed in the coating member 100 of the coating apparatus according to the present invention and the use of a precision dispenser nozzle (20) FIG. 2 is a view schematically showing application. The embodiment of the present invention is characterized in that at least one side of at least one organic light emitting diode (OLED) 1 made of a glass substrate (LTPS Glass) 2 and a glass cover (3) (1), which is an organic light emitting diode held in a state in which glass substrates are held in a vertical direction, is rotated in order to position the surface of the device in the surface modification position, And then the surface of the side surface of the substrate is reformed with the atmospheric pressure plasma.

When the adhesive is sprayed from the dispenser nozzle 20, which is provided on one side surface of the nozzle 14 with the surface modified by the atmospheric pressure plasma 14, and the nozzle end surface is water-repellent, the atmospheric pressure plasma The adhesive is spread along the modified portion of the surface as shown by the direction of filling the reinforcing liquid (see arrows) along the treated portion in FIG. The dispenser nozzle 20 can be ejected from only one side of the plasma apparatus 10 without any need to move along the plasma apparatus 10 and the dispenser nozzle 20 can be ejected along the plasma torch 13 with a certain distance from the plasma torch 13, May be moved simultaneously. In addition, after the process of pretreating all four sides of the substrate with the plasma, the adhesive is sprayed simultaneously from both directions by using the precision dispenser nozzle 20 provided in both lateral directions of the substrate in the next step, It may be coated with an adhesive.

4, a reverse offset printing method in which a paste is supplied to a blanket 22 in addition to a precision dispenser nozzle 20, and a part of the paste is transferred and transferred, a flexography printing method, Gravure fritting method may be adopted. In some cases, a coating method using a piezo electric jet valve or an inkjet printing method may be used.

4 is a schematic view illustrating an atmospheric pressure plasma treatment using a device capable of controlling the width of a surface to be treated, which is one of the surface treatment methods using the plasma of the present invention, wherein (a) (B) is a reverse offset printing method using a blanket. An open mask 30 is used as a device for adjusting the width of the surface of the plasma. An open mask 31 has a thickness of 0.1 to 3 mm and an open pattern 31 And a width of 10 to 30 mu m was used. If the thickness of the mask is less than 0.1 mm, it is difficult to support and hold the mask because the thickness is thin. If the thickness is 3 mm or more, the weight of the mask is large and it is difficult to operate. The open mask used in the present invention is an open mask having a thickness of 1 mm and an off-pattern 31 in which openings are formed in a rectangular shape with a width of 20 m or less. The open mask 30 is a generally used stainless steel It is a metal mask made of copper alloy. The open pattern 31 having the opening of the open mask formed thereon is precisely mounted on the machining area of the side surface of the glass before the atmospheric pressure plasma processing is performed and then the atmospheric pressure plasma apparatus 10 is moved along the off- The surface of the opened glass is plasma-treated to change the surface to be hydrophilic. The opening width and shape of the open pattern 31 can be adjusted according to the shape and thickness of the substrate, and the material of the open mask can also be changed without difficulty by a person skilled in the art depending on the shape of the plasma.

As shown in FIG. 5, the atmospheric-pressure plasma apparatus 10 for generating a plasma is a plasma torch 13 in the form of a nozzle or a plasma in the form of a dielectric barrier discharge for a slit surface treatment, . This atmospheric pressure plasma generator is characterized in that the high voltage power supply and the gas conditioning utility are connected to the plasma torch 13 or the dielectric barrier discharge device by a gas line 11 and a power line 12, The plasma 14 is ejected through the discharge plasma electrode to modify the surface of the side surface of the substrate.

The apparatus using the plasma torch 13 in the atmospheric pressure plasma apparatus 10 is used for local surface treatment. In the case of the linear surface treatment as in the present invention, the surface treatment is performed while moving the plasma torch 13 along the adhesion portion. Or a dielectric barrier discharge plasma electrode is used for the plasma treatment. The gas used for the plasma is a gas such as argon, oxygen, carbon dioxide, or nitrogen, which is ionized. The output power for generating the plasma was adjusted to 500 W or less. The dielectric barrier for the slit surface treatment is advantageous in that it can simultaneously treat rectangular or linear bonded surfaces. Argon, oxygen, and nitrogen gas are used, and a power supply of 30 kHz to 40 kHz and a power of 13.56 MHz An RF power source was used.

When the surface of the side of the glass substrate is modified to be hydrophilic by the atmospheric pressure plasma treatment, the adhesive is ejected from one side of the modified side surface through the dispenser nozzle 20 shown in Fig. The jetted adhesive spreads rapidly along the hydrophilically modified surface, causing the adhesive to be applied over the entire surface. It is preferable that the nozzle for spraying the adhesive has a hydrophobic coating on its surface, and the inner diameter of the tip of the nozzle from which the adhesive is sprayed is preferably 30 to 50 μm and the outer diameter is 80 to 100 μm. The reason why it is preferable to form the hydrophobic coating portion 21 coated with the hydrophobic nozzle is that the adhesive is hydrophilic when the adhesive is sprayed, but the general nozzle has the effect that the adhesive spreads to the upper portion of the nozzle, The area to be coated when the adhesive is ejected is widened and defects are generated. Therefore, the nozzle having the hydrophobic coating portion 21 at the distal end portion can maintain the bonding area at a constant size.

The adhesive used to adhere the glass substrate used in the present invention is a UV adhesive, and its constituent components and composition ranges are shown in Table 1 below.

The adhesive used in the present invention has a flash point of 86 ° C, a specific gravity of 1.0, and a boiling point of about 120 ° C. In addition to the adhesive used in the present invention, polypropylene, ethylene-vinyl acetate, low-density polyethylene, high-density polyethylene, ABS resin, polystyrene, PVC and urea resin Or an adhesive such as a melamine resin.

7 is a view schematically showing a procedure of applying an adhesive to the side surface of the glass substrate. After performing the surface treatment with plasma on each side of the glass substrate, the order of application of the adhesive can be applied in the number of the size given on the side, and if necessary, the entire side surface of the glass substrate is treated with atmospheric plasma It is possible to apply both surfaces simultaneously by providing a nozzle for spraying an adhesive on both sides of the surfaces 1, 4, 2, and 3 and spraying the adhesive on both sides at the same time.

Fig. 8 is a photograph of a cross section of two glass substrate side surfaces bonded together. Fig. The photograph (a) in which the surface of the side of the glass substrate is coated with the adhesive without modification treatment is obtained by bonding two substrates composed of the glass substrate 2 and the glass cover 3, It can be seen that air bubbles are generated in the portion where the air bubbles are generated. On the other hand, in the photograph (b) of the cross section of the surface obtained by modifying the hydrophilic surface with the atmospheric pressure plasma and then applying the adhesive, bubbles are generated on the two bonded surfaces composed of the glass substrate 2 and the glass cover 3 So that it is formed smoothly.

When the side surface of the glass substrate is subjected to the plasma treatment using the open mask in the atmospheric pressure plasma treatment, the width and shape of the hydrophilic surface can be adjusted. Further, the surface shape and width It is possible to adjust the width and shape that can be adhered. Particularly, since the entire side surface of the glass substrate can be coated by jetting while spraying while the nozzle for spraying the adhesive does not move, the adhesive application time can be greatly shortened, thereby improving the productivity and enhancing the economical efficiency.

In addition, since the thickness of the glass panel has a thickness of about 500 탆 at present, there is no great problem in bonding with the ejection type adhesive apparatus of the dot, but considering the tendency that the thickness of the glass panel is gradually thinning Such a thin glass panel has many difficulties in adhering to a currently used dot-type adhesive apparatus. In particular, it is expected that the thickness of the panel glass will reach 100 to 200 탆 within a short period of time. In contrast, the atmospheric pressure plasma surface treatment method using the mask of the present invention, Technology can be provided.

1: object to be bonded
2: glass substrate
3: Glass cover
10: Plasma device
11: Gas line
12: Power line
13: Plasma torch
14: Plasma
20: Dispenser nozzle
21: hydrophobic coating portion
22: Blanket
30: Mask
31: Open pattern
100: Coating member, 140: Supply port, 141: Supply line
200: accommodating container, 210: pressing portion, 220: liquid adhesive
300:
400: alignment unit, 410: pick-up unit, 411: suction port, 420:
500: sensing unit
700: control unit

Claims (23)

A coating apparatus for applying an adhesive by modifying a surface of an adhesive portion among side surfaces of a plurality of glass substrates (1)
The receptacle 200 in which the adhesive 220 is received and connected to the application member 100 by the flow line 141:
A moving unit 300 for moving the applying member 100 horizontally and vertically and a sensing unit 500 disposed in the moving unit for sensing a position of the object and an arrangement state of the coating member,
An alignment apparatus 400 for moving a plurality of substrates,
The coating member 100 is composed of a plasma device 10 and a hydrophobic coating portion 21 and is composed of a dispenser nozzle 20 having an inner diameter of 30 to 50 μm at its end and has a rectangular shape A coating apparatus for applying an adhesive to a substrate characterized by further comprising a mask (30) having apertures.
Claim 1
Wherein the container (200) is further provided with a pressing portion (210) for continuously supplying a liquid adhesive.
The method according to claim 1,
And a supply port (140) is further provided on a flow line (141) connecting the container (200) and the nozzle (20).
The method according to claim 1,
Wherein the plasma apparatus (10) and the nozzle (20) are coated with an adhesive characterized by being arranged at a constant distance.
The method according to claim 1,
Wherein the plasma apparatus (10) is an atmospheric pressure plasma apparatus.
The method of claim 5,
Wherein the plasma apparatus (10) is a plasma torch (13) or is coated with an adhesive characterized by using a dielectric barrier discharge pattern.
delete The method according to claim 1,
Wherein the mask (30) has a thickness of 0.1 to 3 mm.
The method of claim 8,
Wherein a width of the opening formed in the mask (30) is 10 to 30 占 퐉.
delete The method according to claim 1,
Wherein the substrate is coated with an adhesive characterized in that the nozzle (20) to which the adhesive is applied is replaced by a blanket (22).
The method according to claim 1,
Wherein the dispenser nozzle has an outer diameter of 80 to 100 mu m at the tip of the nozzle.
delete 1. A coating method for applying an adhesive by modifying a surface of an adhesive portion among side surfaces of a plurality of glass substrates (1)
Moving and aligning the plurality of glass substrates;
A step of moving and aligning the application member onto the plurality of glass substrate adhering portions,
Mounting a mask (30) having a rectangular shape capable of adjusting a width of a surface to be adhered on the side of the glass substrate and plasma-treating the surface to modify the surface; And a hydrophobic coating portion (21), and applying an adhesive to the dispenser nozzle (20) having an inner diameter of 30 to 50 mu m at the end.
15. The method of claim 14,
Wherein the substrate is a display panel.
15. The method of claim 14,
Wherein the adhesive portion is a side of the display panel.
15. The method of claim 14,
Wherein the adhesive is applied to the substrate by an adhesive characterized by being in contact with the adhesive.
15. The method of claim 14,
The adhesive application method may be any one of a precision dispenser nozzle 20 method, a reverse offset printing method, a flexography printing method, a Gravure fritting method, a method using a Piezo-Electric Jet Valve, or an inkjet printing method. .
18. The method of claim 17,
Wherein the contact is applied to the substrate by an adhesive characterized by applying a glue on one side of the plasma treated substrate.
The method according to any one of claims 14 to 19,
Wherein the plasma treatment is performed by applying an adhesive for treating the surface using an atmospheric plasma.
The method of claim 20,
Wherein the substrate is coated with an adhesive characterized by the surface being hydrophilically modified by the plasma treatment.
The method of claim 20,
Characterized in that the plasma treated width is 10 to 30 占 퐉.
A substrate coated with an adhesive according to any one of claims 14 to 19.

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