CN108514996A - Colloid coating method and colloid apparatus for coating - Google Patents

Colloid coating method and colloid apparatus for coating Download PDF

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Publication number
CN108514996A
CN108514996A CN201810219626.XA CN201810219626A CN108514996A CN 108514996 A CN108514996 A CN 108514996A CN 201810219626 A CN201810219626 A CN 201810219626A CN 108514996 A CN108514996 A CN 108514996A
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China
Prior art keywords
baffle
substrate
colloid
glue
coating
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Granted
Application number
CN201810219626.XA
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Chinese (zh)
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CN108514996B (en
Inventor
李云
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201810219626.XA priority Critical patent/CN108514996B/en
Publication of CN108514996A publication Critical patent/CN108514996A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

The application discloses a kind of colloid coating method and colloid apparatus for coating.The colloid coating method includes:The baffle vertical with substrate is set, and the baffle is higher than the upper surface of the substrate, and determines region to be coated in ceiling substrate;Glue is injected in the region to be coated;Substrate to injecting glue shakes;Glue is cured;Remove baffle.Based on this, the application can form colloid in homogeneous thickness, be conducive to the coating requirement for meeting flexible display apparatus to colloid.

Description

Colloid coating method and colloid apparatus for coating
Technical field
This application involves display fields, and in particular to the encapsulation field of electronic device more particularly to a kind of colloid coating side Method and colloid apparatus for coating.
Background technology
In traditional colloid coating process, glue is instiled after needing area to be protected, that is, is cured, after solidification Colloid can play the role of water proof vapour, etch-proof.In conjunction with shown in Fig. 1 and Fig. 2, instillation is vault in the glue 11 of presumptive area The thickness of dome-shaped structure, middle section is larger, and the thickness of two side portions is smaller, also, colloid caused by excessive glue is shelled in order to prevent (peeling) or injured are fallen, glue 11 will not be applied to the marginal position of substrate (such as display panel) 12, such as institute in figure The marginal position of the left and right sides shown.Colloid after curing as a result, is also dome-like structure, and thickness is larger and uneven.And it is soft Property a main trend of the display device as current display field, can also be coated with colloid in bending region, and colloid covers The marginal position of substrate to be coated is covered, and bends operation in order to prevent and destroys internal cabling, the necessary frivolous and thickness of colloid is uniform. Obviously, traditional colloid coating process cannot be satisfied the requirement.
Invention content
In consideration of it, a kind of colloid coating method of the application offer and colloid apparatus for coating, can form glue in homogeneous thickness Body is conducive to the coating requirement for meeting flexible display apparatus to colloid.
The colloid coating method of one embodiment of the application, including:
The baffle vertical with substrate is set, and the baffle is higher than the upper surface of the substrate, and limits on the substrate Region to be coated;
Glue is injected in the region to be coated;
Substrate to injecting the glue shakes;
The glue is cured;
Remove the baffle.
The colloid apparatus for coating of one embodiment of the application, including baffle, percussion mechanism and curing mechanism, the baffle are used for Be vertically arranged with the substrate of colloid to be coated and baffle be higher than substrate upper surface, to determine region to be coated, institute in ceiling substrate Percussion mechanism is stated for being shaken substrate to be shaken to injecting the glue in region to be coated, the curing mechanism is used Cure in the glue after vibrations.
Advantageous effect:Glue is limited in the region to be coated on substrate by the application using baffle, to injection glue Substrate is shaken, and the mobility of glue is utilized so that and glue is uniformly distributed in region to be coated, and baffle is removed after solidification, Colloid in homogeneous thickness can be formed, to be conducive to the coating requirement for meeting flexible display apparatus to colloid.
Description of the drawings
Fig. 1 is the structure top view of the glue coating on substrate in the prior art;
Fig. 2 is the structural side view of the glue coating on substrate in the prior art;
Fig. 3 is the flow diagram of the colloid coating method of one embodiment of the application;
Fig. 4 is the schematic diagram of a scenario for being coated with colloid on substrate based on method shown in Fig. 3;
Fig. 5 is the structure top view of the application glue coating on substrate;
Fig. 6 is the flow diagram of the colloid coating method of another embodiment of the application;
Fig. 7 is the structure sectional view of the baffle of one embodiment of the application.
Specific implementation mode
The main purpose of the application is:Glue is limited in the region to be coated on substrate using baffle, to injecting glue The substrate of water is shaken, and the mobility of glue is utilized so that glue is uniformly distributed in region to be coated, and gear is removed after solidification Plate, you can form colloid in homogeneous thickness, the coating requirement for meeting flexible display apparatus to colloid is conducive to this.
With reference to the attached drawing in the embodiment of the present application, to the technology of each exemplary embodiment provided herein Scheme is clearly and completely described.In the absence of conflict, the feature in following each embodiments and embodiment can be with It is combined with each other.Also, directional terminology used by text of the statement, such as "upper", "lower" etc. are for preferably describing The technical solution of each embodiment is not intended to limit the protection domain of the application.
Fig. 3 is the flow diagram of the colloid coating method of one embodiment of the application, and Fig. 4 is existed based on method shown in Fig. 3 The schematic diagram of a scenario of colloid is coated on substrate.Please refer to Fig. 3 and Fig. 4, the colloid coating method may include step S31~ S35。
S31:The baffle vertical with substrate is set, and baffle is higher than the upper surface of substrate, and determines area to be coated in ceiling substrate Domain.
In different types of electronic device, the concrete meaning of the substrate 41 is different, and the application does not limit this System.For example, in LCD (Liquid Crystal Display, liquid crystal display), the substrate 41 can be PCB (Printed Circuit Board, printed circuit board), array substrate (Thin Film Transistor Substrate, TFT substrate or Array substrates) or color membrane substrates (Color Filter Substrate, CF substrates or colorized optical filtering chip base Plate).In another example in OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display, the base Plate 41 can be the transparent substrates for encapsulating OLED device.
Reserve the region in need for carrying out colloid encapsulation, such as area to be coated shown in Fig. 5 dotted lines in the upper surface of substrate 41 Domain 411.Region 411 to be coated can cover the edge of substrate 41.
The side of baffle 42 is abutted with the side of substrate 41, and baffle 42 and the upper surface of substrate 41 are perpendicular, baffle 42 are higher than the upper surface of substrate 41, and in this, the baffle 42 and the matching of substrate 41 merge one open-topped groove 43 of formation, The bottom surface of the groove 43 is the upper surface of substrate 41, and the side of the groove 43 is the medial surface of baffle 42.
In other embodiments, if certain sides in region to be coated 411 have been provided with higher than 41 upper surface of substrate Block piece, then baffle 42 is only arranged at the side that these block pieces are not arranged, as shown in figure 5, baffle 42 is provided only on substrate 41 Left and right side.
S32:Glue is injected in the region to be coated.
The present embodiment can inject glue 44 into groove 43 by nozzle or drip nozzle.Glue 44 is dome in groove 43 The thickness of shape structure, middle section is larger, and the thickness of two side portions is smaller, and the medial surface at the edge and baffle 42 of the glue 44 connects It touches.
S33:Substrate to injecting the glue shakes.
After injecting glue 44, the application applies shock pulse to substrate 41 in time, so that substrate 41, baffle 42 and glue 44 synchronous vibratings, at this point, using the mobility of glue 44, the glue 44 of middle section is flowed towards marginal portion, and glue 44 exists The thickness of middle section becomes smaller, and the thickness of edge region increases, finally so that glue 44 is uniform in region 411 to be coated Distribution, glue 44 become layer structure in homogeneous thickness from dome-like structure.
S34:The glue is cured.
The present embodiment may be used light radiation and cure the glue 44, be carried out to glue 44 for example, by using UV light (ultraviolet light) Irradiation, so that glue 44 is cured as colloid 45.After hardening, colloid 45 is identical as the shape of glue 44, is still in homogeneous thickness Layer structure.
S35:Remove the baffle.
It is detached with colloid 45 for ease of baffle 42, in one embodiment, it is low that viscosity may be used in the baffle 42 Material is made, such as the high-molecular organic materials such as polyethylene, polyvinyl chloride are not easy be bonded in this between baffle 42 and colloid 45. Certainly, the medial surface of the baffle 42 can also be previously provided with film, and the viscosity between the film and colloid 45 is relatively low.
Remove the baffle 42, you can obtain the colloid being formed on substrate 41 45.
It is compared to Fig. 1 and colloid shown in Fig. 2,45 thickness of the colloid is uniform, and edge can cover substrate 41 Edge, and the thickness of colloid 45 be greatly reduced (in practical application scene the thickness of colloid 45 can reduce by 20%~ 50%), colloid 45 is thinning, is not easy, by injured, to want the coating of colloid to be conducive to meet flexible display apparatus in bending It asks.Certainly, the colloid 45 equally can play the role of water proof vapour, etch-proof to bending region.
Fig. 6 is the flow diagram of the colloid coating method of another embodiment of the application.As shown in fig. 6, the colloid applies Cloth method may include step S61~S67.
S61:The baffle vertical with substrate is set, and baffle is higher than the upper surface of substrate, and determines area to be coated in ceiling substrate Domain.
S62:Baffle is heated so that baffle keeps predetermined temperature.
S63:Glue is injected in the region to be coated.
S64:Substrate to injecting the glue shakes.
S65:The glue is cured.
S66:Cold wind is blowed to cool down to the baffle.
S67:Remove the baffle.
For ease of description, for structural elements, the application uses identical label.In the description base of previous embodiment It on plinth, but is different from, before injecting glue 44, the present embodiment heats baffle 42 so that baffle 42 keeps pre- Constant temperature degree, and glue 44 injection, vibrations and it is cured during, baffle 42 remains predetermined temperature.Wherein, described predetermined Temperature thermally expands required temperature equal to or more than baffle 42, such as using baffle 42 made from high-molecular organic material, The predetermined temperature can be 40 DEG C, that is to say, that baffle 44 is in thermal expansion state, and thickness becomes larger.When to the baffle 42 when carrying out cooling processing, such as blows cold wind to baffle 42 to realize cooling, and 42 shrinkage of baffle simultaneously deforms upon, and thickness becomes Small, in this, baffle 42 can be with 45 natural separation of colloid.
Wherein, referring to Fig. 7, the inside of the baffle 42 can be provided with heating element 421, for example, it is spiral plus Heated filament.The heating element 421 heats so that baffle 42 keeps predetermined temperature.
The colloid coating method of previous embodiment can be based on a kind of colloid apparatus for coating provided by the present application and be achieved.Tool Body, the colloid apparatus for coating may include baffle, percussion mechanism and curing mechanism, and the baffle is used for and colloid to be coated Substrate be vertically arranged and baffle is higher than the upper surface of substrate, determine region to be coated in ceiling substrate, the percussion mechanism use In being shaken to substrate to be shaken to injecting the glue in region to be coated, after the curing mechanism is used for vibrations Glue is cured.In the present embodiment, the inside of baffle can be provided with heating element, such as spiral heater strip, The heating element heats are so that baffle keeps predetermined temperature;Percussion mechanism can be motor or shock pulse generating means; Curing mechanism can be light radiation curing mechanism, cure to glue for sending out UV light.
Certainly, the colloid apparatus for coating can also include other structures element, such as with percussion mechanism and curing mechanism The central controller of connection, these structural details of the central controller controls execute respective operation.
In addition, each structural detail of the colloid apparatus for coating sees the description of previous embodiment, and generate with before State the identical advantageous effect of embodiment.
Illustrate again, above is only an example of the present application, is not intended to limit the scope of the claims of the application, it is every It is special using technology between equivalent structure or equivalent flow shift, such as each embodiment made by present specification and accompanying drawing content Sign be combined with each other, and is applied directly or indirectly in other relevant technical fields, the patent guarantor for being similarly included in the application It protects in range.

Claims (10)

1. a kind of colloid coating method, which is characterized in that the method includes:
The baffle vertical with substrate is set, and the baffle is higher than the upper surface of the substrate, and limits on the substrate to be coated Cloth region;
Glue is injected in the region to be coated;
Substrate to injecting the glue shakes;
The glue is cured;
Remove the baffle.
2. according to the method described in claim 1, it is characterized in that, before curing to the glue, the method packet It includes:
The baffle is heated so that the baffle keeps predetermined temperature.
3. according to the method described in claim 2, it is characterized in that, the baffle interior is provided with heating element, the heating Element heats so that the baffle keeps predetermined temperature.
4. according to the method in claim 2 or 3, which is characterized in that after curing to the glue, and remove institute Before stating baffle, the method includes:
Cold wind is blowed to cool down to the baffle.
5. according to the method described in claim 4, it is characterized in that, the predetermined temperature is thermally expanded equal to or more than the baffle Required temperature.
6. according to the method described in claim 1, it is characterized in that, the manufacture material of the baffle is high-molecular organic material.
7. according to the method described in claim 1, it is characterized in that, being cured to the glue by light radiation.
8. according to the method described in claim 1, it is characterized in that, the baffle is vertically installed in the upper surface of the substrate, Or the side of the baffle is abutted with the side of the substrate.
9. a kind of colloid apparatus for coating, which is characterized in that the colloid apparatus for coating includes baffle, percussion mechanism and curing Structure, the baffle is used to be vertically arranged with the substrate of colloid to be coated and the baffle is higher than the upper surface of the substrate, with The ceiling substrate determines region to be coated, and the percussion mechanism is used to shake with to injecting the region to be coated substrate Interior glue is shaken, and the curing mechanism is for curing the glue after vibrations.
10. colloid apparatus for coating according to claim 9, which is characterized in that the baffle interior is provided with heating element, The heating element heats are so that the baffle keeps predetermined temperature.
CN201810219626.XA 2018-03-16 2018-03-16 Colloid coating method and colloid coating device Active CN108514996B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111482328A (en) * 2020-04-13 2020-08-04 Tcl华星光电技术有限公司 Coating device and coating method thereof
CN112420789A (en) * 2020-11-13 2021-02-26 武汉华星光电半导体显示技术有限公司 Display panel, preparation method thereof and display device
CN113653714A (en) * 2021-08-11 2021-11-16 翔实光电科技(昆山)有限公司 Full-lamination method, touch display module and full-lamination system
CN113976404A (en) * 2021-10-20 2022-01-28 广东亿源通科技股份有限公司 Optical cable sealing method
WO2023045079A1 (en) * 2021-09-22 2023-03-30 浙江华帅特新材料科技有限公司 Mold for substrate surface functionalization, and method for substrate surface functionalization

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CN206532773U (en) * 2017-02-17 2017-09-29 成都芯锐科技有限公司 Chip-packaging structure
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JP2007044878A (en) * 2005-08-05 2007-02-22 Seiko Epson Corp Liquid jet apparatus
JP2008091897A (en) * 2007-09-07 2008-04-17 Hoya Corp Maskblank manufacturing method
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111482328A (en) * 2020-04-13 2020-08-04 Tcl华星光电技术有限公司 Coating device and coating method thereof
CN112420789A (en) * 2020-11-13 2021-02-26 武汉华星光电半导体显示技术有限公司 Display panel, preparation method thereof and display device
CN113653714A (en) * 2021-08-11 2021-11-16 翔实光电科技(昆山)有限公司 Full-lamination method, touch display module and full-lamination system
WO2023045079A1 (en) * 2021-09-22 2023-03-30 浙江华帅特新材料科技有限公司 Mold for substrate surface functionalization, and method for substrate surface functionalization
CN113976404A (en) * 2021-10-20 2022-01-28 广东亿源通科技股份有限公司 Optical cable sealing method

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