CN102047456B - 发射调谐方法和利用方法制造的器件 - Google Patents

发射调谐方法和利用方法制造的器件 Download PDF

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Publication number
CN102047456B
CN102047456B CN200980121201.4A CN200980121201A CN102047456B CN 102047456 B CN102047456 B CN 102047456B CN 200980121201 A CN200980121201 A CN 200980121201A CN 102047456 B CN102047456 B CN 102047456B
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Prior art keywords
led
conversion material
wafer
light emitting
emitting diode
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Chinese (zh)
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CN102047456A (zh
Inventor
A·奇特尼斯
J·埃德蒙
J·C·布里特
B·P·克勒
D·T·埃默森
M·J·伯格曼
J·S·凯巴卢
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Kerui Led Co
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Cree Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/47—Cutting by use of rotating axially moving tool with work-infeed means

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  • Led Device Packages (AREA)
CN200980121201.4A 2008-03-31 2009-03-31 发射调谐方法和利用方法制造的器件 Active CN102047456B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7254608P 2008-03-31 2008-03-31
US61/072546 2008-03-31
US12/414457 2009-03-30
US12/414,457 US8877524B2 (en) 2008-03-31 2009-03-30 Emission tuning methods and devices fabricated utilizing methods
PCT/US2009/002039 WO2009123726A2 (en) 2008-03-31 2009-03-31 Emission tuning methods and devices fabricated utilizing methods

Publications (2)

Publication Number Publication Date
CN102047456A CN102047456A (zh) 2011-05-04
CN102047456B true CN102047456B (zh) 2016-06-08

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Country Link
US (1) US8877524B2 (enExample)
EP (1) EP2283526B1 (enExample)
JP (1) JP5819187B2 (enExample)
KR (1) KR20100132536A (enExample)
CN (1) CN102047456B (enExample)
WO (1) WO2009123726A2 (enExample)

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JP5819187B2 (ja) 2015-11-18
EP2283526A2 (en) 2011-02-16
EP2283526B1 (en) 2019-12-11
WO2009123726A2 (en) 2009-10-08
JP2011517090A (ja) 2011-05-26
CN102047456A (zh) 2011-05-04
KR20100132536A (ko) 2010-12-17
US20090261358A1 (en) 2009-10-22
WO2009123726A3 (en) 2010-02-18
US8877524B2 (en) 2014-11-04

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