CN102046854B - Sn或Sn合金镀敷被膜、具有该被膜的复合材料、以及复合材料的制备方法 - Google Patents
Sn或Sn合金镀敷被膜、具有该被膜的复合材料、以及复合材料的制备方法 Download PDFInfo
- Publication number
- CN102046854B CN102046854B CN2009801200337A CN200980120033A CN102046854B CN 102046854 B CN102046854 B CN 102046854B CN 2009801200337 A CN2009801200337 A CN 2009801200337A CN 200980120033 A CN200980120033 A CN 200980120033A CN 102046854 B CN102046854 B CN 102046854B
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- CN
- China
- Prior art keywords
- plating
- alloy
- tunicle
- foil
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 82
- 229910052718 tin Inorganic materials 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000002131 composite material Substances 0.000 title abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000011889 copper foil Substances 0.000 claims abstract description 44
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 42
- 239000011888 foil Substances 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims description 228
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- 229910052799 carbon Inorganic materials 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 26
- 239000011159 matrix material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 17
- 238000012360 testing method Methods 0.000 claims description 14
- 230000035515 penetration Effects 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910020816 Sn Pb Inorganic materials 0.000 claims description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 claims description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 claims description 2
- 230000008520 organization Effects 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 41
- 238000000576 coating method Methods 0.000 description 41
- 239000003795 chemical substances by application Substances 0.000 description 24
- 230000007797 corrosion Effects 0.000 description 24
- 238000005260 corrosion Methods 0.000 description 24
- 238000005282 brightening Methods 0.000 description 20
- 239000002245 particle Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 230000006698 induction Effects 0.000 description 12
- 230000002950 deficient Effects 0.000 description 11
- 238000005868 electrolysis reaction Methods 0.000 description 11
- 239000013543 active substance Substances 0.000 description 9
- 238000003287 bathing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000006355 external stress Effects 0.000 description 4
- 150000004002 naphthaldehydes Chemical class 0.000 description 4
- SQYNKIJPMDEDEG-UHFFFAOYSA-N paraldehyde Chemical compound CC1OC(C)OC(C)O1 SQYNKIJPMDEDEG-UHFFFAOYSA-N 0.000 description 4
- 229960003868 paraldehyde Drugs 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000004780 naphthols Chemical class 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007046 ethoxylation reaction Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000001211 (E)-4-phenylbut-3-en-2-one Substances 0.000 description 1
- PWJNDVAKQLOWRZ-UHFFFAOYSA-N 1-hydroxynaphthalene-2-sulfonic acid Chemical compound C1=CC=C2C(O)=C(S(O)(=O)=O)C=CC2=C1 PWJNDVAKQLOWRZ-UHFFFAOYSA-N 0.000 description 1
- 102100036092 Alpha-endosulfine Human genes 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 101000876352 Homo sapiens Alpha-endosulfine Proteins 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229930008407 benzylideneacetone Natural products 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000000981 epithelium Anatomy 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- BWHOZHOGCMHOBV-BQYQJAHWSA-N trans-benzylideneacetone Chemical compound CC(=O)\C=C\C1=CC=CC=C1 BWHOZHOGCMHOBV-BQYQJAHWSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-142064 | 2008-05-30 | ||
JP2008142064 | 2008-05-30 | ||
PCT/JP2009/052140 WO2009144973A1 (ja) | 2008-05-30 | 2009-02-09 | Sn又はSn合金めっき被膜、それを有する複合材料、及び複合材料の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102046854A CN102046854A (zh) | 2011-05-04 |
CN102046854B true CN102046854B (zh) | 2013-09-25 |
Family
ID=41376861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801200337A Active CN102046854B (zh) | 2008-05-30 | 2009-02-09 | Sn或Sn合金镀敷被膜、具有该被膜的复合材料、以及复合材料的制备方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4484962B2 (zh) |
KR (1) | KR101245911B1 (zh) |
CN (1) | CN102046854B (zh) |
WO (1) | WO2009144973A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5268748B2 (ja) * | 2009-03-31 | 2013-08-21 | Jx日鉱日石金属株式会社 | Sn又はSn合金めっき被膜、及びそれを有する複合材料 |
JP5356968B2 (ja) * | 2009-09-30 | 2013-12-04 | Jx日鉱日石金属株式会社 | Snめっき被膜、及びそれを有する複合材料 |
JP5325175B2 (ja) | 2010-07-15 | 2013-10-23 | Jx日鉱日石金属株式会社 | 銅箔複合体、及び成形体の製造方法 |
EP2695733B1 (en) | 2011-05-13 | 2020-09-16 | JX Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
KR101635692B1 (ko) | 2012-01-13 | 2016-07-01 | 제이엑스금속주식회사 | 동박 복합체, 그리고 성형체 및 그 제조 방법 |
BR112014017075A2 (pt) * | 2012-01-13 | 2017-06-13 | Jx Nippon Mining & Metals Corp | composto de folha de cobre, produto formado e método de produção dos mesmos |
CN103114315B (zh) * | 2013-03-11 | 2015-03-25 | 福建清景铜箔有限公司 | 一种铜箔的无铬钝化方法 |
JP5497949B1 (ja) | 2013-07-03 | 2014-05-21 | Jx日鉱日石金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル |
JP5887305B2 (ja) | 2013-07-04 | 2016-03-16 | Jx金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材、及びシールドケーブル |
WO2015181970A1 (ja) | 2014-05-30 | 2015-12-03 | Jx日鉱日石金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル |
KR101620449B1 (ko) * | 2014-06-26 | 2016-05-12 | 삼성전자 주식회사 | 로봇 청소기 및 로봇 청소기의 제어방법 |
JP6421154B2 (ja) * | 2016-09-26 | 2018-11-07 | 千住金属工業株式会社 | 金属体の製造方法 |
CN106757190A (zh) * | 2016-11-21 | 2017-05-31 | 江苏梦得新材料科技有限公司 | 一种电镀锡用光亮剂溶液 |
CN114214600A (zh) * | 2021-12-17 | 2022-03-22 | 东莞市光志光电有限公司 | 一种抗氧化pet银膜制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1551247A (zh) * | 2003-05-14 | 2004-12-01 | ������������ʽ���� | 电镀材料及其生产方法,用于接头的端子和接头 |
CN1718867A (zh) * | 2004-07-07 | 2006-01-11 | 皇家飞利浦电子股份有限公司 | 电子元件及其电镀方法 |
CN1837413A (zh) * | 2005-03-24 | 2006-09-27 | 广东风华高新科技集团有限公司 | 镀纯锡溶液组合物及采用该组合物制得的电子元器件 |
CN1840718A (zh) * | 2005-03-29 | 2006-10-04 | 日矿金属加工株式会社 | Cu-Ni-Si-Zn系合金镀锡条 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3986265B2 (ja) * | 2001-03-13 | 2007-10-03 | 株式会社神戸製鋼所 | 電子・電気部品用銅合金材料 |
JP4639701B2 (ja) * | 2004-09-03 | 2011-02-23 | パナソニック株式会社 | 錫めっき皮膜を有する金属板及びそれを備えた電子部品並びに錫めっき皮膜の製造方法 |
JP2007254860A (ja) * | 2006-03-24 | 2007-10-04 | Fujitsu Ltd | めっき膜及びその形成方法 |
-
2009
- 2009-02-09 JP JP2009525834A patent/JP4484962B2/ja active Active
- 2009-02-09 WO PCT/JP2009/052140 patent/WO2009144973A1/ja active Application Filing
- 2009-02-09 CN CN2009801200337A patent/CN102046854B/zh active Active
- 2009-02-09 KR KR1020107025597A patent/KR101245911B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1551247A (zh) * | 2003-05-14 | 2004-12-01 | ������������ʽ���� | 电镀材料及其生产方法,用于接头的端子和接头 |
CN1718867A (zh) * | 2004-07-07 | 2006-01-11 | 皇家飞利浦电子股份有限公司 | 电子元件及其电镀方法 |
CN1837413A (zh) * | 2005-03-24 | 2006-09-27 | 广东风华高新科技集团有限公司 | 镀纯锡溶液组合物及采用该组合物制得的电子元器件 |
CN1840718A (zh) * | 2005-03-29 | 2006-10-04 | 日矿金属加工株式会社 | Cu-Ni-Si-Zn系合金镀锡条 |
Also Published As
Publication number | Publication date |
---|---|
WO2009144973A1 (ja) | 2009-12-03 |
KR20100135904A (ko) | 2010-12-27 |
KR101245911B1 (ko) | 2013-03-20 |
CN102046854A (zh) | 2011-05-04 |
JP4484962B2 (ja) | 2010-06-16 |
JPWO2009144973A1 (ja) | 2011-10-06 |
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