CN102037555B - 下一代丝网印刷系统 - Google Patents

下一代丝网印刷系统 Download PDF

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Publication number
CN102037555B
CN102037555B CN2009801195714A CN200980119571A CN102037555B CN 102037555 B CN102037555 B CN 102037555B CN 2009801195714 A CN2009801195714 A CN 2009801195714A CN 200980119571 A CN200980119571 A CN 200980119571A CN 102037555 B CN102037555 B CN 102037555B
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CN
China
Prior art keywords
substrate
conveyer belt
strutting piece
revolving actuator
orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009801195714A
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English (en)
Chinese (zh)
Other versions
CN102037555A (zh
Inventor
A·巴希尼
M·佳利亚佐
D·安特烈拉
L·德桑蒂
C·佐资
T·瓦塞斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITUD20080112 external-priority patent/ITUD20080112A1/it
Priority claimed from ITUD2008A000262A external-priority patent/IT1392752B1/it
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN102037555A publication Critical patent/CN102037555A/zh
Application granted granted Critical
Publication of CN102037555B publication Critical patent/CN102037555B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Screen Printers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2009801195714A 2008-05-21 2009-05-18 下一代丝网印刷系统 Expired - Fee Related CN102037555B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
ITUD2008A000112 2008-05-21
ITUD20080112 ITUD20080112A1 (it) 2008-05-21 2008-05-21 Sistema di stampa serigrafica di nuova generazione
ITUD2008A000262 2008-12-18
ITUD2008A000262A IT1392752B1 (it) 2008-12-18 2008-12-18 Sistema di stampa serigrafica di nuova generazione
PCT/EP2009/056024 WO2009141319A1 (en) 2008-05-21 2009-05-18 Next generation screen printing system

Publications (2)

Publication Number Publication Date
CN102037555A CN102037555A (zh) 2011-04-27
CN102037555B true CN102037555B (zh) 2013-03-06

Family

ID=40886196

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801195714A Expired - Fee Related CN102037555B (zh) 2008-05-21 2009-05-18 下一代丝网印刷系统

Country Status (7)

Country Link
US (1) US8215473B2 (https=)
EP (1) EP2297777A1 (https=)
JP (1) JP2011523910A (https=)
KR (1) KR20110020272A (https=)
CN (1) CN102037555B (https=)
TW (1) TWI397146B (https=)
WO (1) WO2009141319A1 (https=)

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WO2010068331A1 (en) * 2008-12-10 2010-06-17 Applied Materials, Inc. Enhanced vision system for screen printing pattern alignment
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JP5553803B2 (ja) * 2011-08-01 2014-07-16 株式会社日立製作所 パネルの印刷装置
JP5803015B2 (ja) * 2011-08-31 2015-11-04 Ｊｕｋｉオートメーションシステムズ株式会社 搬送装置、処理装置及び搬送方法
KR101137995B1 (ko) 2011-10-12 2012-04-23 주식회사 에스제이이노테크 웨이퍼 위치 교체 장치
DE102012205249A1 (de) * 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
DE102012205252A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
CN102642385B (zh) * 2012-04-30 2014-06-11 华南理工大学 全自动多相机丝网印刷设备的定位基准标定方法及装置
CN102700237B (zh) * 2012-05-09 2015-08-26 华南理工大学 一种具有双平台的全自动视觉硅片印刷装置
WO2014037058A1 (en) 2012-09-10 2014-03-13 Applied Materials, Inc. Substrate transfer device and method of moving substrates
CN103085447B (zh) * 2013-01-18 2015-01-21 景德镇陶瓷学院 高速旋转式印花机及其旋转式印花方法
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DE102014215022B3 (de) * 2014-07-30 2015-09-03 Ekra Automatisierungssysteme Gmbh Drucksystem und Verfahren zum Bedrucken von Substraten
CN104275916A (zh) * 2014-10-17 2015-01-14 杰锐光能(苏州)有限公司 带有两套印刷台面的直线传输式晶硅太阳能电池印刷机
CN104354453B (zh) * 2014-10-21 2017-02-08 苏州迈为科技股份有限公司 一种太阳能电池片的高效印刷方法及其装置
CN104401767B (zh) * 2014-11-14 2017-03-15 广州兴森快捷电路科技有限公司 Pcb转角传输装置及方法
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CN112103230A (zh) * 2014-12-02 2020-12-18 应用材料意大利有限公司 在生产太阳能电池基板上印刷的装置及传输该基板的方法
JP6517324B2 (ja) 2015-08-03 2019-05-22 日鍛バルブ株式会社 エンジンバルブの軸接部の探傷検査方法および装置
DE102017204630A1 (de) * 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
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GB2562503A (en) * 2017-05-16 2018-11-21 Asm Assembly Systems Singapore Pte Ltd Workpiece transfer and printing
CN107187191B (zh) * 2017-07-03 2019-11-12 东莞市科隆威自动化设备有限公司 一种硅片印刷机
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
CN111295767A (zh) * 2017-10-27 2020-06-16 应用材料意大利有限公司 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法
US10790466B2 (en) * 2018-12-11 2020-09-29 Feng-wen Yen In-line system for mass production of organic optoelectronic device and manufacturing method using the same system
CN111331156B (zh) * 2018-12-19 2021-06-22 宝成工业股份有限公司 自动上下料装置
CN110060946B (zh) * 2019-04-26 2024-08-02 无锡奥特维科技股份有限公司 双工位导电胶涂覆装置及叠片组件生产装置
CN120998839A (zh) * 2020-04-02 2025-11-21 应用材料公司 检验系统
CN111688338A (zh) * 2020-04-03 2020-09-22 绍兴永通印花有限公司 异花同步双幅印花机
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5518599A (en) * 1994-12-14 1996-05-21 Reflekt Technology, Inc. Cross flow metalizing of compact discs
CN101034678A (zh) * 2006-03-20 2007-09-12 塔工程有限公司 芯片供应单元装载装置

Also Published As

Publication number Publication date
US8215473B2 (en) 2012-07-10
EP2297777A1 (en) 2011-03-23
CN102037555A (zh) 2011-04-27
WO2009141319A1 (en) 2009-11-26
TW201005863A (en) 2010-02-01
KR20110020272A (ko) 2011-03-02
JP2011523910A (ja) 2011-08-25
TWI397146B (zh) 2013-05-21
US20090305441A1 (en) 2009-12-10

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