CN102017202B - 外罩及其生产方法、基体、光电部件和照明装置 - Google Patents

外罩及其生产方法、基体、光电部件和照明装置 Download PDF

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Publication number
CN102017202B
CN102017202B CN2009801154150A CN200980115415A CN102017202B CN 102017202 B CN102017202 B CN 102017202B CN 2009801154150 A CN2009801154150 A CN 2009801154150A CN 200980115415 A CN200980115415 A CN 200980115415A CN 102017202 B CN102017202 B CN 102017202B
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glassy layer
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Expired - Fee Related
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CN2009801154150A
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English (en)
Chinese (zh)
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CN102017202A (zh
Inventor
马蒂亚斯·林特
约瑟夫·基尔迈尔
托马斯·策特勒
罗伯特·黑特勒
筛夫拉·宾·穆罕默德·卡马里
利-李·丘
罗希特·博萨莱
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Schott AG
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Schott AG
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Light Receiving Elements (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
CN2009801154150A 2008-04-29 2009-04-29 外罩及其生产方法、基体、光电部件和照明装置 Expired - Fee Related CN102017202B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008021435A DE102008021435A1 (de) 2008-04-29 2008-04-29 Gehäuse für LEDs mit hoher Leistung
DE102008021435.3 2008-04-29
PCT/EP2009/003109 WO2009132838A1 (de) 2008-04-29 2009-04-29 Gehäuse für leds mit hoher leistung

Publications (2)

Publication Number Publication Date
CN102017202A CN102017202A (zh) 2011-04-13
CN102017202B true CN102017202B (zh) 2012-11-21

Family

ID=40910752

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801154150A Expired - Fee Related CN102017202B (zh) 2008-04-29 2009-04-29 外罩及其生产方法、基体、光电部件和照明装置

Country Status (7)

Country Link
US (1) US8796709B2 (enExample)
EP (1) EP2269238B1 (enExample)
JP (2) JP5536755B2 (enExample)
KR (1) KR101351738B1 (enExample)
CN (1) CN102017202B (enExample)
DE (1) DE102008021435A1 (enExample)
WO (1) WO2009132838A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5554680B2 (ja) * 2010-10-15 2014-07-23 スタンレー電気株式会社 発光素子搭載用基板、発光装置およびこれらの製造方法
JP2012154318A (ja) * 2011-01-06 2012-08-16 Ibiden Co Ltd 排ガス処理装置
DE102011013277A1 (de) * 2011-03-07 2012-09-13 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System"
DE102011013276A1 (de) 2011-03-07 2012-09-13 Schott Ag Glassystem zum hermetischen Verbund von Cu Bauteilen
DE102011013278B4 (de) * 2011-03-07 2020-06-18 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "1-Lagen-System"
JP5992933B2 (ja) 2011-03-07 2016-09-14 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ Ｃｕ部品を気密接続するガラスシステム及び電子部品用のハウジング
JP6293995B2 (ja) * 2012-03-23 2018-03-14 新光電気工業株式会社 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ
DE102012211553A1 (de) * 2012-07-03 2014-01-09 Osram Gmbh Gehäuse für ein halbleiterleuchtmodul
US9651236B2 (en) 2014-01-31 2017-05-16 Christie Digital Systems Usa, Inc. Light emitting device with a heat sink composed of two materials
DE102014111278A1 (de) * 2014-08-07 2016-02-11 Osram Opto Semiconductors Gmbh Leuchtdioden-Halter sowie LED-Lampe oder Leuchte zur Beleuchtung
JP6005779B2 (ja) * 2015-03-02 2016-10-12 ローム株式会社 発光装置、発光装置の製造方法、および光学装置

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JP2002344026A (ja) * 2001-04-12 2002-11-29 Patent Treuhand Ges Elektr Gluehlamp Mbh オプトエレクトロニック構造素子を製造する方法

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US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100693969B1 (ko) 2003-03-10 2007-03-12 도요다 고세이 가부시키가이샤 고체 소자 디바이스 및 그 제조 방법
CN100587560C (zh) * 2003-04-01 2010-02-03 夏普株式会社 发光装置用组件、发光装置、背侧光照射装置、显示装置
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
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Also Published As

Publication number Publication date
KR20110025900A (ko) 2011-03-14
CN102017202A (zh) 2011-04-13
JP2014078749A (ja) 2014-05-01
EP2269238A1 (de) 2011-01-05
KR101351738B1 (ko) 2014-01-14
JP5763742B2 (ja) 2015-08-12
WO2009132838A1 (de) 2009-11-05
JP5536755B2 (ja) 2014-07-02
US20110108857A1 (en) 2011-05-12
EP2269238B1 (de) 2020-08-05
US8796709B2 (en) 2014-08-05
DE102008021435A1 (de) 2009-11-19
JP2011523502A (ja) 2011-08-11

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