JP2006310613A - 半導体発光装置 - Google Patents
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- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Abstract
【解決手段】 本発明の半導体発光装置は、基板1上に、4つの異なる発光色の素子2が設けられ、前記4つの異なる発光色は、赤、青、緑、及び白色である。
【選択図】 図1
Description
(1)青色LEDを蛍光体で励起した白色発光タイプ:
発光および変換効率がよく、赤、青、緑の3原色を組み合わせて白色を作るRGBタイプと比較して高輝度化が容易である反面、青色を蛍光体にて励起した黄緑成分との組み合わせで擬似的に白色発光を作り出しているため、赤色の成分が殆ど含まれておらず演色性が悪く、特に赤色が映えないなどの問題があった。
(2)赤、青、緑の3原色のLEDを各々搭載したRGB発光タイプ:
本タイプは、3原色成分を含んでいるため演色性がかなり優れており、CCDでの撮影や液晶バックライト等に使用した場合は、特に赤色の発色が際立つまた、RGBが個々に存在するため、色味のバランスを調整することも可能で個々の色を出すことや、様々な色を作り出すことが出来、イルミネーションとしても、優れたものであるが、青色LEDを蛍光体で励起した白色発光タイプと比較すると個々の発光効率の問題から、明るさを確保することが難しい。
図1および図2は、本発明の半導体発光装置の一例として示す表面実装型LEDの断面図と平面図である。
即ち、リフレクタ9は、各色それぞれに形成されており、それぞれに有効な角度で反射面10が形成されている。それぞれにリフレクタ9を設けることにより、4つの素子2と反射面10との距離を各々最適に設定することが出来、光を効率よく前面に取り出すことが可能であるとともに、指定距離に離れた照射面にそれぞれの光を効率よく照射し、混色も容易に可能である。
ずなわち、基板1を2段構造とし、下段に青色または紫外LEDチップ2を搭載し、蛍光体入りエポキシまたはシリコン樹脂8で封止する。残りのRGB素子2は基板1の上段部に搭載する。
図9に示すものは、本発明の他の実施の形態であり、前記素子2のうち、白色は前記基板1の中心に配置され、該白色素子2を囲むように赤、青および緑色の素子2が配置されたものである。
青、緑色LEDチップ2の高さはおよそ100μm程度であるが、赤色LEDチップ2の高さはおよそ300μmと高く、同一段に配置した際は、青、緑発光時に影になることがあり、発光効率を低下させる要因となる。赤色のLEDチップ2も下段に配置することで、本問題が解決し効率のよい発光装置の提供が可能となる。即ち、高さの高いLEDチップを下段に配置し、高さの低いLEDチップからの光の光路を妨げないようにすることで輝度を高くすることができる。
Claims (10)
- 基板上に、4つの異なる発光色の素子が設けられ、前記4つの異なる発光色は、赤、青、緑、および白色である半導体発光装置。
- 前記各素子は樹脂によって覆われ、該樹脂の周囲を囲むようにリフレクタが設けられた請求項1記載の半導体発光装置。
- 前記リフレクタの反射面に、金属蒸着またはめっきが施された請求項2記載の半導体発光装置。
- 前記リフレクタは、前記4つの素子それぞれを囲むように形成されていることを特徴とする請求項2または3記載の半導体発光装置。
- 前記リフレクタは、赤、青および緑を一グループとして囲い、白色を一グループとして囲むように形成されている請求項2乃至4のいずれか一つに記載の半導体発光装置。
- 前記リフレクタは、赤、青、緑および白色の全色を一グループとして囲むように形成されている請求項2乃至4のいずれか一つに記載の半導体発光装置。
- 前記基板は前記素子を載置する載置面を有し、該載置面が2段構造とされており、
前記白色の素子は、他の色の素子と異なる段に載置されている請求項1乃至6のいずれか一つに記載の半導体発光装置。 - 前記基板は前記素子を載置する載置面を有し、該載置面が2段構造とされており、
「青と緑色」および「赤と白色」の素子は異なる段に載置されている請求項1乃至6のいずれか一つに記載の半導体発光装置。 - 前記素子のうち、白色は前記基板の中心に配置され、該白色素子を囲むように赤、青および緑色の素子を配置した請求項1乃至8のいずれか一つに記載の半導体発光装置。
- 前記赤、青および緑色の素子は、略正三角形の頂点の位置に配置された請求項1乃至9のいずれか一つに記載の半導体発光装置。
Priority Applications (3)
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JP2005132334A JP4535928B2 (ja) | 2005-04-28 | 2005-04-28 | 半導体発光装置 |
CNB2006100746027A CN100463168C (zh) | 2005-04-28 | 2006-04-19 | 半导体发光器件 |
US11/414,047 US7455423B2 (en) | 2005-04-28 | 2006-04-27 | Semiconductor light emitting device |
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JP2005132334A JP4535928B2 (ja) | 2005-04-28 | 2005-04-28 | 半導体発光装置 |
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JP2009192000A Division JP5330153B2 (ja) | 2009-08-21 | 2009-08-21 | 半導体発光装置 |
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JP2006310613A true JP2006310613A (ja) | 2006-11-09 |
JP4535928B2 JP4535928B2 (ja) | 2010-09-01 |
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JP2008288412A (ja) * | 2007-05-18 | 2008-11-27 | Citizen Electronics Co Ltd | Led発光装置 |
JP2009016827A (ja) * | 2007-06-29 | 2009-01-22 | Seoul Semiconductor Co Ltd | マルチledパッケージ |
JP2009094351A (ja) * | 2007-10-10 | 2009-04-30 | Nichia Corp | 発光装置およびその製造方法 |
WO2009063915A1 (ja) | 2007-11-12 | 2009-05-22 | Mitsubishi Chemical Corporation | 照明装置 |
JP2009266974A (ja) * | 2008-04-23 | 2009-11-12 | Mitsubishi Electric Corp | 発光装置並びに発光器具 |
JP2009272658A (ja) * | 2009-08-21 | 2009-11-19 | Sharp Corp | 半導体発光装置 |
JP2010109170A (ja) * | 2008-10-30 | 2010-05-13 | Stanley Electric Co Ltd | 半導体発光装置 |
KR100982994B1 (ko) | 2008-10-15 | 2010-09-17 | 삼성엘이디 주식회사 | Led 패키지 모듈 |
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US7855389B2 (en) | 2007-03-29 | 2010-12-21 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device |
JP2011096739A (ja) * | 2009-10-27 | 2011-05-12 | Panasonic Electric Works Co Ltd | 発光装置 |
JP2012028652A (ja) * | 2010-07-26 | 2012-02-09 | Civilight Shenzhen Semiconductor Lighting Co Ltd | 高輝度かつ高発色指数を有する温かみのある白色光ledランプおよびledモジュール |
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US7455423B2 (en) | 2008-11-25 |
US20060245188A1 (en) | 2006-11-02 |
CN1855480A (zh) | 2006-11-01 |
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